DD-25664BE-3A

## **OLED DISPLAY MODULE** 

## **Product Specification** 

|**CUSTOMER**|**Standard**|**Standard**|
|---|---|---|
|**PRODUCT**<br>**NUMBER**|**DD-25664BE-3A**||
|**CUSTOMER**<br>**APPROVAL**||**Date**|



|INTERNAL APPROVALS|INTERNAL APPROVALS|INTERNAL APPROVALS|
|---|---|---|
|Product Mgr|Doc. Control|Electr. Eng|
|**Bazile**<br>**Peter**|**Anthony**<br>**Perkins**|**Rekha**<br>**Mani**|
|Date: 11/06/08|Date: 11/06/08|Date:  11/06/08|



## **Approval for Specification only Approval for Specification and Sample** 

Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

FORM No. DT-029 

## **TABLE OF CONTENTS** 

|**1**|**MAIN FEATURES ..................................................................................................... 4**|**MAIN FEATURES ..................................................................................................... 4**|
|---|---|---|
|**2**|**MECHANICAL SPECIFICATION.......................................................................... 5**||
||2.1|MECHANICAL CHARACTERISTICS............................................................... 5|
||2.2|MECHANICAL DRAWING................................................................................ 6|
|**3**|**ELECTRICAL SPECIFICATION............................................................................ 7**||
||3.1|ABSOLUTE MAXIMUM RATINGS .................................................................. 7|
||3.2|ELECTRICAL CHARACTERISTICS ................................................................. 8|
||3.3|INTERFACE PIN ASSIGNMENT....................................................................... 9|
||3.4|BLOCK DIAGRAM ........................................................................................... 11|
||3.5|TIMING CHARACTERISTICS ......................................................................... 12|
|**4**|**OPTICAL SPECIFICATION.................................................................................. 16**||
||4.1|OPTICAL CHARACTERISTICS....................................................................... 16|
|**5**|**FUNCTIONAL SPECIFICATION ......................................................................... 17**||
||5.1|COMMANDS ..................................................................................................... 17|
||5.2|POWER DOWN AND UP SEQUENCE............................................................. 17|
||5.3|RESET CIRCUIT................................................................................................ 17|
||5.4|ACTUAL APPLICATION EXAMPLE.............................................................. 18|
|**6**|**PACKAGING............................................................................................................ 19**||
||6.1|LABELLING AND MARKING......................................................................... 19|
|**7**|**QUALITY ASSURANCE SPECIFICATION........................................................ 20**||
||7.1|CONFORMITY .................................................................................................. 20|
||7.2|DELIVERY ASSURANCE ................................................................................ 20|
||7.3|DEALING WITH CUSTOMER COMPLAINTS............................................... 25|
|**8**|**RELIABILITY SPECIFICATION ......................................................................... 26**||
||8.1|RELIABILITY TESTS ....................................................................................... 26|
||8.2|LIFE TIME.......................................................................................................... 26|
|**9**|**HANDLING PRECAUTIONS................................................................................. 27**||



DD-25664BE-3A REV. B Product No. Page 2 / 27 ~~ee eee |[|]~~ Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## REVISION RECORD 

|**Rev.**|**Date**|**Page**|**Chapt.**|**Comment**|**ECR no.**|
|---|---|---|---|---|---|
|A|27/05/08|--|--|Initial Release||
|B|11/06/08|10||Change in pin no 29, VCC<br>description||



DD-25664BE-3A REV. B Product No. Page 3 / 27 ~~ee eee |[|]~~ Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **1  MAIN FEATURES** 

|**1  MAIN FEATURES**|**1  MAIN FEATURES**|
|---|---|
|**ITEM**|**CONTENTS**|
|Display Format|256 x 64 Dots|
|Colour|Light Blue Monochrome|
|Overall Dimensions|88.00 (W)×27.80 (H)×2.00 (D) mm|
|Viewing Area|78.78 (W) x 21.18 (H) mm|
|Screen Size|3.12”|
|Mode|Passive Matrix|
|Duty ratio|1/64|
|Driver IC|SSD1322|
|Operating temperature|-30°C ~ +85°C|
|Storage temperature|-40°C ~ +90°C|



DD-25664BE-3A REV. B Product No. Page 4 / 27 ~~2 eee |[|]~~ 

Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **2 MECHANICAL SPECIFICATION** 

## _**2.1 MECHANICAL CHARACTERISTICS**_ 

|**ITEM**|**CHARACTERISTIC**|**UNIT**|
|---|---|---|
|Display Format|256 x 64|Dots|
|Overall Dimensions|88.00 (W)×27.80 (H)×2.00 (D)|mm|
|Viewing Area|78.78 (W) x 21.18 (H) mm|mm|
|Active Area|76.78 (W) x 19.18 (H)|mm|
|Dot Size|0.28 (W) 0.28 (H)|Mm|
|Dot Pitch|0.30 (W) x 0.30 (H)|Mm|
|Weight|9.95|G|
|IC Controller/Driver|SSD1322||



