DSC6101JA2B-025.0000

## **DSC61XXB** 

## **Ultra-Small, Ultra-Low Power MEMS Oscillator** 

## **Features** 

- Wide Frequency Range: 3.5 kHz to 100 MHz 

- Ultra-Low Power Consumption: 3 mA/1 µA (Active/Standby) 

- Ultra-Small Footprints 

- 1.6 mm x 1.2 mm VFLGA 

- 2.0 mm x 1.6 mm VFLGA 

- 2.5 mm x 2.0 mm VLGA 

- 3.2 mm x 2.5 mm VDFN 

- 5.0 mm x 3.2 mm VDFN 

- 7.0 mm x 5.0 mm VDFN 

- Frequency Select Input Supports Two Pre-Defined Frequencies 

- High Stability: ±20 ppm, ±25 ppm, ±50 ppm 

- Wide Temperature Range 

- Automotive: –40°C to +125°C 

- Ext. Industrial: –40°C to +105°C 

## **General Description** 

The DSC61xxB family of MEMS oscillators combines the industry leading low power consumption and ultra-small packages with exceptional frequency stability and jitter performance over temperature. The single-output DSC61xxB MEMS oscillators are excellent choices for use as clock references in small, battery-powered devices such as wearable and Internet of Things (IoT) devices in which small size, low power consumption, and long-term reliability are paramount. 

The DSC61xxB family is available in 1.6 mm x 1.2 mm & 2.0 mm x 1.6 mm VFLGA, 7.0 mm x 5.0 mm, 5.0 mm x 3.2 mm & 3.2 mm x 2.5 mm VDFN, and 2.5 mm x 2.0 mm VLGA packages. These packages are “drop-in” replacements for standard 4-pin CMOS quartz crystal oscillators. The Automotive Grade AEC-Q100 qualified option is also available for this device. 

- Industrial: –40°C to +85°C 

- Ext. Commercial: –20° to +70°C 

- Excellent Shock and Vibration Immunity 

- Qualified to MIL-STD-883 

- High Reliability 

- 20x Better MTF Than Quartz Oscillators 

- Supply Range of 1.71V to 3.63V 

- Short Sample Lead Time: <2 weeks 

- Lead Free & RoHS Compliant 

- Automotive Version Available: DSA61xxB 

## **Applications** 

## **Package Types** 

**==> picture [140 x 115] intentionally omitted <==**

**----- Start of picture text -----**<br>
DSC61xxB<br>7.0 mm x 5.0 mm VDFN<br>(Top View)<br>OE/STDBY/FS 1 4 VDD<br>EP<br>GND 2 3 OUT<br>**----- End of picture text -----**<br>


- Low Power/Portable Applications: IoT, Embedded/Smart Devices 

- Consumer: Home Healthcare, Fitness Devices, Home Automation 

- Industrial: Building/Factory Automation, Surveillance Camera 

- Automotive (Please Refer to the DSA61xx Family) 

## **DSC61xxB** 

5.0 mm x 3.2 mm VDFN 3.2 mm x 2.5 mm VDFN 2.5 mm x 2.0 mm VLGA 2.0 mm x 1.6 mm VFLGA 1.6 mm x 1.2 mm VFLGA (Top View) 

**==> picture [140 x 59] intentionally omitted <==**

**----- Start of picture text -----**<br>
OE/STDBY/FS 1 4 VDD<br>GND 2 3 OUT<br>**----- End of picture text -----**<br>


DS20006155C-page 1 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## **Block Diagram** 

## **DSC61XXB** 

**==> picture [341 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
DIGITAL SUPPLY<br>CONTROL REGULATION<br>OE/STDBY/FS VDD<br>PIN 1 PIN 4<br>MEMS<br>RESONATOR<br>TEMP SENSOR PLL<br>OUTPUT<br>CONTROL & VCO DRIVER<br>DIVIDER<br>COMPENSATION<br>GND OUTPUT<br>PIN 2 PIN 3<br>**----- End of picture text -----**<br>


DS20006155C-page 2 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **1.0 ELECTRICAL CHARACTERISTICS** 

## **Absolute Maximum Ratings** 

Supply Voltage .......................................................................................................................................... –0.3V to +4.0V Input Voltage (VIN) ..............................................................................................................................–0.3V to VDD+0.3V ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM 

