DSC6011JI2B-016.0000

## **DSC60XXB** 

## **Ultra-Small, Ultra-Low Power MEMS Oscillator** 

## **Features** 

- Wide Frequency Range: 2 kHz to 80 MHz 

- Ultra-Low Power Consumption: 1.3 mA/1 µA (Active/Standby) 

- Ultra-Small Footprints 

- 1.6 mm x 1.2 mm VFLGA 

- 2.0 mm x 1.6 mm VFLGA 

- 2.5 mm x 2.0 mm VLGA 

- 3.2 mm x 2.5 mm VDFN 

- 5.0 mm x 3.2 mm VDFN 

- 7.0 mm x 5.0 mm VDFN 

- Frequency Select Input Supports Two Pre-Defined Frequencies 

- High Stability: ±20 ppm, ±25 ppm, ±50 ppm 

- Wide Temperature Range 

- Automotive: –40°C to +125°C 

- For AEC-Q100 Qualified, Refer to DSA60xx Family 

- Ext. Industrial: –40°C to +105°C 

- Industrial: –40°C to +85°C 

- Ext. Commercial: –20° to +70°C 

- Excellent Shock and Vibration Immunity 

- Qualified to MIL-STD-883 

- High Reliability 

- 20x Better MTF Than Quartz Oscillators 

- Supply Range of 1.71V to 3.63V 

- Short Sample Lead Time: <2 weeks 

- Lead Free & RoHS Compliant 

## **General Description** 

The DSC60xxB family of MEMS oscillators combines industry-leading low-power consumption, ultra-small packages with exceptional frequency stability, and jitter performance over temperature. The single-output DSC60xxB MEMS oscillators are excellent choices for use as clock references in small, battery-powered devices such as wearable and Internet of Things (IoT) devices in which small size, low power consumption, and long-term reliability are paramount. The Automotive Grade AEC-Q100 qualified option is available for this device. 

The DSC60xxB family is available in 1.6 mm x 1.2 mm & 2.0 mm x 1.6 mm VFLGA, 7.0 mm x 5.0 mm, 5.0 mm x 3.2 mm, & 3.2 mm x 2.5 mm VDFN, and 2.5 mm x 2.0 mm VLGA packages. These packages are “drop-in” replacements for standard 4-pin CMOS quartz crystal oscillators. 

## **Package Types** 

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DSC60xxB<br>**----- End of picture text -----**<br>


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7.0 mm x 5.0 mm VDFN<br>(Top View)<br>OE/STDBY/FS 1 4 VDD<br>EP<br>GND 2 3 OUT<br>**----- End of picture text -----**<br>


## **Applications** 

- Low Power/Portable Applications: IoT, Embedded/Smart Devices 

- Consumer: Home Healthcare, Fitness Devices, Home Automation 

- Automotive: Rear View/Surround View Cameras, Infotainment System (Please refer to DSA60xx Family) 

- Industrial: Building/Factory Automation, Surveillance Camera 

## **DSC60xxB** 

5.0 mm x 3.2 mm VDFN 3.2 mm x 2.5 mm VDFN 2.5 mm x 2.0 mm VLGA 2.0 mm x 1.6 mm VFLGA 1.6 mm x 1.2 mm VFLGA (Top View) 

**==> picture [140 x 59] intentionally omitted <==**

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OE/STDBY/FS 1 4 VDD<br>GND 2 3 OUT<br>**----- End of picture text -----**<br>


DS20006133C-page 1 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **Block Diagram** 

**==> picture [469 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
DSC60xxB<br>DIGITAL SUPPLY<br>CONTROL REGULATION<br>OE/STBY/FS VDD<br>PIN 1 PIN 4<br>MEMS<br>RESONATOR<br>TEMP SENSOR PLL<br>OUTPUT<br>CONTROL & VCO DRIVER<br>DIVIDER<br>COMPENSATION<br>GND OUTPUT<br>PIN 2 PIN 3<br>**----- End of picture text -----**<br>


DS20006133C-page 2 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **1.0 ELECTRICAL CHARACTERISTICS** 

## **Absolute Maximum Ratings** 

Supply Voltage .......................................................................................................................................... –0.3V to +4.0V Input Voltage (VIN) ..............................................................................................................................–0.3V to VDD+0.3V ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM 