DD-25664BE-3A Product No. ~~2 eee~~ 

REV. B Page 5 / 27 ~~|[|]~~ 

Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**2.2  MECHANICAL DRAWING**_ 

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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **3 ELECTRICAL SPECIFICATION** 

## _**3.1 ABSOLUTE MAXIMUM RATINGS**_ 

|**Item**<br>~~a~~<br>~~a~~|**Symbol**<br>~~ee~~|**Min**|**Max**|**Unit**|**Note**|
|---|---|---|---|---|---|
|Supply Voltage for<br>Operation<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~|VCI<br>~~ee~~<br>~~ee~~|-0.3|4|V|1, 2|
|Supply Voltage for<br>Logic<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~|VDD<br>~~ee~~<br>~~ee~~<br>~~ee~~|-0.5|2.75|V|1, 2|
|Supply Voltage for I/O<br>pins<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~|VDDIO<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-0.5<br>~~ee~~|VCI<br>~~ee~~|V<br>~~ee~~|1, 2<br>~~ee~~|
|Supply Voltage for<br>Display<br>~~a~~<br>~~a~~|VCC<br>~~ee~~<br>~~ee~~|-0.5<br>~~ee~~|16<br>~~ee~~|V<br>~~ee~~|1, 2<br>~~ee~~|
|Operating Current for<br>VCC<br>~~a~~|ICC<br>~~ee~~|-<br>~~ee~~|55<br>~~ee~~|mA<br>~~ee~~|1,2<br>~~ee~~|
|Operating Temperature<br>~~Ge~~|TOP<br>~~Ge~~|-30<br>~~Ge~~|+85<br>~~Ge~~|°C<br>~~Ge~~|~~Ge~~|
|Storage Temperature<br>~~SG~~|TSTG<br>~~SG~~|-40<br>~~SG~~|+90<br>~~SG~~|°C<br>~~SG~~|~~SG~~|
|Static Electricity<br>~~SG~~<br>~~a~~|Be sure that you are grounded when handling displays.<br>~~SG~~|||||



Note 1: All the above voltages are on the basis of “VSS = 0V”. 

- Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur.  Also, for normal operations, it is desirable to use this module under the conditions according to Section 3.2 “Electrical Characteristics”.  If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. 

DD-25664BE-3A REV. B Product No. Page 7 / 27 ~~ee eee |[|]~~ Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**3.2 ELECTRICAL CHARACTERISTICS**_ 

|~~a~~|~~ee~~||||||
|---|---|---|---|---|---|---|
|**Item**<br>~~a~~<br>~~a~~|**Symbol**<br>~~ee~~<br>~~ee~~|**Condition**<br>~~ee~~|**Min**<br>~~ee ee~~|**Typ**<br>~~ee~~|**Max**<br>~~ee~~|**Unit**<br>~~ee~~|
|Supply Voltage for<br>Operation<br>~~a~~<br>~~ee~~<br>~~a~~|VCI<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|2.4<br>~~ee~~<br>~~ee ee~~|2.8<br>~~ee~~<br>~~ee~~|3.5<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|Supply Voltage for<br>Logic<br>~~a~~<br>~~a~~|VDD<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ee~~|2.4<br>~~ee ee~~<br>~~ee~~|2.5<br>~~ee~~|2.6<br>~~ee~~|V<br>~~ee~~|
|Supply Voltage for I/O<br>Pins<br>~~a~~<br>~~a~~|VDDIO<br>~~ee ~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ee~~|1.65<br>~~ee ee~~<br>~~ee~~|1.8<br>~~ee~~|VCI<br>~~ee~~|V<br>~~ee~~|
|Supply Voltage for<br>Display<br>~~a~~<br>~~a~~|VCC<br>~~ee~~<br>~~ee~~|Note 3<br>~~ee ~~<br>~~ee~~|11.5<br> ~~ee~~<br>~~ee~~|12<br>~~ee~~|12.5<br>~~ee~~|V<br>~~ee~~|
|High Level Input<br>~~Fs~~|VIH<br>~~Fs~~|~~Fs~~|0.8xVDDIO<br>~~Fs~~|--<br>~~Fs~~|VDDIO<br>~~Fs~~|V<br>~~Fs~~|
|Low Level Input<br>~~Fs~~<br>~~se~~<br>~~a~~|VIL<br>~~Fs~~<br>~~se~~<br>~~**e**e~~|~~Fs~~<br>~~se~~<br>~~ee~~|0<br>~~Fs~~<br>~~se~~<br>~~ee ee~~|--<br>~~Fs~~<br>~~se~~<br>~~ee~~|0.2xVDDIO<br>~~Fs~~<br>~~se~~<br>~~ee~~|V<br>~~Fs~~<br>~~se~~<br>~~ee~~|
|High Level Output<br>~~ee~~<br>~~a~~|VOH<br>~~ee~~<br>~~**e**e~~|IOUT=100µA,<br>3.3MHz<br>~~ee~~<br>~~ee~~|0.9xVDDIO<br>~~ee~~<br>~~ee ee~~|--<br>~~ee~~<br>~~ee~~|VDDIO<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
|Low Level Output<br>~~a~~|VOL<br>~~**e**e ~~|IOUT=100µA,<br>3.3MHz<br> ~~ee~~<br>~~e~~|0<br>~~ee ee~~|--<br>~~ee~~|0.1xVDDIO<br>~~ee~~|V<br>~~ee~~|
|Operating Current for<br>VCI<br>~~FL~~<br>~~Sf~~|ICI<br>~~FL~~<br>~~Sf~~|Note 4<br>~~FL~~|-|1.8|2.25|mA|
|||Note 5<br>~~FL~~~~**a**~~|-|1.8|2.25|mA|
|Operating Current for<br>VCC<br>~~FL~~<br>~~Sf~~|ICC<br>~~FL~~<br>~~Sf~~|Note 4<br>~~FL~~~~**a**~~|-|26.3|32.9|mA|
|||Note 5<br>~~**a**~~|-|41.1|51.4|mA|
|Sleep Mode Current for<br>VCI<br><br>~~Sf~~<br>~~a~~|ICI,SLEEP<br><br>~~Sf~~<br>~~ee~~|~~**a**~~<br>~~ee~~|-|1|5|µA|
|Sleep Mode Current for<br>VCC<br>~~a~~|ICC,SLEEP<br>~~ee~~|~~ee~~|-<br>~~ee~~|1<br>~~ee~~|5<br>~~ee~~|µA<br>~~ee~~|



