DSC1121CI2-125.0000

## & **DSC1101/21** 

## **Low-Jitter Precision CMOS Oscillator** 

## **Features** 

- Low RMS Phase Jitter: <1 ps (typ.) 

- High Stability: ±10 ppm, ±20 ppm, ±25 ppm, ±50 ppm 

- Wide Temperature Range: 

- Automotive: –55°C to +125°C 

- For AEC-Q100 qualified parts, refer to DSA11xx Family 

- Ext. Industrial: –40°C to +105°C 

- Industrial: –40°C to +85°C 

- Commercial: –20°C to +70°C 

- High Supply Noise Rejection: –50 dBc 

- Wide Freq. Range: 2.3 MHz to 170 MHz 

- Small Industry Standard Footprints 

- 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm, 5.0 mm x 3.2 mm, and 7.0 mm x 5.0 mm 

## **General Description** 

The DSC1101 and DSC1121 series of high performance oscillators utilize a proven silicon MEMS technology to provide excellent jitter and stability over a wide range of supply voltages and temperatures. By eliminating the need for quartz or SAW technology, MEMS oscillators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of communications, storage, and networking applications. 

DSC1101 has a standby feature that allows it to completely power-down when EN pin is pulled low; whereas for DSC1121, only the outputs are disabled when EN is low. Both oscillators are available in industry standard packages, including the small 2.5 mm x 2.0 mm, and are “drop-in” replacements for standard 4-pin CMOS quartz crystal oscillators. 

- Excellent Shock and Vibration Immunity 

- Qualified to MIL-STD-883 

- High Reliability 

## **Functional Block Diagram** 

- 20x Better MTF than Quartz Oscillators 

- Low Current Consumption 

- Supply Range of 2.25 to 3.6V 

- Standby and Output Enable Function 

- Lead-Free and RoHS Compliant 

## **Applications** 

- Storage Area Networks 

- SATA, SAS, Fibre Channel 

- Passive Optical Networks 

- EPON, 10G-EPON,V GPON, 10G-PON 

- Ethernet 

- 1G, 10GBASE-T/KR/LR/SR, and FCoE 

- HD/SD/SDI Video and Surveillance 

- PCI Express 

- Display Port 

DS20005613E-page 1 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **1.0 ELECTRICAL CHARACTERISTICS** 

## **Absolute Maximum Ratings †** 

Input Voltage, VIN ..............................................................................................................................–0.3V to VDD + 0.3V Supply Voltage .......................................................................................................................................... –0.3V to +4.0V ESD Protection On All Pins ...........................................................................................4000V HBM, 1500V CDM (max.) **† Notice:** Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. 

**Note:** 1000+ years of data retention on internal memory. 

## **DC CHARACTERISTICS** 

## **Electrical Characteristics** 

|**DC CHARACTERISTICS**|**DC CHARACTERISTICS**|**DC CHARACTERISTICS**|**DC CHARACTERISTICS**|**DC CHARACTERISTICS**|**DC CHARACTERISTICS**|**DC CHARACTERISTICS**|
|---|---|---|---|---|---|---|
|**Electrical Characteristics**|||||||
|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|SupplyVoltage(Note 1)|VDD|2.25|—|3.6|V|—|
|Supply Current|IDD|—|—|0.095|mA|DSC1101, EN pin low, output<br>is disabled|
|||—|20|22||DSC1121, EN pin low, output<br>is disabled|
|||—|31|35||Output enabled, CL= 15 pF,<br>f0= 100 MHz|
|Frequency Stability<br>(Including frequency<br>variations due to initial<br>tolerance, temp. and<br>power supply voltage.)|f|—|—|±10|ppm|Ext Comm. & Ind. only|
|||||±20||All tempranges|
|||—|—|±25||All temp ranges|
|||—|—|±50||All tempranges|
|Aging|f|—|—|±5|ppm|1year@25°C|
|Startup Time(Note 2)|tSU|—|—|5|ms|T = 25°C|
|Input Logic Levels<br>Input Logic High<br>Input Logic Low|VIH|0.75VDD|—|—|V|—|
||VIL|—|—|0.25VDD|||
|Output Disable Time<br>(Note 3)|tDS|—|—|5|ns|—|
|Output Enable Time|tEN|—|—|5|ms|DSC1101|
|||—|—|20|ns|DSC1121|
|Enable Pull-up Resistor<br>(Note 4)|—|—|40|—|k|Pull-up Resistor Exist|
|**CMOS Output**|||||||
|Output Logic Levels<br>Output Logic High<br>Output Logic Low|VOH|0.9VDD|—|—|V|I = ±6 mA|
||VOL|—|—|0.1VDD|||



- **Note 1:** Pin 6 VDD should be filtered with 0.1 µF capacitor. 