## **ELECTRICAL CHARACTERISTICS** 

**Electrical Characteristics:** Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C. 

|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**|
|---|---|---|---|---|---|---|
|**Electrical Characteristics:**Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to +125°C.|||||||
|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|SupplyVoltageNote 1|VDD|1.71|—|3.63|V|—|
|Active Supply Current|IDD|—|1.3|—|mA|FOUT= 24 MHz, VDD= 1.8V,<br>No Load|
|Power SupplyRamp|tPU|0.1|—|100|ms|Note 9|
|Standby Supply Current<br>Note 2|ISTBY|—|1.0|—|µA|VDD= 1.8/2.5V|
|||—|1.5|—||VDD= 3.3V|
|Frequency|f0|0.002|—|80|MHz|—|
|Frequency StabilityNote 3|Δf|—|—|±20<br>±25<br>±50|ppm|All temp ranges|
|Aging|Δf|—|—|±5|ppm|1styear@25°C|
|||—|—|±1||Peryear after firstyear|
|Startup Time|tSU|—|—|1.5|ms|From 90% VDDto valid clock<br>output, T = 25°C|
|Input Logic Levels<br>Note 4|VIH|0.7 x VDD|—|—|V|Input Logic High|
||VIL|—|—|0.3 x VDD|V|Input Logic Low|
|Output Disable Time<br>Note 5|tDA|—|—|200 +<br>2 Periods|ns|—|
|Output Enable Time<br>Note 6|tEN|—|—|1|µs|—|
|Enable Pull-Up Resistor<br>Note 7|—|—|300|—|kΩ|If configured|
|Output Logic Levels,<br>Low Drive|VOH|0.8 x VDD|—|—|V|Output Logic High, I = 1 mA|
||VOL|—|—|0.2 x VDD|V|Output Logic Low, I = –1 mA|



- **Note 1:** Pin 4 VDD should be filtered with 0.1 µF capacitor. 

   - **2:** Not including current through pull-up resistor on EN pin (if configured). 

   - **3:** Includes frequency variations due to initial tolerance, temp. and power supply voltage. 

   - **4:** Input waveform must be monotonic with rise/fall time < 10 ms 

   - **5:** Output Disable time takes up to two periods of the output waveform + 200 ns. 

   - **6:** For parts configured with OE, not Standby. 

   - **7:** Output is enabled if pad is floated or not connected. 

   - **8:** Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz. 

   - **9:** Time to reach 90% of target VDD. Power ramp rise must be monotonic. 

   - **10:** Peak-to-peak period jitter is measured over 10,000 cycles. 

DS20006133C-page 3 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **ELECTRICAL CHARACTERISTICS (CONTINUED)** 

**Electrical Characteristics:** Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C. 

|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|
|---|---|---|---|---|---|---|---|
|**Electrical Characteristics:**Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to +125°C.||||||||
|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**||
|Output Transition Time<br>Rise Time/Fall Time|tRX/tFX|—|2.5|3.5|ns|DSC60x3B<br>Low Drive,<br>20% to 80%<br>CL= 5 pF|VDD= 1.8V|
|||—|1.5|2.2|||VDD=<br>2.5V/3.3V|
||tRY/tFY|—|1.2|2.0|ns|DSC60x1B<br>Std. Drive,<br>20% to 80%<br>CL= 10 pF|VDD= 1.8V|
|||—|0.6|1.2|||VDD=<br>2.5V/3.3V|
|Output DutyCycleNote 8|SYM|45|—|55|%|—||
|Period Jitter, RMS|JPER|—|28|—|ps|DSC60x3B<br>Low Drive,<br>FOUT=<br>27 MHz<br>CL= 5 pF|VDD= 1.8V|
|||—|23|—|||VDD=<br>2.5V/3.3V|
|||—|20|—||DSC60x1B<br>Std. Drive,<br>FOUT=<br>27 MHz<br>CL= 10 pF|VDD= 1.8V|
|||—|18|—|||VDD=<br>2.5V/3.3V|
|Cycle-to-Cycle Jitter, Peak|JCy–Cy|—|120|—|ps|DSC60x3B<br>Low Drive,<br>FOUT=<br>27 MHz<br>CL= 5 pF|VDD= 1.8V|
|||—|90|—|||VDD=<br>2.5V/3.3V|
|||—|115|—||DSC60x1B<br>Std. Drive,<br>FOUT=<br>27 MHz<br>CL= 10 pF|VDD= 1.8V|
|||—|90|—|||VDD=<br>2.5V/3.3V|



- **Note 1:** Pin 4 VDD should be filtered with 0.1 µF capacitor. 

   - **2:** Not including current through pull-up resistor on EN pin (if configured). 

   - **3:** Includes frequency variations due to initial tolerance, temp. and power supply voltage. 

   - **4:** Input waveform must be monotonic with rise/fall time < 10 ms 

   - **5:** Output Disable time takes up to two periods of the output waveform + 200 ns. 