## **ELECTRICAL CHARACTERISTICS** 

**Electrical Characteristics:** Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C. 

|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|
|---|---|---|---|---|---|---|
|**Electrical Characteristics:**Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to +125°C.|||||||
|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|Supply Voltage|VDD|1.71|—|3.63|V|Note 1|
|Power Supply Ramp|tPU|0.1|—|100|ms|Note 8|
|Active Supply Current|IDD|—|3.0|—|mA|fOUT= 27 MHz, VDD= 1.8V, No<br>Load|
|Standby Supply Current|ISTBY|—|1|—|µA|VDD= 1.8/2.5V,Note 2|
|||—|1.5|—||VDD= 3.3V,Note 2|
|Output Duty Cycle|SYM|45|—|55|%|—|
|Frequency|f0|0.0035|—|100|MHz|—|
|Frequency Stability|Δf|—|—|±20<br>±25<br>±50|ppm|All temp ranges,Note 3|
|Aging|Δf|—|—|±5|ppm|1st year @ 25°C|
|||—|—|±1||Per year after first year|
|Startup Time|tSU|—|—|1.5|ms|From 90% VDDto valid clock<br>output, T = 25°C|
|Input Logic Levels|VIH|0.7 x VDD|—|—|V|Input Logic High,Note 4|
||VIL|—|—|0.3 x VDD|V|Input Logic Low,Note 4|
|Output Disable Time|tDA|—|—|200 +<br>2 Periods|ns|Note 5|
|Output Enable Time|tEN|—|—|1|µs|Note 6|
|Enable Pull-up Resistor|—|—|300|—|kΩ|If configured,Note 7|



- **Note 1:** Pin 4 VDD should be filtered with 0.1 µF capacitor. 

   - **2:** Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at >3.3V VDD. 

   - **3:** Includes frequency variations due to initial tolerance, temp. and power supply voltage. 

   - **4:** Input waveform must be monotonic with rise/fall time < 10 ms 

   - **5:** Output Disable time takes up to two periods of the output waveform + 200 ns. 

   - **6:** For parts configured with OE, not Standby. 

   - **7:** Output is enabled if pad is floated or not connected. 

   - **8:** Time to reach 90% of target VDD. Power ramp rise must be monotonic. 

DS20006155C-page 3 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## **ELECTRICAL CHARACTERISTICS (CONTINUED)** 

|**ELECTRICAL CHARACTERISTICS (CONTINUED)**|**ELECTRICAL CHARACTERISTICS (CONTINUED)**|**ELECTRICAL CHARACTERISTICS (CONTINUED)**|**ELECTRICAL CHARACTERISTICS (CONTINUED)**|**ELECTRICAL CHARACTERISTICS (CONTINUED)**|**ELECTRICAL CHARACTERISTICS (CONTINUED)**|**ELECTRICAL CHARACTERISTICS (CONTINUED)**|**ELECTRICAL CHARACTERISTICS (CONTINUED)**|
|---|---|---|---|---|---|---|---|
|||||||||
|**Electrical Characteristics:**Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to +125°C.||||||||
|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**||
|Output Logic Levels|VOH|0.8 x VDD|—|—|V|Output Logic<br>Std. Drive|High, I = 3 mA,|
|||||||Output Logic<br>High Drive|High, I = 6 mA,|
||VOL|—|—|0.2 x VDD|V|Output Logic<br>Std. Drive|Low, I = –3 mA,|
|||||||Output Logic<br>High Drive|Low, I = –6 mA,|
|Output Transition Time<br>Rise Time/Fall Time|tRX/tFX|—|1|1.5|ns|DSC61x2<br>High Drive,<br>20% to 80%<br>CL= 15 pF|VDD= 1.8V|
|||—|0.5|1.0|ns||VDD= 2.5V/3.3V|
||tRY/tFY|—|1.2|2.0|ns|DSC61x1<br>Std Drive,<br>20% to 80%<br>CL= 10 pF|VDD= 1.8V|
|||—|0.6|1.2|ns||VDD= 2.5V/3.3V|
|Period Jitter, RMS|JPER|—|8.5|—|psRMS|fOUT=<br>27 MHz|VDD= 1.8V|
|||—|7|—|||VDD= 2.5V/3.3V|
|Cycle-to-Cycle Jitter<br>(Peak)|JCy–Cy|—|50|70|ps|fOUT=<br>27 MHz|VDD= 1.8V|
|||—|35|60|||VDD= 2.5V/3.3V|
|Period Jitter<br>(Peak-to-Peak)|JPP|—|70|—|ps|fOUT=<br>27 MHz|VDD= 1.8V|
|||—|60|—|||VDD= 2.5V/3.3V|



- **Note 1:** Pin 4 VDD should be filtered with 0.1 µF capacitor. 

