DSC1124CI2-100.0000

## **DSC1104/24** 

## **Low Jitter Precision HCSL Oscillator** 

## **Features** 

- Low RMS Phase Jitter: <1 ps (typ.) 

- High Stability: ±10 ppm, ±20 ppm, ±25 ppm, ±50 ppm 

- Wide Temperature Range 

- Industrial: –40°C to +85°C 

- Ext. Commercial: –20°C to +70°C 

- Ext. Industrial: –40°C to +105°C 

- High Supply Noise Rejection: –50 dBc 

- Wide Frequency Range: 2.3 MHz to 460 MHz 

- Small Industry Standard Footprints: 

- 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm, 5.0 mm x 3.2 mm, and 7.0 mm x 5.0 mm 

- Excellent Shock and Vibration Immunity 

- Qualified to MIL-STD-883 

## **General Description** 

The DSC1104 and DSC1124 series of high performance oscillators utilizes a proven silicon MEMS technology to provide excellent jitter and stability over a wide range of supply voltages and temperatures. By eliminating the need for quartz or SAW technology, MEMS oscillators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of communications, storage, and networking applications. 

DSC1104 has a standby feature allowing it to completely power down when EN pin is pulled low; whereas for DSC1124, only the outputs are disabled when EN is low. Both oscillators are available in industry standard packages, including the small 2.5 mm x 2.0 mm, and are drop-in replacements for standard 6-pin HCSL quartz crystal oscillators. 

- High Reliability 

- 20x Better MTF than Quartz Oscillators 

## **Block Diagram** 

- Low Current Consumption 

- Supply Range of 2.25V to 3.6V 

- Standby and Output Enable Function 

- Lead Free and RoHS Compliant 

## **Applications** 

- Storage Area Networks 

- SATA, SAS, Fibre Channel 

- Passive Optical Networks 

- EPON, 10G-EPON, GPON, 10G-PON 

- Ethernet 

- 1G, 10GBASE-T/KR/LR/SR, and FCoE 

- HD/SD/SDI Video and Surveillance 

- PCI Express: Gen 1 to Gen 4 

- Display Port 

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Pin 1 Pin 6<br>ENABLE TEMP SENSOR &COMPENSATION VDD<br>CIRCUITRY<br>Pin 2 Pin 5<br>NC MEMS DIVIDER OUTPUT<br>PLL<br>OSCILLATOR DRIVER<br>HH<br>Pin 3 Pin 4<br>GND OUTPUT<br>TABLE 1: OUTPUT ENABLE MODES<br>EN Pin DSC1104 DSC1124<br>High Outputs Active Outputs Active<br>NC Outputs Active Outputs Active<br>——=—— Low Standby Outputs Disabled<br>**----- End of picture text -----**<br>


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## **1.0 ELECTRICAL CHARACTERISTICS** 

## **Absolute Maximum Ratings †** 

|Supply Voltage ..........................................................................................................................................–0.3V to +4.0V|
|---|
|Input Voltage .................................................................................................................................... –0.3V to VDD+ 0.3V|
|ESD Protection (HBM) ...............................................................................................................................................4 kV|
|ESD Protection (MM) ............................................................................................................................................... 400V|
|ESD Protection (CDM) ............................................................................................................................................1.5<br>kV|



**† Notice:** Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. 

## **ELECTRICAL CHARACTERISTICS** 

Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified. 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|**Supply Voltage**(Note<br>1)|VDD|2.25|—|3.6|V|—|
|Supply Current|IDD|—|—|0.095|mA|DSC1104, EN pin low,<br>Output is disabled|
|||—|20|22||DSC1124, EN pin low,<br>Output is disabled|
|Frequency Stability|Δf|—|—|±10|ppm|Includes frequency variation<br>due to initial tolerance,<br>temp., and power supply<br>voltage|
|||—|—|±20|||
|||—|—|±25|||
|||—|—|±50|||
|Aging|ΔfY1|—|—|±5|ppm|One year at +25°C|
|Start-up Time (Note<br>2)|tSU|—|—|5|ms|T = +25°C|
|Input Logic Levels|VIH|0.75 x VDD|—|—|V|Input logic high|
||VIL|—|—|0.25 x VDD||Input logic low|
|Output Disable Time (Note<br>3)|tDA|—|—|5|ns|—|
|Output Enable Time|tEN|—|—|5|ms|DSC1104|
|||—|—|20|ns|DSC1124|
|Enable Pull-Up Resistor<br>(Note<br>4)|RPU|—|40|—|kΩ|Pull-up resistor exists|
|**HCSL Outputs**|||||||
|Supply Current|IDD|—|40|42|mA|Output Enabled, RL= 50Ω|
|Output Logic Levels|VOH|0.725|—|—|V|Output logic high, RL= 50Ω|
||VOL|—|—|0.1||Output logic low|
|Peak-to-Peak Output Swing|—|—|750|—|mV|Single-Ended|
|Output Transition Time<br>(Note<br>3)|tr|200|—|400|ps|Rise time, 20% to 80%,RL=<br>50Ω, CL= 2 pF|
||tf|200|—|—||Fall time, 20% to 80%,RL=<br>50Ω, CL= 2 pF|
|Frequency|f0|2.3|—|460|MHz|—|
|Output Duty Cycle|SYM|48|—|52|%|Differential|