   - **6:** For parts configured with OE, not Standby. 

   - **7:** Output is enabled if pad is floated or not connected. 

   - **8:** Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz. 

   - **9:** Time to reach 90% of target VDD. Power ramp rise must be monotonic. 

   - **10:** Peak-to-peak period jitter is measured over 10,000 cycles. 

DS20006133C-page 4 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **ELECTRICAL CHARACTERISTICS (CONTINUED)** 

|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|**ELECTRICAL CHARACTERISTICS(CONTINUED)**|
|---|---|---|---|---|---|---|---|
|||||||||
|**Electrical Characteristics:**Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to +125°C.||||||||
|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**||
|Period Jitter,<br>Peak-to-Peak,Note 10|JPERPK-PK|—|210|—|ps|DSC60x3B<br>Low Drive,<br>FOUT=<br>27 MHz<br>CL= 5 pF|VDD= 1.8V|
|||—|190|—|||VDD=<br>2.5V/3.3V|
|||—|160|—||DSC60x1B<br>Std. Drive,<br>FOUT=<br>27 MHz<br>CL= 10 pF|VDD= 1.8V|
|||—|144|—|||VDD=<br>2.5V/3.3V|



**Note 1:** Pin 4 VDD should be filtered with 0.1 µF capacitor. 

- **2:** Not including current through pull-up resistor on EN pin (if configured). 

- **3:** Includes frequency variations due to initial tolerance, temp. and power supply voltage. 

- **4:** Input waveform must be monotonic with rise/fall time < 10 ms 

- **5:** Output Disable time takes up to two periods of the output waveform + 200 ns. 

- **6:** For parts configured with OE, not Standby. 

- **7:** Output is enabled if pad is floated or not connected. 

- **8:** Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz. 

- **9:** Time to reach 90% of target VDD. Power ramp rise must be monotonic. 

- **10:** Peak-to-peak period jitter is measured over 10,000 cycles. 

DS20006133C-page 5 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **TEMPERATURE SPECIFICATIONS (Note 1)** 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|**Temperature Ranges**|||||||
|Maximum Junction Temperature|TJ|—|—|+150|°C|—|
|Storage Ambient Temperature Range|TS|–55|—|+150|°C|—|
|SolderingTemperature|—|—|+260|—|°C|40 sec. max.|



**Note 1:** The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. 

DS20006133C-page 6 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **2.0 PIN DESCRIPTIONS** 

The DSC60xxB is a highly configurable device and can be factory programmed in many different ways to meet the customer’s needs. Microchip’s ClockWorks[®] Configurator http://clockworks.microchip.com/Timing/ must be used to choose the necessary options, create the final part number, data sheet, and order samples. The descriptions of the pins are listed in Table 2-1. 

**TABLE 2-1: DSC60XXB PIN FUNCTION TABLE** 

|**Pin Number**|**Pin Name**|**Pin Name**|**Description**|
|---|---|---|---|
|1||OE|Output Enable: H = Active, L = Disabled(High Impedance).|
|||STDBY|Standby: H = Device is active, L = Device is in standby (Low<br>Power Mode).|
|||FS|Frequency Select: H = Output Frequency 1, L = Output<br>Frequency2.|
|2||GND|Ground.|
|3|OUTPUT||Oscillator clock output|
|4|VDD||Power Supply: 1.71V to 3.63V.|



An explanation of the different options listed in Table 2-1 follows. 

## **2.1 Pin 1** 

This is a control pin and may be configured to fulfill one of six different functions. If not actively driven, a 10 kΩ pull-up resistor is recommended. 

## 2.1.1 OUTPUT ENABLE (OE) 

Pin 1 may be configured as OE. Oscillator output may be turned on and off according to the state of this pin. 

## 2.1.2 STDBY 

Pin 1 may be configured as Standby. When the pin is low, both output buffer and PLL will be off and the device will enter a low power mode. 

## 2.1.3 FREQUENCY SELECT (FS) 

Pin 1 may be configured as FS. The output may be set to one of two pre-programmed frequencies. The output clock frequencies can only be set to either kHz or MHz. A combination of kHz and MHz cannot be set. 

## **2.2 Pins 2 through 4** 

Pins 2 and 4 are the supply terminals, GND and VDD respectively. Pin 3 is the clock output, programmable to Standard and Low Drive strength settings. Visit ClockWorks[®] Configurator to customize your device. 