Note 3: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of panel characteristics and the customer’s request. 

Note 4: VCI = 2.8V, VCC = 12V, 50% Display Area Turn on. 

Note 5: VCI = 2.8V, VCC = 12V, 100% Display Area Turn on. 

DD-25664BE-3A REV. B Product No. Page 8 / 27 ~~ee eee |[|]~~ Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**3.3 INTERFACE PIN ASSIGNMENT**_ 

|**No.**<br>~~a~~<br>~~ee~~|**Symbol**<br>~~ee~~<br>~~ee~~|**I/O**<br>~~ee~~|**Function**<br>~~ee~~<br>~~ee~~|**Function**<br>~~ee~~<br>~~ee~~|**Function**<br>~~ee~~<br>~~ee~~|**Function**<br>~~ee~~<br>~~ee~~|
|---|---|---|---|---|---|---|
|1<br>~~ee~~|N.C. (GND)<br>~~ee~~|--|**_Reserved Pin (Supporting Pin)._**<br>The supporting pins can reduce the influences from stresses on the<br>functionpins.This pin must be connected to externalground.<br>~~ee~~||||
|2<br>~~ee~~<br>~~ee~~|VSS<br>~~ee~~<br>~~ee~~|P<br>~~ee~~|**_Ground of Logic Circuit_**<br>This is a ground pin. It also acts as a reference for the logic pins. It<br>must be connected to externalground<br>~~ee~~<br>~~ee~~||||
|3<br>~~ee~~<br>~~ee~~|VCC<br>~~ee~~<br>~~ee~~|P<br>~~ee~~<br>~~ee~~|**_Power Supply for OEL Panel_**<br>This is the most positive supply pin of the chip. They must be<br>connectedto externalsource.<br>~~ee~~<br>~~ee~~||||
|4<br>~~ee~~<br>~~Tt~~|VCOMH<br>~~ee~~<br>~~Tt~~|P<br>~~ee~~<br>|**_Voltage Output High Level for COM Signal_**<br>This pin is the input pin for the voltage output high level for COM<br>signals. A tantalum capacitor should be connected between this pin<br>and VSS.<br>~~ee~~<br>||||
|5<br>~~Tt~~|VLSS<br>~~TtTT~~|P<br>~~TT~~|**_Ground of Analog Circuit_**<br>This is analog groundpin. It should be connected to VSS externally<br>~~TT~~||||
|6~13<br>~~Tt~~|D7~D0<br>~~TtTT~~|I/O<br>~~TT~~|**_Host Data Input/Output Bus_**<br>These pins are 8-bit bi-directional data bus to be connected to the<br>microprocessors data bus. When serial mode is selected, D1 will be<br>the serial data input SDIN and D0 will be the serial clock input<br>SCLK.<br>Unused pins must be connected to VSS except for D2 in serial<br>mode.<br>~~TT~~||||
|14<br>~~Tt~~|E/RD#<br>~~Tt~~|I<br>|**_Read/Write Enable or Read_**<br>This pin is MCU interface input. When interfacing to a 68XX-series<br>microprocessor, this pin will be used as the Enable (E) signal.<br>Read/write operation is initiated when this pin is pulled high and<br>the CS# is pulled low.<br>When connecting to an 80XX-microprocessor, this pin receives the<br>Read (RD#) signal. Data read operation is initiated when this pin is<br>low and CS# is pulled low.<br>Whenserial modeis selected, this pin must be connected to VSS.<br>||||
|15|R/W#|I|**_Read/Write Select or Write_**<br>This pin is MCU interface input. When interfacing to a 68XX-series<br>microprocessor, this pin will be used as Read/Write (R/W#)<br>selection input. Pull this pin to “High” for read mode and pull it<br>“Low” for write mode.<br>When 80XX interface mode is selected, this pin will be the Write<br>(WR#) input. Data write operation is initiated when this pin is<br>pulled low and the CS# is pulled low.<br>Whenserial modeis selected,this pin mustbe connectedto VSS.||||
|16<br>17|BS0<br>BS1|I|**_Communicating Protocol Select_**<br>These pins are MCU interface selection input. See the following<br>table:<br>BS0<br>BS1<br>3-wire SPI<br>1<br>0<br>4-wire SPI<br>0<br>0<br>8-bit68XX Parallel<br>1<br>1<br>8-bit 80XX Parallel<br>0<br>1<br>~~a—_—~~||||
|||||~~a—_—~~|BS0<br>~~—_—~~|BS1<br>~~—_—~~|
|||||3-wire SPI<br>~~a—_—~~|1<br>~~—_—~~|0<br>~~—_—~~|
|||||4-wire SPI<br>~~—_—~~|0<br>~~—_—~~|0<br>~~—_—~~|
|||||8-bit68XX Parallel<br>~~—_—~~|1<br>~~—_—~~|1<br>~~—_—~~|
|||||8-bit 80XX Parallel<br>~~—_—~~|0<br>~~—_—~~|1<br>~~—_—~~|



|18|D/C#|I|**_Data/Command Control_**<br>This pin is Data/Command control pin. When the pin is pulled high,<br>the input at D7~D0 is treated as display data. When the pin is<br>pulled low, the input at D7~D0 will be transferred to the command<br>register. For detailed relationship to MCU interface signals, please<br>refer totheTiming CharacteristicsDiagrams|
|---|---|---|---|
|19<br>~~eee~~|CS#<br>~~eee~~|I<br>~~eee~~|**_Chip Select_**<br>This pin is the chip select input. When the pin is enabled for MCU<br>communicationonly whenCS#is pulledlow..<br>~~eee~~|
|20<br>~~eee~~<br>~~tt~~|RES#<br>~~eee~~<br>~~tt~~|**I**<br>~~eee~~<br>~~tt~~|**_Power Reset for Controller and Driver_**<br>This pin is reset signal input. When the pin is low, initialization of<br>the chipis executed.<br>~~eee~~<br>~~tt~~|
|21<br>~~es~~|FR<br>~~es~~|**O**<br>~~es~~|**_Cascade Application Connection Pin_**<br>This pin is No Connection pins. Nothing should be connected to this<br>pin.It should beleft open individually.<br>~~es~~|
|22<br>~~es~~|IREF<br>~~es~~|**I**<br>~~es~~|**_Current Reference for Brightness Adjustment_**<br>This pin is segment current reference pin. A resistor should be<br>connected between this pin and VSS. Set the current lower than<br>10µA<br>~~es~~|
|23<br>~~es~~<br>~~oi~~|N.C.<br>~~es~~<br>~~oi~~|**-**<br>~~es~~<br>~~oi~~|**_Reserved Pin_**<br>The N.C. pin between function pins are reserved for compatible and<br>flexible design.<br>~~es~~|
|24<br>~~oi~~|VDDIO<br>~~oi~~|**P**<br>~~oi~~|**_Power Supply for I/O Pin_**<br>This pin is a power supply pin of I/O buffer. It should be connected<br>to VDD or external source. All I/O signals should have VIH<br>reference to VDDIO. When I/O signal pins (BS0~BS1, D0~D7,<br>controlsignals…) pull high,they should be connectedto VDDIO.|
|25|VDD|**P**|**_Power Supply for Core Logic Circuit_**<br>This is a voltage supply pin. It can be supplied externally (within the<br>range of 2.4~2.6V) or regulated internally from VCI. A capacitor<br>should be connected between this pin & VSS under all<br>circumstances.|
|26<br>~~oi~~|VCI<br>~~oi~~|**P**<br>~~oi~~|**_Power Supply for Operation_**<br>This is a voltage supply pin. It must be connected to external source<br>& always be equalor higherthanVDD& VDDIO.|
|27<br>~~oi~~|VSL<br>~~oi~~|**P**<br>~~oi~~|**_Voltage Output Low Level for SEG Signal_**<br>This is segment voltage reference pin.<br>When external VSL is not used, this pin should be left open.<br>When external VSL is used, this pin should connect with resistor and<br>diodeto ground.|
|28<br>~~tt~~|VLSS<br>~~tt~~|**P**<br>~~tt~~|**_Ground of Analog Circuit_**<br>This is the analog ground pin. It should be connected to VSS<br>externally<br>~~tt~~|
|29<br>~~tt~~|VCC<br>~~tt~~|**I**<br>~~tt~~|**_Power Supply for OEL Panel_**<br>This is the most positive supply pin of the chip. This should be<br>connected to externalsource.<br>~~tt~~|
|30<br>~~tt~~|N.C. (GND)<br>~~tt~~|**-**<br>~~tt~~|**_Reserved Pin (Supporting Pin)._**<br>The supporting pins can reduce the influences from stresses on the<br>functionpins. Thispin must be connected to externalground.<br>~~tt~~|



Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**3.4 BLOCK DIAGRAM**_ 

MCU Interface Selection: BS0 and BS1 Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, CS#, and RES# 

C1, C3, C5: 0.1μF C2, C4: 4.7μF C6: 10μF C7: 1μF C8: 4.7uF / 25V Tantalum Capacitor R1: 680kΩ, R1 = 680kΩ, R1= (Voltage at IREF – VSS) / IREF R2: 50Ω, 1/4W D1: ≤1.4V, 0.5W 

DD-25664BE-3A REV. B Product No. Page 11 / 27 

Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**3.5  TIMING CHARACTERISTICS**_ 

## **3.5.1 68XX-Series MPU Parallel Interface Timing Characteristics:** 

**Symbol Description Min Max Unit** ~~eees~~ tcycle Clock Cycle Time 300 - ns ~~eeee~~ tAS Address Setup Time 10 - ns ~~a~~ tAH Address Hold Time 0 - ns ~~eeee~~ tDSW Write Data Setup Time 40 - ns ~~eeee~~ tDHW Write Data Hold Time 7 - ns ~~a ee~~ tDHR Read Data Hold Time 20 - ns ~~a ee~~ tOH Output Disable Time - 70 ns ~~ee ee~~ ~~**ee**~~ tACC Access Time - 140 ns Chip Select Low Pulse Width (Read) 120 PWCSL Chip Select Low Pulse Width (Write) 60 - ns ~~pp~~ Chip Select High Pulse Width (Read) 60 PWCSH Chip Select High Pulse Width (Write) 60 - ns tR Rise Time - 15 ns ~~ee~~ tF Fall Time - 15 ns ~~a eees~~ (VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25° C) 

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pe XP<br>ee<br>ewrey iS<br>E(RD#) yeeee<br>‘one<br>PWes:<br>po<br>D[7:0] (WRITE) PL vatiaata |<br>D[7:0] (READ)<br>“ a é<br>tox<br>DD-25664BE-3A  REV. B<br>Product No.  Page  12 / 27<br>**----- End of picture text -----**<br>


Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **3.5.2 80XX-Series MPU Parallel Interface Timing Characteristics:** 

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||||||
|---|---|---|---|---|
|Symbol|Description|Min|Max|Unit|
|tcycle|Clock Cycle Time|300|-|ns|
|tAS|Address Setup Time|10|-|ns|
|tAH|Address Hold Time|0|-|ns|
|tDSW|Write Data Setup Time|40|-|ns|
|tDHW|Write Data Hold Time|7|-|ns|
|tDHR|Read Data Hold Time|20|-|ns|
|tOH|Output Disable Time|-|70|ns|
|tACC|Access Time|-|140|ns|
|tPWLR|Read Low Time|150|-|ns|
|tPWLW|Write Low Time|60|-|ns|
|tPWHR|Read High Time|60|-|ns|
|tPWHW|Write High Time|60|-|ns|
|tCS|Chip Select Setup Time|0|-|ns|
|Chip Select Hold Time to Read|0|
|tCSH|Signal|-|ns|
|tCSF|Chip Select Hold Time|20|-|ns|
|tR|Rise Time|-|15|ns|
|tF|Fall Time|-|15|ns|

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(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25° C) 

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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **3.5.3 Serial Interface Timing Characteristics: (4-wire SPI)** 

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||||||
|---|---|---|---|---|
|Symbol|Description|Min|Max|Unit|
|tcycle|Clock Cycle Time|100|-|ns|
|tAS|Address Setup Time|15|-|ns|
|tAH|Address Hold Time|15|-|ns|
|tCSS|Chip Select Setup Time|20|-|ns|
|tCSH|Chip Select Hold Time|10|-|ns|
|tDSW|Write Data Setup Time|15|-|ns|
|tDHW|Write Data Hold Time|15|-|ns|
|tCLKL|Clock Low Time|20|-|ns|
|tCLKH|Clock High Time|20|-|ns|
|tR|Rise Time|-|15|ns|
|tF|Fall Time|-|15|ns|

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(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25° C) 

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|DD-25664BE-3A|REV. B|
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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **3.5.4 Serial Interface Timing Characteristics: (3-wire SPI)** 

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||||||
|---|---|---|---|---|
|Symbol|Description|Min|Max|Unit|
|tcycle|Clock Cycle Time|100|-|ns|
|tAS|Address Setup Time|15|-|ns|
|tAH|Address Hold Time|15|-|ns|
|tCSS|Chip Select Setup Time|20|-|ns|
|tCSH|Chip Select Hold Time|10|-|ns|
|tDSW|Write Data Setup Time|15|-|ns|
|tDHW|Write Data Hold Time|15|-|ns|
|tCLKL|Clock Low Time|20|-|ns|
|tCLKH|Clock High Time|20|-|ns|
|tR|Rise Time|-|15|ns|
|tF|Fall Time|-|15|ns|

**----- End of picture text -----**<br>


(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25° C) 

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|---|---|---|
|DD-25664BE-3A|REV. B|
|Product No.|Page|15 / 27|

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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **4 OPTICAL SPECIFICATION** 

## _**4.1 OPTICAL CHARACTERISTICS**_ 

|**Characteristics**|**Symbol**|**Conditions**|**Min**|**Typ**|**Max Unit**|**Max Unit**|
|---|---|---|---|---|---|---|
|Brightness|Lbr|With Polarizer<br>(Note 3)|60|80|-|cd/m2|
|C.I.E. (Yellow)|(x)<br>(y)|Without Polarizer|0.12<br>0.22|0.16<br>0.26|0.20<br>0.30||
|Dark Room Contrast|CR||-|>2000:1|-||
|View Angle|||>160|-|-|degree|



Note 3: Optical measurement taken at VCI = 2.8V, VCC = 12V 

DD-25664BE-3A Product No. ~~2 eee~~ 

REV. B Page 16 / 27 ~~|[|]~~ 

Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **5 FUNCTIONAL SPECIFICATION** 

## _**5.1 COMMANDS**_ 

Refer to the Technical Manual for the SSD1322 

## _**5.2 POWER DOWN AND UP SEQUENCE**_ 

To protect the panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off.  Such that panel has enough time to charge and discharge before/after operation. 

## **5.2.1 Power up Sequence:** 

1. Power up VCI & VDDIO 

2. Send Display off command 

3. Initialization 

4. Clear Screen 

5. Power up VCC 

6. Delay 100ms (when VCC is stable) 

7. Send Display on command 

## **5.2.2 Power down Sequence:** 

1. Send Display off command 

2. Power down VCC 

3. Delay 100ms (when VCC is reach 

- 0 and panel is completely discharges) 

4. Power down VCI & VDDIO 

## _**5.3 RESET CIRCUIT**_ 

When RES# input is low, the chip initialized with the following status: 

1. Display is OFF 

2. 480x128 Display Mode 

3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h) 

4. Display start line is set at display RAM address 0 

5. Column address counter is set at 0 

6. Normal scan direction of the COM outputs 

7. Contrast control registers is set at 7Fh 

DD-25664BE-3A REV. B Product No. Page 17 / 27 

Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**5.4 ACTUAL APPLICATION EXAMPLE**_ 

Command usage and explanation of an actual example 

## <Initialization> 

If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function. 

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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **6 PACKAGING** 

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Ss,<br>**----- End of picture text -----**<br>


## _**6.1 LABELLING AND MARKING**_ 

DENSITRON DD-25664BE-3A TW   YYMM 

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|---|---|---|
|DD-25664BE-3A|REV. B|
|Product No.|Page|19 / 27|

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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **7 QUALITY ASSURANCE SPECIFICATION** 

## _**7.1 CONFORMITY**_ 

The performance, function and reliability of the shipped products conform to the Product Specification. 

## _**7.2 DELIVERY ASSURANCE**_ 

## **7.2.1 Delivery inspection standards** 

- IPC-AA610 rev. C, class 2 electronic assemblies standard 

## **7.2.2 Zone definition** 

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A   Viewing area<br>B   Outside viewing area<br>**----- End of picture text -----**<br>


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DD-25664BE-3A  REV. B<br>Product No.  Page  20 / 27<br>2 eee | [|]<br>**----- End of picture text -----**<br>


Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **7.2.3 Visual inspection** 

- Inspect under 30W fluorescent lamp leaving 50 cm between the module and the lamp and 30 cm between the module and the eye (measuring position). 

- Appearance is inspected at the best contrast voltage (best contrast is adjusted considering clearness and crosstalk on screen). 

- Inspect the module at 45° right and left, top and bottom. 