   - **2:** tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled. 

   - **3:** Output Waveform and Test Circuit figures define the parameters. 

   - **4:** Output is enabled if pad is floated or not connected. 

DS20005613E-page 2 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **DC CHARACTERISTICS (CONTINUED)** 

|**DC CHARACTERISTICS(CONTINUED)**|**DC CHARACTERISTICS(CONTINUED)**|**DC CHARACTERISTICS(CONTINUED)**|**DC CHARACTERISTICS(CONTINUED)**|**DC CHARACTERISTICS(CONTINUED)**|**DC CHARACTERISTICS(CONTINUED)**|**DC CHARACTERISTICS(CONTINUED)**|
|---|---|---|---|---|---|---|
||||||||
|**Electrical Characteristics**|||||||
|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|Output Transition Time<br>Rise Time<br>Fall Time|tR|—|1.1|2|ns|20% to 80%<br>CL= 15 pF|
||tF|—|1.3|2|||
|Frequency|f0|2.3|—|170|MHz|CL= 15 pF, –20°C to +70°C<br>and –40°C to +85°C|
|||3.3|—|170||CL= 15 pF, –40°C to +105°C<br>and –55°C to +125°C|
|Output DutyCycle|SYM|45|—|55|%|—|
|Period Jitter|JPER|—|3|—|psRMS|fOUT= 125 MHz|
|Integrated Phase Noise|JPH|—|0.3|—|psRMS|200 kHz to 20 MHz@125 MHz|
|||—|0.38|—||100 kHz to 20 MHz@125 MHz|
|||—|1.7|2||12 kHz to 20 MHz@125 MHz|



- **Note 1:** Pin 6 VDD should be filtered with 0.1 µF capacitor. 

   - **2:** tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled. 

   - **3:** Output Waveform and Test Circuit figures define the parameters. 

   - **4:** Output is enabled if pad is floated or not connected. 

DS20005613E-page 3 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **TEMPERATURE SPECIFICATIONS** 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|**Temperature Ranges(Note 1)**|||||||
|Operating Temperature Range|TA|–20|—|+70|°C|OrderingOption E|
||TA|–40|—|+85|°C|OrderingOption I|
||TA|–40|—|+105|°C|OrderingOption L|
||TA|–55|—|+125|°C|OrderingOption M|
|Junction OperatingTemperature|TJ|—|—|+150|°C|—|
|Storage Temperature Range|TS|–55|—|+150|°C|—|
|SolderingTemperature Range|—|—|—|+260|°C|40 sec. max|



**Note 1:** The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. 

DS20005613E-page 4 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **2.0 NOMINAL PERFORMANCE CURVES** 

**Note:** The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 

_**FIGURE 2-1:** Phase Jitter (Integrated Phase Noise)._ 

_**FIGURE 2-2:** Power Supply Rejection Ratio._ 

DS20005613E-page 5 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC1101/21** 

## **3.0 PIN DESCRIPTIONS** 

The descriptions of the pins are listed in Table 3-1. Pin order and descriptions apply across all package types. **TABLE 3-1: PIN FUNCTION TABLE** 

|**Pin Number**<br>**7x5 w/ Pad**|**Pin Number**<br>**7x5 w/o Pad**|**Pin Number**<br>**5x3.2**|**Pin Number**<br>**3.2x2.5**|**Pin Number**<br>**2x2.5**|**Pin Name**|**Description**|
|---|---|---|---|---|---|---|
|1|1|1|1|1|EN|Enable.|
|2|2|2|2|2|NC|Do not connect.|
|3|3|3|3|3|GND|Ground.|
|4|4|4|4|4|OUT|Output.|
|5|5|5|5|5|NC|Do not connect.|
|6|6|6|6|6|VDD|Supplyvoltage.|
|PAD|—|—|—|—|PAD|Tie toground.|



## **TABLE 3-2: OUTPUT ENABLE MODES** 

|**EN Pin**|**DSC1101**|**DSC1121**|
|---|---|---|
|High|Output Active|Output Active|
|NC|Output Active|Output Active|
|Low|Standby|Output Disabled|



DS20005613E-page 6 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **4.0 OUTPUT WAVEFORM** 

