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DSC6083CI2A-032K768
Timer, Oscillator & Pulse Generator, 32.768kHz, 1.71V to 3.63V, DFN-4
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: MICROCHIP
- Product type: MEMS Oscillators
- Frequency:32.768kHz; Supply Voltage Min:1.71V; Supply Voltage Max:3.63V; Digital IC Case:DFN; No. of Pins:4Pins; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product Rang
- MSL: MSL 1 - Unlimited
- SVHC: No SVHC (15-Jan-2018)
- Frequency: 32.768kHz
- No. of Pins: 4Pins
- Product Range: -
- Digital IC Case: DFN
- Supply Voltage Max: 3.63V
- Supply Voltage Min: 1.71V
- Operating Temperature Max: 85°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 110 |
| Price | 0.479 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **DSC60XX** ## **Ultra-Small, Ultra-Low Power MEMS Oscillator** ## **Features** - Wide Frequency Range: 2 kHz to 80 MHz - Ultra-Low Power Consumption: 1.3 mA/12 µA (Active/Standby) - Ultra-Small Footprints - 1.6 mm 1.2 mm - 2.0 mm 1.6 mm - 2.5 mm 2.0 mm - 3.2 mm 2.5 mm - Frequency Select Input Supports Two Pre-Defined Frequencies - High Stability: ±25 ppm, ±50 ppm - Wide Temperature Range - Industrial: –40°C to 85°C - Ext. Commercial: –20° to 70°C - Excellent Shock and Vibration Immunity - Qualified to MIL-STD-883 - High Reliability ## **General Description** The DSC60xx family of MEMS oscillators combines industry-leading low-power consumption, ultra-small packages with exceptional frequency stability, and jitter performance over temperature. The single-output DSC60xx MEMS oscillators are excellent choices for use as clock references in small, battery-powered devices such as wearable and Internet of Things (IoT) devices in which small size, low power consumption, and long-term reliability are paramount. They also meet the stringent mechanical durability and reliability requirements within Automotive Electronics Council standard Q100 (AEC-Q100), so they are well suited for under-hood applications as well. The DSC60xx family is available in ultra-small 1.6 mm x 1.2 mm and 2.0 mm x 1.6 mm packages. Other package sizes include: 2.5 mm x 2.0 mm and 3.2 mm x 2.5 mm. These packages are “drop-in” replacements for standard 4-pin CMOS quartz crystal oscillators. - 20x Better MTF Than Quartz Oscillators - Supply Range of 1.71V to 3.63V - Short Sample Lead Time: <2 weeks - Lead Free & RoHS Compliant ## **Applications** - Low Power/Portable Applications: IoT, Embedded/Smart Devices ## **Package Types** **DSC60XX** 3.2 mm x 2.5 mm DFN 2.5 mm x 2.0 mm LGA 2.0 mm x 1.6 mm LGA 1.6 mm x 1.2 mm LGA (Top View) - Consumer: Home Healthcare, Fitness Devices, Home Automation - Automotive: Rear View/Surround View Cameras, Infotainment System - Industrial: Building/Factory Automation, Surveillance Camera **==> picture [134 x 40] intentionally omitted <==** **----- Start of picture text -----**<br> OE/STBY/FS 1 4 VDD<br>GND 2 3 OUT<br>**----- End of picture text -----**<br> DS20005625C-page 1 2017-2018 Microchip Technology Inc. ## **DSC60XX** ## **Block Diagrams** ## **DSC6001/03/11/13/21/23/41/43/51/53/61/63** **==> picture [360 x 311] intentionally omitted <==** **----- Start of picture text -----**<br> DIGITAL SUPPLY<br>CONTROL REGULATION<br>OE/STBY/FS VDD<br>PIN 1 PIN 4<br>MEMS<br>RESONATOR<br>TEMP SENSOR PLL<br>OUTPUT<br>CONTROL & VCO DRIVER<br>DIVIDER<br>COMPENSATION<br>GND OUTPUT<br>PIN 2 PIN 3<br>DSC6083 (kHz Output)<br>SUPPLY<br>REGULATION P4<br>DRIVER<br>P1 VDD<br>OUTPUT<br>MEMS<br>RESONATOR<br>PLL<br>OUTPUT<br>TEMP SENSOR VCO<br>P2 CONTROL & DIVIDER P3<br>GND COMPENSATION DNC<br>**----- End of picture text -----**<br> DS20005625C-page 2 2017-2018 Microchip Technology Inc. **DSC60XX** ## **1.0 ELECTRICAL CHARACTERISTICS** ## **Absolute Maximum Ratings** Supply Voltage .......................................................................................................................................... –0.3V to +4.0V Input Voltage (VIN) ..............................................................................................................................