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## **ELECTRICAL CHARACTERISTICS (CONTINUED)** 

Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified. 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|Period Jitter|JPER|—|2.5|—|psRMS|—|
|Integrated Phase Noise|JPH|—|0.25|—|psRMS|200<br>kHz to 20<br>MHz @<br>156.25<br>MHz|
|||—|0.38|—||100<br>kHz to 20<br>MHz @<br>156.25<br>MHz|
|||—|1.7|2||12<br>kHz to 20<br>MHz @<br>156.25<br>MHz|



**Note 1:** Pin 6 VDD should be filtered with a 0.1 μF capacitor. 

- **2:** tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. 

- **3:** Output Waveform and Test Circuit figures below define the parameters. 

- **4:** Output is enabled if pad is floated or not connected. 

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## **DSC1104/24** 

## **TEMPERATURE SPECIFICATIONS (Note 1)** 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|Operating Temperature Range|TA|–20|—|+70|°C|Ordering Option E|
|||–40|—|+85|°C|Ordering Option I|
|||–40|—|+105|°C|Ordering Option L|
|Junction Temperature|TJ|—|—|+150|°C|—|
|Storage Temperature Range|TS|–55|—|+150|°C|—|
|Soldering Temperature|—|—|—|+260|°C|40 sec. max.|



**Note 1:** The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. 

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## **2.0 PIN DESCRIPTIONS** 

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EN 1 6 VDD<br>NC 2 5 OUT<br>GND 3 4 OUT<br>**----- End of picture text -----**<br>


## _**FIGURE 2-1:** Pin Configuration, 6-Lead QFN._ 

The descriptions of the pins are listed in Table 2-1. 

## **TABLE 2-1: PIN FUNCTION TABLE** 

|**Pin Number**|**Pin Name**|**Description**|
|---|---|---|
|1|EN|Enable.|
|2|NC|Leave unconnected.|
|3|GND|Ground.|
|4|OUT|Output.|
|5|OUT|Complementary output.|
|6|VDD|Input.|



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## **3.0 NOMINAL PERFORMANCE PARAMETERS** 

Unless specified otherwise, T = +25°C, VDD = 3.3V. 

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0<br>50-mV<br>-10<br>100-mV<br>-20<br>-30<br>-40<br>-50<br>-60<br>-70<br>-80<br>0.1 1 10 100 1000 10000<br>Supply Noise Frequency (kHz)<br>Rejection (dBc)<br>**----- End of picture text -----**<br>


_**FIGURE 3-1:** Power Supply Rejection Ratio._ 

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2.5<br>50MHz-HCSL<br>2.0 106MHz-HCSL<br>156MHz-HCSL<br>1.5 212MHz-HCSL<br>1.0<br>0.5<br>0.0<br>0 200 400 600 800 1000<br>Low-end of integration BW: x kHz to 20 MHz<br>Phase Jitter (ps RMS)<br>**----- End of picture text -----**<br>


_**FIGURE 3-2:** Phase Jitter (Integrated Phase Noise)._ 

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## **4.0 OUTPUT WAVEFORM** 

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tR tF<br>Output 80%<br>50% 830 mv<br>20%<br>Output<br>1/f o tEN<br>tDA<br>VIH<br>Enable<br>VIL<br>**----- End of picture text -----**<br>


_**FIGURE 4-1:** Output Waveform._ 

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## **5.0 TYPICAL TERMINATION SCHEME** 

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VDD<br>an 0.1uF<br>Rs = 0 Ω for test<br>| 6 |<br>Rs<br>a 2 5<br>100 Ω<br>7 3 4 Areae<br>Rs<br>Rs is a series termination that,  50 Ω 50 Ω<br>when added to the output impedance,<br>add up to the line characteristic impedance<br>:<br>to prevent reflections from the driver back to the line.<br>**----- End of picture text -----**<br>


