DSC1001DL5-027.0000

## **DSC1001/3/4** 

## **1.8V-3.3V Low-Power Precision CMOS Oscillators** 

## **Features** 

- Frequency Range: 1 MHz to 150 MHz 

- Exceptional Stability over Temperature 

- ±10 ppm, ±20 ppm, ±25 ppm, ±50 ppm 

- Operating Voltage - 1.7 to 3.6V 

- Operating Temperature Range 

- Ext. Industrial –40°C to 105°C 

- Industrial –40°C to 85°C 

- Commercial –20°C to 70°C 

- Low Operating and Standby Current 

- 6 mA Operating (1 MHz) 

- 15 µA Standby (Max.) 

- Ultra Miniature Footprint 

- 2.5 mm x 2.0 mm x 0.85 mm 

- 3.2 mm x 2.5 mm x 0.85 mm 

- 5.0 mm x 3.2 mm x 0.85 mm 

- 7.0 mm x 5.0 mm x 0.85 mm 

- MIL-STD 883 Shock and Vibration Resistant 

- Pb Free, RoHS, Reach SVHC Compliant 

- For AEC-Q100 Qualified, Refer to DSA10xx Family 

## **Applications** 

- Mobile Applications 

- Consumer Electronics 

- Portable Electronics 

- DVR, CCTV, Surveillance Cameras 

- Low Profile Applications 

- Industrial Applications 

## **Benefits** 

## **General Description** 

The DSC1001/3/4 is a silicon MEMS based CMOS family of oscillators that offers excellent jitter and stability performance over a wide range of supply voltages and temperatures. The device operates from 1 MHz to 150 MHz with supply voltages between 1.8 to 3.3 volts and temperature ranges up to –40°C to 105°C. 

The DSC1001/3/4 incorporate an all silicon resonator that is extremely robust and nearly immune to stress related fractures, common to crystal based oscillators. Without sacrificing the performance and stability required of today’s systems, a crystal-less design allows for a higher level of reliability, making the DSC1001/3/4 ideal for rugged, industrial, and portable applications where stress, shock, and vibration can damage quartz crystal based systems. 

Available in industry standard packages, the DSC1001/3/4 can be “dropped-in” to the same PCB footprint as standard crystal oscillators. 

The DSC1003 and DSC1004 have the same functionality and performance as the DSC1001, but feature higher output drives of 25 pF and 40 pF, respectively. 

## **Package Types** 

|**Package Types**|||
|---|---|---|
|**DSC1001/3/4**|||
|4-Lead VDFN|||
|(Top View)|||
|STANDBY#<br>1|4|VDD|
|2<br>GND|3|OUT|



- Pin for Pin “Drop-In” Replacement for Industry Standard Oscillators 

- Semiconductor Level Reliability, Significantly Higher than Quartz 

- Short Mass Production Lead Times 

- Longer Battery Life/Reduced Power Consumption 

- Compact Plastic Package 

- Cost Effective 

DS20005529D-page 1 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **Block Diagram** 

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**----- Start of picture text -----**<br>
V OUTPUT<br>DD<br>RESONATOR PFD V CO<br>FRAC-NFRAC-N<br>PLL<br>STANDBY# GND<br>(PIN1)<br>**----- End of picture text -----**<br>


DS20005529D-page 2 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **1.0 ELECTRICAL CHARACTERISTICS** 

## **Absolute Maximum Ratings †** 

Input Voltage (VIN) ............................................................................................................................–0.3V to VDD + 0.3V ESD Protection ....................................................................................................... 4 kV HBM, ±200V MM, 1.5 kV CDM 

## **Recommended Operating Conditions** 

Supply Voltage (VDD) ................................................................................................................................ +1.7V to +3.6V Output Load (ZL) ............................................................................................................................. R > 10 kΩ, C ≤ 15 pF **† Notice:** Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. 

