DD-12864YO-3A

## **OLED DISPLAY MODULE** 

## **Product Specification** 

> **CUSTOMER Standard PRODUCT DD-12864YO-3A NUMBER CUSTOMER Date APPROVAL** 

|INTERNAL APPROVALS|INTERNAL APPROVALS|INTERNAL APPROVALS|
|---|---|---|
|Product Mgr|Doc. Control|Electr. Eng|
|**Bazile**<br>**Peter**|**Bazile**<br>**Peter**|**Luo**<br>**LUO**|
|Date: 29 Jul 10|Date: 29 Jul 10|Date: 29 Jul 10|



Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **TABLE OF CONTENTS** 

|**1**|**MAIN FEATURES .......................................................................................................4**|**MAIN FEATURES .......................................................................................................4**|
|---|---|---|
|**2**|**MECHANICAL SPECIFICATION.............................................................................5**||
||2.1|MECHANICAL CHARACTERISTICS ..................................................................5|
||2.2|MECHANICAL DRAWING ..................................................................................6|
|**3**|**ELECTRICAL SPECIFICATION ..............................................................................7**||
||3.1|ABSOLUTE MAXIMUM RATINGS .....................................................................7|
||3.2|ELECTRICAL CHARACTERISTICS ....................................................................8|
||3.3|INTERFACE PIN ASSIGNMENT ..........................................................................9|
||3.4|BLOCK DIAGRAM ............................................................................................. 11|
||3.5|TIMING CHARACTERISTICS ............................................................................ 12|
|**4**|**OPTICAL SPECIFICATION .................................................................................... 16**||
||4.1|OPTICAL CHARACTERISTICS ......................................................................... 16|
|**5**|**FUNCTIONAL SPECIFICATION ............................................................................ 17**||
||5.1|COMMANDS ....................................................................................................... 17|
||5.2|POWER UP/DOWN SEQUENCE ........................................................................ 17|
||5.3|RESET CIRCUIT.................................................................................................. 17|
||5.4|ACTUAL APPLICATION EXAMPLE ................................................................. 18|
|**6**|**PACKAGING AND LABELLING SPECIFICATION ............................................. 19**||
|**7**|**QUALITY ASSURANCE SPECIFICATION ........................................................... 20**||
||7.1|CONFORMITY .................................................................................................... 20|
||7.2|DELIVERY ASSURANCE ................................................................................... 20|
||7.3|DEALING WITH CUSTOMER COMPLAINTS................................................... 24|
|**8**|**RELIABILITY SPECIFICATION ............................................................................ 25**||
||8.1|RELIABILITY TESTS ......................................................................................... 25|
||8.2|LIFE TIME ........................................................................................................... 25|
|**9**|**HANDLING PRECAUTIONS ................................................................................... 26**||
|**10** **SUPPORTED ACCESSORIES .................................................................................. 27**|||
||10.1|DUO KIT .............................................................................................................. 27|
||10.2|TRANSITION BOARD CARD ............................................................................. 27|
||10.3|CONNECTOR BOARD CARD ............................................................................ 27|
||10.4|CONNECTOR ...................................................................................................... 27|



DD-12864YO-3A REV. D Product No. Page 2 / 27 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## REVISION RECORD 

|**Rev.**|**Date**|**Page**|**Chapt.**|**Comment**|**ECR no.**|
|---|---|---|---|---|---|
|A|12 Nov 07|||First Issue||
|||6|2.2|Mechanical Drawing||
|||7|3.1|Absolute maximum Rating||
|B|10 June 10|16<br>18|4.1<br>5.4|Optical characteristics<br>Actual application examples||
|||25|8.1|Reliability test||
|||25|8.2|Life time||
|C|29 Jul 10|25|8.2|Life time (typing error)||
|D|28 Nov 12|27|10|Add chapter 10 supported<br>accessories||



Product No. ~~a~~ 

DD-12864YO-3A 

REV. D Page 3 / 27 ~~|[|]~~ 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **1 MAIN FEATURES** 

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|||
|---|---|
|ITEM|CONTENTS|
|Display Format|128 x 64 Dots|
|Overall Dimensions|45.24 x 29.14 x 2.00 mm|
|Colour|Monochrome Yellow|
|Active Area|35.056 x 17.52 mm|
|Viewing Area|37.056 x 19.52 mm|
|Display Mode|Passive Matrix (1.54”)|
|Driving Method|1/64 duty|
|Driver IC|SSD1305|
|Operating temperature|-30 ~ +70|
|Storage temperature|-40 ~ +80|

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DD-12864YO-3A Product No. 

