DLP0NSC280HL2L

Reference Only 

Spec No. JEFL243E-0018F-01 P1/10 

## **Chip Common Mode Choke Coil** ~~Po~~ **DLP0NS** □□□□ **HL2** □ **Reference Specification 1. Scope** 

This reference specification applies to Chip Common Mode Choke Coil DLP0NS Series. 

## **2. Part Numbering** 

(ex.) DL P 0N S N 121 H L 2 L (1)   (2) (3)  (4) (5)    (6)   (7)  (8)  (9) (10) 

(1) Chip Common Mode Choke Coil (6) Impedance (Typ. at 100MHz) 

(2) Structure (P : Film Type) 

(3) Dimension (L × W) 

(4) Type (5) Category   N : General Use 

(7) Circuit  H : Characteristic Impedance  100Ω system (8) Features 

(9) Number of Line (10) Packaging Code   L : Taping / B : Bulk 

C : mipi D-phy Use 

(DSI、CSI、UniPro) 

## **3. Rating** 

|**3. Ratingg**||||||||
|---|---|---|---|---|---|---|---|
|Customer<br>Part Number<br>~~ps~~<br>~~|~~<br>~~ee~~|Murata<br>Part Number<br>~~|~~<br>~~es~~|Common Mode Impedance<br>(at 100MHz, Under<br>Standard TestingCondition)|Rated<br>Voltage|Withstanding<br>Voltage|Rated<br>Current<br>~~pf~~|Rated<br>Current<br>DC<br>Resistance<br>~~pf~~|Insulation<br>Resistance|
|~~ps~~<br>~~|~~<br>~~ee~~<br>~~ee~~|DLP0NSN350HL2L<br>DLP0NSN350HL2B<br>~~|~~<br>~~es~~<br>~~es~~|35Ω±10Ω|5V(DC)|12.5V(DC)<br>~~|~~|100mA 1.2<br>~~pf~~<br>~~pf~~|100mA 1.2Ω±25%<br>~~pf~~<br>~~pf~~|100MΩ<br>min.|
|~~ee~~<br>~~ee~~<br>~~ee~~|DLP0NSN670HL2L<br>DLP0NSN670HL2B<br>~~es~~<br>~~es~~<br>~~es~~|67Ω ±20%|||110mA 2.4<br>~~pf~~<br>~~pf~~<br>~~pf~~|110mA 2.4Ω±25%<br>~~pf~~<br>~~pf~~<br>~~pf~~||
|~~ee ~~<br>~~ee~~|DLP0NSN900HL2L<br>DLP0NSN900HL2B<br> ~~es~~<br>~~es~~|90Ω ±20%|||100mA 3.0<br>~~pf~~<br>~~pf~~|100mA 3.0Ω±25%<br>~~pf~~<br>~~pf~~||
|~~ee ~~<br>~~ee~~|DLP0NSN121HL2L<br>DLP0NSN121HL2B<br> ~~es~~<br>~~ee~~|120Ω ±20%|||90mA<br>~~pf~~<br>~~pf~~|90mA<br>3.8Ω±25%<br>~~pf~~<br>~~pf~~||
|~~ee~~<br>~~ee~~|DLP0NSC280HL2L<br>DLP0NSC280HL2B<br>~~ee~~<br>~~es ae~~|28Ω±20%<br>~~ae~~|||100mA 1.3<br>~~pf~~<br>~~|~~|100mA 1.3Ω±25%<br>~~pf~~<br>||
|~~ee ~~<br>~~ee~~|DLP0NSC900HL2L<br>DLP0NSC900HL2B<br> ~~ee~~<br>~~es ae~~|90Ω±35%<br>~~ae~~|||75mA<br>~~pf~~<br>~~||~~|75mA<br>4.0Ω±30%<br>~~pf~~<br>~~|~~||



## **4. Standard Testing Conditions** 

<Unless otherwise specified> <In case of doubt> Temperature : Ordinary Temperature  15 to 35°C          Temperature : 20 ± 2°C Humidity : Ordinary Humidity  25 to 85%(RH)              Humidity : 60 to 70%(RH) Atmospheric Pressure : 86 to106kPa 