## **TABLE 1-1: DC CHARACTERISTICS** 

**Electrical Characteristics:** VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|Frequency|F0|1|—|150|MHz|Single Frequency||
|Frequency Tolerance|Δf|—|—|±10|ppm|Includes frequency variations<br>due to initial tolerance,<br>temperature and power supply<br>voltage||
|||—|—|±20||||
|||—|—|±25||||
|||—|—|±50||||
|Aging|Δf|—|—|±5|ppm|1year@+25°C||
|SupplyCurrent, Standby|IDD|—|—|15|µA|T = +25°C||
|Output Startup Time<br>(Note 1)|tSU|—|1.0|1.3|ms|T = +25°C||
|Output Disable Time|tDA|—|20|100|ns|—||
|Output DutyCycle|SYM|45|—|55|%|—||
|Input Logic Level High|VIH|0.75 x VDD|—|—|V|—||
|Input Logic Level Low|VIL|—|—|0.25 x VDD|V|—||
|**VDD = 1.8V**||||||||
|Supply Current, No Load|IDD|—|6.0|6.3|mA|1 MHz|CL= 0 pF,<br>RL= ∞,<br>T = +25°C|
|||—|6.5|7.1||27 MHz||
|||—|7.2|8.5||70 MHz||
|||—|8.3|11.9||150 MHz||
|Output Logic Level High|VOH|0.8 x VDD|—|—|V|–6 mA, DSC1004, CL= 40 pF||
|||0.8 x VDD|—|—||–6 mA, DSC1003, CL= 25pF||
|||0.8 x VDD|—|—||–4 mA, DSC1001, CL= 15pF||
|Output Logic Level Low|VOL|—|—|0.2 x VDD|V|6 mA, DSC1004, CL= 40 pF||
|||—|—|0.2 x VDD||6 mA, DSC1003, CL= 25pF||
|||—|—|0.2 x VDD||4 mA, DSC1001, CL= 15pF||



**Note 1:** tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 

- **2:** Measured over 50k clock cycles. 

DS20005529D-page 3 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

## **DSC1001/3/4** 

## **TABLE 1-1: DC CHARACTERISTICS (CONTINUED)** 

**Electrical Characteristics:** VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|Output Transition Rise<br>Time|tR|—|1.4|3.0|ns|DSC1001, CL=<br>15pF|T = +25°C,<br>20% to 80%|
|||—|1.5|3.0||DSC1003, CL=<br>25 pF||
|||—|1.8|3.0||DSC1004, C2=<br>40pF||
|Output Transition Fall<br>Time|tF|—|1.0|3.0|ns|DSC1001, CL=<br>15 pF|T = +25°C,<br>20% to 80%|
|||—|1.1|3.0||DSC1003, CL=<br>25pF||
|||—|1.2|3.0||DSC1004, C2=<br>40 pF||
|Jitter, Max.<br>Cycle-to-Cycle|JCC|—|60|—|ps|f = 100 MHz (Note 2)||
|Period Jitter|JP|—|10|15|psRMS|f = 100 MHz(Note 2)||
|**VDD = 2.5V**||||||||
|Supply Current, No Load|IDD|—|6.0|6.4|mA|1 MHz|CL= 0 pF,<br>RL= ∞,<br>T = +25°C|
|||—|6.7|7.5||27 MHz||
|||—|7.7|9.4||70 MHz||
|||—|9.6|13.9||150 MHz||
|Output Logic Level High|VOH|0.9 x VDD|—|—|V|–6 mA, DSC1004, CL= 40 pF||
|||0.8 x VDD|—|—||–6 mA, DSC1003, CL= 25 pF||
|||0.8 x VDD|—|—||–4 mA, DSC1001, CL= 15pF||
|Output Logic Level Low|VOL|—|—|0.1 x VDD|V|6 mA, DSC1004, CL= 40pF||
|||—|—|0.2 x VDD||6 mA, DSC1003, CL= 25 pF||
|||—|—|0.2 x VDD||4 mA, DSC1001, CL= 15pF||
|Output Transition Rise<br>Time|tR|—|1.0|2.0|ns|DSC1001, CL=<br>15 pF|T = +25°C,<br>20% to 80%|
|||—|1.1|2.0||DSC1003, CL=<br>25pF||
|||—|1.2|2.0||DSC1004, C2=<br>40 pF||
|Output Transition Fall<br>Time|tF|—|0.9|2.0|ns|DSC1001, CL=<br>15pF|T = +25°C,<br>20% to 80%|
|||—|1.0|2.0||DSC1003, CL=<br>25 pF||
|||—|1.1|2.0||DSC1004, C2=<br>40pF||



- **Note 1:** tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 

   - **2:** Measured over 50k clock cycles. 

