DSC1102NE1-125.0000

## **DSC1102/22** 

## **Low-Jitter Precision LVPECL Oscillator** 

## **Features** 

- Low RMS Phase Jitter: <1 ps (typ.) 

- High Stability: ±10 ppm, ±20 ppm, ±25 ppm, ±50 ppm 

- Wide Temperature Range 

- Ext. Industrial: –40°C to +105°C 

- Industrial: –40°C to +85°C 

- Ext. Commercial: –20°C to +70°C 

- High Supply Noise Rejection: –50 dBc 

- Wide Frequency Range: 2.3 MHz to 460 MHz 

- Small Industry Standard Footprints: 

- 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm, 5.0 mm x 3.2 mm, and 7.0 mm x 5.0 mm 

- Excellent Shock and Vibration Immunity 

- Qualified to MIL-STD-883 

## **General Description** 

The DSC1102 and DSC1122 series of high performance oscillators utilizes a proven silicon MEMS technology to provide excellent jitter and stability over a wide range of supply voltages and temperatures. By eliminating the need for quartz or SAW technology, MEMS oscillators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of communications, storage, and networking applications. 

DSC1102 has a standby feature allowing it to completely power down when EN pin is pulled low; whereas for DSC1122, only the outputs are disabled when EN is low. Both oscillators are available in industry standard packages, including the smallest 2.5 mm x 2.0 mm, and are drop-in replacements for standard 6-pin LVPECL quartz crystal oscillators. 

- High Reliability 

- 20x Better MTF than Quartz Oscillators 

## **Block Diagram** 

- Low Current Consumption 

- Supply Range of 2.25V to 3.63V 

- Standby and Output Enable Function 

- Lead Free and RoHS Compliant 

- LVDS and HCSL Versions Available 

## **Applications** 

- Storage Area Networks 

- SATA, SAS, Fibre Channel 

- Passive Optical Networks 

- EPON, 10G-EPON, GPON, 10G-GPON 

- Ethernet 

- 1G, 10GBASE-T/KR/LR/SR, and FCoE 

- HD/SD/SDI Video and Surveillance 

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Pin 1 Pin 6<br>ENABLE TEMP SENSOR &COMPENSATION VDD<br>CIRCUITRY<br>Pin 2 Pin 5<br>NC MEMS DIVIDER OUTPUT<br>PLL<br>OSCILLATOR DRIVER<br>HH<br>Pin 3 Pin 4<br>GND OUTPUT<br>TABLE 1: OUTPUT ENABLE MODES<br>EN Pin DSC1102 DSC1122<br>High Outputs Active Outputs Active<br>NC Outputs Active Outputs Active<br>——=—— Low Standby Outputs Disabled<br>**----- End of picture text -----**<br>


DS20006254A-page 1 

 2019 Microchip Technology Inc. 

**DSC1102/22** 

## **1.0 ELECTRICAL CHARACTERISTICS** 

## **Absolute Maximum Ratings †** 

|Supply Voltage ..........................................................................................................................................–0.3V to +4.0V|
|---|
|Input Voltage .................................................................................................................................... –0.3V to VDD+ 0.3V|
|ESD Protection (HBM) ...............................................................................................................................................4 kV|
|ESD Protection (MM) ............................................................................................................................................... 400V|
|ESD Protection (CDM) ............................................................................................................................................1.5<br>kV|