**==> picture [468 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
tR  tF<br>VOH<br>OUTPUT<br>VOL<br>1/fo tEN<br>tDA<br>VIH<br>ENABLE<br>VIL<br>**----- End of picture text -----**<br>


_**FIGURE 4-1:** DSC1101/21 Output Waveform._ 

DS20005613E-page 7 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **5.0 TYPICAL TERMINATION SCHEME** 

_**FIGURE 5-1:** Typical Termination Scheme for DSC1101/21._ 

DS20005613E-page 8 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6.0 BOARD LAYOUT (RECOMMENDED)** 

**==> picture [468 x 269] intentionally omitted <==**

**----- Start of picture text -----**<br>
Via to GND layer<br>1 6<br>Supply bypass<br>capacitor<br>2 5<br>3 4<br>Via to GND layer<br>**----- End of picture text -----**<br>


_**FIGURE 6-1:** DSC1101/21 Recommended Board Layout._ 

DS20005613E-page 9 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **7.0 SOLDER REFLOW PROFILE** 

|**MSL 1 @ 260°C refer to JSTD-020C**|**MSL 1 @ 260°C refer to JSTD-020C**|
|---|---|
|Ramp-Up Rate(200°C to Peak Temp)|3°C/Sec. Max.|
|Preheat Time 150°C to 200°C|60-180 Sec.|
|Time Maintained Above 217°C|60-150 Sec.|
|Peak Temperature|255-260°C|
|Time within 5°C of Actual Peak|20-40 Sec.|
|Ramp-Down Rate|6°C/Sec. Max.|
|Time 25°C to Peak Temperature|8 minutes Max.|



DS20005613E-page 10 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **8.0 PACKAGING INFORMATION** 

## **8.1 Package Marking Information** 

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**----- Start of picture text -----**<br>
6-Lead VDFN* Example<br>XXXXXXX 0750000<br>XXXYYWW DAP1723<br>0SSS 0421<br>Legend: XX...X Product code, customer-specific information, or frequency in MHz<br>without printed decimal point<br>Y Year code (last digit of calendar year)<br>YY Year code (last 2 digits of calendar year)<br>WW Week code (week of January 1 is week ‘01’)<br>SSS Alphanumeric traceability code<br>e3 Pb-free JEDEC [®]  designator for Matte Tin (Sn)<br>* This package is Pb-free. The Pb-free JEDEC designator (     )e3<br>can be found on the outer packaging for this package.<br>●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle<br>Note : In the event the full Microchip part number cannot be marked on one line, it will<br>be carried over to the next line, thus limiting the number of available<br>characters for customer-specific information. Package may or may not include<br>the corporate logo.<br>Underbar (_) and/or Overbar (‾) symbol may not be to scale.<br>**----- End of picture text -----**<br>


DS20005613E-page 11 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]** 

**==> picture [442 x 496] intentionally omitted <==**

**----- Start of picture text -----**<br>
Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.05 C<br>1 2<br>2X<br>TOP VIEW<br>0.05 C<br>0.10 C<br>C A<br>A1<br>SEATING<br>PLANE<br>6X<br>SIDE VIEW 0.08 C<br>2X b2<br>1 2<br>L2<br>5X L1<br>N<br>4X b1<br>e 0.10 C A B<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


**==> picture [428 x 37] intentionally omitted <==**

**----- Start of picture text -----**<br>
Microchip Technology Drawing  C04-1005-J7A Rev E Sheet 1 of 2<br>© 2024 Microchip Technology Inc.<br>**----- End of picture text -----**<br>


DS20005613E-page 12 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|0.825 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|2.50 BSC|||
|Overall Width|E|2.00 BSC|||
|Terminal Width|b1|0.60|0.65|0.70|
|Terminal Width|b2|0.20|0.25|0.30|
|Terminal Length|L1|0.60|0.70|0.80|
|Terminal Length|L2|0.665|0.765|0.865|



## Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M 

BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1005-J7A Rev E Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20005613E-page 13 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [256 x 236] intentionally omitted <==**

**----- Start of picture text -----**<br>
X1<br>X2<br>6<br>Y<br>G2 C<br>1 2<br>G1 SILK SCREEN<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|0.825 BSC|||
|Contact Pad Width(X4)|X1|||0.65|
|Contact Pad Width(X2)|X2|||0.25|
|Contact Pad Length(X6)|Y|||0.85|
|Contact Pad Spacing|C||1.45||
|Space Between Contacts(X4)|G1|0.38|||
|Space Between Contacts(X3)|G2|0.60|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 

Microchip Technology Drawing C04-3005-J7A Rev E 

© 2024 Microchip Technology Inc. 