## **5.Style and Dimensions** 

**==> picture [258 x 179] intentionally omitted <==**

**----- Start of picture text -----**<br>
(1) (2)<br>(Top View)<br>(4) (3)<br>0.27±0.10<br>(Side View)<br>(Bottom View) : Electrode<br>(in : mm)<br>0.20 +0.05/-0.10<br>Ing<br>6.Marking 0.65±0.05 °<br>No Marking.<br>0.05<br>±<br>0.45<br>0.050.85± 0.100.50±<br>**----- End of picture text -----**<br>


**==> picture [132 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
■  Equivalent Circuits<br>(1) (2)<br>(4) (3)<br>No polarity.<br>■ Unit Mass(Typical value)<br>0.001g<br>**----- End of picture text -----**<br>


MURATA MFG.CO., LTD 

Spec No. JEFL243E-0018F-01 P2/10 

## Reference Only 

## **7. Electrical Performance** 

|No.|Item|Specification|Test Method|
|---|---|---|---|
|7.1|Common Mode<br>Impedance|Meet item 3.|Measuring Frequency : 100±1MHz  (ref.item 10.)<br>Measuring Equipment :KEYSIGHT4291A or the<br>equivalents<br>(In case of doubt in standard condition, the heat<br>treatment(200°C,about 10 minutes)shall be applied.|
|7.2|Withstanding<br>Voltage|Products shall not be damaged.|Test Voltage : 2.5 times for Rated Voltage<br>Time : 1 to 5 seconds<br>Charge Current : 1 mA max.(ref.item 10.)|
|7.3|DC Resistance<br>(Rdc)<br>Insulation<br>Resistance(I.R.)|Meet item 3.|Measuring current : 90mA max.(ref.item 10.)|
|7.4|||Measuring voltage : Rated Voltage<br>Measuringtime : 1 minute max.(ref.item 10.)|



## **8.Mechanical Performance** 

|No.|Item|Specification|Specification|Test Method|
|---|---|---|---|---|
|8.1|Appearance and<br>Dimensions|Meet item 5.||Visual Inspection and measured with Slide Calipers.|
|8.2|Solderability|The electrodes shall be at least<br>95% covered with new solder<br>coating.||Flux : Ethanol solution of rosin,25(wt)%<br>Pre-Heating : 150±10°C, 60～90s<br>Solder : Sn-3.0Ag-0.5Cu<br>Solder Temperature : 240±3°C<br>Immersion Time : 3±0.5s<br>Immersion and emersion rates : 25 mm / s|
|8.3|Resistance to<br>Soldering Heat<br>Drop<br>Vibration|Meet Table 1.<br>Table 1<br>Appearance<br>Common Mode<br>Impedance<br>Change<br>I.R.<br>DC Resistance<br>Change|No damaged<br> <br>within±20%<br>100MΩmin.<br>within±30%|Flux : Ethanol solution of rosin,25(wt)%<br>Pre-Heating : 150±10°C, 60～90s<br>Solder : Sn-3.0Ag-0.5Cu<br>Solder Temperature : 270±5°C<br>Immersion Time : 5±1s<br>Immersion and emersion rates : 25 mm / s<br>Then measured arter exposure in the room condition<br>for 4 to 48 hours.|
|8.4||||It shall be dropped on concrete or steel board.<br>Method : free fall<br>Height : 1m<br>The Number of Times : 10 times|
|8.5||||It shall be soldered on the substrate.<br>Oscillation Frequency : 10 to 2000 to 10Hz for 15<br>minutes<br>Total amplitude : 3.0 mm or Acceleration amplitude<br>196 m/s2whichever is smaller.<br>Testing Time : A period of 2 hours in each of 3<br>mutually perpendicular directions.|
|8.6|Bending<br>Strength|Meet Table 2.<br>Table 2<br>Appearance<br>DC Resistance<br>Change|No damaged<br>within±30%|Substrate : (t =1.0 mm).<br>Deflection : 3 mm<br>Speed of Applying Force : 1.0 mm / s<br>Keeping time : 5 seconds<br>45<br>R230<br>F<br>Deflection<br>45<br>Product<br>Pressure jig|