**† Notice:** Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. 

## **ELECTRICAL CHARACTERISTICS** 

Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified. 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|Supply Voltage (Note<br>1)|VDD|2.25|—|3.63|V|—|
|Supply Current|IDD|—|—|0.095|mA|DSC1102, EN pin low,<br>Output is disabled|
|||—|20|22||DSC1122, EN pin low,<br>Output is disabled|
|Frequency Stability|Δf|—|—|±10|ppm|Includes frequency variation<br>due to initial tolerance,<br>temp., and power supply<br>voltage.|
|||—|—|±20|||
|||—|—|±25|||
|||—|—|±50|||
|Aging - First Year|ΔfY1|—|—|±5|ppm|One year at +25°C|
|Aging - After First Year|ΔfY2+|—|—|<±1|ppm/yr|Year two and beyond at<br>+25°C|
|Start-up Time (Note<br>2)|tSU|—|—|5|ms|T = +25°C|
|Input Logic Levels|VIH|0.75 x VDD|—|—|V|Input logic high|
||VIL|—|—|0.25 x VDD||Input logic low|
|Output Disable Time (Note<br>3)|tDA|—|—|5|ns|—|
|Output Enable Time|tEN|—|—|5|ms|DSC1102|
|||—|—|20|ns|DSC1122|
|Enable Pull-Up Resistor<br>(Note<br>4)|RPU|—|40|—|kΩ|Pull-up resistor exists|
|**LVPECL Outputs**|||||||
|Supply Current|IDD|—|56.5|58|mA|Output Enabled, RL= 50Ω|
|Output Logic Levels|VOH|VDD– 1.08|—|—|V|Output logic high, RL= 50Ω|
||VOL|—|—|VDD– 1.55||Output logic low|
|Peak-to-Peak Output Swing|—|—|800|—|mV|Single-Ended|



- **Note 1:** Pin 6 VDD should be filtered with a 0.1 μF capacitor. 

   - **2:** tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. 

   - **3:** Output Waveform and Test Circuit figures below define the parameters. 

   - **4:** Output is enabled if pad is floated or not connected. 

DS20006254A-page 2 

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**DSC1102/22** 

## **ELECTRICAL CHARACTERISTICS (CONTINUED)** 

Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified. 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|Output Transition Time<br>(Note<br>3)|tr|—|250|—|ps|Rise time, 20% to 80%|
||tf|||||Fall time, RL= 50Ω,<br>CL= 0 pF|
|Frequency|f0|2.3|—|460|MHz|—|
|Output Duty Cycle|SYM|48|—|52|%|Differential|
|Period Jitter|JPER|—|2.5|—|psRMS|—|
|Integrated Phase Noise|JPH|—|0.25|—|psRMS|200<br>kHz to 20<br>MHz @<br>156.25<br>MHz|
|||—|0.38|—||100<br>kHz to 20<br>MHz @<br>156.25<br>MHz|
|||—|1.7|2||12<br>kHz to 20<br>MHz @<br>156.25<br>MHz|



- **Note 1:** Pin 6 VDD should be filtered with a 0.1 μF capacitor. 

   - **2:** tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. 

   - **3:** Output Waveform and Test Circuit figures below define the parameters. 

   - **4:** Output is enabled if pad is floated or not connected. 

DS20006254A-page 3 

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## **DSC1102/22** 

## **TEMPERATURE SPECIFICATIONS (Note 1)** 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|**Temperature Ranges**|||||||
|Operating Temperature Range|TA|–20|—|+70|°C|Ordering Option E|
|||–40|—|+85|°C|Ordering Option I|
|||–40|—|+105|°C|Ordering Option L|
|Junction Temperature|TJ|—|—|+150|°C|—|
|Storage Temperature Range|TS|–55|—|+150|°C|—|
|Soldering Temperature|—|—|—|+260|°C|40 sec. max.|



**Note 1:** The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. 

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**DSC1102/22** 

## **2.0 PIN DESCRIPTIONS** 

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EN 1 6 VDD<br>NC 2 5 OUT<br>GND 3 4 OUT<br>**----- End of picture text -----**<br>


_**FIGURE 2-1:** Pin Configuration, 6-Lead QFN_ 

The descriptions of the pins are listed in Table 2-1. 

**TABLE 2-1: PIN FUNCTION TABLE** 

|**Pin Number**|**Pin Name**|**Description**|
|---|---|---|
|1|EN|Enable or Standby.|
|2|NC|Leave unconnected or connect to ground.|
|3|GND|Ground.|
|4|OUT|Output.|
|5|OUT|Complementary Output.|
|6|VDD|Supply Voltage.|



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**DSC1102/22** 

## **3.0 NOMINAL PERFORMANCE PARAMETERS** 

Unless specified otherwise, T = +25°C, VDD = 3.3V. 

