DN2450K4-G

## **DN2450** 

## **N-Channel, Depletion-Mode, Vertical DMOS FET** 

## **Features** 

- High-input impedance 

- Low-input capacitance 

- Fast switching speeds 

- Low on-resistance 

- Free from secondary breakdown 

- Low input and output leakages 

## **Applications** 

- Normally-on switches 

- Battery operated systems 

- Voltage to current converters 

- Constant current sources 

- Current and voltage limiters 

## **Description** 

This low threshold, depletion-mode, normally-on, transistor utilizes an advanced vertical Diffusion Metal Oxide Semiconductor (DMOS) structure and a well proven silicon-gate manufacturing process. This combination produces a device with the power-handling capabilities of bipolar transistors, plus the high-input impedance and positive-temperature coefficient inherent in Metal-Oxide Semiconductor (MOS) devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown. 

Vertical DMOS Field-Effect Transistors (FETs) are ideally suited to a wide range of switching and amplifying applications where a very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired. 

DS20005404A-page 1 

 2015 Microchip Technology Inc. 

## **DN2450** 

## **Package Type** 

**==> picture [394 x 150] intentionally omitted <==**

**----- Start of picture text -----**<br>
DRAIN<br>DRAIN<br>SOURCE<br>DRAIN<br>SOURCE GATE<br>GATE<br>TO-252 (D-PAK) TO-243AA (SOT-89)<br>See Table 2-1 for pin information<br>**----- End of picture text -----**<br>


DS20005404A-page 2 

 2015 Microchip Technology Inc. 

**DN2450** 

## **1.0 ELECTRICAL CHARACTERISTICS** 

## **ABSOLUTE MAXIMUM RATINGS[†]** 

Drain-to-source voltage................................................................................................................................................................ BVDSX Drain-to-gate voltage....................................................................................................................................................................BVDGX Gate-to-source voltage................................................................................................................................................................... ±20V Operating and storage temperature............................................................................................................................. -55°C to +150°C Maximum junction temperature.....................................................................................................................................................150°C 

**† Notice:** Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 

## **1.1 ELECTRICAL SPECIFICATIONS** 

## **TABLE 1-1: DC AND AC CHARACTERISTICS** 

|**TABLE 1-1:**<br>**DC AND AC CHARACTERISTICS**|**TABLE 1-1:**<br>**DC AND AC CHARACTERISTICS**|**TABLE 1-1:**<br>**DC AND AC CHARACTERISTICS**|**TABLE 1-1:**<br>**DC AND AC CHARACTERISTICS**|**TABLE 1-1:**<br>**DC AND AC CHARACTERISTICS**|**TABLE 1-1:**<br>**DC AND AC CHARACTERISTICS**|**TABLE 1-1:**<br>**DC AND AC CHARACTERISTICS**|
|---|---|---|---|---|---|---|
|**Electrical Specifications:**Unless otherwise specified, for all specifications TA=TJ= +25°C|||||||
|**Symbol**|**Parameter**|**Min**|**Typ**|**Max**|**Units**|**Conditions**|
|**DC Parameters**(**Note 1, **unless otherwise stated)|||||||
|BVDSX|Drain-to-source breakdown voltage|500|–|–|V|VGS= -5.0V, ID= 100µA|
|VGS(OFF)|Gate-to-source off voltage|-1.5|–|-3.5|V|VDS= 25V, ID= 10µA|
|∆VGS(OFF)|Change in VGS(OFF)with temperature|–|–|-4.5|mV/°C|VDS= 25V, ID= 10µA(**Note 2**)|
|IGSS|Gate bodyleakage|–|–|100|nA|VGS= ±20V, VDS= 0V|
|ID(OFF)|Drain-to-source leakage current|–|–|1.0|µA|VDS= BVDSX, VGS= -10V|
|||–|–|1.0|mA|VDS= 0.8 BVDSX,<br>VGS= -10V, TA= 125°C(**Note 2**)|
|IDSS|Saturated drain-to-source current|700|–|–|mA|VGS= 0V, VDS= 25V|
|RDS(ON)|Static drain-to-source on-state<br>resistance|–|7.0|10|Ω|VGS= 0V, ID= 300mA|
|∆RDS(ON)|Change in RDS(ON)with temperature|–|–|1.1|%/°C|VGS= 0V, ID= 300mA(**Note 2**)|
|**AC Parameters**(**Note 2**)|||||||
|GFS|Forward transconductance|500|–|–|mmho|VDS= 10V, ID= 300mA|
|CISS|Input capacitance|–|150|200|pF|VGS= -10V,<br>VDS= 25V,<br>f = 1MHz|
|COSS|Common source output capaci-<br>tance|–|40|55|||
|CRSS|Reverse transfer capacitance|–|15|25|||
|td(ON)|Turn-on delaytime|–|–|15|ns|VDD= 25V,<br>ID= 300mA,<br>RGEN= 25Ω,|
|tr|Rise time|–|–|20|||
|td(OFF)|Turn-off delaytime|–|–|15|||
|tf|Fall time|–|–|15|||
|**Diode Parameters**|||||||
|VSD|Diode forward voltage drop|–|–|1.8|V|VGS= -5.0V, ISD= 300mA(**Note 1)**|
|trr|Reverse recoverytime|–|800|–|ns|VGS= -5.0V, ISD= 300mA(**Note 2**)|