DS20005529D-page 4 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **TABLE 1-1: DC CHARACTERISTICS (CONTINUED)** 

**Electrical Characteristics:** VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|Jitter, Max.<br>Cycle-to-Cycle|JCC|—|50|—|ps|f = 100 MHz (Note 2)||
|Period Jitter|JP|—|5|10|psRMS|f = 100 MHz(Note 2)||
|**VDD = 3.3V**||||||||
|Supply Current, No Load|IDD|—|6.0|6.5|mA|1 MHz|CL= 0 pF,<br>RL= ∞,<br>T = +25°C|
|||—|6.8|8.0||27 MHz||
|||—|8.2|10.5||70 MHz||
|||—|10.8|16.6||150 MHz||
|Output Logic Level High|VOH|0.9 x VDD|—|—|V|–8 mA, DSC1004, CL= 40 pF||
|||0.9 x VDD|—|—||–6 mA, DSC1003, CL= 25pF||
|||0.8 x VDD|—|—||–4 mA, DSC1001, CL= 15pF||
|Output Logic Level Low|VOL|—|—|0.1 x VDD|V|8 mA, DSC1004, CL= 40 pF||
|||—|—|0.1 x VDD||6 mA, DSC1003, CL= 25pF||
|||—|—|0.2 x VDD||4 mA, DSC1001, CL= 15pF||
|Output Transition Rise<br>Time|tR|—|1.0|2.0|ns|DSC1001, CL=<br>15 pF|T = +25°C,<br>20% to 80%|
|||—|1.1|2.0||DSC1003, CL=<br>25pF||
|||—|1.2|2.0||DSC1004, C2=<br>40 pF||
|Output Transition Fall<br>Time|tF|—|0.9|2.0|ns|DSC1001, CL=<br>15pF|T = +25°C,<br>20% to 80%|
|||—|1.0|2.0||DSC1003, CL=<br>25 pF||
|||—|1.1|2.0||DSC1004, C2=<br>40pF||
|Jitter, Max.<br>Cycle-to-Cycle|JCC|—|50|—|ps|f = 100 MHz (Note 2)||
|Period Jitter|JP|—|5|10|psRMS|f = 100 MHz(Note 2)||



**Note 1:** tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 

- **2:** Measured over 50k clock cycles. 

DS20005529D-page 5 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **TEMPERATURE SPECIFICATIONS (Note 1)** 

|**Parameters**|**Sym.**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|**Temperature Ranges**|||||||
|Operating Temperature Range|TA|–40|—|+105|°C|OrderingOption L|
|||–40|—|+85|°C|OrderingOption I|
|||–20|—|+70|°C|OrderingOption E|
|Junction OperatingTemperature|TJ|—|—|+150|°C|—|
|Storage Temperature Range|TA|–55|—|+150|°C|—|
|SolderingTemperature Range|TS|—|—|+260|°C|40 sec. max|



**Note 1:** The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. 

DS20005529D-page 6 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **2.0 PIN DESCRIPTIONS** 

The descriptions of the pins are listed in Table 2-1 and Table 2-2. 

## **TABLE 2-1: VDFN PACKAGE PIN FUNCTION TABLE** 

|**Pin Number**|**Symbol**|**Description**|
|---|---|---|
|1|STANDBY#|Standbyinput(see theStandbyFunctionsection)|
|2|GND|Power supply ground|
|3|OUT|Oscillator output|
|4|VDD|Positivepower supply|



## **TABLE 2-2: 7 MM X 5 MM VDFN PACKAGE PIN FUNCTION TABLE** 

|**Pin Number**|**Symbol**|**Description**|
|---|---|---|
|1|STANDBY#|Standbyinput(see theStandbyFunctionsection)|
|2|GND|Power supply ground|
|3|OUT|Oscillator output|
|4|VDD|Positivepower supply|
|Center Pad|NC|Tie to GND or do not connect.|



DS20005529D-page 7 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **3.0 NOMINAL PERFORMANCE CHARACTERISTICS** 

**Note:** The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 

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FIGURE 3-1: Supply Current.<br>**----- End of picture text -----**<br>