_**FIGURE 3-1:** Power Supply Rejection Ratio._ 

_**FIGURE 3-2:** Phase Jitter (Integrated Phase Noise)._ 

## **3.1 Output Waveform** 

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tR tF<br>Output 80%<br>50% 830 mv350 mV<br>20%<br>Output<br>1/f o tEN<br>tDA<br>VIH<br>Enable<br>VIL<br>**----- End of picture text -----**<br>


_**FIGURE 3-3:** Output Waveform._ 

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**DSC1102/22** 

## **3.2 Typical Termination Scheme** 

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VDD<br>VDD<br>R1 R3<br>6<br>2 5 I<br>3 4<br>R2 R4<br>**----- End of picture text -----**<br>


## _**FIGURE 3-4:**_ 

_Typical Termination Scheme._ 

The values for R1, R2, R3, and R4 in the termination scheme depend on what VDD is used. Table 3-1 lists the recommended values for each resistor depending on VDD. 

**TABLE 3-1: RECOMMENDED RESISTOR VALUES** 

|||**VDD**|**R1, R3**|**R2, R4**|
|---|---|---|---|---|
|||3.3V|130Ω|82Ω|
|||2.5V|249Ω|62Ω|
|**3.3**||**Test Circuit**|||



_**FIGURE 3-5:**_ 

_Test Circuit._ 

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**DSC1102/22** 

## **3.4 Recommended Board Layout** 

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Via to GND layer<br>1 6<br>Supply bypass<br>capacitor<br>2 5<br>3 4<br>Via to GND layer<br>**----- End of picture text -----**<br>


_**FIGURE 3-6:** Recommended Board Layout._ 

## **3.5 Solder Reflow Profile** 

**MSL 1 @ 260°C refer to JSTD-020C** 

|**MSL 1 @ 260°C refer to JSTD-020C°C refer to JSTD-020CC refer to JSTD-020C**|**MSL 1 @ 260°C refer to JSTD-020C°C refer to JSTD-020CC refer to JSTD-020C**|
|---|---|
|Ramp-Up Rate (200°C to Peak Temp)|3°C/sec. max.|
|Preheat Time 150°C to 200°C|60-180 sec.|
|Time Maintained above 217°C|60-150 sec.|
|Peak Temperature|255°C to 260°C|
|Time within 5°C of Actual Peak|20-40 sec.|
|Ramp-Down Rate|6°C/sec. max.|
|Time 25°C to Peak Temperature|8 minutes max.|



DS20006254A-page 8 

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**DSC1102/22** 

## **4.0 PACKAGE MARKING INFORMATION** 

## **4.1 Package Marking Information** 

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6-Lead CDFN/VDFN* Example<br>XXXXXXX 0400000<br>DCPYYWW DCP1941<br>0SSS 0603<br>**----- End of picture text -----**<br>


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Legend: XX...X Product code or customer-specific information<br>Y Year code (last digit of calendar year)<br>YY Year code (last 2 digits of calendar year)<br>WW Week code (week of January 1 is week ‘01’)<br>SSS Alphanumeric traceability code<br>e3 Pb-free JEDEC [®]  designator for Matte Tin (Sn)<br>* This package is Pb-free. The Pb-free JEDEC designator (     )  e3<br>can be found on the outer packaging for this package.<br>●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle<br>mark).<br>Note : In the event the full Microchip part number cannot be marked on one line, it will<br>be carried over to the next line, thus limiting the number of available<br>characters for customer-specific information. Package may or may not include<br>the corporate logo.<br>Underbar (_) and/or Overbar (‾) symbol may not be to scale.<br>**----- End of picture text -----**<br>


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## **DSC1102/22** 

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## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.05 C<br>1 2<br>2X<br>0.05 C TOP VIEW<br>0.10 C A1<br>C<br>A<br>SEATING<br>PLANE<br>6X<br>0.08 C<br>SIDE VIEW<br>2X b2<br>1 2<br>NOTE 1<br>L<br>N<br>4X b1<br>L1<br>e 0.07 C A B<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1007A Sheet 1 of 2 