**Note 1:** All DC parameters are 100% tested at 25°C unless otherwise stated. Pulse test: 300 µs pulse, 2% duty cycle. 

**2:** Specification is obtained by characterization and is not 100% tested. 

DS20005404A-page 3 

 2015 Microchip Technology Inc. 

## **DN2450** 

## **TABLE 1-2: TYPICAL THERMAL RESISTANCE** 

|**TABLE 1-2:**<br>**TYPICAL THERMAL RESISTANCE**||
|---|---|
|**Package**|**θja**|
|TO-252(D-PAK)|81°C/W|
|TO-243AA(SOT-89)|133°C/W|



## **TABLE 1-3: THERMAL CHARACTERISTICS** 

|**Package**|**ID**<br>**1**<br>**continuous**<br>**(mA)**|**ID**<br>**pulsed**<br>**(mA)**|**Power**<br>**Dissipation**<br>**@TA = 25°C (W)**|**IDR**<br>**1**<br>**(mA)**|**IDRM**<br>**(mA)**|
|---|---|---|---|---|---|
|TO-252(D-PAK)|350|1000|2.5~~2~~|350|1000|
|TO-243AA(SOT-89)|230|900|1.6**2**|230|900|



1. ID continuous is limited by max rated Tj 

2. Mounted on FR4 board, 25mm x 25mm x 1.57 mm 

## **2.0 PIN DESCRIPTION** 

The locations of the pins are listed in Package Type. 

## **TABLE 2-1: PIN DESCRIPTION** 

|**Pin # TO-252**|**Pin # TO-243AA**|**Function**|
|---|---|---|
|1|1|GATE|
|3|3|SOURCE|
|2,4|2,4|DRAIN|



DS20005404A-page 4 

 2015 Microchip Technology Inc. 

**DN2450** 

## **3.0 APPLICATION INFORMATION** 

Figure  shows the switching waveform and test circuit for DN2450. 

**==> picture [412 x 112] intentionally omitted <==**

**----- Start of picture text -----**<br>
0V 90% VDD<br>INPUT 10% GeneratorPulse RL<br>-10V OUTPUT<br>t t<br>(ON) (OFF) RGEN<br>td(ON) tr td(OFF) tf<br>VDD INPUT D.U.T.<br>10% 10%<br>OUTPUT<br>0V 90% 90%<br>**----- End of picture text -----**<br>


_**FIGURE 3-1:** Switching Waveforms and Test Circuit_ 

## **Product Summary** 

|**Product Summary**|||
|---|---|---|
|BVDSX/BVDGX<br>(V)|RDS(ON)<br>(max) (Ω)|IDSS<br>(min) (mA)|
|500|10|700|