- Use the optimum viewing angle during the contrast inspection. 

eye 45° 45° ~~NK~~ 

DD-25664BE-3A Product No. ~~2 eee~~ 

REV. B Page 21 / 27 ~~|[|]~~ 

Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **7.2.3.1 Standard of appearance inspection** 

Units: mm 

|**Class**<br>~~ee~~|**Item**<br>~~ee~~|**Criteria**<br>~~ee~~|**Criteria**<br>~~ee~~|
|---|---|---|---|
|Minor<br>~~ee~~|Packing &<br>Label<br>~~ee~~|Outside & insidepackage<br>~~ee~~|Presence ofproduct no.,lot no., quantity<br>~~ee~~|
|Critical<br>~~i~~||Product must not be mixed with others and quantity must not be different from<br>that indicated on the label||
|Major<br>~~a~~|Dimension|Product dimensions must be according to specification and drawing||
|Major<br>~~aa~~<br>~~Se~~|Electrical<br>|Product electrical characteristics must be according to specification<br>||
|Critical<br>~~Se~~|LCD<br>Display<br>|Missing lines or wrong patterns on LCD display are not allowed<br>||
|Minor<br>~~Se ~~|Black spot,<br>white spot,<br>dust<br>|Round type: as per following drawing<br>∅= (X+Y)/2<br>Acceptable quantity<br>Size<br>Zone A<br>Zone B<br> ∅<0.1<br>Anynumber<br>0.1<∅<0.2<br>3<br>0.2<∅<0.25<br>1<br>0.25<∅<br>0<br>Any number<br>Line type: as per following drawing<br>Acceptable quantity<br>Length<br>Width<br>Zone A<br>Zone B<br>- -<br>W≤0.05<br>Any number<br>L≤2.0<br>W≤0.1<br>3<br>L>2.0<br>0<br>Any number<br>Total acceptable quantity: 3<br>X<br>Y<br>L<br>W<br> ~~ae~~<br>~~——— a~~||
|Minor<br>~~a~~|Polariser<br>scratch<br>~~a~~|Scratch on protective film is permitted<br>Scratch on polariser: same as No. 1||
|Minor<br>~~a~~|Polariser<br>bubble<br>~~a~~|∅= (X+Y)/2<br>Acceptable quantity<br>Size<br>ZoneA<br>ZoneB<br> ∅<0.5<br>Anynumber<br>∅>0.5<br>0<br>Any number<br>Total acceptable quantity: 3<br>X<br>Y||



DD-25664BE-3A REV. B Product No. Page 22 / 27 ~~ee~~ 

Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Class**||**Item**|**Criteria**|||||||||||||
|Minor|Minor||Segment<br>deformation|1b. Pin hole on dot matrix display<br>Acceptable quantity<br>Size<br>a,b<<br>(a+b)/2≤0.1<br>0.5<∅<<br>Total acceptable quantity: 7<br>2. Segments / dots with different width|||||||||||||
||||||2. Segments / dots with different width||||||||||||
||||||||||||||||||
||||||||||||||||||
|||||||||||Acceptable|||||||
|||||Acceptable<br>a≥b<br>a<b<br>3. Alignment layer defect<br>∅= (a+b)/2<br>Acceptable<br>Size<br> ∅≤0.4<br>0.4<∅≤1.0<br>1.0<∅≤1.5<br>1.5<∅≤2.0<br>Total acceptable quantity: 7|Acceptable<br>a≥b<br>a<b<br>3. Alignment layer defect|||||Acceptable<br>a≥b||Acceptable|Acceptable<br>a/b≤4/3||a/b≤4/3||
|||||||||||a<b|||a/b||a/b>4/3||
||||||||||||||||||
|||||||||||Acceptable||tablequantity|||||
|||||||||||Size|||||||
|||||||||||∅≤0.4|||Anynumber||||
|||||||||||0.4<∅≤1.0|||5||||
|||||||||||∅|||3||||
|||||||1.0<∅≤1.5<br>1.5<∅≤2.0<br>Total acceptable quantity: 7||||1.0<∅≤1.5|||3||||
|||||||||||1.5<∅≤2.0|||2||||
|||||||||||||Total acceptable quantity: 7|||||
|Minor||Minor|Panel||||||||||||||
||||Chipping|X ≤ 1/6 Panel length<br>Y ≤ 1<br>Z ≤ T|||||||||||||
||||||||||||||||||
|Minor|||Panel<br>Cracking|Cracks not allowed||Cracks not allowed|||||||||||
||||||||Cracks not allowed||||||||||
||||||||Cracks not allowed||||||||||
|Minor|||Cupper<br>exposed<br>(pin or film)|Not allowed if visible by eye inspection|||Not allowed if visible by eye inspection||||||||||
|Minor|||Film or<br>Trace<br>Damage|Not allowed if affects electrical function|||||||||||||



DD-25664BE-3A REV. B Product No. Page 23 / 27 ~~ee eee |[|]~~ Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