REV. D 

Page 4 / 27 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **2 MECHANICAL SPECIFICATION** 

## _**2.1 MECHANICAL CHARACTERISTICS**_ 

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|---|---|---|
|ITEM|CHARACTERISTIC|UNIT|
|Display Format|128 x 64 Dots|Dots|
|Overall Dimensions|45.24 x 29.14 x 2.00|mm|
|Viewing Area|37.056 x 19.52|mm|
|Active Area|35.056 x 17.52|mm|
|Dot Size|0.258 x 0.258|mm|
|Dot Pitch|0.274 x 0.274|mm|
|Weight|5.4|g|
|IC Controller/Driver|SSD1305|

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**2.2  MECHANICAL DRAWING**_ 

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **3 ELECTRICAL SPECIFICATION** 

## _**3.1 ABSOLUTE MAXIMUM RATINGS**_ 

|**Item**|**Symbol**|**Min**|**Max**|**Unit**|**Note**|
|---|---|---|---|---|---|
|Supply Voltage for logic|VDD|-0.3|4.0|V|Note 1, 2|
|Supply voltage for Display|VCC|0|15|V||
|Operating Temperature|Top|-30|85|°C||
|Storage Temperature|Tst|-40|90|°C||
|Life Time(150 cd/m<br>2)||10,000||Hour||
|Life Time(100 cd/m<br>2)||40,000||Hour||
|Static Electricity|Be sure that you are grounded when handling displays.|||||



Note 1: All the above voltages are on the basis of “GND=0V”. 

- Note 2: When this module is used beyond the above absolute maximum ratings, permanent damage to the module may occur. Also for normal operations it’s desirable to use this module under the conditions according to Section 3.2 “Electrical 

   - Characteristics”. If this module is used beyond these conditions the module may malfunction and the reliability could deteriorate. 

- Note 3: V CC[= 12.5V, T] a[= 25°C, 50% Checkerboard.  ] 

Software configuration follows Section 5.4 Initialization. 

End of lifetime is specified as 50% of initial brightness reached. The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions. 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**3.2 ELECTRICAL CHARACTERISTICS**_ 

**Characteristics Symbol Conditions Min Typ Max Unit** ~~aee ee~~ Supply Voltage VDD 2.4 2.8 3.5 V ~~OG~~ Supply Voltage for Display VCC Note 3 12 12.5 13.0 V ~~Se~~ High Level Input VIH 0.8xVDD - VDD V ~~ee eee |~~ 0.2 x Low Level Input VIL 0 - V VDD ~~a~~ IOUT=0.1mA, ~~ee|~~ |} 3.3MHz 0.9 x High Level Output VOH - VDD V VDD ~~a~~ 0.1 x Low Level Output VOL 0 - V VDD ~~aee~~ Note 4 - 180 300 Operating current for VDD IDD µA Note 5 - 180 300 ~~Seeeee eee~~ Note 4 - 20 25 Operating current for VCC ICC mA Note 5 - 30 38 ~~oeeeee ee~~ IDD Sleep mode current for VDD - 1 5 µA ~~Se~~ SLEEP ICC Sleep mode current for VCC - 2 10 µA ~~ee~~ SLEEP 

Note 3 Brigthness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of the panel characteristics and the customer’s request 

Note 4 VDD = 2.8V, VCC = 12.5V, 50% display area turned on. 

Note 5 VDD = 2.8V, VCC = 12.5V, 100% display area turned on. 