DS20005613E-page 14 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [349 x 479] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C A1<br>C<br>A<br>SEATING<br>PLANE<br>6X<br>0.08 C<br>SIDE VIEW<br>2X b2<br>1 2<br>NOTE 1<br>L<br>N<br>4X b1<br>(L1)<br>e 0.07 C A B<br>0.05 C<br>BOTTOM VIEW<br>Microchip Technology Drawing  C04-1007-H5A Rev C Sheet 1 of 2<br>**----- End of picture text -----**<br>


© 2024 Microchip Technology Inc. 

DS20005613E-page 15 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|1.05 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|3.20 BSC|||
|Overall Width|E|2.50 BSC|||
|Terminal Width|b1|0.85|0.90|0.95|
|Terminal Width|b2|0.45|0.50|0.55|
|Terminal Length|L|0.65|0.70|0.75|
|Terminal Pullback|L1|0.10 REF|||



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M 

   - BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1007-H5A Rev C Sheet 2 of 2 

- © 2024 Microchip Technology Inc. 

DS20005613E-page 16 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [291 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
X2<br>G2<br>6<br>Y<br>G1 C<br>(CH)<br>1 2<br>X1 SILK SCREEN<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|1.05 BSC|||
|Contact Pad Spacing|C||1.60||
|Contact Pad Width(X4)|X1|||1.00|
|Contact Pad Width(X2)|X2|||0.60|
|Contact Pad Length(X6)|Y|||0.85|
|Space Between Contacts(X4)|G1|0.75|||
|Space Between Contacts(X3)|G2|0.25|||
|Pin 1 Index Chamfer(X4)|CH||0.25||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

Microchip Technology Drawing C04-3007-H5A Rev C 

- © 2024 Microchip Technology Inc. 

DS20005613E-page 17 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Dual Flat, No Lead Package (H7A) - 3.2x5.0 x0.9 Body [VDFN]** 

**==> picture [444 x 572] intentionally omitted <==**

**----- Start of picture text -----**<br>
Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>D A<br>B<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.05 C<br>2X<br>0.05 C TOP VIEW<br>0.10 C<br>A1<br>C<br>A<br>SEATING<br>PLANE<br>6X<br>(A3) SIDE VIEW 0.08 C<br>NOTE 1<br>1 2<br>(CH) (K)<br>L<br>N<br>6X b<br>e 0.10 C A B<br>0.05 C<br>BOTTOM VIEW<br>Microchip Technology Drawing  C04-1009-H7A Rev B Sheet 1 of 2<br>© 2024 Microchip Technology Inc.<br>**----- End of picture text -----**<br>


DS20005613E-page 18 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Dual Flat, No Lead Package (H7A) - 3.2x5.0 x0.9 Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|1.27 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Terminal Thickness|A3|0.203 REF|||
|Overall Length|D|5.00 BSC|||
|Overall Width|E|3.20 BSC|||
|Terminal Width|b|0.59|0.64|0.69|
|Terminal Length|L|0.90|1.00|1.10|
|Terminal 1 Index Chamfer|CH|0.25 REF|||
|Terminal-to-Terminal|K|1.20 REF|||



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M 

BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1009-H7A Rev B Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20005613E-page 19 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Dual Flat, No Lead Package (H7A) - 3.2x5.0 x0.9 Body [VDFN]** 

**==> picture [441 x 305] intentionally omitted <==**

**----- Start of picture text -----**<br>
Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>SILK SCREEN<br>6<br>C (G)<br>Y<br>1 2<br>X<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|1.27 BSC|||
|Contact Pad Spacing|C||2.30||
|Contact Pad Width(X6)|X|||0.64|
|Contact Pad Length(X6|Y|||1.10|
|Contact Pad to Contact Pad(X4)|G|1.20 REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 

Microchip Technology Drawing  C04-3009-H7A Rev B © 2024 Microchip Technology Inc. 