   - **2:** Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at >3.3V VDD. 

   - **3:** Includes frequency variations due to initial tolerance, temp. and power supply voltage. 

   - **4:** Input waveform must be monotonic with rise/fall time < 10 ms 

   - **5:** Output Disable time takes up to two periods of the output waveform + 200 ns. 

   - **6:** For parts configured with OE, not Standby. 

   - **7:** Output is enabled if pad is floated or not connected. 

   - **8:** Time to reach 90% of target VDD. Power ramp rise must be monotonic. 

DS20006155C-page 4 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **TEMPERATURE SPECIFICATIONS (Note 1)** 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|**Temperature Ranges**|||||||
|Junction Operating Temperature|TJ|–40|—|+150|°C|—|
|Storage Ambient Temperature Range|TA|–55|—|+150|°C|—|
|Soldering Temperature|TS|—|+260|—|°C|40 sec. max.|



**Note 1:** The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. 

DS20006155C-page 5 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## **2.0 PIN DESCRIPTIONS** 

The DSC61xxB is a highly configurable device and can be factory programmed in many different ways to meet the customer’s needs. Microchip’s ClockWorks[®] Configurator http://clockworks.microchip.com/Timing/ must be used to choose the necessary options, create the final part number, data sheet, and order samples. The descriptions of the pins are listed in Table 2-1. 

**TABLE 2-1: DSC61XXB PIN FUNCTION TABLE** 

|**Pin Number**|**Pin Name**|**Pin Name**|**Description**|
|---|---|---|---|
|1<br>(Note 1)||OE|Output Enable: H = Active, L = Disabled (High Impedance).|
|||STDBY|Standby: H = Device is active, L = Device is in standby (Low Power Mode).|
|||FS|Frequency Select: H = Output Frequency 1, L = Output Frequency 2.|
|2||GND|Ground.|
|3||Output|Oscillator clock output.|
|4||VDD|Power supply: 1.71V to 3.63V.|



**Note 1:** DSC610xB/1xB/3xB has a 300 kΩ internal pull-up resistor on pin 1. DSC614xB/5xB/7xB has no internal pull-up resistor on pin 1 and needs an external pull-up or to be driven by another chip. 

An explanation of the different options listed in Table 2-1 follows. 

## **2.1 Pin 1** 

This is a control pin and may be configured to fulfill one of three different functions. If not actively driven, a 10 kΩ pull-up resistor is recommended. 

## 2.1.1 OUTPUT ENABLE (OE) 

Pin 1 may be configured as OE. Oscillator output may be turned on and off according to the state of this pin. 

## **2.3 Output Buffer Options** 

The DSC61xx family is available in multiple output driver configurations. 

The standard-drive (61x1) and high-drive (61x2) deliver respective output currents of greater than 3 mA and 6 mA at 20%/80% of the supply voltage. For heavy loads of 15 pF or higher, the high-drive option is recommended. 

## 2.1.2 STDBY 

Pin 1 may be configured as Standby. When the pin is low, both output buffer and PLL will be off and the device will enter a low power mode. 

## 2.1.3 FREQUENCY SELECT (FS) 

Pin 1 may be configured as FS. The output may be set to one of two pre-programmed frequencies. The output clock frequencies can only be set to either kHz or MHz. A combination of kHz and MHz cannot be set. 

## **2.2 Pins 2 through 4** 

Pins 2 and 4 are the supply terminals, GND and VDD respectively. Pin 3 is the clock output, programmable to Standard and High Drive strength settings. Visit ClockWorks® Configurator to customize your device. 