_**FIGURE 5-1:**_ 

_Typical Termination Scheme._ 

## **6.0 TEST CIRCUIT** 

_**FIGURE 6-1:**_ 

_Test Circuit._ 

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## **7.0 SOLDER REFLOW PROFILE** 

**MSL 1 @ 260°C refer to JSTD-020C** 

|**MSL 1 @ 260°C refer to JSTD-020C°C refer to JSTD-020CC refer to JSTD-020C**|**MSL 1 @ 260°C refer to JSTD-020C°C refer to JSTD-020CC refer to JSTD-020C**|
|---|---|
|Ramp-Up Rate (200°C to Peak Temp)|3°C/sec. max.|
|Preheat Time 150°C to 200°C|60-180 sec.|
|Time Maintained above 217°C|60-150 sec.|
|Peak Temperature|255°C to 260°C|
|Time within 5°C of Actual Peak|20-40 sec.|
|Ramp-Down Rate|6°C/sec. max.|
|Time 25°C to Peak Temperature|8 minutes max.|



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## **8.0 PACKAGE MARKING INFORMATION** 

## **8.1 Package Marking Information** 

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6-Pin CDFN/VDFN* Example<br>XXXXXXX 0750000<br>DCPYYWW DCP1723<br>0SSS 0421<br>Legend: XX...X Product code, customer-specific information, or frequency in MHz<br>without printed decimal point<br>Y Year code (last digit of calendar year)<br>YY Year code (last 2 digits of calendar year)<br>WW Week code (week of January 1 is week ‘01’)<br>SSS Alphanumeric traceability code<br>e3 Pb-free JEDEC [®]  designator for Matte Tin (Sn)<br>* This package is Pb-free. The Pb-free JEDEC designator (     )  e3<br>can be found on the outer packaging for this package.<br>●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle<br>mark).<br>Note : In the event the full Microchip part number cannot be marked on one line, it will<br>be carried over to the next line, thus limiting the number of available<br>characters for customer-specific information. Package may or may not include<br>the corporate logo.<br>Underbar (_) and/or Overbar (‾) symbol may not be to scale.<br>**----- End of picture text -----**<br>


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## **6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern** 

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## **DSC1104/24** 

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## **6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern** 

## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C A1<br>C<br>A<br>SEATING<br>PLANE<br>6X<br>0.08 C<br>SIDE VIEW<br>2X b2<br>1 2<br>NOTE 1<br>L<br>N<br>4X b1<br>L1<br>e 0.07 C A B<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1007A Sheet 1 of 2 

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## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|1.05 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|3.20 BSC|||
|Overall Width|E|2.50 BSC|||
|Terminal Width|b1|0.85|0.90|0.95|
|Terminal Width|b2|0.45|0.50|0.55|
|Terminal Length|L|0.65|0.70|0.75|
|Terminal Pullback|L1|0.10 REF|||



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1007A Sheet 2 of 2 

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## **DSC1104/24** 

## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

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**----- Start of picture text -----**<br>
Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>X2<br>G<br>6<br>C<br>Y<br>1 2<br>X1 SILK SCREEN<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|1.05 BSC|||
|Contact Pad Spacing|C||1.60||
|Contact Pad Width(X4)|X1|||1.00|
|Contact Pad Width(X2)|X2|||0.60|
|Contact Pad Length(X6)|Y|||0.85|
|Space Between Contacts(X4)|G1|0.25|||



## Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

Microchip Technology Drawing C04-3007A 

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## **6-Lead CDFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern** 

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## **6-Lead VDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern** 

## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

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**----- Start of picture text -----**<br>
Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>X2<br>EV<br>6<br>C Y2 EV ØV<br>G<br>Y1<br>1 2<br>X1<br>E<br>SILK SCREEN<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|2.54 BSC|||
|Optional Center Pad Width|X2|||2.90|
|Optional Center Pad Length|Y2|||1.90|
|Contact Pad Spacing|C||3.70||
|Contact Pad Width(X6)|X1|||1.50|
|Contact Pad Length(X6)|Y1|||1.35|
|Contact Pad to Center Pad(X2)|G|0.20|||
|Thermal Via Diameter(X6)|V||0.33||
|Thermal Via Pitch|EV||1.20||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 

Microchip Technology Drawing C04-3010A 

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## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

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Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.20 C<br>1 2<br>2X<br>0.20 C<br>TOP VIEW<br>A1<br>0.10 C<br>C<br>SEATING A<br>PLANE<br>6X<br>0.08 C<br>SIDE VIEW<br>0.10 C A B<br>D2<br>1 2<br>0.10 C A B<br>NOTE 1<br>E2<br>6X L<br>(K)<br>N<br>6X b<br>e 0.10 C A B<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1010A Sheet 1 of 2 