DS20005404A-page 5 

 2015 Microchip Technology Inc. 

**DN2450** 

## **4.0 PACKAGING INFORMATION** 

## **4.1 Package Marking Information** 

**==> picture [353 x 503] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-252 (D-PAK)  Example<br>XXXX DN<br>XXXXX e3 2450 e3<br>YYWWNNN 1517343<br>3-lead TO-243AA *  Example<br>(SOT-89)<br>XXXYYWW DN4E517<br>NNN 343<br>Legend: XX...X Product Code or Customer-specific information<br>Y Year code (last digit of calendar year)<br>YY Year code (last 2 digits of calendar year)<br>WW Week code (week of January 1 is week ‘01’)<br>NNN Alphanumeric traceability code<br>e3 Pb-free JEDEC [®]  designator for Matte Tin (Sn)<br>* This package is Pb-free. The Pb-free JEDEC designator (     ) e3<br>can be found on the outer packaging for this package.<br>Note : In the event the full Microchip part number cannot be marked on one line, it will<br>be carried over to the next line, thus limiting the number of available<br>characters for product code or customer-specific information. Package may or<br>not include the corporate logo.<br>**----- End of picture text -----**<br>


DS20005404A-page 6 

 2015 Microchip Technology Inc. 

**DN2450** 

## **3-Lead TO-243AA (SOT-89) Package Outline (N8)** 

**==> picture [277 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>D1 C<br>E H E1<br>1 2 3<br>L<br>b b1 A<br>e<br>e1<br>Top View Side View<br>**----- End of picture text -----**<br>


**Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.** 

|**Symbol**|**Symbol**|**A**|**b**|**b1**|**C**|**D**|**D1**|**E**|**E1**|**e**|**e1**|**H**|**L**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Dimensions<br>(mm)|MIN|1.40|0.44|0.36|0.35|4.40|1.62|2.29|2.00**_†_**|1.50<br>BSC|3.00<br>BSC|3.94|0.73**_†_**|
||NOM|-|-|-|-|-|-|-|-|||-|-|
||MAX|1.60|0.56|0.48|0.44|4.60|1.83|2.60|2.29|||4.25|1.20|
|_JEDEC Registration TO-243, Variation AA, Issue C, July 1986._<br>**_†_**_This dimension differs from the JEDEC drawing_<br>**_Drawings not to scale_**_._||||||||||||||



DS20005404A-page 7 

 2015 Microchip Technology Inc. 

**DN2450** 

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. 

DS20005404A-page 8 

 2015 Microchip Technology Inc. 

**DN2450** 

## **APPENDIX A: REVISION HISTORY** 

## **Revision A (July 2015)** 

- Update file to new format 

DS20005404A-page 9 

 2015 Microchip Technology Inc. 

**DN2450** 

## **PRODUCT IDENTIFICATION SYSTEM** 

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. 

|Device:<br>DN2450 = N-Channel, Depletion-Mode,<br>vertical DMOS FET<br>Package:<br>K4<br>= TO-252 (D-PAK)<br>N8<br>= TO-243AA (SOT-89)<br>Environmental<br>G<br>= Lead (Pb)-free/ROHS-compliant package<br>Media Type:<br>(blank)<br>= 2000/Reel<br>**PART NO.**<br>**X**<br>**Device**<br>**X**<br>**Environmental**<br>**X**<br>**X**<br>**Package**<br>**Options**<br>**Media**<br>**-**<br>**-**<br>**Type**|**Examples:**<br>a)<br>DN2450K4-G<br>TO-252 package,<br>2000/reel<br>b)<br>DN2450N8-G<br>TO-243AA package,<br>2000/reel|
|---|---|



DS20005404A-page 10 

 2015 Microchip Technology Inc. 

**DN2450** 

**Note the following details of the code protection feature on Microchip devices:** 

- Microchip products meet the specification contained in their particular Microchip Data Sheet. 

- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. 

- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. 

- Microchip is willing to work with the customer who is concerned about the integrity of their code. 

- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” 

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. 

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE **.** Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 

## **Trademarks** 

The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC[32] logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. 

Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. 

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. 

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. 

All other trademarks mentioned herein are property of their respective companies. 

© 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 

ISBN: 978-1-63277-585-6 

## **QUALITY MANAGEMENT  SYSTEM CERTIFIED BY DNV** == == **ISO/TS 16949** 

_Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC[®] MCUs and dsPIC[®] DSCs, KEELOQ[®] code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified._ 

DS20005404A-page 11 

 2015 Microchip Technology Inc. 

## **Worldwide Sales and Service** 

## **AMERICAS** 

**Corporate Office** 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com 

**Atlanta** Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 

**Austin, TX** Tel: 512-257-3370 

**Boston** Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 

**Chicago** Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 

**Cleveland** Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 

**Dallas** Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 

**Detroit** Novi, MI Tel: 248-848-4000 

**Houston, TX** Tel: 281-894-5983 Indianapolis 

**Noblesville, IN** Tel: 317-773-8323 Fax: 317-773-5453 

**Los Angeles** Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 

**New York, NY** Tel: 631-435-6000 

**San Jose, CA** Tel: 408-735-9110 

**Canada - Toronto** Tel: 905-673-0699 Fax: 905-673-6509 

## **ASIA/PACIFIC** 

**Asia Pacific Office** Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon 

**Hong Kong** Tel: 852-2943-5100 Fax: 852-2401-3431 

**Australia - Sydney** Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 

**China - Beijing** Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 

**China - Chengdu** Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 

**China - Chongqing** Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 

**China - Dongguan** Tel: 86-769-8702-9880 

**China - Hangzhou** Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 

**China - Hong Kong SAR** Tel: 852-2943-5100 Fax: 852-2401-3431 

**China - Nanjing** Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 

**China - Qingdao** Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 

**China - Shanghai** Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 

**China - Shenyang** Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 

**China - Shenzhen** Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 

**China - Wuhan** Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 

**China - Xian** Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 

## **ASIA/PACIFIC** 

**China - Xiamen** Tel: 86-592-2388138 Fax: 86-592-2388130 

**China - Zhuhai** Tel: 86-756-3210040 Fax: 86-756-3210049 

**India - Bangalore** Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 

**India - New Delhi** Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 

**India - Pune** Tel: 91-20-3019-1500 

**Japan - Osaka** Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 

**Japan - Tokyo** Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 

**Korea - Daegu** Tel: 82-53-744-4301 Fax: 82-53-744-4302 

**Korea - Seoul** Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 

**Malaysia - Kuala Lumpur** Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 

**Malaysia - Penang** Tel: 60-4-227-8870 Fax: 60-4-227-4068 

**Philippines - Manila** Tel: 63-2-634-9065 Fax: 63-2-634-9069 

**Singapore** Tel: 65-6334-8870 Fax: 65-6334-8850 

**Taiwan - Hsin Chu** Tel: 886-3-5778-366 Fax: 886-3-5770-955 

**Taiwan - Kaohsiung** Tel: 886-7-213-7828 

**Taiwan - Taipei** Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 

**Thailand - Bangkok** Tel: 66-2-694-1351 

Fax: 66-2-694-1350 

## **EUROPE** 

**Austria - Wels** Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 

**Denmark - Copenhagen** Tel: 45-4450-2828 Fax: 45-4485-2829 

**France - Paris** Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 

**Germany - Dusseldorf** Tel: 49-2129-3766400 

**Germany - Munich** Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 

**Germany - Pforzheim** Tel: 49-7231-424750 

**Italy - Milan** Tel: 39-0331-742611 Fax: 39-0331-466781 

**Italy - Venice** Tel: 39-049-7625286 

**Netherlands - Drunen** Tel: 31-416-690399 Fax: 31-416-690340 

**Poland - Warsaw** Tel: 48-22-3325737 

**Spain - Madrid** Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 

**Sweden - Stockholm** Tel: 46-8-5090-4654 

**UK - Wokingham** Tel: 44-118-921-5800 Fax: 44-118-921-5820 

01/27/15 

DS20005404A-page 12 

 2015 Microchip Technology Inc.