DZ2J033M0L

Doc No. TT4-EA-11540 Revision. 3 

Zener Diode DZ2J0330L 

Product Standards 

## DZ2J0330L 

## Silicon epitaxial planar type 

**==> picture [488 x 387] intentionally omitted <==**

**----- Start of picture text -----**<br>
Unit: mm<br>For constant voltage / For surge absorption circuit 1.25 0.13<br>0.35<br>2<br> Features<br> Excellent rising characteristics of zener current Iz<br> Low zener operating resistance Rz<br> Halogen-free / RoHS compliant<br>  (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)<br>1<br> Marking Symbol: 5J or 5U<br>0.5 0.7<br> Packaging<br>Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard) 1. Cathode<br>2. Anode<br> Absolute Maximum Ratings  Ta = 25 C Panasonic SMini2-F5-B<br>Parameter Symbol Rating Unit JEITA SC-90A<br>Repetitive peak forward current IFRM 200 mA Code ―<br>Total power dissipation  [*1] PT 200 mW<br>Electrostatic discharge  [*2] ESD 15 kV<br>Junction temperature Tj 150 C Internal Connection<br>Operating ambient temperature Topr -40 to +85 C 2<br>Storage temperature Tstg -55 to +150 C<br>Note) *1 Mounted on glass epoxy print board ( 45 mm  45 mm  1 mm )<br>Solder in ( Recommended land pattern )<br>*2 Test method : IEC61000_4_2<br>( C = 150 pF, R = 330 , Contact discharge : 10 times )<br>1<br>1.7 2.5<br>**----- End of picture text -----**<br>


##  Electrical Characteristics  Ta = 25 C  3 C 

|Electrical Characteristics  Ta = 25C|3C||||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Min|Typ|Max|Unit|
|Forward voltage|VF|IF = 10 mA|||1.0|V|
|Zener voltage*1, *2|VZ|IZ = 5 mA|3.14||3.47|V|
|Zener operatingresistance|RZ|IZ = 5 mA|||130||
|Reverse current|IR|VR = 1 V|||20|A|
|Temperature coefficient of zener voltage*3|SZ|IZ = 5 mA||-2.1||mV/C|
|Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.<br>Absolute frequency of input and output is 5 MHz.<br>The temperature must be controlled 25C for VZ mesurement.<br>VZ value measured at other temperature must be adjusted to VZ (25C).<br>VZ guaranted 20 ms after current flow<br>Rank classification<br>Tj = 25C to 150C<br>Code<br>M<br>0<br>Rank<br>M<br>No-rank<br>3.47<br>3.38<br>Markingsymbol<br>5U<br>5J<br>VZ<br>3.22<br>to<br>3.14<br>to<br>Note)<br>1.<br>2.<br>*3<br>3.<br>*1<br>*2|||||||



Page 1 of 4 

Established : 2009-10-14 Revised : 2013-07-01 

Doc No. TT4-EA-11540 Revision. 3 

Product Standards Zener Diode DZ2J0330L 

## Technical Data ( reference ) 

**==> picture [242 x 596] intentionally omitted <==**

**----- Start of picture text -----**<br>
PT - Ta<br>250<br>Mounted on glass epoxy print board.<br>Board size : 45 mm × 45 mm x 1 mm<br>200<br>Solder in : land pattern<br>150<br>100<br>50<br>0<br>0 20 40 60 80 100 120 140 160 180 200<br>Ambient temperature Ta (°C)<br>IZ - VZ<br>1.E-01<br>1.E-02<br>Ta = 125 °C<br>1.E-03<br>85 °C<br>25 °C<br>1.E-04<br>1.E-05 -40  ° C<br>1.E-06<br>0 1 2 3 4 5<br>Zener voltage VZ (V)<br>RZ - IZ<br>1000<br>Ta = 25 °C<br>100<br>10<br>1<br>0.0001 0.001 0.01 0.1<br>Zener current IZ (A)<br>Total power dissipation PT (mW)<br>Zener current IZ (A)<br>)<br>Zener operating resistance RZ<br>**----- End of picture text -----**<br>


**==> picture [227 x 582] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF - VF<br>1.E+00<br>Ta = 25 °C<br>1.E-01<br>1.E-02<br>1.E-03<br>1.E-04<br>1.E-05<br>1.E-06<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>Forward voltage VF (V)<br>IR - VR<br>1.E-04<br>Ta = 25 °C<br>1.E-05<br>1.E-06<br>1.E-07<br>1.E-08<br>1.E-09<br>1.E-10<br>1.E-11<br>1.E-12<br>0 0.2 0.4 0.6 0.8 1<br>Reverse voltage VR (V)<br>SZ - IZ<br>5<br>3<br>1<br>-1<br>-3<br>-5<br>0 2 4 6 8 10<br>Zener current IZ (mA)<br>Forward current IF (A)<br>Reverse current IR (A)<br>voltage SZ (mV/°C)<br>Temparature coefficient of zener<br>**----- End of picture text -----**<br>


Page 2 of 4 

Established : 2009-10-14 Revised : 2013-07-01 

Doc No. TT4-EA-11540 Revision. 3 

Product Standards Zener Diode DZ2J0330L 

## Technical Data ( reference ) 

**==> picture [242 x 362] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ct - VR<br>80<br>70 Ta = 25 °C<br>f = 1 MHz<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>0 0.2 0.4 0.6 0.8 1<br>Reverse voltage VR (V)<br>PZSM - tw<br>100<br>Ta = 25 °C<br>10<br>1<br>0.1<br>100 1000 10000<br>Pulse width  tw (μs)<br>Terminal capacitance Ct (pF)<br>dissipation  PZSM (W)<br>Non-repetitive reverse surge power<br>**----- End of picture text -----**<br>


Rth - t 

**==> picture [228 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>Rth(j-l) = 80  ° C/W (1)<br>(2)<br>100<br>10 (1) Non-heat sink<br>(2) Mounted on glass epoxy print board.<br>Board size : 45 mm × 45 mm x 1 mm<br>Solder in : land pattern<br>1<br>0.001 0.01 0.1 1 10 100 1000<br>Time  t (s)<br>Thermal resistance  Rth (°C/W)<br>**----- End of picture text -----**<br>


Page 3 of 4 

Established : 2009-10-14 Revised : 2013-07-01 

Doc No. TT4-EA-11540 Revision. 3 

Product Standards Zener Diode DZ2J0330L 

## SMini2-F5-B 

Unit: mm 

**==> picture [326 x 380] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.25±0.10<br>+0.05<br>0.35±0.05 0.13-0.02<br>2<br>1<br>0.50±0.05 0 to 0.05<br>(5°)<br>±0.1 0.2±<br>1.7 2.5<br>(5°)<br>±0.1<br>0.4<br>0.1<br>±<br>0.7<br>0.15)<br>(<br>**----- End of picture text -----**<br>


##  Land Pattern (Reference) (Unit: mm) 

**==> picture [100 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.9<br>1.1<br>0.9<br>2.4<br>0.9<br>**----- End of picture text -----**<br>


Page 4 of 4 

Established : 2009-10-14 Revised : 2013-07-01 

## Request for your special attention and precautions in using the technical information and semiconductors described in this book 

- (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. 

- (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. 

- (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: 

   - Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. 

- It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. 

- (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. 

- (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. 

- Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 

- (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 

- (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 

20100202