DD-12864YO-3A REV. D Product No. Page 8 / 27 ~~el eee |[|]~~ Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**3.3 INTERFACE PIN ASSIGNMENT**_ 

|**No.**|**Symbol**|**Function**|
|---|---|---|
|1|N.C.(GND)|Reserved Pin (Supporting Pin)<br>The supporting pins can reduce the influences from stresses on the function pins.<br>Thesepins must be connected to externalground.|
|2|VLSS|Ground of Analog Circuit<br>Thisis ananalog ground pin. It should be connected toVSS externally|
|3|VSS|Ground of OEL System<br>This is a ground pin. It also acts as a reference for the logic pins, the OEL<br>driving voltages, and the analog circuits. It must be connected to external<br>ground.|
|4|N.C.|No Connection|
|5|VDD|Power Supply for Logic Circuit<br>Thisis avoltage supply pin. Itmust be connected to externalsource.|
|6<br>~~Pp fo~~|BS1<br>~~fo /[~~|Communicating Protocol Select<br>These pins are MCU interface selection input. See the following table:<br>~~/[8XX-parallel| SOXX-parallel | Serial | DC]~~<br>~~==~~<br>BS2<br>1<br>0<br>0|
|7<br>~~Pp fo~~|BS2<br>~~fo /[~~||
|8<br>~~Pp fo~~|CS#<br>~~fo /[~~|Chip Select<br>This pin is the chip select input. The chip is enabled for MCU<br>communicationonlywhenCS#is pulledlow.<br>~~/[ 8XX-parallel | SOXX-parallel | Serial | DC]~~|
|9|RES#|Power Reset for Controller and Driver<br>This pin is reset signal input. When the pin is low, initialization of the chip<br>is executed.|
|10|D/C#|Data/Command Control<br>This pin is Data/Command control pin. When the pin is pulled high, the input at<br>D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0<br>will be transferred to the command register. For detail relationship to MCU<br>interface signals, please refer to the Timing Characteristics Diagrams.<br>When the pin is pulled high and serial interface mode is selected, the data at<br>SDIN is treated as data. When it is pulled low, the data at SDIN will be<br>transferred to the command register. In I2C mode, this pin acts as SA0 for slave<br>address selection.|
|11|R/W#|Read/Write Select or Write<br>This pin is MCU interface input. When interfacing to a 68XX-series<br>microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull<br>this pin to “High” for read mode and pull it “Low” for write mode.<br>When 80XX interface mode is selected, this pin will be the Write (WR#) input.<br>Data write operation is initiated when this pin is pulled low and the CS# is pulled<br>low.|
|12|E/RD#|Read/Write Enable or Read<br>This pin is MCU interface input. When interfacing to a 68XX-series<br>microprocessor, this pin will be used as the Enable (E) signal. Read/write<br>operation is initiated when this pin is pulled high and the CS# is pulled low.<br>When connecting to an 80XX-microprocessor, this pin receives the Read (RD#)<br>signal. Data read operation is initiated when this pin is pulled low and CS# is<br>pulled low.|
|13~20|D0~D7|Host Data Input/Output Bus<br>These pins are 8-bit bi-directional data bus to be connected to the<br>microprocessor’s data bus. When serial mode is selected, D1 will be the serial<br>data input SDIN and D0 will be the serial clock input SCLK. When I2C mode is|



Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

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|---|---|---|---|---|
|selected, D2 & D1 should be tied together and serve as SDAout &SDAin in|
|application and D0 is the serial clock input SCL.|
|Current Reference for Brightness Adjustment|
|21|IREF|This pin is segment current reference pin. A resistor should be connected|
|between this|pin and VSS. Set|the|current lower than 10uA|
|Voltage Output High Level for COM signal|
|22|VCOMH|This pin is the input pin for the voltage output high level for COM signals.|
|A capacitor should|be|connected|between this|pin and VSS.|
|Power Supply for OEL Panel|
|23|VCC|This is the most positive voltage supply pin of the chip. It can be supplied|
|externally or generated internally by using internal DC/DC voltage converter.|
|Reserved Pin (Supporting Pin)|
|24|N.C.(GND)|The supporting pins can reduce the influences from stresses on the function pins.|
|These pins must be connected to external ground.|

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**3.4 BLOCK DIAGRAM**_ 

MCU Interface Selection: BS1 and BS2 

Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, RES# and CS#. 