–0.3V to VDD+0.3V ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM ## **ELECTRICAL CHARACTERISTICS** **Electrical Characteristics:** Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to 85°C. |**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**| |---|---|---|---|---|---|---| |**Electrical Characteristics:**Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to 85°C.||||||| |**Parameters**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**| |SupplyVoltageNote 1|VDD|1.71|—|3.63|V|—| |Active Supply Current|IDD|—|1.3|—|mA|FOUT= 24 MHz, VDD= 1.8V,<br>No Load| |||—|1.19|—||FOUT= 32.768 kHz<br>(DSC6083), VDD= 1.8V, No<br>Load| |Power SupplyRamp|tPU|0.1|—|100|ms|Note 9| |Standby Supply Current<br>Note 2|ISTBY|—|12|—|µA|VDD= 1.8/2.5V| |||—|80|—||VDD= 3.3V| |Frequency StabilityNote 3|Δf|—|—|±25<br>±50|ppm|All temp ranges| |Aging|Δf|—|—|±5|ppm|1styear@25°C| |||—|—|±1||Peryear after firstyear| |Startup Time|tSU|—|—|1.3|ms|From 90% VDDto valid clock<br>output, T = 25°C| |Input Logic LevelsNote 4|VIH|0.7 x VDD|—|—|V|Input Logic High| ||VIL|—|—|0.3 x VDD|V|Input Logic Low| |Output Disable Time<br>Note 5|tDA|—|—|200+Period|µs|—| |Output Enable Time<br>Note 6|tEN|—|—|1|µs|—| |Enable Pull-Up Resistor<br>Note 7|—|—|300|—|kΩ|If configured| |Output Logic Levels,<br>Low Drive|VOH|0.8 x VDD|—|—|V|Output Logic High, I = 1 mA| ||VOL|—|—|0.2 x VDD|V|Output Logic Low, I = –1 mA| **Note 1:** Pin 4 VDD should be filtered with 0.1 µF capacitor. - **2:** Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at >3.3V VDD. - **3:** Includes frequency variations due to initial tolerance, temp. and power supply voltage. - **4:** Input waveform must be monotonic with rise/fall time < 10 ms - **5:** Output Disable time takes up to one period of the output waveform + 200 ns. - **6:** For parts configured with OE, not Standby. - **7:** Output is enabled if pad is floated or not connected. - **8:** Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz. - **9:** Time to reach 90% of target VDD. Power ramp rise must be monotonic. DS20005625C-page 3 2017-2018 Microchip Technology Inc. ## **DSC60XX** ## **ELECTRICAL CHARACTERISTICS (CONTINUED)** |**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**| |---|---|---|---|---|---|---|---| ||||||||| |**Electrical Characteristics:**Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to 85°C.|||||||| |**Parameters**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|| |Output Transition Time<br>Rise Time/Fall Time|tRX/tFX|—|2.5|3.5|ns|DSC60x3<br>Low Drive,<br>20% to 80%<br>CL= 5 pF|VDD= 1.8V| |||—|1.5|2.2|||VDD=<br>2.5V/3.3V| ||tRY/tFY|—|1.2|2.0|ns|DSC60x1<br>Std. Drive,<br>20% to 80%<br>CL= 10 pF|VDD= 1.8V| |||—|0.6|1.2|||VDD=<br>2.5V/3.3V| |Frequency|f0|0.002|—|80|MHz|Output on Pin|1 for < 1 MHz| |Output DutyCycle,Note 8|SYM|45|—|55|%|—|| |Period Jitter, RMS|JPER|—|32|40|psRMS|DSC60x3<br>Low Drive,<br>FOUT=<br>27 MHz|VDD= 1.8V| |||—|25|32|||VDD=<br>2.5V/3.3V| |||—|23|30||DSC60x1<br>Std. Drive,<br>FOUT=<br>27 MHz|VDD= 1.8V| |||—|20|28|||VDD=<br>2.5V/3.3V| |Cycle-to-Cycle Jitter<br>(peak)|JCy–Cy|—|180|240|ps|DSC60x3<br>Low Drive,<br>FOUT=<br>27 MHz|VDD= 1.8V| |||—|120|170|||VDD=<br>2.5V/3.3V| |||—|115|190||DSC60x1,<br>Std. Drive,<br>FOUT=<br>27 MHz|VDD= 1.8V| |||—|90|150|||VDD=<br>2.5V/3.3V| - **Note 1:** Pin 4 VDD should be filtered with 0.1 µF capacitor. - **2:** Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at >3.3V VDD. - **3:** Includes frequency variations due to initial tolerance, temp. and