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FIGURE 3-4: Supply Current.<br>**----- End of picture text -----**<br>


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FIGURE 3-2: Rise Time.<br>**----- End of picture text -----**<br>


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FIGURE 3-5: Fall Time.<br>**----- End of picture text -----**<br>


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FIGURE 3-3: Rise Time.<br>**----- End of picture text -----**<br>


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FIGURE 3-6: Fall Time.<br>**----- End of picture text -----**<br>


DS20005529D-page 8 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4.0 OUTPUT WAVEFORM** 

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tR tF<br>V<br>OH<br>OUTPUT<br>V<br>OL<br>1/fo tEN<br>tDA<br>VIH<br>STANDBY# VIL<br>**----- End of picture text -----**<br>


_**FIGURE 4-1:** Output Waveform._ 

## **4.1 Standby Function** 

|**4.1**<br>**Standby Function**||
|---|---|
|**Standby# (Pin 1)**|**Output (Pin 3)**|
|High Level|Output ON|
|Open(no connect)|Output ON|
|Low Level|High Impedance|



DS20005529D-page 9 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **5.0 TEST CIRCUIT** 

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IDD<br>4 3<br>1 2<br>VDD 0.01μF  15pF<br>*VSD<br>*VSD = Standby# Logic Level Input   = Standby# Logic Level Input<br>**----- End of picture text -----**<br>


- *VSD = Standby# Logic Level Input 

_**FIGURE 5-1:**_ 

_DSC1001/3/4 Test Circuit._ 

DS20005529D-page 10 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **6.0 BOARD LAYOUT (RECOMMENDED)** 

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Via to GND Layer<br>C1<br>VDD Output<br>Standby GND<br>Via to GND Layer<br>**----- End of picture text -----**<br>


_**FIGURE 6-1:** Recommended Board Layout for DSC1001/3/4._ 

DS20005529D-page 11 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **7.0 SOLDER REFLOW PROFILE** 

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20-40<br>° Sec<br>260 C<br>217°C<br>60-150<br>200°C  Sec<br>Re�ow<br>° 60-180<br>150 C<br>Sec<br>Pre heat Cool<br>25°C<br>8 min max Time<br>3C/Sec Max.<br>3C/Sec Max.<br>6C/Sec Max.<br>°C)<br>Temperature  (<br>**----- End of picture text -----**<br>


## _**FIGURE 7-1:** Solder Reflow Profile._ 

|**_FIGURE 7-1:_**<br>_Solder Reflow Profile._|**_FIGURE 7-1:_**<br>_Solder Reflow Profile._|
|---|---|
|**MSL 1 @ 260°C refer to JSTD-020C**||
|Ramp-UpRate(200°C to Peak Temp)|3°C/sec. max.|
|Preheat Time 150°C to 200°C|60 to 180 sec.|
|Time maintained above 217°C|60 to 150 sec.|
|Peak Temperature|255°C to 260°C|
|Time within 5°C of Actual Peak|20 to 40 sec.|
|Ramp-Down Rate|6°C/sec. max.|
|Time 25°C to Peak Temperature|8 minutes max.|



DS20005529D-page 12 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **8.0 PACKAGING INFORMATION** 

## **8.1 Package Marking Information** 

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4-Lead VDFN* Example<br>XXXXXX 0400000<br>XXXYYWW DAP2319<br>0SSS 0BD2<br>**----- End of picture text -----**<br>


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Legend: XX...X Product code, customer-specific information, or frequency in MHz<br>without printed decimal point<br>Y Year code (last digit of calendar year)<br>YY Year code (last 2 digits of calendar year)<br>WW Week code (week of January 1 is week ‘01’)<br>SSS Alphanumeric traceability code<br>e3 Pb-free JEDEC [®]  designator for Matte Tin (Sn)<br>* This package is Pb-free. The Pb-free JEDEC designator (     )e3<br>can be found on the outer packaging for this package.<br>●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle<br>mark).<br>Note : In the event the full Microchip part number cannot be marked on one line, it will<br>be carried over to the next line, thus limiting the number of available<br>characters for customer-specific information. Package may or may not include<br>the corporate logo.<br>Underbar (_) and/or Overbar (‾) symbol may not be to scale.<br>**----- End of picture text -----**<br>