DS20006155C-page 6 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **3.0 DIAGRAMS** 

**==> picture [428 x 538] intentionally omitted <==**

**----- Start of picture text -----**<br>
tR tF<br>VOH<br>OUTPUT<br>VOL<br>1/fo tEN<br>tDA<br>VIH<br>ENABLE<br>ik VIL<br>ara<br>FIGURE 3-1: Output Waveform.<br>IDD<br>4 3<br>VDD 0.1μF 1 2 CL<br>VDA<br>a=<br>FIGURE 3-2: Test Circuit.<br>Via to GND Layer<br>C1<br>VDD Output<br>— _<br>Enable GND<br>—_] Lo<br>Via to GND Layer<br>**----- End of picture text -----**<br>


**==> picture [224 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIGURE 3-3: Recommended Board Layout.<br>**----- End of picture text -----**<br>


DS20006155C-page 7 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## **4.0 SOLDER REFLOW PROFILE** 

**==> picture [248 x 120] intentionally omitted <==**

**----- Start of picture text -----**<br>
20-40<br>Seconds<br>260°C<br>217°C 60-150<br>200°C Seconds<br>Reflow<br>150°C 60-180<br>Seconds<br>25°C<br>Pre-Heat Cool<br>8 minutes max . Time<br>3°C/sec max.<br>3°C/sec max.<br>6C/sec max.°<br>Temperature  (°C)<br>**----- End of picture text -----**<br>


_**FIGURE 4-1:** Solder Reflow Profile._ 

**MSL 1 @ 260°C refer to JSTD-020C** 

|**_FIGURE 4-1:_**<br>_Solder Reflow Profile._|**_FIGURE 4-1:_**<br>_Solder Reflow Profile._|
|---|---|
|**MSL 1 @ 260°C refer to JSTD-020C**||
|Ramp-Up Rate (200°C to Peak Temp)|3°C/sec. max.|
|Preheat Time 150°C to 200°C|60 to 180 sec.|
|Time maintained above 217°C|60 to 150 sec.|
|Peak Temperature|255°C to 260°C|
|Time within 5°C of actual Peak|20 to 40 sec.|
|Ramp-Down Rate|6°C/sec. max.|
|Time 25°C to Peak Temperature|8 minutes max.|



DS20006155C-page 8 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **5.0 PACKAGING INFORMATION** 

## **5.1 Package Marking Information** 

## 4-Lead 

**==> picture [354 x 447] intentionally omitted <==**

**----- Start of picture text -----**<br>
7.0mm x 5.0mm VDFN*<br>5.0mm x 3.2mm VDFN*<br>3.2mm x 2.5mm VDFN*<br>Example<br>2.5mm x 2.0mm VLGA*<br>XXXXXXX 0400000<br>XXXYYWW DCP1834<br>0SSS 0287<br>4-Lead VFLGA*<br>2.0mm x 1.6mm<br>Example<br>1.6mm x 1.2mm<br>XXXX 011H<br>SSS 502<br>Legend: XX...X Product code or customer-specific information<br>Y Year code (last digit of calendar year)<br>YY Year code (last 2 digits of calendar year)<br>WW Week code (week of January 1 is week ‘01’)<br>SSS Alphanumeric traceability code<br>e3 Pb-free JEDEC [®]  designator for Matte Tin (Sn)<br>* This package is Pb-free. The Pb-free JEDEC designator (     )e3<br>can be found on the outer packaging for this package.<br>●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle<br>mark).<br>Note : In the event the full Microchip part number cannot be marked on one line, it will<br>be carried over to the next line, thus limiting the number of available<br>characters for customer-specific information. Package may or may not include<br>the corporate logo.<br>Underbar (_) and/or Overbar (‾) symbol may not be to scale.<br>**----- End of picture text -----**<br>


DS20006155C-page 9 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

DS20006155C-page 10 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

DS20006155C-page 11 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

DS20006155C-page 12 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

DS20006155C-page 13 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

DS20006155C-page 14 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

DS20006155C-page 15 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

DS20006155C-page 16 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

DS20006155C-page 17 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

DS20006155C-page 18 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [306 x 442] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C<br>A1<br>C A<br>SEATING<br>PLANE<br>4X<br>(A3) SIDE VIEW 0.08 C<br>4X b1<br>CH 0.07 C A B<br>1 2 0.03 C<br>CH<br>NOTE 1 e1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1202B Sheet 1 of 2 

DS20006155C-page 19 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [160 x 94] intentionally omitted <==**

**==> picture [161 x 93] intentionally omitted <==**

Notes: 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Terminal Pitch|e|1.65 BSC|||
|Terminal Pitch|e1|1.25 BSC|||
|Overall Height|A|0.79|0.84|0.89|
|Standoff|A1|0.00|0.02|0.05|
|Substrate Thickness(with Terminals)|A3|0.20 REF|||
|Overall Length|D|2.50 BSC|||
|Overall Width|E|2.00 BSC|||
|Terminal Width|b1|0.60|0.65|0.70|
|Terminal Length|L|0.60|0.65|0.70|
|Terminal 1 Index Chamfer|CH|-|0.225|-|