power supply voltage. - **4:** Input waveform must be monotonic with rise/fall time < 10 ms - **5:** Output Disable time takes up to one period of the output waveform + 200 ns. - **6:** For parts configured with OE, not Standby. - **7:** Output is enabled if pad is floated or not connected. - **8:** Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz. - **9:** Time to reach 90% of target VDD. Power ramp rise must be monotonic. DS20005625C-page 4 2017-2018 Microchip Technology Inc. **DSC60XX** ## **TEMPERATURE SPECIFICATIONS (Note 1)** |**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**| |---|---|---|---|---|---|---| |**Temperature Ranges**||||||| |Maximum Junction Temperature|TJ|—|—|+150|°C|—| |Ambient OperatingTemperature|TA|–40|—|+85|°C|Industrial| |Ambient OperatingTemperature|TA|–20|—|+70|°C|Extended Commercial| |Storage Ambient Temperature Range|TA|–55|—|+150|°C|—| |SolderingTemperature|TS|—|+260|—|°C|40 sec. max.| **Note 1:** The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. DS20005625C-page 5 2017-2018 Microchip Technology Inc. **DSC60XX** ## **2.0 PIN DESCRIPTIONS** The descriptions of the pins are listed in Table 2-1 and Table 2-2. **TABLE 2-1: DSC6001/03/11/13/21/23/41/43/51/53/61/63 PIN FUNCTION TABLE (OUTPUT ≥1 MHZ)** |**Pin Number**|**Pin Name**|**Pin Type**|**Description**| |---|---|---|---| |1|OE|I|Output Enable: H = Specified Frequency Output,Note 1<br>L = Output is high impedance| ||STBY||Standby: H = Specified Frequency Output,Note 1<br>L = Output is high impedance, Device is in low power<br>mode, Supplycurrent is at ISTBY| ||FS||Frequency Select: H = Output Frequency 1,Note 2<br>L = Output Frequency2| |2|GND|Power|Power supply ground| |3|Output|O|Oscillator clock output| |4|VDD|Power|Power supply,Note 3| **Note 1:** DSC600x/1x/2x has 300 kΩ internal pull-up resistor on pin1. DSC604x/5x/6x has no internal pull-up resistor on pin1 and needs an external pull-up or to be driven by another chip. - **2:** Two pre-programmed frequencies can be configured at http://clockworks.microchip.com/timing/. - **3:** Bypass with 0.1 µF capacitor placed as close to the VDD pin as possible. **TABLE 2-2: DSC6083 PIN FUNCTION TABLE (OUTPUT FREQUENCY <1 MHZ)** |**Pin Number**|**Pin Name**|**Pin Type**|**Description**| |---|---|---|---| |1|Output|O|Oscillator clock output| |2|GND|Power|Power supply ground| |3|DNC|DNC|Do Not Connect| |4|VDD|Power|Power supply,Note 1| **Note 1:** Bypass with 0.1 µF capacitor placed as close to VDD pin as possible. ## **2.1 Output Buffer Options** The DSC60xx family is available in multiple output driver configurations. The low-drive DSC60x3 is configured with a low-power driver that minimizes current consumption and EMI while delivering greater than 1 mA output current at 20%/80% of the supply voltage. The standard-drive DSC60x1 delivers greater than 3 mA output current at 20%/80% of the supply voltage. DS20005625C-page 6 2017-2018 Microchip Technology Inc. **DSC60XX** ## **3.0 DIAGRAMS** **==> picture [427 x 536] intentionally omitted <==** **----- Start of picture text -----**<br> tR tF<br>VOH<br>OUTPUT<br>VOL<br>tEN<br>Fi 1/fo rwan<br>tDA<br>VIH<br>ENABLE<br>VIL<br>=f FR<br>FIGURE 3-1: Output Waveform.<br>IDD<br>4 3<br>VDD + 0.1μF 1 2 CL<br>VDA<br>FIGURE 3-2: Test Circuit.<br>Via to GND Layer<br>C1<br>VDD Output<br>H e<br>Enable GND<br>— | Lo<br>Via to GND Layer<br>**----- End of picture text -----**<br> _**FIGURE 3-3:** Recommended Board Layout._ DS20005625C-page 7 2017-2018 Microchip Technology Inc. **DSC60XX** ## **4.0 SOLDER REFLOW PROFILE** **==> picture [468 x 147] intentionally omitted <==** **----- Start of picture text -----**<br> 20-40<br>Seconds<br>260°C<br>217°C 60-150<br>200°C Seconds<br>Reflow<br>150°C 60-180<br>Seconds<br>25°C<br>Pre-Heat Cool<br>8 minutes max . Time<br>3°C/sec max.