DS20006133C-page 7 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **3.0 DIAGRAMS** 

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tR tF<br>VOH<br>OUTPUT<br>VOL<br>1/fo tEN<br>tDA<br>VIH<br>ENABLE<br>VIL<br>en<br>a<br>Output Waveform.<br>IDD<br>4 3<br>VDD 0.1μF 1 2 CL<br>VDA<br>TE7<br>Test Circuit.<br>Via to GND Layer<br>i<br>C1<br>VDD Output<br>— : |<br>Enable GND<br>—_|L2o<br>Via to GND Layer<br>**----- End of picture text -----**<br>


_**FIGURE 3-1:** Output Waveform._ 

_**FIGURE 3-2:**_ 

_**FIGURE 3-3:** Recommended Board Layout._ 

DS20006133C-page 8 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4.0 SOLDER REFLOW PROFILE** 

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20-40<br>Seconds<br>260°C<br>217°C 60-150<br>200°C Seconds<br>Reflow<br>150°C 60-180<br>Seconds<br>25°C<br>Pre-Heat Cool<br>8 minutes max . Time<br>3°C/sec max.<br>3°C/sec max.<br>6C/sec max.°<br>Temperature  (°C)<br>**----- End of picture text -----**<br>


## _**FIGURE 4-1:** Solder Reflow Profile._ 

|**_FIGURE 4-1:_**<br>_Solder Reflow Profile._|**_FIGURE 4-1:_**<br>_Solder Reflow Profile._|
|---|---|
|**MSL 1 @ 260°C refer to JSTD-020C**||
|Ramp-UpRate(200°C to Peak Temp)|3°C/sec. max.|
|Preheat Time 150°C to 200°C|60 to 180 sec.|
|Time maintained above 217°C|60 to 150 sec.|
|Peak Temperature|255°C to 260°C|
|Time within 5°C of actual Peak|20 to 40 sec.|
|Ramp-Down Rate|6°C/sec. max.|
|Time 25°C to Peak Temperature|8 minutes max.|



DS20006133C-page 9 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **5.0 PACKAGING INFORMATION** 

## **5.1 Package Marking Information** 

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4-Lead<br>7.0mm x 5.0mm VDFN*<br>5.0mm x 3.2mm VDFN*<br>3.2mm x 2.5mm VDFN*<br>Example<br>2.5mm x 2.0mm VLGA*<br>XXXXXXX 0400000<br>XXXYYWW DAP1834<br>0SSS 0287<br>4-Lead VFLGA*<br>2.0mm x 1.6mm<br>Example<br>1.6mm x 1.2mm<br>XXXX 011H<br>SSS 502<br>**----- End of picture text -----**<br>


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Legend: XX...X Product code or customer-specific information<br>Y Year code (last digit of calendar year)<br>YY Year code (last 2 digits of calendar year)<br>WW Week code (week of January 1 is week ‘01’)<br>SSS Alphanumeric traceability code<br>e3 Pb-free JEDEC [®]  designator for Matte Tin (Sn)<br>* This package is Pb-free. The Pb-free JEDEC designator (     )e3<br>can be found on the outer packaging for this package.<br>●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle<br>mark).<br>Note : In the event the full Microchip part number cannot be marked on one line, it will<br>be carried over to the next line, thus limiting the number of available<br>characters for customer-specific information. Package may or may not include<br>the corporate logo.<br>Underbar (_) and/or Overbar (‾) symbol may not be to scale.<br>**----- End of picture text -----**<br>


DS20006133C-page 10 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Dual Flatpack, No Lead Package (JZA) - 7x5x0.9 mm Body [VDFN] With 2.2x3.5 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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D A<br>B<br>4<br>E<br>(DATUM B)<br>(DATUM A)<br>2X<br>0.10 C<br>1 2<br>2X<br>NOTE 1<br>0.10 C<br>TOP VIEW<br>A1<br>0.10 C<br>C<br>A<br>SEATING<br>PLANE<br>4X<br>(A3) SIDE VIEW 0.08 C<br>0.10 C A B<br>D2<br>1.50 Ref<br>1 2<br> 1.00 Ref 0.10 C A B<br>C0.25<br>2.60 Ref E2<br>4<br>4X b<br>L<br>0.10 C A B<br>e<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1025-JZA Rev B Sheet 1 of 2 

© 2024 Microchip Technology Inc. 

DS20006133C-page 11 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **4-Lead Very Thin Dual Flatpack, No Lead Package (JZA) - 7x5x0.9 mm Body [VDFN] With 2.2x3.5 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|004|||
|Pitch|e|5.08 Ref|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|-|0.05|
|Terminal Thickness|A3|0.203 Ref|||
|Overall Length|D|6.90|7.00|7.10|
|Exposed Pad Length|D2|2.10|2.20|2.30|
|Overall Width|E|4.90|5.00|5.10|
|Exposed Pad Width|E2|3.40|3.50|3.60|
|Terminal Width|b|1.35|1.40|1.45|
|Terminal Length|L|1.10|1.20|1.30|



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the pin 1 area. 

