DFLS1200-7

**DFLS1200** 

**1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER** PowerDI[®] 123 

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## **Features** 

- Guard Ring Die Construction for Transient Protection 

- • Low Power Loss, High Efficiency 

- Patented Interlocking Clip Design for High Surge Current Capacity 

- **Lead Free Finish, RoHS Compliant (Note 4)** 

- **"Green" Molding Compound (No Br, Sb)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Mechanical Data** 

- ® 

- • Case: PowerDI 123 

- Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020D 

- Terminal Connections: Cathode Band 

- Terminals: Finish – Matte Tin annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 

Marking Information: See Page 2 

- 

Ordering Information: See Page 2 

- 

- Weight: 0.01 grams (approximate) 

Top View 

## **Maximum Ratings** @TA = 25°C unless otherwise specified 

Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. 

|**Characteristic**|**Symbol **|**Value**|**Unit**|
|---|---|---|---|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|200|V|
|RMS Reverse Voltage|VR(RMS)|141|V|
|Average Forward Current|R(RMS)<br>IF(AV)|1.0|A|
|Non-Repetitive Peak Forward Surge Current 8.3ms<br>SingleHalfSine-Wave Superimposed on RatedLoad|F(AV)<br>IFSM|40|A|



## **Thermal Characteristics** 

|**Thermal Characteristics**|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Typ**|**Max**|**Unit**|
|Thermal Resistance Junction to Ambient(Note 1)|RθJA|132|⎯|°C/W|
|Thermal Resistance Junction to SolderingPoint(Note 2)|RθJS|⎯|7|°C/W|
|Operatingand Storage Temperature Range|TJ,TSTG|-65 to +175||°C|



## **Electrical Characteristics** @TA = 25°C unless otherwise specified 

|**Electrical Characteristics**@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|||||
|---|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max **|**Unit**|**Test Condition **|
|Reverse Breakdown Voltage(Note 3)|V(BR)R|200|⎯|⎯|V|IR= 8μA|
|Forward Voltage|(BR)R<br>VF|⎯|⎯|0.85|V|IF= 1.0A|
|Leakage Current(Note 3)|IR|⎯|⎯|2|μA|VR= 200V,TA= 25°C|
|Total Capacitance|CT|⎯|23|⎯|pF|VR= 5VDC,f = 1MHz|



Notes: 1.  Part mounted on FR-4 board with 2 oz., minimum recommended copper pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. TA = 25°C 

2.  Theoretical RθJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction. 

3.  Short duration pulse test used to minimize self-heating effect. 

4.  EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see _EU Directive 2002/95/EC Annex Notes._ 

PowerDI is a registered trademark of Diodes Incorporated. 

1 of 3 **www.diodes.com** 

DFLS1200 Document number: DS30628 Rev. 6 - 2 

October 2008 © Diodes Incorporated 

**DFLS1200** 

**==> picture [220 x 445] intentionally omitted <==**

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**==> picture [189 x 35] intentionally omitted <==**

**----- Start of picture text -----**<br>
0 20 40 60 80 100 120 140 160 180 200<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Fig. 2, Typical Reverse Characteristics<br>**----- End of picture text -----**<br>


**==> picture [214 x 216] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>1.8 et tt =<br>ft<br>1.6 ft | | pe<br>1.4<br>1.2 et Pt tT<br>1<br>0.8<br>ft tS) ft<br>0.6<br>0.4 INae eeNee<br>0.2<br>ft tt | |KT<br>0 .<br>i tt | | IN<br>0 25 50 75 100 125 150 175 200<br>TA, AMBIENT TEMPERATURE (ºC)<br>Fig. 4, Forward Current Derating Curve<br>, AVERAGE FORWARD CURRENT (A)<br>IF(AV)<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 5) 

||**Part Number**|**Case**|**Packaging**|
|---|---|---|---|
||DFLS1200-7|PowerDI<br>®123|3000/Tape &Reel|
|Notes:|5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.|||



## **Marking Information** 

|||||||||||**F08**<br>**YM**|**F08**<br>**YM**|||F08 = Product Type Marking Code<br>YM = Date Code Marking<br>Y = Year (ex: R = 2004)<br>M = Month (ex: 9 = September)|F08 = Product Type Marking Code||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Date CodeKey|||||||||||||||||||||||
|**Year**|**2004**|||**2005**||||||**2006**|||**2007**<br>**2008**<br>**2009**||**2010**|||**2011**||||**2012**|
|**Code**|R|||S||||||T||||U<br>V<br>W|X|||Y||||Z|
||||||||||||||||||||||||
|**Month**|**Jan**||**Feb**|||**Mar**||||**Apr**||**May**<br>**Jun**<br>**Jul**<br>**Aug**|||**Sep**||**Oct**|||**Nov**||**Dec**|
|**Code**|1||2|||3||||4|||5|5<br>6<br>7<br>8|9||O|||N||D|



PowerDI is a registered trademark of Diodes Incorporated. 

2 of 3 **www.diodes.com** 

DFLS1200 Document number: DS30628 Rev. 6 - 2 

October 2008 © Diodes Incorporated 

**DFLS1200** 

## **Package Outline Dimensions** 

|||||~~B~~||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||C<br>E<br>~~if~~||||||||||||||||||**PowerDI**<br>~~®~~**123**<br>**Dim**<br>**Min**<br>**Max**<br>**A**<br>3.50<br>3.90|||**Typ**<br>3.70|||
|||||||||||||||||||||||**B**|2.60<br>3.00||2.80|||
|||||||||||||||||||||||**C**|1.63<br>1.93||1.78|||
|||||D||||||H||||||||||||**D**<br>**E**<br>**H**|0.93<br>1.00<br>0.85<br>1.25<br>0.15<br>0.25||0.98<br>1.00<br>0.20|||
|||||||||||||||||||||||**L**|0.55<br>0.75||0.65|||
|||||~~A~~<br>E<br>L<br>L1<br>~~L2~~<br>~~ft~~||||||||||||||||||**L1**<br>1.80<br>2.20<br>**L2**<br>0.95<br>1.25<br>**All Dimensions in mm**|||2.00<br>1.10<br>**in mm**|||
|**Suggested Pad Layout**||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||
|||||~~X1~~|||~~G~~|||||~~X2~~|||||||||**Dimensions**<br>**Value (in mm**|||||**in mm)**||
|Y2<br>~~L~~d||||||||||Y1<br> L~~a~~||||||||||||**G**<br>**X1**<br>**X2**<br>**Y1**<br>**Y2**|**X1**<br>**X2**<br>**Y1**<br>**Y2**||1.0<br>2.2<br>0.9<br>1.4<br>1.4|||
||||||||||||||IMPORTANT NOTICE|||||||||||||||
|Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes||||||Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes|||Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes||||Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes|||||Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes||||||||||
|without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product||without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product||||||||||||||without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product||||||||||||
|described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall||||||||||||||||||||||||described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall||||
|assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,|assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,||assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,||||||||||assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,||||||||assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,|||assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,||||
|harmless against all damages.||||||||||||||||||||||||||||
||||||||||||||||LIFE SUPPORT||||||LIFE SUPPORT|||||||
|Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written|||||Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written|||Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written|||||||||||||Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written|||Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written||||
|approval of the President of Diodes Incorporated.|||||approval of the President of Diodes Incorporated.|||||||||||||||||||||||



## **Suggested Pad Layout** 

PowerDI is a registered trademark of Diodes Incorporated. 

3 of 3 **www.diodes.com** 

DFLS1200 Document number: DS30628 Rev. 6 - 2 

October 2008 © Diodes Incorporated