DS20005613E-page 20 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [369 x 490] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.20 C<br>1 2<br>2X<br>0.20 C<br>TOP VIEW<br>A1<br>0.10 C<br>C<br>A<br>SEATING<br>PLANE<br>6X<br>0.08 C<br>SIDE VIEW<br>0.10 C A B<br>D2<br>1 2<br>0.10 C A B<br>NOTE 1<br>E2<br>6X L<br>(K)<br>N<br>6X b<br>e 0.10 C A B<br>0.05 C<br>BOTTOM VIEW<br>Microchip Technology Drawing  C04-1010A Sheet 1 of 2<br>**----- End of picture text -----**<br>


DS20005613E-page 21 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [194 x 112] intentionally omitted <==**

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|2.54|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|7.00 BSC|||
|Exposed Pad Length|D2|2.70|2.80|2.90|
|Overall Width|E|5.00 BSC|||
|Exposed Pad Width|E2|1.70|1.80|1.90|
|Terminal Width|b|1.35|1.40|1.45|
|Terminal Length|L|1.00|1.10|1.20|
|Terminal-to-Exposed-Pad|K|0.20 REF|||



## Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M 

BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

- REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1010A Sheet 2 of 2 

DS20005613E-page 22 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [330 x 211] intentionally omitted <==**

**----- Start of picture text -----**<br>
X2<br>EV<br>6<br>C Y2 EV ØV<br>G<br>Y1<br>1 2<br>X1<br>E<br>SILK SCREEN<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|2.54 BSC|||
|Optional Center Pad Width|X2|||2.90|
|Optional Center Pad Length|Y2|||1.90|
|g<br>nic<br>a<br>p<br>S<br>d<br>a<br>P<br>tc<br>a<br>t<br>n<br>o<br>C|C||0<br>7<br>.<br>3||
|Contact Pad Width(X6)|X1|||1.50|
|Contact Pad Length(X6)|Y1|||1.35|
|Contact Pad to Center Pad(X2)|G|0.20|||
|Thermal Via Diameter(X6)|V||0.33||
|Thermal Via Pitch|EV||1.20||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 

Microchip Technology Drawing C04-3010A 

DS20005613E-page 23 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Dual Flatpack, No Lead Package (HPA) - 7x5 mm Body [VDFN]** 

**==> picture [449 x 578] intentionally omitted <==**

**----- Start of picture text -----**<br>
Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.10 C<br>1 2<br>2X<br>0.10 C<br>TOP VIEW<br>A1<br>0.10 C<br>C<br>A<br>SEATING<br>PLANE<br>6X<br>0.08 C<br>SIDE VIEW<br>1 2<br>NOTE 1<br>(L1)<br>L<br>N<br>8X b<br>e 0.10 C A B<br>0.05 C<br>BOTTOM VIEW<br>Microchip Technology Drawing  C04-1227-HPA Rev B Sheet 1of 2<br>© 2024 Microchip Technology Inc.<br>**----- End of picture text -----**<br>


DS20005613E-page 24 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Dual Flatpack, No Lead Package (HPA) - 7x5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|2.54 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|7.00 BSC|||
|Overall Width|E|5.00 BSC|||
|Terminal Width|b|1.30|1.40|1.50|
|Terminal Length|L|1.00|1.10|1.20|
|Pullback|L1|0.10 REF|||



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M 

BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1227-HPA Rev B Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20005613E-page 25 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **6-Lead Very Thin Dual Flatpack, No Lead Package (HPA) - 7x5 mm Body [VDFN]** 

**==> picture [448 x 285] intentionally omitted <==**

**----- Start of picture text -----**<br>
Note: For the most current package drawings, please see the Microchip Packaging Specification located at<br>http://www.microchip.com/packaging<br>6<br>C<br>Y1<br>1 2<br>X1<br>SILK SCREEN<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|2.54 BSC|||
|Contact Pad Spacing|C||3.90||
|Contact Pad Width(X6)|X1|||1.55|
|Contact Pad Length(X6)|Y1|||1.40|



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 

Microchip Technology Drawing C04-3227-HPA Rev B 

© 2024 Microchip Technology Inc. 

DS20005613E-page 26 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/1121** 

## **APPENDIX A: REVISION HISTORY** 

## **Revision A (August 2017)** 

- Initial creation of document DSC1101/21 to Microchip data sheet template DS20005613A. 

- Minor text changes throughout. 

## **Revision B (December 2017)** 

- Military temperature range changed to Automotive in Features and Product Identification System. 

- Supply Current values updated in DC Characteristics table. 

- Test Circuit section removed. 

- Updated Figure 6-1, Recommended Board Layout. 

## **Revision C (December 2019)** 

- Corrected Input Logic Low value in DC Characteristics table. 

- Updated 6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern Package Drawing. 

## **Revision D (September 2020)** 

- Updated the minimum storage temperate value in the Temperature Specifications table to correctly read –55°C. 

## **Revision E (July 2025)** 

- Added DSA11xx reference to Features and the Product Identification System sections for customers seeking AEC-Q100 qualified parts. 