2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1025-JZA Rev B Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20006133C-page 12 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Dual Flatpack, No Lead Package [JZA] - 7x5x0.9 mm Body [VDFN] With 2.2x3.5 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [276 x 249] intentionally omitted <==**

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C1<br>X2 X1<br>4 3<br>C2 Y2<br>ØV<br>EV<br>Y1<br>1 2<br>G1<br>EV<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

SILK SCREEN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Optional Center Pad Width|X2|||2.30|
|Optional Center Pad Length|Y2|||3.60|
|Contact Pad Spacing|C1||5.08||
|Contact Pad Spacing|C2||3.90||
|Contact Pad Width(Xnn)|X1|||1.50|
|Contact Pad Length(Xnn)|Y1|||1.30|
|Contact Pad to Center Pad(Xnn)|G1|0.69|||
|Thermal Via Diameter|V||0.33||
|Thermal Via Pitch|EV||1.20||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 

Microchip Technology Drawing  C04-3025-JZA Rev B 

© 2024 Microchip Technology Inc. 

DS20006133C-page 13 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Plastic Dual Flat, No Lead Package (H6A) - 5x3.2 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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D A<br>B<br>4 3<br>(DATUM B)<br>E<br>(DATUM A)<br>2X<br>0.05 C<br>1 2<br>2X<br>NOTE 1<br>0.05 C<br>TOP VIEW<br>(A3) 0.10 C<br>C<br>A<br>SEATING<br>PLANE<br>SIDE VIEW 4X<br>A1<br>0.08 C<br>(b1) NOTE 1 (CH)<br>(L1)<br>1 2<br>(L2) (K)<br>DETAIL A<br>ALTERNATE PIN 1<br>CONFIGURATION L<br>4 3<br>4X b<br>e 0.08 C A B<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1008-H6A Rev C Sheet 1 of 2 

DS20006133C-page 14 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Plastic Dual Flat, No Lead Package (H6A) - 5x3.2 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

Notes: 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||<br>MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Pitch|e|2.54 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Terminal Thickness|A3|0.20 REF|||
|Overall Length|D|5.00 BSC|||
|Overall Width|E|3.20 BSC|||
|Terminal Width|b|1.15|1.20|1.25|
|Terminal 1 Tab|b1|0.10 REF|||
|Terminal Length|L|0.80|0.90|1.00|
|Terminal Pull Back|L1|0.10 REF|||
|Terminal 1 Tab|L2|0.20 REF|||
|Terminal 1 Chamfer|CH|0.25 REF|||
|Terminal Spacing|K|1.20 REF|||



1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing C04-1008-H6A Rev C Sheet 2 of 2 

DS20006133C-page 15 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **4-Lead Very Thin Plastic Dual Flat, No Lead Package (H6A) - 5x3.2 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [387 x 222] intentionally omitted <==**

**----- Start of picture text -----**<br>
E<br>E2 EDGE OF PACKAGE<br>4 3<br>C G1<br>Y1<br>1 2<br>X1<br>SILK SCREEN<br>G2<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E||2.54||
|g<br>nic<br>a<br>p<br>S<br>d<br>a<br>P<br>tc<br>a<br>t<br>n<br>o<br>C|C||0<br>0<br>.<br>2||
|)<br>4<br>X<br>(<br>h<br>t<br>di<br>W<br>d<br>a<br>P<br>tc<br>a<br>t<br>n<br>o<br>C|1<br>X|||0<br>4<br>.<br>1|
|Contact Pad Length(X4)|Y1||||
|Contact Pad to Center Pad(X2)|G1|1.00||1.10|
|Contact Pad to Contact Pad(X2)|G2|1.14|||
|Terminal 1 Contact Pad Chamfer|CH||0.30||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

Microchip Technology Drawing  C04-3008 Rev C 

DS20006133C-page 16 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [306 x 472] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.05 C<br>2X<br>0.05 C TOP VIEW<br>0.05 C<br>C A<br>SEATING A1<br>PLANE<br>4X<br>(A3) SIDE VIEW 0.05 C<br>e<br>1 2<br>(CH)<br>NOTE 1<br>L<br>N<br>4X b<br>0.10 C A B<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing C04-1006-H4A Rev C Sheet 1 of 2 

© 2024 Microchip Technology Inc. 