DS20005529D-page 13 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Dual Flatpack, No Lead Package (JZA) - 7x5x0.9 mm Body [VDFN] With 2.2x3.5 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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D A<br>B<br>4<br>E<br>(DATUM B)<br>(DATUM A)<br>2X<br>0.10 C<br>1 2<br>2X<br>NOTE 1<br>0.10 C<br>TOP VIEW<br>A1<br>0.10 C<br>C<br>A<br>SEATING<br>PLANE<br>4X<br>(A3) SIDE VIEW 0.08 C<br>0.10 C A B<br>D2<br>1.50 Ref<br>1 2<br> 1.00 Ref 0.10 C A B<br>C0.25<br>2.60 Ref E2<br>4<br>4X b<br>L<br>0.10 C A B<br>e<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1025-JZA Rev B Sheet 1 of 2 

© 2024 Microchip Technology Inc. 

DS20005529D-page 14 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Dual Flatpack, No Lead Package (JZA) - 7x5x0.9 mm Body [VDFN] With 2.2x3.5 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|004|||
|Pitch|e|5.08 Ref|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|-|0.05|
|Terminal Thickness|A3|0.203 Ref|||
|Overall Length|D|6.90|7.00|7.10|
|Exposed Pad Length|D2|2.10|2.20|2.30|
|Overall Width|E|4.90|5.00|5.10|
|Exposed Pad Width|E2|3.40|3.50|3.60|
|Terminal Width|b|1.35|1.40|1.45|
|Terminal Length|L|1.10|1.20|1.30|



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the pin 1 area. 

2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-1025-JZA Rev B Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20005529D-page 15 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Dual Flatpack, No Lead Package [JZA] - 7x5x0.9 mm Body [VDFN] With 2.2x3.5 mm Exposed Pad** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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RECOMMENDED LAND PATTERN SILK SCREEN<br>**----- End of picture text -----**<br>


|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Optional Center Pad Width|X2|||2.30|
|Optional Center Pad Length|Y2|||3.60|
|Contact Pad Spacing|C1||5.08||
|Contact Pad Spacing|C2||3.90||
|Contact Pad Width(Xnn)|X1|||1.50|
|Contact Pad Length(Xnn)|Y1|||1.30|
|Contact Pad to Center Pad(Xnn)|G1|0.69|||
|Thermal Via Diameter|V||0.33||
|Thermal Via Pitch|EV||1.20||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 

Microchip Technology Drawing  C04-3025-JZA Rev B 

© 2024 Microchip Technology Inc. 

DS20005529D-page 16 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Plastic Dual Flat, No Lead Package (H6A) - 5x3.2 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

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D A<br>B<br>4 3<br>(DATUM B)<br>E<br>(DATUM A)<br>2X<br>0.05 C<br>1 2<br>2X<br>NOTE 1<br>0.05 C<br>TOP VIEW<br>(A3) 0.10 C<br>C<br>A<br>SEATING<br>PLANE<br>SIDE VIEW 4X<br>A1<br>0.08 C<br>(b1) NOTE 1 (CH)<br>(L1)<br>1 2<br>(L2) (K)<br>DETAIL A<br>ALTERNATE PIN 1<br>CONFIGURATION L<br>4 3<br>4X b<br>e 0.08 C A B<br>0.05 C<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing  C04-1008-H6A Rev C Sheet 1 of 2 

DS20005529D-page 17 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Plastic Dual Flat, No Lead Package (H6A) - 5x3.2 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

Notes: 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||<br>MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Pitch|e|2.54 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Terminal Thickness|A3|0.20 REF|||
|Overall Length|D|5.00 BSC|||
|Overall Width|E|3.20 BSC|||
|Terminal Width|b|1.15|1.20|1.25|
|Terminal 1 Tab|b1|0.10 REF|||
|Terminal Length|L|0.80|0.90|1.00|
|Terminal Pull Back|L1|0.10 REF|||
|Terminal 1 Tab|L2|0.20 REF|||
|Terminal 1 Chamfer|CH|0.25 REF|||
|Terminal Spacing|K|1.20 REF|||



1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing C04-1008-H6A Rev C Sheet 2 of 2 