1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

   - REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1202B Sheet 2 of 2 

DS20006155C-page 20 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [293 x 219] intentionally omitted <==**

**----- Start of picture text -----**<br>
X<br>4<br>Y<br>C G2<br>1 2<br>(CH)<br>G1<br>SILK SCREEN<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|1.65 BSC|||
|Contact Spacing|C||1.25||
|Contact Width(X4)|X|||0.70|
|Contact Pad Length(X4)|Y|||0.80|
|Space Between Contacts(X2)|G1|0.95|||
|Space Between Contacts(X2)|G2|0.45|||
|Contact 1 Index Chamfer|CH|0.13 X 45° REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

Microchip Technology Drawing C04-3202B 

DS20006155C-page 21 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [326 x 452] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C<br>A1<br>C A<br>SEATING<br>PLANE<br>4X<br>(A3) 0.08 C<br>SIDE VIEW<br>b2 3X b1<br>CH 0.07 C A B<br>1 2 0.03 C<br>CH<br>e1<br>NOTE 1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1200 Rev D Sheet 1 of 2 

DS20006155C-page 22 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [128 x 75] intentionally omitted <==**

**==> picture [128 x 75] intentionally omitted <==**

## Notes: 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Terminal Pitch|e|1.55 BSC|||
|Terminal Pitch|e1|0.95 BSC|||
|Overall Height|A|0.79|0.84|0.89|
|Standoff|A1|0.00|0.02|0.05|
|Substrate Thickness(with Terminals)|A3|0.20 REF|||
|Overall Length|D|2.00 BSC|||
|Overall Width|E|1.60 BSC|||
|Terminal Width|b1|0.30|0.35|0.40|
|Terminal Width|b2|0.40|0.45|0.50|
|Terminal Length|L|0.50|0.55|0.60|
|Terminal 1 Index Chamfer|CH|-|0.15|-|



1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M 

   - BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1200 Rev D Sheet 2 of 2 

© 

DS20006155C-page 23 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [289 x 227] intentionally omitted <==**

**----- Start of picture text -----**<br>
X2<br>G3<br>4<br>Y<br>G2<br>C<br>1 2<br>(CH)<br>G1<br>SILK SCREEN<br>X1<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|1.55 BSC|||
|Contact Spacing|C||0.95||
|Contact Width|X1|||0.50|
|Contact Width(X3)|X2|||0.40|
|Contact Pad Length(X4)|Y|||0.70|
|Space Between Contacts|G1|1.05|||
|Space Between Contacts(X2)|G2|0.25|||
|Space Between Contacts|G3|1.15|||
|Contact 1 Index Chamfer|CH|0.13 X 45° REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. The value in parenthesis, next to the item description is a unit multiplier. 

Microchip Technology Drawing C04-3200 Rev D 

DS20006155C-page 24 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [217 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>**----- End of picture text -----**<br>


**==> picture [317 x 279] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.10 C<br>A A1<br>C<br>SEATING<br>PLANE<br>4X<br>(A3)<br>SIDE VIEW 0.08 C<br>b2 3X b1<br>CH 0.07 C A B<br>1 2 0.03 C<br>CH<br>NOTE 1 e1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1199B Sheet 1 of 2 

DS20006155C-page 25 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [119 x 70] intentionally omitted <==**

**==> picture [118 x 70] intentionally omitted <==**

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Terminal Pitch|e|1.20 BSC|||
|Terminal Pitch|e1|0.75 BSC|||
|Overall Height|A|0.79|0.84|0.89|
|Standoff|A1|0.00|0.02|0.05|
|Substrate Thickness(with Terminals)|A3|0.20 REF|||
|Overall Length|D|1.60 BSC|||
|Overall Width|E|1.20 BSC|||
|Terminal Width|b1|0.25|0.30|0.35|
|Terminal Width|b2|0.325|0.375|0.425|
|Terminal Length|L|0.30|0.35|0.40|
|Terminal 1 Index Chamfer|CH|-|0.125|-|



## Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1199B Sheet 2 of 2 

DS20006155C-page 26 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [289 x 239] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>X1<br>G1<br>4<br>Y<br>C G2<br>1 2<br>(CH) G3<br>SILK SCREEN<br>X2<br>E2<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E1|1.20 BSC|||
|Contact Pitch|E2||1.16 BSC||
|Contact Spacing|C||0.75||
|Contact Width(X3)|X1|||0.35|
|Contact Width|X2|||0.43|
|Contact Pad Length(X4)|Y|||0.50|
|Space Between Contacts|G1|0.85|||
|Space Between Contacts(X2)|G2|0.25|||
|Space Between Contacts|G3|0.77|||
|Contact 1 Index Chamfer|CH|0.13 X 45° REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. The value in parenthesis, next to the item description is a unit multiplier. 

Microchip Technology Drawing C04-3199B 

DS20006155C-page 27 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **NOTES:** 

DS20006155C-page 28 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **APPENDIX A: REVISION HISTORY** 

## **Revision A (January 2019)** 

- Initial creation of DSC61xxB Microchip data sheet DS20006155A. 

## **Revision B (December 2021)** 

- Replaced all three package drawings with the most current versions. 

## **Revision C (November 2022)** 

- Added the 7.0 mm x 5.0 mm VDFN, 5.0 mm x 3.2 mm VDFN, and 3.2 mm x 2.5 mm VDFN package options throughout the document. 

- Updated the previously existing package outline drawings to their most current versions. 

DS20006155C-page 29 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **NOTES:** 

DS20006155C-page 30 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **DSC61XXB** 

## **PRODUCT IDENTIFICATION SYSTEM** 

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. 

||**Note 1:**<br>Media Type identifier only appears in the<br>catalog part number description. This<br>identifier is used for ordering purposes and<br>is not printed on the device package. Check<br>with your Microchip Sales Office for package<br>availability with different media options.<br>**Examples:**<br>a) DSC6112JI2B-100.0000:<br>Ultra-Small, Ultra-Low Power MEMS Oscillator,<br>Pin 1 = STDBY<br>with Internal Pull-Up, High Drive<br>Strength, 4-Lead 2.5 mm x 2.0 mm VLGA, Industrial<br>Temperature, ±25 ppm Stability, Revision B,<br>100 MHz Frequency, 140/Tube<br>b) DSC6101HE1B-016.0000T:<br>Ultra-Small, Ultra-Low Power MEMS Oscillator,<br>Pin 1 = OE with Internal Pull-Up, Standard Drive<br>Strength, 4-Lead 1.6 mm x 1.2 mm VFLGA, Extended<br>Commercial Temperature, ±50 ppm Stability,<br>Revision B, 16 MHz Frequency, 1,000/Reel<br>c) DSC6121MI2B-005QB:<br>Ultra-Small, Ultra-Low Power MEMS Oscillator,<br>Pin 1 = Freq. Select with Internal Pull-Up, Standard<br>Drive Strength, 4-Lead 2.0 mm x 1.6 mm VLGA,<br>Industrial Temperature, ±25 ppm Stability, Revision B,<br>Two Frequencies Configured through ClockWorks,<br>3,000/Reel|
|---|---|
|**Note 1:**<br>Please visit Microchip ClockWorks®Configurator Website<br>quency. http://clockworks.microchip.com/timing/.|to configure the part number for customized fre-|



**Note 1:** Please visit Microchip ClockWorks[®] Configurator Website to configure the part number for customized frequency. http://clockworks.microchip.com/timing/. 

DS20006155C-page 31 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

**DSC61XXB** 

## **NOTES:** 

DS20006155C-page 32 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

- **Note the following details of the code protection feature on Microchip products:** 

- Microchip products meet the specifications contained in their particular Microchip Data Sheet. 

- Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. 

- Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. 

- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable" Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. 

This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-supportservices. 

THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. 

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. 

Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 

## **Trademarks** 

The Microchip name and logo, the Microchip logo, Adaptec, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. 

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, Clockstudio, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, InCircuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, IntelliMOS, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, KoD, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, Trusted Time, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. 

The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. 

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. 

All other trademarks mentioned herein are property of their respective companies. 

© 2019 - 2022, Microchip Technology Incorporated and its subsidiaries. 

All Rights Reserved. 