<br>3°C/sec max.<br>6C/sec max.°<br>Temperature (°C)<br>**----- End of picture text -----**<br> _**FIGURE 4-1:** Solder Reflow Profile._ **MSL 1 @ 260°C refer to JSTD-020C** |**_FIGURE 4-1:_**<br>_Solder Reflow Profile._|**_FIGURE 4-1:_**<br>_Solder Reflow Profile._| |---|---| |**MSL 1 @ 260°C refer to JSTD-020C**|| |Ramp-UpRate(200°C to Peak Temp)|3°C/sec. max.| |Preheat Time 150°C to 200°C|60 to 180 sec.| |Time maintained above 217°C|60 to 150 sec.| |Peak Temperature|255°C to 260°C| |Time within 5°C of actual Peak|20 to 40 sec.| |Ramp-Down Rate|6°C/sec. max.| |Time 25°C to Peak Temperature|8 minutes max.| DS20005625C-page 8 2017-2018 Microchip Technology Inc. **DSC60XX** ## **5.0 PACKAGING INFORMATION** ## **4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline** ## **4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]** **==> picture [396 x 471] intentionally omitted <==** **----- Start of picture text -----**<br> Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C<br>A A1<br>C<br>SEATING<br>PLANE<br>4X<br>(A3)<br>SIDE VIEW 0.08 C<br>b2 3X b1<br>CH 0.07 C A B<br>1 2 0.03 C<br>CH<br>NOTE 1 e1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br> **==> picture [183 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> Microchip Technology Drawing C04-1199A Sheet 1 of 2<br>**----- End of picture text -----**<br> DS20005625C-page 9 2017-2018 Microchip Technology Inc. ## **DSC60XX** ## **4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline** ## **4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]** **Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging **==> picture [114 x 66] intentionally omitted <==** **==> picture [114 x 66] intentionally omitted <==** |Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS| |---|---|---|---|---| |Dimension Limits||MIN|NOM|MAX| |Number of Terminals|N|4||| |Terminal Pitch|e|1.20 BSC||| |Terminal Pitch|e1|0.75 BSC||| |Overall Height|A|0.79|0.84|0.89| |Standoff|A1|0.00|0.02|0.05| |Substrate Thickness(with Terminals)|A3|0.20 REF||| |Overall Length|D|1.60 BSC||| |Overall Width|E|1.20 BSC||| |Terminal Width|b1|0.25|0.30|0.35| |Terminal Width|b2|0.325|0.375|0.425| |Terminal Length|L|0.30|0.35|0.40| |Terminal 1 Index Chamfer|CH|-|0.125|-| Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. - REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1199A Sheet 2 of 2 DS20005625C-page 10 2017-2018 Microchip Technology Inc. **DSC60XX** ## **4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern** **4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]** **==> picture [396 x 294] intentionally omitted <==** **----- Start of picture text -----**<br> Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>E1<br>X1<br>G1<br>4<br>Y<br>C G2<br>1 2<br>(CH)<br>SILK SCREEN<br>X2<br>E2<br>RECOMMENDED LAND PATTERN<br>**----- End of picture text -----**<br> |Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS| |---|---|---|---|---| |Dimension Limits||MIN|NOM|MAX| |Contact Pitch|E1|1.20 BSC||| |Contact Pitch|E2||1.16 BSC|| |Contact Spacing|C||0.75|| |Contact Width(X3)|X1|||0.35| |Contact Width|X2|||0.43| |Contact Pad Length(X6)|Y|||0.50| |Space Between Contacts(X4)|G1|0.85||| |Space Between Contacts(X3)|G2|0.25||| |Contact 1 Index Chamfer|CH|0.13 X 45° REF||| Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-3199A DS20005625C-page 11 2017-2018 Microchip Technology Inc. **DSC60XX** ## **4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline** ## **4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]** **==> picture [405 x 511] intentionally omitted <==** **----- Start of picture text -----**<br> Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C<br>A1<br>C A<br>SEATING<br>PLANE<br>4X<br>(A3) 0.08 C<br>SIDE VIEW<br>b2 3X b1<br>CH 0.07 