DS20005529D-page 18 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Plastic Dual Flat, No Lead Package (H6A) - 5x3.2 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [387 x 222] intentionally omitted <==**

**----- Start of picture text -----**<br>
E<br>E2 EDGE OF PACKAGE<br>4 3<br>C G1<br>Y1<br>1 2<br>X1<br>SILK SCREEN<br>G2<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E||2.54||
|g<br>nic<br>a<br>p<br>S<br>d<br>a<br>P<br>tc<br>a<br>t<br>n<br>o<br>C|C||0<br>0<br>.<br>2||
|)<br>4<br>X<br>(<br>h<br>t<br>di<br>W<br>d<br>a<br>P<br>tc<br>a<br>t<br>n<br>o<br>C|1<br>X|||0<br>4<br>.<br>1|
|Contact Pad Length(X4)|Y1||||
|Contact Pad to Center Pad(X2)|G1|1.00||1.10|
|Contact Pad to Contact Pad(X2)|G2|1.14|||
|Terminal 1 Contact Pad Chamfer|CH||0.30||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 

Microchip Technology Drawing  C04-3008 Rev C 

DS20005529D-page 19 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [306 x 472] intentionally omitted <==**

**----- Start of picture text -----**<br>
D A<br>B<br>(DATUM A)<br>(DATUM B)<br>E<br>NOTE 1<br>2X<br>0.05 C<br>2X<br>0.05 C TOP VIEW<br>0.05 C<br>C A<br>SEATING A1<br>PLANE<br>4X<br>(A3) SIDE VIEW 0.05 C<br>e<br>1 2<br>(CH)<br>NOTE 1<br>L<br>N<br>4X b<br>0.10 C A B<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


Microchip Technology Drawing C04-1006-H4A Rev C Sheet 1 of 2 

© 2024 Microchip Technology Inc. 

DS20005529D-page 20 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Number of Terminals|N|4|||
|Pitch|e|2.10 BSC|||
|Overall Height|A|0.80|0.85|0.90|
|Standoff|A1|0.00|0.02|0.05|
|Overall Length|D|3.20 BSC|||
|Overall Width|E|2.50 BSC|||
|Terminal Width|b|0.85|0.90|0.95|
|Terminal Length|L|0.70|0.80|0.90|
|Terminal 1 Index Chamfer|CH|0.25 REF|||



Notes: 

1. Pin 1 visual index feature may vary, but must be located within the hatched area. 

2. Package is saw singulated 

3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing C04-1006-H4A Rev C Sheet 2 of 2 

© 2024 Microchip Technology Inc. 

DS20005529D-page 21 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]** 

**Note:** For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 

**==> picture [356 x 281] intentionally omitted <==**

**----- Start of picture text -----**<br>
X<br>4<br>Y<br>C<br>(CH)<br>1 2<br>E<br>SILK SCREEN<br>**----- End of picture text -----**<br>


## RECOMMENDED LAND PATTERN 

|Units|Units|MILLIMETERS|MILLIMETERS|MILLIMETERS|
|---|---|---|---|---|
|Dimension Limits||MIN|NOM|MAX|
|Contact Pitch|E|2.10 BSC|||
|Contact Pad Spacing|C||1.80||
|Contact Pad Width(X4)|X|||0.90|
|Contact Pad Length(X4)|Y|||1.00|
|Contact 1 Index Chamfer|CH|0.20 REF|||



Notes: 

1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 

Microchip Technology Drawing  C04-3006-H4A Rev C 

- © 2024 Microchip Technology Inc. 

DS20005529D-page 22 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

DS20005529D-page 23 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

DS20005529D-page 24 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

DS20005529D-page 25 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **NOTES:** 

DS20005529D-page 26 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **APPENDIX A: REVISION HISTORY** 

## **Revision A (September 2017)** 

- Converted Micrel data sheet DSC1001 to Microchip format data sheet DS20005529A. 

- Minor text changes throughout. 

- Added Table 2-2 for DFN package. 

- Combined Micrel data sheet DSC1003 and DSC1004 into this data sheet. 

- Updated **Section 1.0 “Electrical Characteristics”** to reflect this change. 

- Updated General Description and Features to reflect this change. 