- Updated all Package Outline Drawings with the most current versions. 

DS20005613E-page 27 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **NOTES:** 

DS20005613E-page 28 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **PRODUCT IDENTIFICATION SYSTEM** 

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. 

||**PART NO.**|**PART NO.**|**X**|**X**||**X**|**X**|**X**<br>**-X**<br>**X**<br>**X.XXXX**|**X**<br>**-X**<br>**X**<br>**X.XXXX**|**X**||**Examples:**|**Examples:**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Device**||**Package**||**Temperature**|||**Stability**<br>**Frequency**||**Packaging**||a) DSC1101AM1-010.0000T:||
|||||||**Range**||||**Option**|||Low-Power Precision CMOS Oscillator with|
||||||||||||||Standby, 6-Ld 7.0X5.0 VDFN, Automotive|
||**Device:**<br>**(Note 1)**||DSC1101:|||Low-Power Precision CMOS Oscillator with<br>Standby|||||||Temperature Range, ±50 ppm, 10 MHz Out-<br>put Frequency, 1,000/Reel|
||||DSC1121:|||Low-Power Precision CMOS Oscillator||||||b) DSC1101BL2-030.0000:||
||||||||||||||Low-Power Precision CMOS Oscillator with|
||**Package:**||A||=|6-Lead 7.0||mm x 5.0 mm VDFN|||||Standby, 6-Ld 5.0X3.2 VDFN, Extended|
||||B||=|6-Lead 5.0||mm x 3.2 mm VDFN|||||Industrial Temperature Range, ±25 ppm, 30|
||||C||=|6-Lead 3.2||mm x 2.5 mm VDFN|||||MHz Output Frequency, 110/Tube|
||||D||=|6-Lead 2.5||mm x 2.0 mm VDFN||||||
||||N||=|6-Lead 7.0||mm x 5.0 mm VDFN (no||center pad)||c) DSC1101DE5-150.0000:||
||||||||||||||Low-Power Precision CMOS Oscillator with|
||**Temperature**<br>**Range:**||E<br>I<br>L||=<br>=<br>=|–20C to +70C (Extended Commercial)<br>–40C to +85C (Industrial)<br>–40C to +105C (Extended Industrial)|||||||Standby, 6-Ld 2.5X2.0 VDFN, Extended<br>Commercial Temperature Range, ±10 ppm,<br>150 MHz Output Frequency, 110/Tube|
||||M||=|–55C to +125C (Automotive)||||||d) DSC1101AI2-075.0000T:||
||||||||||||||Low-Power Precision CMOS Oscillator with|
||**Stability:**||1||=|±50 ppm|||||||Standby, 6-LD 7.0X5.0 VDFN, Industrial|
||||2<br>3<br>5||=<br>=<br>=|±25 ppm<br>±20 ppm<br>±10 ppm|||||||Temperature Range, ±25 ppm, 75 MHz Out-<br>put Frequency, 1,000/Reel|
|||||||||||||**Note 1:**|Tape and Reel identifier only appears in the|
||**Frequency:**||xxx.xxxx|||=2.3|MHz to|170 MHz (user-defined)|||||catalog part number description. This identifier is<br>used for ordering purposes and is not printed on|
||||||||||||||the device package. Check with your Microchip|
||**Packing Option:**||<blank>=<br>T<br>=|||110/Tube<br>1,000/Reel|||||||Sales Office for package availability with the<br>Tape and Reel option.|
||**Note 1:**|For|AEC-Q100|||qualified parts, please refer to||||the||||
|||DSA11xx family.||||||||||||



DS20005613E-page 29 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1101/21** 

## **NOTES:** 

DS20005613E-page 30 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

## **Microchip Information** 

## **Trademarks** 

The “Microchip” name and logo, the “M” logo, and other names, logos, and brands are registered and unregistered trademarks of Microchip Technology Incorporated or its affiliates and/or subsidiaries in the United States and/or other countries (“Microchip Trademarks”). Information regarding Microchip Trademarks can be found at https://www.microchip.com/en-us/about/legalinformation/microchiptrademarks. 

ISBN: 979-8-3371-1511-5 

## **Legal Notice** 

This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at www.microchip.com/en-us/support/design-help/client-support-services. 

THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. 

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. 

Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 

## **Microchip Devices Code Protection Feature** 

Note the following details of the code protection feature on Microchip products: 

- Microchip products meet the specifications contained in their particular Microchip Data Sheet. 

- Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. 

- Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. 

- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. 

DS20005613E-page 31 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries