DF08S

**DATA SHEET** ~~oe~~ **www.onsemi.com** 

## Bridge Rectifiers 

## DF005S - DF10S 

## **Description** 

With the ever−pressing need to improve power supply efficiency, improve surge rating, improve reliability, and reduce size, the DFxS family sets a standard in performance. 

The design offers an surge rating of 50 A. This is important when improving reliability and increasing efficiency. High efficiency designs strive to reduce circuit resistance, which, unfortunately can result in increased inrush surge. As such high surge current ratings can be required to maintain or improve reliability. 

The design also offers better efficiency by achieving a 1.5 A VF of 1.1 V maximum at 25°C. This lower VF also supports cooler and more efficient operation. 

Finally, the DFxS achieves all this in a SDIP surface mount form factor, reducing board space and volumetric requirements vs. competitive devices. 

**PDIP−4 GW CASE 709AE** 

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## **MARKING DIAGRAM** 

## **Features** 

- Maximum Surge Rating: IFSM = 50 A, I[2] t = 10 A[2] Sec 

- Optimized VF: Typical 0.94 V at 1.5 A, 25°C 

- Glass Passivated Junctions 

- Lead Free Compliant to EU RoHS 2002/95/EU Directives 

- Green Molding Compound: IEC61249 

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ON<br> ZXYY<br>DF06M<br>**----- End of picture text -----**<br>


- Qualified with IR Reflow and Wave Soldering 

- UL Certified, UL #E258596 

Z = Subcon Assembly Plant Code X = Last Digit of Calendar Year YY = Weekly Payweek Date code DFXXXM = Specific Device Number xxx = 01, 02, 04, 06, 08, 10, or 005 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 4 of this data sheet. 

Publication Order Number: **DF10S/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **March, 2022 − Rev 2** 

**DF005S − DF10S** 

**ABSOLUTE MAXIMUM RATINGS** (Note 3) Values are at TA = 25 ° C unless otherwise noted. 

|**Symbol**|**Parameter**|**Value**|**Value**|**Value**|**Value**|**Value**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|---|---|---|---|---|
|||**DF005S**|**DF01S**|**DF02S**|**DF04S**|**DF06S**|**DF08S**|**DF10S**||
|VRRM|Maximum Repetitive Reverse Voltage|50|100|200|400|600|800|1000|V|
|VRMS|Maximum RMS Bridge Input Voltage|35|70|140|280|420|560|700|V|
|VDC|DC Reverse Voltage at Rated IR|50|100|200|400|600|800|1000|V|
|IF(AV)|Average Rectified Forward Current at TA = 40°C|1.5|||||||A|
|IFSM|Non−Repetitive Peak Forward Surge Current<br>8.3 ms Single Half−Sine Wave|50|||||||A|
|TSTG|Storage Temperature Range|−55 to +150|||||||°C|
|TJ|Operating Junction Temperature|−55 to +150|||||||°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**THERMAL CHARACTERISTICS** Values are at TA = 25 ° C unless otherwise noted. 

|**Symbol**||**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|PD|Power Dissipation||3.1|W|
|RθJA|Thermal Resistance,<br>Junction−to−Ambient|Single−Die Measurement (Note 1)<br>(Maximum Land Pattern: 13 x 13 mm)|62|°C/W|
|||Multi−Die Measurement (Note 2)<br>(Maximum Land Pattern: 13 x 13 mm)|50||
|||Multi−Die Measurement (Note 2)<br>(Minimum Land Pattern: 1.3 x 1.5 mm)|105||
|ψJL|Thermal Characterization<br>Parameter, Junction to Lead|Single−Die Measurement (Note 2)<br>(Maximum and Minimum Land Pattern)|27|°C/W|



1. Device mounted on PCB with 0.5 inch x 0.5 inch (13 mm x 13 mm). Minimum Pads of 2 oz Copper. 

2. The thermal resistances (R θ JA & ψ JL) are characterized with the device mounted on the following FR4 printed circuit boards, as shown in Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Heating effect from adjacent dice is considered and only tow dices are powered at the same time. 

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F F<br>S S<br>S S<br>F F<br>**----- End of picture text -----**<br>


**Figure 1. Maximum pads of 2 oz copper** 

**Figure 2. Minimun pads of 2 oz copper** 

**ELECTRICAL CHARACTERISTICS** 

Values are at TA = 25 ° C unless otherwise noted. 

|Values ar|e at TA= 25°C unless otherwise noted.||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|VF|Forward Voltage, per Element|IF = 1.5 A|−|−|1.1|V|
|IR|Reverse Current, per Element at Rated VR|TA= 25°C|−|−|5.0|�A|
|||TA = 125�C|−|−|500||
|I2t|Rating for Fusing (t < 8.35 ms)|−|−|−|10|A2s|
|CJ|Typical Capacitance, per Leg|VR = 4.0 V,<br>f = 1.0 MHz|−|25|−|pF|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

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**2** 

**DF005S − DF10S** 

## **TYPICAL CHARACTERISTICS** 

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50 1.5<br>40<br>1<br>30<br>20<br>0.5<br>Based on R � JA, per Leg<br>10<br>0 0<br>1 2 5 10 20 50 100 20 40 60 80 100 120 140 160<br>Number of Cycles at 60 Hz Ambient Temperature [ � C]<br>Figure 3. Non−Repetitive Surge Current Figure 4. Forward Current Derating Curve<br>10 100<br>10<br>TJ=150 ° C TJ=125 ° C<br>1<br>1<br>TJ = 150J = 150= 150 ° C 0.1 T J =25 ° C<br>0.1<br>°<br>TJ = 125J = 125= 125 ° C TJJ = 25 C<br>0.01 TJ=−55 ° C<br>TJ=−55J=−55=−55 ° C<br>0.01<br>0.001<br>0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 200 300 400 500 600 700 800 900 1000<br>Forward Voltage Drop, VF [V]F [V][V] Reverse Voltage Drop, VR [V]<br> [A]<br>F<br> [A]<br>FSM<br>Peak Forward Surge Current, I<br>Average Rectified Forward Current, I<br>[A] A]<br>F  �<br>[<br>R<br>Forward Current, I<br>Reverse Current, I<br>**----- End of picture text -----**<br>


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10<br>1<br>TJ = 150J = 150= 150 ° C<br>0.1<br>°<br>TJ = 125J = 125= 125 ° C TJJ = 25 C<br>TJ=−55J=−55=−55 ° C<br>0.01<br>0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2<br>Forward Voltage Drop, VF [V]F [V][V]<br>[A]<br>F<br>Forward Current, I<br>**----- End of picture text -----**<br>


**Figure 5. Forward Voltage Characteristics** 

**Figure 6. Reverse Current vs. Reverse Voltage** 

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**3** 

**DF005S − DF10S** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**||||
|---|---|---|---|
|**Product Number**|**Device Code Marking**|**Package**|**Shipping**†|
|DF005S|DF005S|PDIP−4, GW<br>(Pb−Free, Halide Free)|1500 / Tape and Reel|
|DF01S|DF01S|PDIP−4, GW<br>(Pb−Free, Halide Free)|1500 / Tape and Reel|
|DF02S|DF02S|PDIP−4, GW<br>(Pb−Free, Halide Free)|1500 / Tape and Reel|
|DF04S|DF04S|PDIP−4 GW<br>(Pb−Free, Halide Free)|1500 / Tape and Reel|
|DF06S|DF06S|PDIP−4, GW<br>(Pb−Free, Halide Free)|1500 / Tape and Reel|
|DF08S|DF08S|PDIP−4, GW<br>(Pb−Free, Halide Free)|1500 / Tape and Reel|
|DF10S|DF10S|PDIP−4, GW<br>(Pb−Free, Halide Free)|1500 / Tape and Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

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**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**PDIP4 GW** CASE 709AE ISSUE O 

DATE 31 JUL 2016 

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5.200<br>5.000<br>1.30<br>4 3 1.50<br>PIN1 ID<br>OPTIONAL<br>6.500 10.300<br>6.200 9.400 10.40<br>1 2<br>1.200<br>0.890 5.10<br>TOP VIEW LAND PATTERN RECOMMENDATION<br>8.510 7.874<br>CHAMFER 8.050 7.370<br>OPTIONAL<br>2.60<br>0.330<br>2.20<br>0.220<br>0.330<br>1.530<br>1.12 0.076<br>1.020<br>SIDE VIEW END VIEW<br>**----- End of picture text -----**<br>


## NOTES: 

- A. THIS PACKAGE DOES NOT CONFORM TO ANY REFERENCE STANDARD. 

- B. ALL DIMENSIONS ARE IN MILLIMETERS. 

- C. DIMENSIONS ARE EXCLUSIVE OF BURRS, 

   - MOLD FLASH AND TIE BAR PROTRUSIONS. 

## **DOCUMENT NUMBER: 98AON13473G** 

**DESCRIPTION: PDIP4 GW** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

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