C1, C3: 0.1μF C2: 4.7μF C4: 10μF C5: 4.7μF/25V Tantalum Capacitor R1: 910 kΩ, R1 = (Voltage at IREF – BGGND) / IREF 

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**3.5 TIMING CHARACTERISTICS**_ 

## **3.5.1 AC CHARACTERISTICS** 

## **3.5.1.1 68XX-Series MPU Parallel Interface Timing Characteristics** 

VDD = 2.8V, Ta = 25˚C 

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||||||||
|---|---|---|---|---|---|---|
|a|Symbol|Description|Min|Max|Unit|
|a|tcycle|System Cycle Time|300|-|ns|
|tAS|Address Setup Time|0|-|ns|
|tAH|Address Hold Time|0|-|ns|
|a|
|a|tDSW|Write Data Setup Time|40|-|ns|
|tDHW|Write Data Hold Time|7|-|ns|
|a|
|tDHR|Read Data Hold Time|20|-|ns|
|a|
|a|tOH|Output Disable Time|-|70|ns|
|tACC|Access Time|-|140|ns|
|a|
|Chip Select Low Pulse Width (Read) Chip Select|120|
|PWCSL|-|ns|
|a|e|Low Pulse width (Write)|ee|60|
|Chip Select High Pulse Width (Read) Chip Select|ee|60|
|PWCSH|-|ns|
|High Pulse Width (Write)|60|
|eeee|
|a|tR|Rise Time|ee|-|15|ns|
|tF|Fall Time|-|15|ns|
|a|

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **3.5.1.2 8080-Series MPU Parallel Interface Timing Characteristics** 

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|---|---|---|---|---|
|Symbol|Description|Min|Max|Unit|
|tcycle|Clock Cycle Time|300|-|ns|
|tAS|Address Setup Time|10|-|ns|
|tAH|Address Hold Time|0|-|ns|
|tDSW|Write Data Setup Time|40|-|ns|
|tDHW|Write Data Hold Time|7|-|ns|
|tDHR|Read Data Hold Time|20|-|ns|
|tOH|Output Disable Time|-|70|ns|
|tACC|Access Time|-|140|ns|
|tPWLR|Read Low Time|120|-|ns|
|tPWLW|Write Low Time|60|-|ns|
|tPWHR|Read High Time|60|-|ns|
|tPWHW|Write High Time|60|-|ns|
|tCS|Chip Select Setup Time|0|-|ns|
|tCSH|Chip Select Hold Time to Read Signal|0|-|ns|
|tCSF|Chip Select Hold Time|20|-|ns|
|tR|Rise Time|-|15|ns|
|tF|Fall Time|-|15|ns|

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

VDD = 2.8V , Ta = 25˚C 

## **3.5.1.3 Serial Interface Timing Characteristics** 

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||||||||
|---|---|---|---|---|---|---|
|Symbol|Description|Min|Max|Unit|
|esa|
|a|tcycle|ee|Clock Cycle Time|250|-|ns|
|a|tAS|ee|Address Setup Time|150|-|ns|
|a|tAH|Address Hold Time|150|-|ns|
|a|tCSS|Chip Select Setup Time|120|-|ns|
|a|tCSH|Chip Select Hold Time|60|-|ns|
|a|tDSW|Write Data Setup Time|50|-|ns|
|a|tDHW|a|Write Data Hold Time|15|-|ns|
|tCLKL|Serial Clock Low Time|100|-|ns|
|a|
|a|tCLKH|Serial Clock High Time|100|-|ns|
|tR|Rise Time|-|15|ns|
|a|
|tF|Fall Time|-|15|ns|
|a|

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **3.5.1.4 I ²C Interface Timing Characteristics** 

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|||||||
|---|---|---|---|---|---|
|Symbol|Description|Min|Max|Unit|
|tcycle|Clock Cycle Time|2.5|-|us|
|tHSTART|Start Condition Hold Time|0.6|-|us|
|eeee|
|Data Hold Time (for “SDAOUT” Pin) Data|0|
|tHD|-|ns|
|Hold Time (for “SDAIN” Pin)|300|
|a|tSD|Data Setup Time|100|-|ns|
|Start Condition Setup Time|
|a|tSSTART|(Only relevant for a repeated Start condition)|0.6|-|us|
|tSSTOP|Stop Condition Setup Time|0.6|-|us|
|es ee|
|tR|Rise Time for Data and Clock Pin|300|ns|
|eses|
|tF|Fall Time for Data and Clock Pin|300|ns|
|Idle Time before a New Transmission can|
|tIDLE|1.3|-|us|
|Start|
|a|eeee|

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **4 OPTICAL SPECIFICATION** 

## _**4.1 OPTICAL CHARACTERISTICS**_ 

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|---|---|---|---|---|---|---|
|Characteristics|Symbol|Condition|Min|Typ|Max|Unit|
|With Polarizer|
|Brightness(White)|Lbr|120|150|-|cd/m|[2]|
|(Note 3)|
|(X)|0.44|0.48|0.52|
|C.I.E.(White)|C.I.E 1931|-|
|(Y)|0.46|0.50|0.54|
|Dark Room|
|CR|-|>2000:1|-|-|
|Contrast|
|Viewing Angle|>160|-|-|degree|

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Optical measurement taken at VDD = 2.8V, VCC = 12.5V. Software configuration follows Section 5.4 Initialization 

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **5 FUNCTIONAL SPECIFICATION** 

## _**5.1 COMMANDS**_ 

Please refer to the Technical Manual for the SSD1305 

## _**5.2 POWER UP/DOWN SEQUENCE**_ 

To protect panel and extend the panel lifetime, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the panel enough time to complete the action of charge and discharge before/after the operation. 

## **5.2.1 POWER UP SEQUENCE** 

VDD ON VCC ON 

1. Power up VDD 

> [Display On] 

2. Send Display off command                                   Vcc 

3. Initialization 

4. Clear Screen 

5.Power up VCC VDD 

6. Delay 100ms (when VDD is stable) VSS Ground 

7. Send Display on command 

## **5.2.2 POWER DOWN SEQUENCE** 

Display off         VCC off VDD off 

1. Send Display off command 

2. Power down VCC                                                  VCC 

3. Delay 100ms 

(When VPP reach 0 and panel is 

completely discharges)                                     VDD 

4. Power down VDD VSS Groun ~~d~~ 

## _**5.3 RESET CIRCUIT**_ 

When RES# input is low, the chip is initialized with the following status: 

1. Display is OFF 

2. 132x64 Display mode 

3. Normal segment and display data colume and row address mapping (SEG0 mapped to column address 00H and COM0 mapped to row address 00H) 

4. Shift register data clear in serial interface 

5. Display start line is set at display RAM address 0 

6. Column address counter is set at 0 

7. Normal scan direction of the COM outputs 

8. Contrast control register is set at 80H 

9. Normal display mode (Equivalent to A4h command) 

DD-12864YO-3A REV. D Product No. Page ~~|]~~ ~~**|**~~ Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

REV. D Page 17 / 27 ~~**|**~~ 

## _**5.4 ACTUAL APPLICATION EXAMPLE**_ 

Command usage and explanation of an actual example 

<Initialisation Setting> 

If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function. 

DD-12864YO-3A REV. D Product No. Page 18 / 27 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **6 PACKAGING AND LABELLING SPECIFICATION** 

DENSITRON DD-12864YO-3A TW YY MM 54 Pieces per tray 15 trays per box ( 810 pieces ) 4 boxes per carton (3240 pieces ) oe 

DD-12864YO-3A REV. D Product No. Page 19 / 27 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **7 QUALITY ASSURANCE SPECIFICATION** 

## _**7.1 CONFORMITY**_ 

The performance, function and reliability of the shipped products conform to the Product Specification. 

## _**7.2 DELIVERY ASSURANCE**_ 

## **7.2.1 DELIVERY INSPECTION STANDARDS** 

IPC-AA610, class 2 electronic assemblies standard 

## **7.2.2 Zone definition** 

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## **7.2.3 Visual inspection** 

Test and measurement to be conducted under following conditions `：` 

Temperature: 23±5 ℃ Humidity: 55±15%RH Fluorescent lamp: 30 W Distance between the Panel & Eyes of the Inspector: ≧ 30cm Distance between the Panel & the lamp: ≧ 50cm 

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Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **7.2.4 Standard of appearance inspection** 

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Units: mm<br>Class  Item   Criteria<br>Minor  Packing &  Outside & inside package  Presence of product no., lot no., quantity<br>pf ff<br>Critical  Label  Product must not be mixed with others and quantity must not be different from<br>that indicated on the label<br>TS<br>Major  Dimension  Product dimensions must be according to specification and drawing<br>Major  Electrical  Product electrical characteristics must be according to specification<br>aa<br>Critical  OLED  Missing lines, short circuits or wrong patterns on OLED display are not<br>a Display allowed<br>Minor  Black spot,  Round type: as per following drawing<br>white spot,    = (X+Y)/2<br>dust  Acceptable quantity<br>Size  Zone A  Zone B<br> <0.1  Any number<br>Y 0.1<  <0.2  3<br>Any number<br>0.2<  <0.25 1<br>X<br>0.25<  0<br>ae<br>Line type: as per following drawing<br>Acceptable quantity<br>W Length  Width  Zone A  Zone B<br>- -   W≤0.05 Any number<br>L≤2.0  W≤0.1  3  Any number<br>L>2.0  0<br>————a<br>L<br>Total acceptable quantity: 3<br>Minor  Polariser  Scratch on protective film is permitted<br>a scratch  Scratch on polariser: same as No. 1<br>Minor  Polariser    = (X+Y)/2<br>bubble  Acceptable quantity<br>Size  Zone A  Zone B<br> <0.5  Any number<br>Any number<br>Y  >0.5 0<br>X<br>ita<br>DD-12864YO-3A  REV. D<br>Product No.  Page  21 / 27<br>Tee oot<br>**----- End of picture text -----**<br>


Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Class**||**Item**|**Criteria**|||||||||||
|Minor<br>|Minor||Segment<br>deformation|1b. Pin hole on dot matrix display<br>Acce<br>Size<br>a,b<0.1<br> (a+b)/2≤<br> 0.5<<1<br>Total acceptable quantity: 7<br>2. Segments / dots with different width|||||||||||
||||||2. Segments / dots with different width||||||||||
||||||||||Acceptable||||||
|||||p<br>a≥b<br>a<b<br>3. Alignment layer defect<br>= (a+b)/2<br>Acceptable<br>Size<br> ≤0.4<br>0.4<≤1.0<br>1.0<≤1.5<br>1.5<≤2.0<br>Total acceptable quantity: 7<br>|p<br>a≥b<br>a<b<br>3. Alignment layer defect||||p<br>a≥b||a/b≤||/b≤4/3||
||||||||||a<b||a/b>4/3||a/b>4/3||
||||||||||||||||
||||||||||Acceptable||tablequantity||||
||||||||||Size||||||
||||||||||≤0.4||Anynumber||||
||||||||||0.4<≤1.0||5||||
||||||||||1.01||3||||
|||||||1.0<≤1.5<br>1.5<≤2.0<br>Total acceptable quantity: 7<br>|||1.0<≤1.5||3|||~~2~~|
||||||||||1.5<≤2.0||2||||
||||||||||||Total acceptable quantity: 7<br>||||
|Minor<br>~~2~~||Minor<br>~~2~~|Panel<br>~~2~~|~~2~~||X ≤ 1/6 Panel length<br>~~2~~||||||~~22~~|||
||||Chipping<br>~~2~~|X ≤ 1/6 Panel length<br>Y ≤ 1<br>Z ≤ T<br>~~2~~|||||||||||
||||||||~~2~~||||||||
|Minor<br>|||Panel<br>Cracking<br>|Cracks not allowed<br>||Cracks not allowed<br>|||||||||
||||||||Cracks not allowed||||||||
||||||||Cracks not allowed||||||||
|Minor|||Cupper<br>exposed<br>(pin or film)|Not allowed if visible by eye inspection|||Not allowed if visible by eye inspection||||||||
|Minor|||Film or<br>Trace<br>Damage|Not allowed if affect electrical function|||||||||||



DD-12864YO-3A REV. D Product No. Page 22 / 27 ~~a|[|]~~ 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

**==> picture [453 x 485] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||
|---|---|---|---|---|---|
|Class|Item|Criteria|
|Minor|Contact|
|Lead Twist|Not allowed|7aa|-—D.|TWISTED|LEAD|
|MY|D|
|\|!|
|\|i|
|i\altiAv1|
|Minor|Contact|
|—|
|Lead|Not allowed|/“eo|7-4.|BRIKEKEN|LEAD|
|Broken|f\|
|\|
|'|}|
|\|t|
|N|,|
|ve|
|Minor|Contact|
|Lead Bent|Not allowed if|‘i“|—||\|
|bent lead causes|\|
|short circuit|\|j|
|‘a|\|Wh|}|
|NS|AWS’|
|a|
|Not allowed if bent lead|i)//_|—|-|ay7~ _\|
|extends horizontally|/|
|1|\|
|more than 50% of its width|‘‘\O|||sJ}!-|?|
|Minor|Colour|Level of sample for approval set as limit sample|
|uniformity|
|Major|PCB|No unmelted solder paste should be present on PCB|
|Critical|Cold solder joints, missing solder connections, or oxidation are not allowed|
|Minor|No residue or solder balls on PCB are allowed|
|Critical|Short circuits on components are not allowed|
|Minor|Tray|Size|Quantity|
|particles||<0.2|Any number|
|On tray|
||>0.25|4|
||0.25|2|
|On display|
|L = 3|1|

**----- End of picture text -----**<br>


DD-12864YO-3A Product No. 

**==> picture [225 x 16] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||
|---|---|
|REV. D|
|Page|23 / 27|

**----- End of picture text -----**<br>


Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## _**7.3 DEALING WITH CUSTOMER COMPLAINTS**_ 

## **7.3.1 Non-conforming analysis** 

Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. 

If the analysis cannot be completed on time, Densitron must inform the purchaser. 

## **7.3.2 Handling of non-conforming displays** 

If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. 

Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear. 

Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard. 

Product No. 

DD-12864YO-3A 

REV. D 

Page 24 / 27 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **8 RELIABILITY SPECIFICATION** 

## _**8.1 RELIABILITY TESTS**_ 

**==> picture [455 x 186] intentionally omitted <==**

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||||
|---|---|---|
|Test Item|Test Condition|Evaluation and assessment|
|No abnormalities in function|
|High Temperature Operation|85°C, 500 hours|
|and appearance|
|No abnormalities in function|
|Low Temperature Operation|-30°C, 500 hours|
|and appearance|
|No abnormalities in function|
|High Temperature Storage|90°C, 500 hours|
|and appearance|
|No abnormalities in function|
|Low Temperature Storage|-40°C, 500 hours|
|and appearance|
|High Temperature & High|No abnormalities in function|
|60°C, 90%RH, 240 hours|
|Humidity Storage(Operation)|and appearance|
|-40°C 85°C, 100 cycles|No abnormalities in function|
|Thermal Shock|
|30 mins dwell|and appearance|

**----- End of picture text -----**<br>


- The samples used for above tests do not include polarizer. 

- No moisture condensation is observed during tests. 