MURATA MFG.CO., LTD 

Spec No. JEFL243E-0018F-01 P3/10 

## Reference Only 

## **9.Environmental Performance** (Products shall be soldered on the glass-epoxy substrate) 

|No.|Item|Specification|Test Method|
|---|---|---|---|
|9.1|Temperature<br>Cycle|Meet Table 1.|1 Cycle<br>Step 1<br>-40°C(+0°C,-3°C) / 30(+3,-0) min<br>Step 2<br>Ordinary Temp. / within 3 min<br>Step 3<br>+85(+3°C,-0°C) / 30(+3,-0) min<br>Step 4<br>Ordinary Temp. / within 3 min<br>Total of 100 cycles.<br>Then measured after exposure in the room condition<br>for 4 to 48 hours.|
|9.2|Humidity||Temperature : 40±2°C<br>Humidity : 90 to 95 % (RH)<br>Time : 1000 hours(+48 hours,-0 hours)<br>Then measured after exposure in the room condition<br>for 4 to 48 hours.|
|9.3|Heat life||Temperature : 85±2°C<br>Test Voltage : 2 times for Rated Voltage<br>Time : 1000 hours(+48 hours,-0 hours)<br>Then measured after exposure in the room condition<br>for 4 to48hours. (ref. Item 10.)|
|9.4|Cold Resistance||Temperature : -40± 2°C<br>Time : 1000 hours(+48 hours,-0 hours)<br>Then measured after exposure in the room condition<br>for 4 to 48 hours.|



## **10. Terminal to be Tested.** 

When measuring and supplying the voltage,the following terminal is applied. 

**==> picture [386 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
No.  Item  Terminal to be Tested<br>10.1  Common Mode<br>           Impedance  ＩＮ ＯＵＴ<br>10.2  Withstanding Voltage  ＩＮ<br>Insulation Resistance<br>Heat Life  ＯＵＴ<br>10.3 DC Resistance  ＩＮ ＯＵＴ<br>ＩＮ ＯＵＴ<br>**----- End of picture text -----**<br>


## **11. Measuring method for common mode impedance.** 

Measured common mode impedance may be included measurement error due to stray capacitance, residual inductance of test fixture. 

To correct this error, the common mode impedance should be calculate as follows; 

(1) Measure admittance of the fixture(opened), Go  Bo. 

- (2) Measure impedance of the fixture(shorted), Rs  Xs. 

- (3) Measure admittance of the specimen, Gm  Bm. 

- (4) Calculate corrected impedance Z using the formula below. 

Z = (Rx[2] +Xx[2] )[1/2] 

Where 

**==> picture [170 x 63] intentionally omitted <==**

## **12. P.C.B., Flux, Solder and Soldering condition** 

Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the case of being specified special condition. 

MURATA MFG.CO., LTD 

Spec No. JEFL243E-0018F-01 P4/10 

## Reference Only 

## **13.Impedance Frequency Characteristics(Typical)** 

**==> picture [336 x 365] intentionally omitted <==**

**----- Start of picture text -----**<br>
DLP0NSC Series DLP0NSN Series<br>1 ] 10000<br>| | Common mode<br>| | Impedance<br>: 1000 -——- bipowsnsoanta SS [===]<br>N aq DLPONSN670HL2<br>. 3 DrPONSNSSOHL2<br>ia €<br>|| awit po 3 100 Jt ><br>+H 54 | 2 ae aA<br>ah ta ii | £ So<br>ol -7 +71a?’ le TSQ ovronsesoontDLPONSC280HL2 | alae?2277o\*<br>Ble t | = =| Serr<br>==---7"= [Differential- mode i D0 SSS _2==-77ZS [Differential<br>Impedance<br>100 1000 10000 1 10 100<br>Frequency[MHz] Frequency[MHz]<br>Comal 0) = eel<br>IN =<br>[e}<br>SA\ a -10 IN<br>DLPONSC9OOHL2DLPONSC280HL2 m= 2)o AN<br>1 | Baan @V2) -15 DLPONSN350HL2 =<br>A) DLPONSN670HL2 <<<br>| = 20 DLPONSN9OOHL2 ~<br>fo) DLPONSN121HL2<br>z<br>100 1000 10000 1 10 100<br>Frequency[MHz] Frequency[MHz]<br>TT<br>—— 0 —————S—————————<br>DLP0NSC280HL2<br>~~ DLPONSC9OOHL2 TT = 2- | TTT— |<br>**----- End of picture text -----**<br>


MURATA MFG.CO., LTD 

Reference Only 

Spec No. JEFL243E-0018F-01 P5/10 

## **14.Specification of Packaging** 

## **14.1  Appearance and Dimensions ( 8mm-wide, 2mm pitch Plastic tape)** 

**==> picture [449 x 165] intentionally omitted <==**

**----- Start of picture text -----**<br>
Sprocket Hole送り穴 4.0±0.1 φ 1.5 [+0.1] -0 2.0±0.05 Cavityｷｬﾋﾞﾃｨ 0.25±0.05<br>(1)  (2)<br>(4) (3) * Dimension of the Cavity is measured<br>at the bottom side.<br>＊(1)(2)(3)(4) indicates<br>terminal number<br>2.0±0.1 0.75±0.05 0.55±0.05 (in:mm)<br>Direction of feed引き出し方向<br>1.75±0.1<br>3.5±0.05<br>8.0±0.2<br>0.95±0.05<br>**----- End of picture text -----**<br>


## **14.2  Specification of Taping** 

(1)Packing quantity(Standard quantity)  10000 pcs. / reel 

- (2)Packing Method 

Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3)Sprocket Hole 

The sprocket holes are to the right as the tape is pulled toward the user. 

(4)Spliced point 

The cover tape have no spliced point. 

- (5)Missing components number 

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 

## **14.3  Pull Strength of Plastic Tape** 

|**astic Tape **||
|---|---|
|Plastic Tape|5N min.|
|Cover Tape|10N min.|



## **14.4  Peeling off force of Cover Tape** 

**==> picture [363 x 49] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.2 to 0.7N(Minimum value is Typical)  165 to 180 degree F Cover tape<br>Speed of Peeling off : 300 mm/min.<br>Plastic tape<br>**----- End of picture text -----**<br>


## **14.5 Dimensions of Leader-tape, Trailer and Reel** 

**==> picture [368 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
Trailer Leader<br>2.0±0.5 160 min.<br>Label 190 min. 210 min.<br>Empty tape Top tape<br>φ 13.0±0.2<br>φ 60± 10<br>9± 10 φ 21.0±0.8 Direction of feed<br>13±1.4<br>φ 180± 03 (in:mm)<br>**----- End of picture text -----**<br>


MURATA MFG.CO., LTD 

Reference Only 

Spec No. JEFL243E-0018F-01 P6/10 

## **14.6 Marking for reel** 

Customer part number **,** MURATA part number, Inspection number( ∗ 1), RoHS marking( ∗ 2), Quantity, etc 

∗ 1) « Expression of Inspection No. » □□ OOOO ××× 

(1)      (2)      (3) 

(1) Factory Code (2) Date First digit : Year  / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day 

- (3) Serial No. 

∗ 2) « Expression of RoHS marking » ROHS – Y (△) 

(1) (2) 

- (1) RoHS regulation conformity parts. 

- (2) MURATA classification number 

## **14.7 Marking for Outside package** 

Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking( ∗ 2), Quantity, etc 

## **14.8 Specification of Outer Case** 

|||||
|---|---|---|---|
|Outer|Case Dimensions<br>(mm)||Standard Reel Quantity in Outer Case<br>(Reel)|
|W|D|H||
|186|186|93|5|
|Above Outer Case size is typical. It depends on a quantity of an order.||||



## **15.** △ **! Caution** 

## **15.1  Mounting Direction** 

Mount products in right direction. 

Wrong direction which is 90 ° rotated from right direction causes not only open or short circuit but also flames or other serious trouble. 

**==> picture [203 x 56] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ｚ Ｚ<br>right direction wrong direction<br>**----- End of picture text -----**<br>


## **15.2  Limitation of Applications** 

Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. 

(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment 

(5) Medical equipment                 (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. 

## **16. Notice** 

This product is designed for solder mounting. (reflow soldering only) 

Please consult us in advance for applying other mounting method such as conductive adhesive. 