_For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality._ 

ISBN: 978-1-6683-1638-2 

DS20006155C-page 33 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

## **Worldwide Sales and Service** 

## **AMERICAS** 

**Corporate Office** 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com 

**Atlanta** 

Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 

**Austin, TX** Tel: 512-257-3370 

**Boston** Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 

**Chicago** Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 

**Dallas** Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 

**Detroit** Novi, MI Tel: 248-848-4000 

**Houston, TX** Tel: 281-894-5983 

**Indianapolis** Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 

**Los Angeles** Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 

**Raleigh, NC** Tel: 919-844-7510 

**New York, NY** Tel: 631-435-6000 

**San Jose, CA** Tel: 408-735-9110 Tel: 408-436-4270 

**Canada - Toronto** Tel: 905-695-1980 Fax: 905-695-2078 

## **ASIA/PACIFIC** 

**Australia - Sydney** Tel: 61-2-9868-6733 **China - Beijing** Tel: 86-10-8569-7000 

**China - Chengdu** Tel: 86-28-8665-5511 

**China - Chongqing** Tel: 86-23-8980-9588 

**China - Dongguan** Tel: 86-769-8702-9880 

**China - Guangzhou** Tel: 86-20-8755-8029 

**China - Hangzhou** Tel: 86-571-8792-8115 

**China - Hong Kong SAR** Tel: 852-2943-5100 

**China - Nanjing** Tel: 86-25-8473-2460 

**China - Qingdao** Tel: 86-532-8502-7355 

**China - Shanghai** Tel: 86-21-3326-8000 

**China - Shenyang** Tel: 86-24-2334-2829 

**China - Shenzhen** Tel: 86-755-8864-2200 **China - Suzhou** Tel: 86-186-6233-1526 

**China - Wuhan** Tel: 86-27-5980-5300 

**China - Xian** Tel: 86-29-8833-7252 

**China - Xiamen** Tel: 86-592-2388138 

**China - Zhuhai** Tel: 86-756-3210040 

## **ASIA/PACIFIC** 

**India - Bangalore** Tel: 91-80-3090-4444 

**India - New Delhi** Tel: 91-11-4160-8631 

**India - Pune** Tel: 91-20-4121-0141 **Japan - Osaka** Tel: 81-6-6152-7160 

**Japan - Tokyo** Tel: 81-3-6880- 3770 

**Korea - Daegu** Tel: 82-53-744-4301 

**Korea - Seoul** Tel: 82-2-554-7200 

**Malaysia - Kuala Lumpur** Tel: 60-3-7651-7906 

**Malaysia - Penang** Tel: 60-4-227-8870 **Philippines - Manila** Tel: 63-2-634-9065 

**Singapore** Tel: 65-6334-8870 **Taiwan - Hsin Chu** Tel: 886-3-577-8366 

**Taiwan - Kaohsiung** Tel: 886-7-213-7830 

**Taiwan - Taipei** Tel: 886-2-2508-8600 

**Thailand - Bangkok** Tel: 66-2-694-1351 

**Vietnam - Ho Chi Minh** Tel: 84-28-5448-2100 

## **EUROPE** 

**Austria - Wels** Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 

**Denmark - Copenhagen** Tel: 45-4485-5910 Fax: 45-4485-2829 

**Finland - Espoo** Tel: 358-9-4520-820 

**France - Paris** Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 

**Germany - Garching** Tel: 49-8931-9700 

**Germany - Haan** Tel: 49-2129-3766400 **Germany - Heilbronn** Tel: 49-7131-72400 

**Germany - Karlsruhe** Tel: 49-721-625370 

**Germany - Munich** Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 **Germany - Rosenheim** Tel: 49-8031-354-560 

**Israel - Ra’anana** Tel: 972-9-744-7705 

**Italy - Milan** Tel: 39-0331-742611 Fax: 39-0331-466781 

**Italy - Padova** Tel: 39-049-7625286 

**Netherlands - Drunen** Tel: 31-416-690399 Fax: 31-416-690340 

**Norway - Trondheim** Tel: 47-7288-4388 

**Poland - Warsaw** Tel: 48-22-3325737 

**Romania - Bucharest** Tel: 40-21-407-87-50 

**Spain - Madrid** Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 

**Sweden - Gothenberg** Tel: 46-31-704-60-40 

**Sweden - Stockholm** Tel: 46-8-5090-4654 

**UK - Wokingham** Tel: 44-118-921-5800 

Fax: 44-118-921-5820 

DS20006155C-page 34 

 2019 - 2022 Microchip Technology Inc. and its subsidiaries 

09/14/21