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## **DSC1104/24** 

## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [184 x 107] intentionally omitted <==**

## Notes: 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|2.54|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|7.00 BSC|||
|Exposed Pad Length|D2|2.70|2.80|2.90|
|Overall Width|E|5.00 BSC|||
|Exposed Pad Width|E2|1.70|1.80|1.90|
|Terminal Width|b|1.35|1.40|1.45|
|Terminal Length|L|1.00|1.10|1.20|
|Terminal-to-Exposed-Pad|K|0.20 REF|||



1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1010A Sheet 2 of 2 

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## **6-Lead CDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern** 

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## **NOTES:** 

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## **APPENDIX A: REVISION HISTORY** 

## **Revision A (December 2017)** 

- Initial conversion of Micrel document DSC1104/24 to Microchip data sheet template DS20005870A. 

- Minor text changes throughout. 

## **Revision B (October 2019)** 

- Updated 6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern package drawing. 

- Updated note in Figure 5-1. 

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## **NOTES:** 

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## **PRODUCT IDENTIFICATION SYSTEM** 

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. 

|**P**<br>**ART NO.**|**P**<br>**ART NO.**|**X**|**X**||**X**|**X**|**X**|**-XXX.XXXX**|**-XXX.XXXX**|**-XXX.XXXX**|**X**|**X**||**Examples:**|**Examples:**||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||||||
|**Device**||**Package**||**Temperature**<br>**Range**||**Stability**|||**Frequency**||**Packaging**<br>**Option**|||a) DSC1104AE1-<br>053.5000:||Low Jitter Precision HCSL Oscillator<br>with Standby, 6-Lead 7x5 CDFN, Ext.<br>Commercial Temp. Range, ±50<br>ppm|
|||||||||||||||||Stability, 53.5<br>MHz Frequency, Tube|
|**Device:**||DSC1104:|||Low-Jitter Precision HCSL Oscillator with<br>Standby|||||||||b) DSC1124BI2-<br>246.8100T:||Low Jitter Precision HCSL Oscillator, 6-<br>Lead 5x3.2 VDFN, Industrial Temp.<br>Range, ±25<br>ppm Stability, 246.81<br>MHz|
|||DSC1124:|||Low-Jitter Precision HCSL Oscillator|||||||||||Frequency, 1000/Reel|
|||||||||||||||c) DSC1104CL5-||Low Jitter Precision HCSL Oscillator|
|||||||||||||||156.2500:||with Standby, 6-Lead 3.2x2.5 VDFN,|
|**Package:**||A||=|6-Lead 7.0|mm||x 5.0|mm CDFN|||||||Ext. Industrial Temp. Range, ±10<br>ppm|
|||B||=|6-Lead 5.0|mm||x 3.2|mm CDFN|||||||Standby, 156.25<br>MHz Frequency, Tube|
|||C<br>D<br>N||=<br>=<br>=|6-Lead 3.2<br>6-Lead 2.5<br>6-Lead 7.0<br>pad|mm<br>mm<br>mm||x 2.5<br>x 2.0<br>x 5.0|mm CDFN<br>mm CDFN<br>mm CDFN w/o||center|||d) DSC1124DE3-<br>094.5500T:||Low Jitter Precision HCSL Oscillator, 6-<br>Lead 2.5x2.0 CDFN, Ext. commercial<br>Temp.<br>Range,<br>±20<br>ppm<br>Stability,<br>94.55<br>MHz Frequency, 1000/Reel|
|**Temperature**<br>**Range:**||E<br>I||=<br>=|–20C to +70C (Extended Commercial)<br>–40C to +85C (Industrial)|||||||||**Note 1:**|Tape|and Reel identifier only appears in the|
|||L||=|–40C to +105C (Extended Industrial)||||||||||catalog part number description. This<br>identifier is used for ordering purposes and||
||||||||||||||||is not printed on the device package. Check||
|**Stability:**||1||=|±50<br>ppm||||||||||with your Microchip Sales Office for package||
|||2||=|±25<br>ppm||||||||||availability with the Tape and Reel option.||
|||3||=|±20<br>ppm||||||||||||
|||5||=|±10<br>ppm||||||||||||
|**Frequency:**||xxx.xxxx|||=2.3<br>MHz to|460||MHz (User||Defined)|||||||
|**Packing Option:**||<blank>=|||Tube||||||||||||
|||T||=|1000/Reel||||||||||||
||||||||||||||||||



DS20005870B-page 25 

 2017-2019 Microchip Technology Inc. 