## **16.1  Flux and Solder** 

|Flux|Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )<br>Donotusewater-solubleflux.|
|---|---|
|Solder|Use Sn-3.0Ag-0.5Cu solder<br>Use of Sn-Zn based solder will deteriorate performance of products.<br>Incase ofusing Sn-Znbased solder, please contact Muratainadvance.|



MURATA MFG.CO., LTD 

Reference Only 

Spec No. JEFL243E-0018F-01 P7/10 

## **16.2  Assembling** 

<Thermal Shock> 

Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 

## **16.3  Resin coating** 

The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 

## **16.4  Attention regarding P.C.B. bending** 

The following shall be considered when designing and laying out P.C.B.'s. 

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［ Products direction ］ 

Products shall be location the sideways Direction (Length : a<b) to the machanical Stress. 

**==> picture [404 x 140] intentionally omitted <==**

**----- Start of picture text -----**<br>
a<br>b Direction (Length : a<b) to the machanical Stress.<br>〈 Poor example 〉 〈 Good example 〉<br>］<br>roducts(warping direction 1, warping direction<br>a a 2) shall be located carefully so that products<br>b b are not subject to the mechanical stress due to<br>warping the board. Because they may be<br>subjected the mechanical stress in order of<br>warping direction 1 > warping direction 2.<br>〈Warping direction 1〉 〈Warping direction 2〉<br>**----- End of picture text -----**<br>


## ［ Warping direction ］ 

It is effective to implement the following measures, to reduce stress in separating the board. 

It is best to implement all of the following three measures; however, implement as many measures as possible 

to reduce stress. 

|to reduce stress.||
|---|---|
|Contents of Measures|StressLevel|
|(1)Turnthemounting directionofthe component parallelto the board separationsurface.|A > D *1|
|(2) Add slits in the board separation part.|A > B|
|(3)Keep themounting positionofthe component awayfromthe board separationsurface.|A > C|



**==> picture [410 x 71] intentionally omitted <==**

**----- Start of picture text -----**<br>
C<br>Perforation<br>B *1 A > D is valid when stress is added vertically to the perforation as<br>with Hand Separation.<br>A  D If a Cutting Disc is used, stress will be diagonal to the PCB,<br>Slit therefore A > D is invalid.<br>**----- End of picture text -----**<br>


## (3) Mounting Components Near Screw Holes 

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 

**==> picture [92 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
Screw Hole Recommended<br>**----- End of picture text -----**<br>


## **16.5  Attention Regarding P.C.B. Design** 

**==> picture [334 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
Portion of<br>< The Arrangement of Products > Perforation<br>P.C.B. shall be designed so that products are P.C.B . ×<br>far from the portion of perforation. ○<br>○<br>Product<br>The portion of perforation shall be designed<br>Portion of ×<br>as narrow as possible, and shall be designed  Perforation<br>so as not to be applied the stress in the<br>case of P.C.B. separation.<br>**----- End of picture text -----**<br>


- < The Arrangement of Products > 

MURATA MFG.CO., LTD 

~~P~~ Reference ~~o~~ Only Spec No. JEFL243E-0018F-01 P8/10 

Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. 

(Because the stress concentrate on the line of holes.) 

- < Products Placing > 

Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. 

- < P.C.B. Separation > 

   - P.C.B. shall not be separated with hand. 

**==> picture [154 x 159] intentionally omitted <==**

**----- Start of picture text -----**<br>
P.C.B . ○ ×<br>Product<br>Hole<br>on<br>we]<br>Pick-up nozzle<br>Product<br>P.C.B.<br>ele<br>Support pin<br>**----- End of picture text -----**<br>


- P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. 

## **16.6  Attention Regarding P.C.B. Mounting** 

In case of mounting by use of mounting machine, please choose nozzle which can pick up components of 1005 size or 0603 size. 

## **16.7  Standard Land Dimensions** 

**==> picture [305 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
LE ml 0.30<br>Y<br>(1) (2)<br>(4) (3)<br>*(1)(2)(3)(4)Indicates terminal number<br>Resist<br>Copper foil pattern<br>0.90 = No pattern<br>0.30<br>0.80 0.50<br>**----- End of picture text -----**<br>


(in : mm) 

## **16.8 Soldering(Reflow soldering)** 

Standard soldering profile and the limit soldering profile is as follows. 