DS20006254A-page 13 

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**DSC1102/22** 

## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|1.05 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|3.20 BSC|||
|Overall Width|E|2.50 BSC|||
|Terminal Width|b1|0.85|0.90|0.95|
|Terminal Width|b2|0.45|0.50|0.55|
|Terminal Length|L|0.65|0.70|0.75|
|Terminal Pullback|L1|0.10 REF|||



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1007A Sheet 2 of 2 

DS20006254A-page 14 

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**DSC1102/22** 

## **6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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X2<br>G<br>6<br>C<br>Y<br>1 2<br>X1 SILK SCREEN<br>E<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|1.05 BSC|||
|Contact Pad Spacing|C||1.60||
|Contact Pad Width(X4)|X1|||1.00|
|Contact Pad Width(X2)|X2|||0.60|
|Contact Pad Length(X6)|Y|||0.85|
|Space Between Contacts(X4)|G1|0.25|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

Microchip Technology Drawing C04-3007A 

DS20006254A-page 15 

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**DSC1102/22** 

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## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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D A<br>B<br>N<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.20 C<br>1 2<br>2X<br>0.20 C<br>TOP VIEW<br>A1<br>0.10 C<br>C<br>SEATING A<br>PLANE<br>6X<br>0.08 C<br>SIDE VIEW<br>0.10 C A B<br>D2<br>1 2<br>0.10 C A B<br>NOTE 1<br>E2<br>6X L<br>(K)<br>N<br>6X b<br>e 0.10 C A B<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1010A Sheet 1 of 2 

DS20006254A-page 17 

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**DSC1102/22** 

## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [184 x 107] intentionally omitted <==**

## Notes: 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|6|||
|Pitch|e|2.54|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|7.00 BSC|||
|Exposed Pad Length|D2|2.70|2.80|2.90|
|Overall Width|E|5.00 BSC|||
|Exposed Pad Width|E2|1.70|1.80|1.90|
|Terminal Width|b|1.35|1.40|1.45|
|Terminal Length|L|1.00|1.10|1.20|
|Terminal-to-Exposed-Pad|K|0.20 REF|||



1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1010A Sheet 2 of 2 

DS20006254A-page 18 

 2019 Microchip Technology Inc. 

**DSC1102/22** 

## **6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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X2<br>EV<br>6<br>C Y2 EV ØV<br>G<br>Y1<br>1 2<br>X1<br>E<br>SILK SCREEN<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|2.54 BSC|||
|Optional Center Pad Width|X2|||2.90|
|Optional Center Pad Length|Y2|||1.90|
|Contact Pad Spacing|C||3.70||
|Contact Pad Width(X6)|X1|||1.50|
|Contact Pad Length(X6)|Y1|||1.35|
|Contact Pad to Center Pad(X2)|G|0.20|||
|Thermal Via Diameter(X6)|V||0.33||
|Thermal Via Pitch|EV||1.20||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 

Microchip Technology Drawing C04-3010A 

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**DSC1102/22** 

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**DSC1102/22** 

## Notes: 

DS20006254A-page 21 

 2019 Microchip Technology Inc. 

## **DSC1102/22** 

DS20006254A-page 22 

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**DSC1102/22** 

## **APPENDIX A: REVISION HISTORY** 

## **Revision A (October 2019)** 

- Initial creation of document DSC1102/22 to Microchip data sheet template DS20006254A. 

- •Minor text changes throughout. 

DS20006254A-page 23 

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**DSC1102/22** 

## **NOTES:** 

DS20006254A-page 24 

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**DSC1102/22** 

## **PRODUCT IDENTIFICATION SYSTEM** 

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. 

