DB2430700L
Fast / Ultrafast Diode, 30 V, 3 A, Single, 370 mV, 35 ns, 60 A
- Manufacturer: PANASONIC
- Product type: Fast & Ultrafast Recovery Rectifier Diodes
- No. of Pins: 2 Pin
- Product Range: DB243
- Diode Case Style: TMiniP2-F2-B
- Diode Configuration: Single
- Forward Voltage Max: 370mV
- Forward Surge Current: 60A
- Reverse Recovery Time: 35ns
- Average Forward Current: 3A
- Operating Temperature Max: 125°C
- Repetitive Peak Reverse Voltage: 30V
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.213 € |
| Current stock | 10+ |
| Lead time | 30 days |
Doc No. TT4-EA-12750 Revision. 3 Product Standards ## Schottky Barrier Diode DB2430700L ## DB2430700L ## Silicon epitaxial planar type ## For rectification ## Features - Low forward voltage VF - Forward current (Average) IF(AV) = 3 A rectification is possible - Halogen-free / RoHS compliant - (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant) ## Marking Symbol: A5 ## Packaging Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard) **==> picture [155 x 258] intentionally omitted <==** **----- Start of picture text -----**<br> Unit: mm<br>2.4 0.15<br>2<br>1<br>1.75 0.85<br>1. Cathode<br>2. Anode<br>Panasonic TMiniP2-F2-B<br>JEITA SC-110A<br>Code ―<br>3.8 4.7<br>**----- End of picture text -----**<br> ## Absolute Maximum Ratings Ta = 25 C |Absolute Maximum Ratings Ta = 25|C||| |---|---|---|---| |Parameter|Symbol|Rating|Unit| |Reverse voltage|VR|30|V| |Maximumpeak reverse voltage|VRM|30|V| |Forward current(Average)|IF(AV)|3.0|A| |Non-repetitive peak forward surge current*1|IFSM|60|A| |Junction temperature|Tj|125|°C| |Operatingambient temperature|Topr|+85<br>-40 to|°C| |Storage temperature|Tstg|-40 to +125|°C| Note: *1 50 Hz sine wave 1 cycle (Non-repetitive peak current) ## Internal Connection 2 1 Page 1 of 4 Established : 2010-10-01 Revised : 2013-04-19 Doc No. TT4-EA-12750 Revision. 3 Product Standards Schottky Barrier Diode DB2430700L ## Electrical Characteristics Ta = 25 C 3 C |Electrical Characteristics Ta = 25C|3C||||||| |---|---|---|---|---|---|---|---| |Parameter|Symbol|Conditions||Min|Typ|Max|Unit| |Forward voltage|VF|IF = 3.0 A||||0.37|V| |Reverse current|IR|VR = 30 V||||2.0|mA| |Terminal capacitance|Ct|VR = 10 V,f = 1 MHz|||111||pF| |Reverse recovery time*1|trr|IF = IR = 100 mA<br>Irr = 10 mA,RL = 100|||35||ns| - Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes. 2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage of current from the operating equipment. 3. *1 trr test circuit **==> picture [447 x 176] intentionally omitted <==** **----- Start of picture text -----**<br> Bias Application Unit (N-50BU) Input Pulse Output Pulse<br>tr tp<br>t<br>10% IF trr t<br>A<br>90%<br>VR Irr = 10 mA<br>tp = 2 μs IF = 100 mA<br>Pulse Generator Wave Form Analyzer tr = 0.35 ns IR = 100 mA<br>(PG-10N) (SAS-8130) δ = 0.05 RL = 100 Ω<br>Rs = 50 Ω Ri = 50 Ω<br>**----- End of picture text -----**<br> Page 2 of 4 Established : 2010-10-01 Revised : 2013-04-19 Doc No. TT4-EA-12750 Revision. 3 Product Standards Schottky Barrier Diode DB2430700L ## Technical Data ( reference ) **==> picture [475 x 167] intentionally omitted <==** **----- Start of picture text -----**<br> IF - VF IR - VR<br>1.E+01 1.E-01<br>Ta = 125 °C Ta = 85 °C<br>1.E+00 1.E-02 25 °C<br>1.E-03<br>1.E-01 85 °C<br>1.E-04<br>1.E-02 -40 °C<br>1.E-05<br>1.E-03 25 °C<br>1.E-06<br>1.E-04 -40 °C 1.E-07<br>1.E-05 1.E-08<br>0.0 0.1 0.2 0.3 0.4 0.5 0 5 10 15 20 25 30<br>Forward voltage VF (V) Reverse voltage VR (V)<br>Forward current IF (A) Reverse current IR (A)<br>**----- End of picture text -----**<br> **==> picture [241 x 399] intentionally omitted <==** **----- Start of picture text -----**<br> Ct - VR<br>600<br>Ta = 25 °C<br>500<br>f = 1 MHz<br>400<br>300<br>200<br>100<br>0<br>0 5 10 15 20 25 30<br>Reverse voltage VR (V)<br>IF(AV) - Tl<br>3.5<br>tp/T IF<br>3 tp<br>DC T<br>2.5 1/2 VR = 15 V<br>2 Tj = 125 °C<br>1.5<br>1/4<br>Sine Wave<br>1<br>0.5<br>0<br>0 25 50 75 100 125 150 175<br>Lead temperature Tl (°C)<br>Terminal capacitance Ct (pF)<br>Forward current (Average) IF(AV) (A)<br>**----- End of picture text -----**<br> Rth - t **==> picture [229 x 377] intentionally omitted <==** **----- Start of picture text -----**<br> 1000<br>(1)<br>(2)<br>100<br>(3)<br>Rth(j-l) = 9 °C/W<br>10 (1) Non-heat sink<br>(2) Mounted on glass epoxy print board.<br>(3) Mounted on alumina print board.<br>Board size : 50 mm × 50 mm x 0.8 mm<br>Solder in : 2 mm x 2 mm<br>1<br>0.001 0.01 0.1 1 10 100 1000<br>Time t (s)<br>PF(AV) - IF(AV)<br>1.5<br>IF<br>tp<br>T<br>DC<br>1 Sine Wave 1/2<br>1/4<br>0.5<br>0<br>0 1 2 3 4<br>Forward current (Average) IF(AV) (A)<br>Thermal resistance Rth (°C/W)<br>Forward power dissipation (Average) PF(AV) (W)<br>**----- End of picture text -----**<br> Page 3 of 4 Established : 2010-10-01 Revised : 2013-04-19 Doc No. TT4-EA-12750 Revision. 3 Product Standards Schottky Barrier Diode DB2430700L ## TMiniP2-F2-B Unit: mm **==> picture [279 x 377] intentionally omitted <==** **----- Start of picture text -----**<br> 2.4±0.1 0.15±0.05<br>2<br>1<br>1.75±0.10<br>(5°)<br>0.1± ±0.1<br>3.8 4.7<br>(5°)<br>0<br>±0.1<br>0.45<br>±0.05<br>0.85<br>03<br> to 0.4<br>0<br>0 to 0.<br>**----- End of picture text -----**<br> Land Pattern (Reference) (Unit: mm) **==> picture [108 x 155] intentionally omitted <==** **----- Start of picture text -----**<br> 2.1<br>1.4<br>4.4<br>1.4<br>**----- End of picture text -----**<br> Page 4 of 4 Established : 2010-10-01 Revised : 2013-04-19 ## Request for your special attention and precautions in using the technical information and semiconductors described in this book - (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. - (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. - (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. - It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. - (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. - (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. - Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. - (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. - (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202
Updated at February 9, 2023
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