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. 

**==> picture [303 x 209] intentionally omitted <==**

**----- Start of picture text -----**<br>
Temp. 260℃<br>( ℃)<br>245℃±3℃<br>230℃<br>220℃<br>Limit Profile<br>180<br>150 Po<br>30s ～ 60s Standard Profile<br>60s max.<br>/_|a s—<br>LY 90s±30s Time ( s)<br>Standard Profile  Limit Profile<br>Pre-heating 150～180°C  、90s±30s<br>Heating above 220°C、30s～60s above 230°C、60s max.<br>Peak temperature  245±3°C  260°C、10s<br>Cycle of reflow  2 times  2 times<br>**----- End of picture text -----**<br>


MURATA MFG.CO., LTD 

~~PO~~ Reference Only 

Spec No. JEFL243E-0018F-01 P9/10 

**==> picture [427 x 73] intentionally omitted <==**

**----- Start of picture text -----**<br>
Standard printing pattern of solder paste<br>• Standard thickness of the solder paste should be 100 to 150µm.<br>• Use the solder paste printing pattern of the right pattern.<br>• For the resist and copper foil pattern, use standard land dimensions.  i) [ | =<br>• Use Sn-3.0Ag-0.5Cu solder.<br>aad<br>0.30 0.30 0.30  (in ： mm) mm)<br>0.50<br>0.30<br>**----- End of picture text -----**<br>


## (1) Standard printing pattern of solder paste 

- (2) Reworking with Soldering iron 

   - The following conditions shall be strictly followed when using a soldering iron after being mounted by reflow soldering. 

      - Pre-heating: 150°C, 1 min          · Soldering iron output: 30W max. 

      - Tip temperature: 380°C max.       · Tip diameter:φ3mm max. 

      - Soldering time : 3(+1,-0) seconds.   · Times : 2times max. 

   - Do not touch the products directly with the tip of the soldering iron. 

- (3) Solder Volume 

Solder shall be used not to be exceeded the upper limits as shown below. 

**==> picture [223 x 57] intentionally omitted <==**

**----- Start of picture text -----**<br>
Upper Limit<br>Recommendable Upper Limit<br>Recommendable<br>t<br>1/3 T ≦  t ≦  T （T : Chip thickness）<br>**----- End of picture text -----**<br>


Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. 

## **16.9  Cleaning Conditions** 

Products shall be cleaned on the following conditions. 

- (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.) 

- (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B.. 

      - ・ Power : 20W/ l max. ・ Frequency : 28kHz to 40kHz ・ Time : 5 minutes max. 

- (3) Cleaner 

   1. Alternative cleaner • Isopropyl alcohol (IPA) 

   2. Aqueous agent • PINE ALPHA ST-100S 

- (4) There shall be no residual flux and residual cleaner after cleaning. 

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. 

- (5) Other cleaning 

Please contact us. 

## **16.10 Handling of a substrate** 

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. 

Excessive mechanical stress may cause cracking in the product. 

Bending                         Twisting 

## **16.11  Operating Environment** 

Do not use this product under the following environmental conditions, on deterioration  of the performance, such as insulation resistance may result from the use. 

- (1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) 

- (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 

MURATA MFG.CO., LTD 

Spec No. JEFL243E-0018F-01 P10/10 

## Reference Only 

## **16.12  Storage Conditions** 

- (1) Storage period 

Use the products within 12 months after delivered. 

Solderability should be checked if this period is exceeded. 

- (2) Storage environment condition 

- Products should be stored in the warehouse on the following conditions. 

Temperature : -10 to +40°C 

Humidity    : 15 to 85% relative humidity 

No rapid change on temperature and humidity 

- Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to prevent the following deterioration. 

Poor solderability due to the oxidized electrode. 

- Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. 

- Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. 

- Products should be stored under the airtight packaged condition. 

- (3) Delivery 

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 

## **17.** △ **! Note** 

(1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 

(2)You are requested not to use our product deviating from the reference specifications. 

(3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. 

MURATA MFG.CO., LTD