C A B<br>1 2 0.03 C<br>CH<br>NOTE 1 e1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>Microchip Technology Drawing C04-1200A Sheet 1 of 2<br>**----- End of picture text -----**<br> DS20005625C-page 12 2017-2018 Microchip Technology Inc. **DSC60XX** ## **4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline (Continued)** ## **4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]** **Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging **==> picture [125 x 72] intentionally omitted <==** **==> picture [124 x 73] intentionally omitted <==** |Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS| |---|---|---|---|---| |Dimension Limits||<br>MIN|NOM|MAX| |Number of Terminals|N|6||| |Terminal Pitch|e|1.55 BSC||| |Terminal Pitch|e1|0.95 BSC||| |Overall Height|A|0.79|0.84|0.89| |Standoff|A1|0.00|0.02|0.05| |Substrate Thickness(with Terminals)|A3|0.20 REF||| |Overall Length|D|2.00 BSC||| |Overall Width|E|1.60 BSC||| |Terminal Width|b1|0.30|0.35|0.40| |Terminal Width|b2|0.40|0.45|0.50| |Terminal Length|L|0.50|0.55|0.60| |Terminal 1 Index Chamfer|CH|-|0.15|-| ## Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M - BSC: Basic Dimension. Theoretically exact value shown without tolerances. - REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1200A Sheet 2 of 2 DS20005625C-page 13 2017-2018 Microchip Technology Inc. **DSC60XX** ## **4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline** ## **4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]** **Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging **==> picture [280 x 205] intentionally omitted <==** **----- Start of picture text -----**<br> X1<br>4<br>Y<br>G2<br>C<br>1 2<br>(CH)<br>G1<br>SILK SCREEN<br>E<br>**----- End of picture text -----**<br> RECOMMENDED LAND PATTERN |Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS| |---|---|---|---|---| |Dimension Limits||MIN|NOM|MAX| |Contact Pitch|E|1.55 BSC||| |Contact Spacing|C||0.95|| |Contact Width(X4)|X1|||0.50| |Contact Width(X2)|X2|||0.40| |Contact Pad Length(X6)|Y|||0.70| |Space Between Contacts(X4)|G1|1.05||| |Space Between Contacts(X3)|G2|0.25||| |Contact 1 Index Chamfer|CH|0.13 X 45° REF||| ## Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-3200A DS20005625C-page 14 2017-2018 Microchip Technology Inc. **DSC60XX** ## **4-Lead VLGA 2.5 mm x 2.0 mm Package Outline** ## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** **==> picture [396 x 471] intentionally omitted <==** **----- Start of picture text -----**<br> Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C<br>A1<br>C A<br>SEATING<br>PLANE<br>4X<br>(A3) SIDE VIEW 0.08 C<br>4X b1<br>CH 0.07 C A B<br>1 2 0.03 C<br>CH<br>NOTE 1 e1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br> Microchip Technology Drawing C04-1202A Sheet 1 of 2 DS20005625C-page 15 2017-2018 Microchip Technology Inc. ## **DSC60XX** ## **4-Lead VLGA 2.5 mm x 2.0 mm Package Outline (Continued)** ## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** **Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging **==> picture [210 x 199] intentionally omitted <==** |Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS| |---|---|---|---|---| |Dimension Limits||MIN|NOM|MAX| |Number of Terminals|N|4||| |Terminal Pitch|e|1.65 BSC||| |Terminal Pitch|e1|1.25 BSC||| |Overall Height|A|0.79|0.84|0.89| |Standoff|A1|0.00|0.02|0.05| |Substrate Thickness(with Terminals)|A3|0.20 REF||| |Overall Length|D|2.50 BSC||| |Overall Width|E|2.00 BSC||| |Terminal Width|b1|0.60|0.65|0.70| |Terminal Length|L|0.60|0.65|0.70| |Terminal 1 Index Chamfer|CH|-|0.225|-| Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M - BSC: Basic Dimension. Theoretically exact value shown without tolerances. - REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1202A Sheet 2 of 2 