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**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|Class|Item|Criteria|
|Minor|Contact|
|wo|
|Lead Twist|Not allowed|i5/7,|a|“.—D.<.\|[\]|LTWISTED|LEAD|
|i.|[1]|1|
|4alltitalt\.\N._a,///|i|
|Minor|Contact|
|Pa|;|
|Lead Broken|Not allowed|4t}éf“|“7-4,\|[‘]|‘|[t]|iBROKEN|LEAD|
|1tx‘NXN|FAféi}|[1]|
|a“|
|Minor|Contact|
|Lead Bent|Not allowed if|i|7|a|[‘]|\|\|
|;|\|
|bent lead causes|!i|A.|LEAD|SHORTING:|\\|
|short circuit|1HH\|\\|||\|
|\\NNY|SS///1|
|Not allowed if bent lead|‘|/J|SIrN‘AlNX\|
|'\|
|extends horizontally|f|
|Hl1|1Hl\|
|more than 50% of its width|1\\\\.|NS|JYof|,|//fl|
|—|we|
|Minor|Colour|Level of sample for approval set as limit sample|
|uniformity|
|Major|PCB|No unmelted solder paste should be present on PCB|
|Critical|Cold solder joints, missing solder connections, or oxidation are not allowed|
|Minor|No residue or solder balls on PCB are allowed|
|Critical|Short circuits on components are not allowed|
|Minor|Tray|Size|Quantity|
|particles|∅|<0.2|Any number|
|On tray|
|∅|>0.25|4|
|∅≥|0.25|2|
|On display|L = 3|1|

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|---|---|---|
|DD-25664BE-3A|REV. B|
|Product No.|Page|24 / 27|

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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**7.3 DEALING WITH CUSTOMER COMPLAINTS**_ 

## **7.3.1 Non-conforming analysis** 

Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. 

If the analysis cannot be completed on time, Densitron must inform the purchaser. 

## **7.3.2 Handling of non-conforming displays** 

If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. 

Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear. 

Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard. 

DD-25664BE-3A REV. B Product No. Page 25 / 27 ~~ee eee |[|]~~ Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **8 RELIABILITY SPECIFICATION** 

## _**8.1 RELIABILITY TESTS**_ 

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||||
|---|---|---|
|Test Item|Test Condition|Evaluation and assessment|
|High Temperature Operation 85°C, 500 hrs|
|Low Temperature Operation|-30°C, 500 hrs|
|The brightness should be|
|High Temperature Storage|90°C, 500 hrs|
|greater than 50% of the|
|initial brightness. The|
|Low Temperature Storage|-40°C, 500 hrs|
|operational functions work.|
|High Temperature & High|
|60°C, 90% RH, 500 hrs|
|Humidity Storage|
|-40°C ↔85°C, 100 cycles|
|Thermal Shock Storage|
|30 min. dwell|

**----- End of picture text -----**<br>


- All operation tests are conducted in all display on pattern. 

- The samples used for above tests do not include polarizer. 

- No moisture condensation is observed during tests. 

## **8.1.1 FAILURE CHECK STANDARD** 

After the completion of the described reliability test, the samples were left at room 

## _**8.2 LIFE TIME**_ 

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|||
|---|---|
|Item|Description|
|Function, performance, appearance, etc. shall be free from remarkable deterioration|
|within 10,000 hours under ordinary operating and storage conditions of room|
|1|
|temperature (25±10 °C), normal humidity (45±20% RH), and in area not exposed to|
|direct|sunlight.|
|2|End of lifetime is specified as 50% of initial brightness.|

**----- End of picture text -----**<br>


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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **9 HANDLING PRECAUTIONS** 

## _Safety_ 

If the panel breaks, be careful not to get the organic substance in your mouth or in your eyes. If the organic substance touches your skin or clothes, wash it off immediately using soap and plenty of water. 

## _Mounting and Design_ 

Place a transparent plate (e.g. acrylic, polycarbonate or glass) on the display surface to protect the display from external pressure. Leave a small gap between the transparent plate and the display surface. 

Design the system so that no input signal is given unless the power supply voltage is applied. 

## _Caution during OLED cleaning_ 

Lightly wipe the display surface with a soft cloth soaked with Isopropyl alcohol, Ethyl alcohol or Trichlorotriflorothane. 

Do not wipe the display surface with dry or hard materials that will damage the polariser surface. Do not use aromatic solvents (toluene and xylene), or ketonic solvents (ketone and acetone). 

## _Caution against static charge_ 

As the display uses C-MOS LSI drivers, connect any unused input terminal to VDD or VSS. Do not input any signals before power is turned on. 

Also, ground your body, work/assembly table and assembly equipment to protect against static electricity. 

## _Packaging_ 

Displays use OLED elements, and must be treated as such. Avoid strong shock and drop from a height. 

To prevent displays from degradation, do not operate or store them exposed directly to sunshine or high temperature/humidity. 

## _Caution during operation_ 

It is indispensable to drive the display within the specified voltage limit since excessive voltage shortens its life. 

## _Other Precautions_ 

When a display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. 

Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. 

## _Storage_ 

Store the display in a dark place where the temperature is 25°C ± 10°C and the humidity below 50%RH. 

Store the display in a clean environment, free from dust, organic solvents and corrosive gases. Do not crash, shake or jolt the display (including accessories). 

DD-25664BE-3A REV. B Product No. Page 27 / 27 ~~ee eee |[|]~~ Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data