**DSC1104/24** 

## **NOTES:** 

DS20005870B-page 26 

 2017-2019 Microchip Technology Inc. 

**Note the following details of the code protection feature on Microchip devices:** 

- Microchip products meet the specification contained in their particular Microchip Data Sheet. 

- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. 

- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. 

- Microchip is willing to work with the customer who is concerned about the integrity of their code. 

- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” 

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. 

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE **.** Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 

## **Trademarks** 

The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. 

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. 

The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. 

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. 

All other trademarks mentioned herein are property of their respective companies. 

- © 2017-2019, Microchip Technology Incorporated, All Rights Reserved. 

_For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality._ 

ISBN: 978-1-5224-5099-3 

DS20005870B-page 27 

 2017-2019 Microchip Technology Inc. 

## **Worldwide Sales and Service** 

## **AMERICAS** 

**Corporate Office** 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com 

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**Austin, TX** Tel: 512-257-3370 

**Boston** Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 

**Chicago** Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 

**Dallas** Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 

**Detroit** Novi, MI Tel: 248-848-4000 

**Houston, TX** Tel: 281-894-5983 

**Indianapolis** Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 

**Los Angeles** Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 

**Raleigh, NC** Tel: 919-844-7510 

**New York, NY** Tel: 631-435-6000 

**San Jose, CA** Tel: 408-735-9110 Tel: 408-436-4270 

**Canada - Toronto** Tel: 905-695-1980 Fax: 905-695-2078 

## **ASIA/PACIFIC** 

**Australia - Sydney** Tel: 61-2-9868-6733 **China - Beijing** Tel: 86-10-8569-7000 

**China - Chengdu** Tel: 86-28-8665-5511 

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**China - Qingdao** Tel: 86-532-8502-7355 

**China - Shanghai** Tel: 86-21-3326-8000 

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**China - Shenzhen** Tel: 86-755-8864-2200 **China - Suzhou** Tel: 86-186-6233-1526 

**China - Wuhan** Tel: 86-27-5980-5300 

**China - Xian** Tel: 86-29-8833-7252 

**China - Xiamen** Tel: 86-592-2388138 

**China - Zhuhai** Tel: 86-756-3210040 

## **ASIA/PACIFIC** 

**India - Bangalore** Tel: 91-80-3090-4444 **India - New Delhi** Tel: 91-11-4160-8631 

**India - Pune** Tel: 91-20-4121-0141 **Japan - Osaka** Tel: 81-6-6152-7160 

**Japan - Tokyo** Tel: 81-3-6880- 3770 

**Korea - Daegu** Tel: 82-53-744-4301 

**Korea - Seoul** Tel: 82-2-554-7200 

**Malaysia - Kuala Lumpur** Tel: 60-3-7651-7906 

**Malaysia - Penang** Tel: 60-4-227-8870 **Philippines - Manila** Tel: 63-2-634-9065 

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**Taiwan - Taipei** Tel: 886-2-2508-8600 

**Thailand - Bangkok** Tel: 66-2-694-1351 

**Vietnam - Ho Chi Minh** Tel: 84-28-5448-2100 

## **EUROPE** 

**Austria - Wels** Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 

**Denmark - Copenhagen** Tel: 45-4450-2828 Fax: 45-4485-2829 

**Finland - Espoo** Tel: 358-9-4520-820 

**France - Paris** Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 

**Germany - Garching** Tel: 49-8931-9700 

**Germany - Haan** Tel: 49-2129-3766400 **Germany - Heilbronn** Tel: 49-7131-72400 

**Germany - Karlsruhe** Tel: 49-721-625370 

**Germany - Munich** Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 **Germany - Rosenheim** Tel: 49-8031-354-560 

**Israel - Ra’anana** Tel: 972-9-744-7705 

**Italy - Milan** Tel: 39-0331-742611 Fax: 39-0331-466781 

**Italy - Padova** Tel: 39-049-7625286 

**Netherlands - Drunen** Tel: 31-416-690399 Fax: 31-416-690340 

**Norway - Trondheim** Tel: 47-7288-4388 

**Poland - Warsaw** Tel: 48-22-3325737 

**Romania - Bucharest** Tel: 40-21-407-87-50 

**Spain - Madrid** Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 

**Sweden - Gothenberg** Tel: 46-31-704-60-40 

**Sweden - Stockholm** Tel: 46-8-5090-4654 

**UK - Wokingham** Tel: 44-118-921-5800 

Fax: 44-118-921-5820 

DS20005870B-page 28 

 2017-2019 Microchip Technology Inc. 

05/14/19