|**P**<br>**ART NO.**|**P**<br>**ART NO.**|**X**|**X**||**X**<br>**X**<br>**-XXX.XXXX**|**X**<br>**X**<br>**-XXX.XXXX**||**X**|**X**||**Examples:**|**Examples:**||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||a) DSC1102AE1-053.5000:||DSC1102,|
|**Device**||**Package**||**Stability**<br>**Temperature**<br>**Frequency**|||**Packaging**||||||6-Lead 7x5 VDFN,|
||||||**Range**|||**Option**|||||Ext. Commercial|
||||||||||||||Temp. Range, ±50<br>ppm|
||||||||||||||Stability, 53.5<br>MHz|
|**Device:**||DSC1102:<br>DSC1122:|||Low-Jitter Precision LVPECL Oscillator with<br>Standby Pin<br>Low-Jitter Precision LVPECL Oscillator with||||||b) DSC1122BI2-246.8100T:||Frequency, Tube<br>DSC1122,|
||||||Output Enable||||||||6-Lead 5x3.2 CDFN,|
||||||||||||||Industrial Temp. Range,|
|**Package:**||A<br>B||=<br>=|6-Lead 7.0<br>mm x 5.0<br>mm VDFN<br>6-Lead 5.0<br>mm x 3.2<br>mm CDFN||||||||±25<br>ppm Stability,<br>246.81<br>MHz Frequency,|
|||C||=|6-Lead 3.2<br>mm x 2.5<br>mm VDFN||||||||1000/Reel|
|||D<br>N||=<br>=|6-Lead 2.5<br>mm x 2.0<br>mm VDFN<br>6-Lead 7.0<br>mm x 5.0<br>mm VDFN w/o<br>pad||center||||c) DSC1102CL5-156.2500:||DSC1102,<br>6-Lead 3.2x2.5 VDFN,<br>Ext. Industrial|
||||||||||||||Temp. Range, ±10<br>ppm|
|**Temperature**||E||=|–20C to +70C (Extended|Commercial)|||||||Stability, 156.25<br>MHz|
|**Range:**||I<br>L||=<br>=|–40C to +85C (Industrial)<br>–40C to +105C (Extended Industrial)||||||d) DSC1122DE3-094.5500T:||Frequency, Tube<br>DSC1122,|
||||||||||||||6-Lead 2.5x2.0 VDFN,|
|**Stability:**||1<br>2<br>3<br>5||=<br>=<br>=<br>=|±50<br>ppm<br>±25<br>ppm<br>±20<br>ppm<br>±10<br>ppm||||||||Industrial Temp. Range,<br>±20<br>ppm Stability,<br>94.55<br>MHz Frequency,<br>1000/Reel|
|**Frequency:**||xxx.xxxx|||=2.3<br>MHz to 460<br>MHz (User|Defined)|||||**Note 1:**|Tape and Reel identifier only appears in the||
|||||||||||||catalog part number|description. This identifier is|
|**Packing Option:**||<blank>=<br>T<br>=|||Tube<br>1000/Reel|||||||used for ordering purposes and is not printed on<br>the device package. Check with your Microchip<br>Sales Office for package availability with the||
|**Note:**|Please visit the MicrochipClockWorks® Configurator <br>the part number for customized frequency.||||||to|configure||||Tape and Reel option.||
||http://clockworks.microchip.com/timing|||||||||||||



DS20006254A-page 25 

 2019 Microchip Technology Inc. 

**DSC1102/22** 

## **NOTES:** 

DS20006254A-page 26 

 2019 Microchip Technology Inc. 

**Note the following details of the code protection feature on Microchip devices:** 

- Microchip products meet the specification contained in their particular Microchip Data Sheet. 

- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. 

- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. 

- Microchip is willing to work with the customer who is concerned about the integrity of their code. 

- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” 

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. 

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE **.** Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 

## **Trademarks** 

The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. 

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. 

The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. 

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. 

All other trademarks mentioned herein are property of their respective companies. 

© 2019, Microchip Technology Incorporated, All Rights Reserved. 

_For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality._ 

ISBN: 978-1-5224-5100-6 

DS20006254A-page 27 

 2019 Microchip Technology Inc. 

## **Worldwide Sales and Service** 

## **AMERICAS** 

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## **ASIA/PACIFIC** 

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## **ASIA/PACIFIC** 

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## **EUROPE** 

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**Sweden - Stockholm** Tel: 46-8-5090-4654 

**UK - Wokingham** Tel: 44-118-921-5800 

Fax: 44-118-921-5820 

DS20006254A-page 28 

 2019 Microchip Technology Inc. 

05/14/19