DS20006133C-page 17 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Pitch|e|2.10 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|3.20 BSC|||
|Overall Width|E|2.50 BSC|||
|Terminal Width|b|0.85|0.90|0.95|
|Terminal Length|L|0.70|0.80|0.90|
|Terminal 1 Index Chamfer|CH|0.25 REF|||



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing C04-1006-H4A Rev C Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20006133C-page 18 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [356 x 281] intentionally omitted <==**

**----- Start of picture text -----**<br>
X<br>4<br>Y<br>C<br>(CH)<br>1 2<br>E<br>SILK SCREEN<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|2.10 BSC|||
|Contact Pad Spacing|C||1.80||
|Contact Pad Width(X4)|X|||0.90|
|Contact Pad Length(X4)|Y|||1.00|
|Contact 1 Index Chamfer|CH|0.20 REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-3006-H4A Rev C 

- © 2024 Microchip Technology Inc. 

DS20006133C-page 19 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [220 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>**----- End of picture text -----**<br>


**==> picture [311 x 288] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.10 C<br>A1<br>C A<br>SEATING<br>PLANE<br>4X<br>(A3) SIDE VIEW 0.08 C<br>4X b1<br>0.07 C A B<br>1 2 0.03 C<br>(CH)<br>e1<br>NOTE 1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1202-AUA Rev C Sheet 1 of 2 

© 2024 Microchip Technology Inc. 

DS20006133C-page 20 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Terminal Pitch|e|1.65 BSC|||
|Terminal Pitch|e1|1.25 BSC|||
|Overall Height|A|0.79|0.84|0.89|
|Standoff|A1|0.00|0.02|0.05|
|Substrate Thickness(with Terminals)|A3|0.20 REF|||
|Overall Length|D|2.50 BSC|||
|Overall Width|E|2.00 BSC|||
|Terminal Width|b1|0.60|0.65|0.70|
|Terminal Length|L|0.60|0.65|0.70|
|Terminal 1 Index Chamfer|CH|-|0.225|-|



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1202-AUA Rev C Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20006133C-page 21 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [292 x 218] intentionally omitted <==**

**----- Start of picture text -----**<br>
X<br>4<br>Y<br>C G2<br>1 2<br>(CH)<br>G1<br>SILK SCREEN<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|1.65 BSC|||
|Contact Spacing|C||1.25||
|Contact Width(X4)|X|||0.70|
|Contact Pad Length(X4)|Y|||0.80|
|Space Between Contacts(X2)|G1|0.95|||
|Space Between Contacts(X2)|G2|0.45|||
|Contact 1 Index Chamfer|CH|0.13 X 45° REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

Microchip Technology Drawing C04-3202-AUA Rev C 

© 2024 Microchip Technology Inc. 

DS20006133C-page 22 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [324 x 448] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C<br>A1<br>C A<br>SEATING<br>PLANE<br>4X<br>(A3) 0.08 C<br>SIDE VIEW<br>b2 3X b1<br>0.07 C A B<br>1 2 0.03 C<br>(CH)<br>NOTE 1 e1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1200-ASA Rev E Sheet 1 of 2 

© 2024 Microchip Technology Inc. 

DS20006133C-page 23 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## **4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Terminal Pitch|e|1.55 BSC|||
|Terminal Pitch|e1|0.95 BSC|||
|Overall Height|A|0.79|0.84|0.89|
|Standoff|A1|0.00|0.02|0.05|
|Substrate Thickness(with Terminals)|A3|0.20 REF|||
|Overall Length|D|2.00 BSC|||
|Overall Width|E|1.60 BSC|||
|Terminal Width|b1|0.30|0.35|0.40|
|Terminal Width|b2|0.40|0.45|0.50|
|Terminal Length|L|0.50|0.55|0.60|
|Terminal 1 Index Chamfer|CH|-|0.15|-|



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1200-ASA Rev E Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20006133C-page 24 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [295 x 233] intentionally omitted <==**

**----- Start of picture text -----**<br>
X2<br>G3<br>4<br>Y<br>G2<br>C<br>1 2<br>(CH)<br>G1<br>SILK SCREEN<br>X1<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|1.55 BSC|||
|Contact Spacing|C||0.95||
|Contact Width(X1)|X1|||0.50|
|Contact Width(X3)|X2|||0.40|
|Contact Pad Length(X4)|Y|||0.70|
|Space Between Contacts|G1|1.05|||
|Space Between Contacts|G2|0.25|||
|Space Between Contacts|G3|1.15|||
|Contact 1 Index Chamfer|CH|0.13 X 45° REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

Microchip Technology Drawing C04-3200-ASA Rev E 

© 2024 Microchip Technology Inc. 