DS20005625C-page 16 2017-2018 Microchip Technology Inc. **DSC60XX** ## **4-Lead VLGA 2.5 mm x 2.0 mm Recommended Land Pattern** ## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** **Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging **==> picture [280 x 209] intentionally omitted <==** **----- Start of picture text -----**<br> X<br>4<br>Y<br>C G2<br>1 2<br>(CH)<br>G1<br>SILK SCREEN<br>E<br>**----- End of picture text -----**<br> ## RECOMMENDED LAND PATTERN |Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS| |---|---|---|---|---| |Dimension Limits||MIN|NOM|MAX| |Contact Pitch|E|1.65 BSC||| |Contact Spacing|C||1.25|| |Contact Width(X4)|X|||0.70| |Contact Pad Length(X6)|Y|||0.80| |Space Between Contacts(X4)|G1|0.95||| |Space Between Contacts(X3)|G2|0.45||| |Contact 1 Index Chamfer|CH|0.13 X 45° REF||| Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-3202A DS20005625C-page 17 2017-2018 Microchip Technology Inc. ## **DSC60XX** ## **4-Lead CDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern** **Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ## **TITLE** 4 LEAD CDFN 3.2x2.5mm COL PACKAGE OUTLINE & RECOMMENDED LAND PATTERN **==> picture [408 x 12] intentionally omitted <==** **----- Start of picture text -----**<br> DRAWING # CDFN3225-4LD-PL-1 UNIT MM<br>**----- End of picture text -----**<br> **==> picture [406 x 351] intentionally omitted <==** ## NOTE: 1. Green shaded rectangles in Recommended Land Pattern are solder stencil opening. DS20005625C-page 18 2017-2018 Microchip Technology Inc. **DSC60XX** ## **APPENDIX A: REVISION HISTORY** ## **Revision A (September 2016)** - Initial creation of DSC60xx Microchip data sheet DS20005625A. ## **Revision B (September 2017)** - Added Power Supply Ramp value in Electrical Characteristics table. - Redrew diagrams for clarity. No technical content affected. ## **Revision C (November 2018)** - Added a new condition to the Active Supply Current parameter with a new typical value in the Electrical Characteristics table. DS20005625C-page 19 2017-2018 Microchip Technology Inc. **DSC60XX** ## **NOTES:** DS20005625C-page 20 2017-2018 Microchip Technology Inc. **DSC60XX** ## **PRODUCT IDENTIFICATION SYSTEM** To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. ||||||||||||||||||**Examples:**|| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |**PART NO.**|||**X**||**X**||**X**||**X**<br>**X**<br>**X**||**–**|**X**<br>**XX.XXXX**||**X**|||a) DSC6013JI2A-100.0000:|| |**Device**<br>**Pin 1**<br>**Definition**<br>|||||**Package**<br>**Output**<br>**Drive**<br>**Strength**||||**Temperature**<br>**Range**<br>**Frequency**<br>**Stability**<br>**Revision**|||**Frequency**||**Tape**<br>**and**<br>**Reel**|||Ultra–Low Power MEMS Oscillator, Pin1 = Standby<br>with Internal Pull-Up, Low Drive Strength, 4-Lead<br>2.5 mm x 2.0 mm VLGA, Industrial Temperature,|| ||||||||||||||||||±25 ppm Stability, Revision A, 100 MHz Frequency,|| |**Device:**||||||DSC60xx:|||Ultra-Low Power MEMS Oscillator||||||||100/Bag|| ||||||||||||||||||b) DSC6001HE1A-016.0000T:|| |**Pin Definition:**||||||Selection|||Pin 1<br>Internal Pull-Up Register||||||||Ultra–Low Power MEMS Oscillator, Pin1 = OE with|| |||||||0|||OE<br>Pull-up||||||||Internal Pull–Up, Standard Drive Strength, 4-Lead|| |||||||1|||STDBY<br>Pull-up||||||||1.6 mm x 1.2 mm VFLGA, Extended Commercial<br>Temp., ±50 ppm Stability, Revision A, 16 MHz|| |||||||2|||FS<br>Pull-up||||||||Frequency, 1,000/Reel|| |||||||4|||OE<br>None||||||||c) DSC6021MI2A-005Q:|| |||||||5|||STDBY<br>None||||||||Ultra–Low Power MEMS Oscillator, Pin1 = Freq. Select|| |||||||6|||FS<br>None||||||||with Internal Pull-Up, Standard Drive Strength, 4-Lead|| |||||||8|||kHz<br>Output<br>None||||||||2.0 mm x 1.6 mm VFLGA, Industrial Temperature,<br>±25 ppm Stability, Revision A, Two Frequencies<br>Configured through ClockWorks, 100/Bag|| |**Output Drive**<br>**Strength:**||||||1<br>3|||Standard<br>Low||||||||**Note 1:**<br>Tape and Reel identifier only appears in the<br>catalog part number description. This<br>identifier is used for ordering purposes and|| ||||||||||||||||||is not printed on the device package. Check|| |**Packages:**||||||C<br>J||=<br>=|4-Lead 3.2 mm x 2.5 mm DFN<br>4-Lead 2.5 mm x 2.0 mm VLGA||||||||with your Microchip Sales Office for package<br>availability with the Tape and Reel option.