## **8.1.1 FAILURE CHECK STANDARD** 

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure teat at 23±5 °C; 55±15% RH 

## _**8.2 LIFE TIME**_ 

**==> picture [450 x 94] intentionally omitted <==**

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|||
|---|---|
|Item|Description|
|Function, performance, appearance, etc. shall be free from remarkable deterioration|
|more than 10,000 hours under 150 cd/m² brightness  and 40,000 hours under 100|
|1|
|cd/m² brightness at 50% Checkerboard, humidity (50% RH), and in area not exposed|
|to direct sunlight.|
|2|End of lifetime is specified as 50% of initial brightness.|

**----- End of picture text -----**<br>


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||||
|---|---|---|
|DD-12864YO-3A|REV. D|
|Product No.|Page|25 / 27|

**----- End of picture text -----**<br>


Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **9 HANDLING PRECAUTIONS** 

## _Safety_ 

If the panel breaks, be careful not to get the organic substance in your mouth or in your eyes. If the organic substance touches your skin or clothes, wash it off immediately using soap and plenty of water. 

## _Mounting and Design_ 

Place a transparent plate (e.g. acrylic, polycarbonate or glass) on the display surface to protect the display from external pressure. Leave a small gap between the transparent plate and the display surface. 

Design the system so that no input signal is given unless the power supply voltage is applied. 

## _Caution during OLED cleaning_ 

Lightly wipe the display surface with a soft cloth soaked with Isopropyl alcohol, Ethyl alcohol or Trichlorotriflorothane. 

Do not wipe the display surface with dry or hard materials that will damage the polariser surface. Do not use aromatic solvents (toluene and xylene), or ketonic solvents (ketone and acetone). 

## _Caution against static charge_ 

As the display uses C-MOS LSI drivers, connect any unused input terminal to VDD or VSS. Do not input any signals before power is turned on. 

Also, ground your body, work/assembly table and assembly equipment to protect against static electricity. 

## _Packaging_ 

Displays use OLED elements, and must be treated as such. Avoid strong shock and drop from a height. 

To prevent displays from degradation, do not operate or store them exposed directly to sunshine or high temperature/humidity. 

## _Caution during operation_ 

It is indispensable to drive the display within the specified voltage limit since excessive voltage shortens its life. 

## _Other Precautions_ 

When a display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. 

Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. 

## _Storage_ 

Store the display in a dark place where the temperature is 25°C ± 10°C and the humidity below 50%RH. 

Store the display in a clean environment, free from dust, organic solvents and corrosive gases. Do not crash, shake or jolt the display (including accessories). 

Product No. 

DD-12864YO-3A 

REV. D 

Page 26 / 27 

Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 

## **10 SUPPORTED ACCESSORIES** 

## _**10.1  DUO KIT**_ 

Densitron has developed an easy to use yet powerful development and demonstration tool for driving its range of Passive Matrix OLED displays from the USB port of a PC. DUO (Densitron USB OLED) kit is hot pluggable and does not require extra cables or power supply to run, allowing users to be up and running in minutes. 

The kit consists of an OLED display with transition Board, USB controller card, mini USB cable and a CD with software application and drivers. 

## **Part number: PDK-N-12864YO-3A** 

## _**10.2  TRANSITION BOARD CARD**_ 

A Transition board card is like a daughterboard which is meant to be a circuit board for connections between the baseboards (DUO). 

It has connector pins for interfacing between the display and the baseboards. It also includes the OLED display. 

**Part number: PDT-N-12864YO-3A** 

## _**10.3  CONNECTOR BOARD CARD**_ 

A Connector board is a daughterboard which allows a connection between customer’s microprocessor or microcontroller (customer’s system) to the display. 

## **Part number: EVK-CONNECT-015** 

## _**10.4  CONNECTOR**_ 

Type: ZIF connector 

|No. of<br>connections|Pitch<br>(mm)|Manufacturer|Manufacturer part<br>no.|Manufacturer part<br>no.|Distributor part no.|Distributor part no.||
|---|---|---|---|---|---|---|---|
|24|0.50|Omron|XF2M-2415-1A||Farnell/1112559<br>Digikey/ OR721CT-ND|||
|||||||||
|Product No.|DD-12864YO-3A||REV. D||Page|27 / 27|27 / 27|



Copyright ©2010 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data