DS20006133C-page 25 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [326 x 452] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>NOTE 1 E<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C<br>A A1<br>C<br>SEATING<br>PLANE<br>4X<br>(A3)<br>SIDE VIEW 0.08 C<br>b2 3X b1<br>CH 0.07 C A B<br>1 2 0.03 C<br>CH<br>NOTE 1 e1<br>e1<br>2<br>4X L<br>N<br>e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1199B Sheet 1 of 2 

DS20006133C-page 26 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [120 x 70] intentionally omitted <==**

**==> picture [121 x 70] intentionally omitted <==**

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Terminal Pitch|e|1.20 BSC|||
|h<br>cti<br>P la<br>ni<br>m<br>r<br>e<br>T|1<br>e|C<br>S<br>B<br>5<br>7.0|||
|Overall Height|A|0.79|0.84|0.89|
|Standof|A1|0.00|0.02|0.05|
|Substrate Thickness(with Terminals)|A3|0.20 REF|||
|h<br>t<br>g<br>n<br>e<br>L lla<br>r<br>e<br>v<br>O|D|C<br>S<br>B<br>0<br>6.1|||
|Overall Width|E|1.20 BSC|||
|Terminal Width|b1|0.25|0.30|0.35|
|Terminal Width|b2|0.325|0.375|0.425|
|Terminal Length|L|0.30|0.35|0.40|
|Terminal 1 Index Chamfer|CH|-|0.125|-|



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

   - REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1199B Sheet 2 of 2 

DS20006133C-page 27 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC60XXB** 

## 4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA] 

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [282 x 243] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>X1<br>G1<br>4<br>Y<br>C G2<br>1 2<br>(CH)<br>G3<br>SILK SCREEN<br>X2<br>E2<br>**----- End of picture text -----**<br>


RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E1|1.20 BSC|||
|h<br>cti<br>P<br>t<br>c<br>at<br>n<br>o<br>C|E2||C<br>S<br>B<br>6<br>1.1||
|g<br>nic<br>a<br>p<br>S t<br>c<br>at<br>n<br>o<br>C|C||5<br>7.0||
|Contact Width(X3)|X1|||0.35|
|Contact Width|X2|||0.43|
|Contact Pad Length(X4)|Y|||0<br>5.0|
|Space Between Contacts|G1|0.85|||
|Space Between Contacts(X2)<br>G|2|0.25|||
|Space Between Contacts<br>|G3|0.77|||
|Contact 1 Index Chamfer|CH|0.13 X 45° REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. The value in parenthesis, next to the item description is a unit multiplier. 

Microchip Technology Drawing C04-3199B 

DS20006133C-page 28 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **APPENDIX A: REVISION HISTORY** 

## **Revision A (January 2019)** 

- Initial creation of DSC60xxB Microchip data sheet DS20006133A. 

## **Revision B (November 2022)** 

- Added the 7.0 mm x 5.0 mm VDFN, 5.0 mm x 3.2 mm VDFN, and 3.2 mm x 2.5 mm VDFN package options throughout the document. 

- Updated the previously existing package outline drawings to their most current versions. 

## **Revision C (June 2025)** 

- Added DSA60xx reference to Features and the Product Identification System sections for customers seeking AEC-Q100 qualified parts. 

- Updated all package outline drawings to reflect the most current versions. 

DS20006133C-page 29 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **NOTES:** 

DS20006133C-page 30 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **PRODUCT IDENTIFICATION SYSTEM** 

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. 