|| |||||||M||=|4-Lead 2.0 mm x 1.6 mm VFLGA|||||||||| |||||||H||=|4-Lead 1.6 mm x 1.2 mm VFLGA|||||||||| |**Temperature**||||||E||=|–20C to +70C (Extended|Commercial)||||||||| |**Range:**||||||I||=|–40C to +85C (Industrial)|||||||||| |**Frequency**||||||1||=|± 50 ppm|||||||||| |**Stability:**||||||2||=|± 25 ppm|||||||||| |**Revision:**||||||A||=|Revision A|||||||||| |**Frequency:**||||||xxx.xxxx =|||User-Defined Frequency between|||||||||| ||||||||||001.0000 MHz and 80.0000||MHz|||||||| |||||||xxxkxxx =|||User-Defined Frequency between 002.000 kHz|||||||||| ||||||||||and 999.999 kHz|||||||||| |||||||xxxx||=|Frequency configuration code when pin 1 = FS.|||||||||| ||||||||||Configure the part online through ClockWorks|||||||||| ||||||||||configurator.|||||||||| |**Tape and Reel:**||||||<blank>=|||100/Bag|||||||||| |||||||T||=|1,000/Reel|||||||||| |||||||||||||||||||| **Note 1:** Please visit Microchip ClockWorks[®] Configurator Website to configure the part number for customized frequency. http://clockworks.microchip.com/timing/. DS20005625C-page 21 2017-2018 Microchip Technology Inc. **DSC60XX** ## **NOTES:** DS20005625C-page 22 2017-2018 Microchip Technology Inc. ## **Note the following details of the code protection feature on Microchip devices:** - Microchip products meet the specification contained in their particular Microchip Data Sheet. - Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. - There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. - Microchip is willing to work with the customer who is concerned about the integrity of their code. - Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE **.** Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. _Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC[®] MCUs and dsPIC[®] DSCs, KEELOQ[®] code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified._ ## **QUALITY MANAGEMENT SYSTEM** ## **CERTIFIED BY DNV** ## **Trademarks** The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. - © 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-3842-7 ## == == **ISO/TS 16949** DS20005625C-page 23 2017-2018 Microchip Technology Inc. ## **Worldwide Sales and Service** ## **AMERICAS** **Corporate Office** 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com **Atlanta** Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 **Austin, TX** Tel: 512-257-3370 **Boston** Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 **Chicago** Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 **Dallas** Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 **Detroit** Novi, MI Tel: 248-848-4000 **Houston, TX** Tel: 281-894-5983 **Indianapolis** Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 **Los Angeles** Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 **Raleigh, NC** Tel: 919-844-7510 **New York, NY** Tel: 631-435-6000 **San Jose, CA** Tel: 408-735-9110 Tel: 408-436-4270 **Canada - Toronto** Tel: 905-695-1980 Fax: 905-695-2078 ## **ASIA/PACIFIC** **Australia - Sydney** Tel: 61-2-9868-6733 **China - Beijing** Tel: 86-10-8569-7000 **China - Chengdu** Tel: 86-28-8665-5511 **China - Chongqing** Tel: 86-23-8980-9588 **China - Dongguan** Tel: 86-769-8702-9880 **China - Guangzhou** Tel: 86-20-8755-8029 **China - Hangzhou** Tel: 86-571-8792-8115 **China - Hong Kong SAR** Tel: 852-2943-5100 **China - Nanjing** Tel: 86-25-8473-2460 **China - Qingdao** Tel: 86-532-8502-7355 **China - Shanghai** Tel: 86-21-3326-8000 **China - Shenyang** Tel: 86-24-2334-2829 **China - Shenzhen** Tel: 86-755-8864-2200 **China - Suzhou** Tel: 86-186-6233-1526 **China - Wuhan** Tel: 86-27-5980-5300 **China - Xian** Tel: 86-29-8833-7252 **China - Xiamen** Tel: 86-592-2388138 **China - Zhuhai** Tel: 86-756-3210040 ## **ASIA/PACIFIC** **India - Bangalore** Tel: 91-80-3090-4444 **India - New Delhi** Tel: 91-11-4160-8631 **India - Pune** Tel: 91-20-4121-0141 **Japan - Osaka** Tel: 81-6-6152-7160 **Japan - Tokyo** Tel: 81-3-6880- 3770 **Korea - Daegu** Tel: 82-53-744-4301 **Korea - Seoul** Tel: 82-2-554-7200 **Malaysia - Kuala Lumpur** Tel: 60-3-7651-7906 **Malaysia - Penang** Tel: 60-4-227-8870 **Philippines - Manila** Tel: 63-2-634-9065 **Singapore** Tel: 65-6334-8870 **Taiwan - Hsin Chu** Tel: 886-3-577-8366 **Taiwan - Kaohsiung** Tel: 886-7-213-7830 **Taiwan - Taipei** Tel: 886-2-2508-8600 **Thailand - Bangkok** Tel: 66-2-694-1351 **Vietnam - Ho Chi Minh** Tel: 84-28-5448-2100 ## **EUROPE** **Austria - Wels** Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 **Denmark - Copenhagen** Tel: 45-4450-2828 Fax: 45-4485-2829 **Finland - Espoo** Tel: 358-9-4520-820 **France - Paris** Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 **Germany - Garching** Tel: 49-8931-9700 **Germany - Haan** Tel: 49-2129-3766400 **Germany - Heilbronn** Tel: 49-7131-67-3636 **Germany - Karlsruhe** Tel: 49-721-625370 **Germany - Munich** Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 **Germany - Rosenheim** Tel: 49-8031-354-560 **Israel - Ra’anana** Tel: 972-9-744-7705 **Italy - Milan** Tel: 39-0331-742611 Fax: 39-0331-466781 **Italy - Padova** Tel: 39-049-7625286 **Netherlands - Drunen** Tel: 31-416-690399 Fax: 31-416-690340 **Norway - Trondheim** Tel: 47-7288-4388 **Poland - Warsaw** Tel: 48-22-3325737 **Romania - Bucharest** Tel: 40-21-407-87-50 **Spain - Madrid** Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 **Sweden - Gothenberg** Tel: 46-31-704-60-40 **Sweden - Stockholm** Tel: 46-8-5090-4654 **UK - Wokingham** Tel: 44-118-921-5800 Fax: 44-118-921-5820 DS20005625C-page 24 2017-2018 Microchip Technology Inc. 08/15/18
Updated at April 29, 2026
Microchip Technology Inc. is a leading global provider of smart, connected, and secure embedded control solutions. Known for enabling engineers to design with confidence, the company delivers a comprehensive product portfolio that reduces total system costs and accelerates time to market across the industrial, automotive, communications, and computing sectors. Our extensive selection of Microchip components highlights the manufacturer's strength in both discrete semiconductors and advanced wireless connectivity. We carry a robust lineup of highly efficient single MOSFETs and Schottky diodes tailored for demanding power management and switching applications. Alongside these essential discretes, engineers can source a wide array of ready-to-use networking modules, prominently featuring Bluetooth and WLAN adapters that streamline the development of modern IoT and connected devices. Rounding out the offering is a diverse range of Microchip integrated circuits and specialized components. This includes versatile I/O expanders for simplified system integration, precision timing solutions such as MEMS oscillators and pulse generators, as well as AC/DC LED driver ICs and sub-2.4GHz RF transceivers. Backed by Microchip's renowned commitment to exceptional quality and reliable performance, these components provide scalable, dependable building blocks for complex electronic designs.
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