## **Revision B (November 2017)** 

- Updated VOH and VOL values in Table 1-1. 

## **Revision C (July 2023)** 

- Updated the Package Marking Information drawing. 

## **Revision D (June 2025)** 

- Added DSA10xx reference to Features and the Product Identification System sections for customers seeking AEC-Q100 qualified parts. 

- Updated all Package Outline Drawings with the most current versions. 

DS20005529D-page 27 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **NOTES:** 

DS20005529D-page 28 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **PRODUCT IDENTIFICATION SYSTEM** 

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. 

||**PART NO.**|**PART NO.**|**X**||**X**|**X**|**X**<br>**-X**<br>**X**<br>**X.XXXX**|**X**<br>**-X**<br>**X**<br>**X.XXXX**||**X**|**X**||**Examples:**|**Examples:**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Device**||**Package**|**Temperature**|||**Stability**|**Frequency**|**Package**||||a) DSC1001AE1-010.0000T:||
||||||**Range**|||||||||1.8V - 3.3V Low-Power Precision CMOS|
|||||||||||||||Oscillator, 4-Lead 7.0 mm x 5.0 mm VDFN,|
||**Device:**||DSC1001/3/4: 1.8V - 3.3V Low-Power Precision CMOS<br>Oscillator (Note 1)|||||||||||Ext. Commercial Temperature Range, ±50<br>ppm, 10 MHz Output Frequency, 1,000/Reel|
||||||||||||||b) DSC1003BL2-030.0000:||
||**Package:**||A<br>B|=<br>=|4-Lead 7.0<br>4-Lead 5.0||mm x 5.0<br>mm x 3.2|mm VDFN<br>mm VDFN||||||1.8V - 3.3V Low-Power Precision CMOS<br>Oscillator, 4-Lead 5.0 mm x 3.2 mm VDFN,|
||||C|=|4-Lead 3.2||mm x 2.5|mm VDFN||||||Ext. Industrial Temperature Range, ±25|
||||D|=|4-Lead 2.5||mm x 2.0|mm VDFN||||||ppm, 30 MHz Output Frequency, 110/Tube|
||||||||||||||c) DSC1001DE5-150.0000:||
||**Temperature**||E|=|–20C to +70C (Extended Commercial)|||||||||1.8V - 3.3V Low-Power Precision CMOS|
||**Range:**||I<br>L|=<br>=|–40C to +85C (Industrial)<br>–40C to +105C (Extended Industrial)|||||||||Oscillator, 4-Lead 2.5 mm x 2.0 mm VDFN,<br>Ext. Commercial Temperature Range, ±10|
|||||||||||||||ppm, 150 MHz Output Frequency, 110/Tube|
||**Stability:**||1<br>2|=<br>=|±50ppm<br>±25ppm||||||||d) DSC1004AI3-075.0000T:||
||||3|=|±20 ppm|||||||||1.8V - 3.3V Low-Power Precision CMOS|
||||5|=|±10 ppm|||||||||Oscillator, 4-Lead 7.0 mm x 5.0 mm VDFN,|
|||||||||||||||Industrial Temperature Range, ±20 ppm, 75|
||**Frequency:**||xxx.xxxx||=1 MHz to 150 MHz (user-defined)|||||||||MHz Output Frequency, 1,000/Reel|
||||||||||||||**Note 1:**|Tape and Reel identifier only appears in the|
||**Packing Option:**||<blank>=||110/Tube|||||||||catalog part number description. This identifier is|
||||T|=|1,000/Reel|||||||||used for ordering purposes and is not printed on|
|||||||||||||||the device package. Check with your Microchip|
|||||||||||||||Sales Office for package availability with the Tape|
||**Note 1:**|For|AEC-Q100||qualified parts, please refer to||||the|||||and Reel option.|
|||DSA10xx family.|||||||||||||



DS20005529D-page 29 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

**DSC1001/3/4** 

## **NOTES:** 

DS20005529D-page 30 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries 

## **Microchip Information** 

## **Trademarks** 

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ISBN: 979-8-3371-1456-9 

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Note the following details of the code protection feature on Microchip products: 

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DS20005529D-page 31 

 2017 - 2025 Microchip Technology Inc. and its subsidiaries