|**PART NO.**<br>**X**<br>**Package**<br>**Device**<br>**Device:**<br>DSC60:<br>Ultra-Low Power MEMS Oscillator (Note 1)<br>**Pin 1 Definition:**<br>Selection<br>Pin 1<br>Internal Pull-Up Register<br>0<br>OE<br>Pull-up<br>1<br>STDBY<br>Pull-up<br>2<br>FS<br>Pull-up<br>4<br>OE<br>None<br>5<br>STDBY<br>None<br>6<br>FS<br>None<br>**Output Drive**<br>**Strength:**<br>1<br>3<br>Standard<br>Low<br>**Package:**<br>A<br>=<br>4-Lead 7.0 mm x 5.0 mm VDFN<br>B<br>=<br>4-Lead 5.0 mm x 3.2 mm VDFN<br>C<br>=<br>4-Lead 3.2 mm x 2.5 mm VDFN<br>J<br>=<br>4-Lead 2.5 mm x 2.0 mm VLGA<br>M<br>=<br>4-Lead 2.0 mm x 1.6 mm VFLGA<br>H<br>=<br>4-Lead 1.6 mm x 1.2 mm VFLGA<br>**Temperature**<br>**Range:**<br>A<br>=<br>–40C to +125C (Automotive)<br>L<br>=<br>–40C to +105C (Extended Industrial)<br>I<br>=<br>–40C to +85C (Industrial)<br>E<br>=<br>–20C to +70C (Extended Commercial)<br>**Frequency**<br>**Stability:**<br>1<br>=<br>± 50 ppm<br>2<br>=<br>± 25 ppm<br>3<br>=<br>± 20 ppm<br>**Revision:**<br>B<br>=<br>Revision B<br>**Frequency:**<br>xxx.xxxx =   User-Defined Frequency between<br>001.0000 MHz and 80.0000 MHz<br>xxxkxxx =   User-Defined Frequency between 002.000 kHz<br>and 999.999 kHz<br>xxxx      =   Frequency configuration code when pin 1 = FS.<br>Configure the part online through ClockWorks®<br>configurator.<br>**Tape and Reel:**<br><blank>=<br>50/Tube, 100 pce. min. (A Package Option)<br><blank>=<br>72/Tube, 144 pce. min. (B Package Option)<br><blank>=<br>110/Tube (C Package Option)<br><blank>=<br>140/Tube (J Package Option)<br><blank>=<br>100/Bag (M & H Package Options)<br>T<br>=<br>1,000/Reel<br>B<br>=<br>3,000/Reel<br>**X**<br>**Pin 1**<br>**Definition**<br>**X**<br>**Output**<br>**Drive**<br>**Strength**<br>**X**<br>**Temperature**<br>**Range**<br>**X**<br>**Frequency**<br>**Stability**<br>**X**<br>**Revision**<br>**X**<br>**XX.XXXX**<br>**Frequency**<br>**X**<br>**Tape**<br>**and**<br>**Reel**<br>**–**|**Examples:**<br>a) DSC6013JI3B-80.0000:<br>Ultra–Low Power MEMS Oscillator, Pin1 = STDBY<br>with Internal Pull-Up, Low Drive Strength, 4-Lead<br>2.5 mm x 2.0 mm VLGA, Industrial Temperature,<br>±20 ppm Stability, Revision B, 80 MHz Frequency,<br>140/Tube<br>b) DSC6001HE1B-016.0000T:<br>Ultra–Low Power MEMS Oscillator, Pin1 = OE with<br>Internal Pull–Up, Standard Drive Strength, 4-Lead<br>1.6 mm x 1.2 mm VFLGA, Extended Commercial<br>Temp., ±50 ppm Stability, Revision B, 16 MHz<br>Frequency, 1,000/Reel<br>c) DSC6021MI2B-005Q:<br>Ultra–Low Power MEMS Oscillator, Pin1 = Freq. Select<br>with Internal Pull-Up, Standard Drive Strength, 4-Lead<br>2.0 mm x 1.6 mm VFLGA, Industrial Temperature,<br>±25 ppm Stability, Revision B, Two Frequencies<br>Configured through ClockWorks, 100/Bag<br>**Note 1:**<br>Tape and Reel identifier only appears in the<br>catalog part number description. This identifier is<br>used for ordering purposes and is not printed on<br>the device package. Check with your Microchip<br>Sales Office for package availability with the Tape<br>and Reel option.||
|---|---|---|
|**Note 1:**<br>For AEC-Q100 qualified parts, refer to the DSA60xx famil<br>**2:**<br>Please visit Microchip ClockWorks®Configurator Website<br>quency. http://clockworks.microchip.com/timing/.|y.<br>to configure the part number for customized fre-||



- **Note 1:** For AEC-Q100 qualified parts, refer to the DSA60xx family. 

   - **2:** Please visit Microchip ClockWorks[®] Configurator Website to configure the part number for customized frequency. http://clockworks.microchip.com/timing/. 

DS20006133C-page 31 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC60XXB** 

## **NOTES:** 

DS20006133C-page 32 

 2019 - 2025 Microchip Technology Inc. and its subsidiaries 

## **Microchip Information** 

## **Trademarks** 

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ISBN: 979-8-3371-1455-2 

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## **Microchip Devices Code Protection Feature** 

Note the following details of the code protection feature on Microchip products: 

- Microchip products meet the specifications contained in their particular Microchip Data Sheet. 

- Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. 

- Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. 

- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. 

DS20006133C-page 33 

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