CW252016-R33J

Wirewound Inductor, 330 nH, 1.05 ohm, 570 MHz, 450 mA, 1008 [2520 Metric], CW252016 Series

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Manufacturer: BOURNS
Product type: Wirewound Inductors
Inductance:330nH; Product Range:CW252016 Series; DC Current Rating:450mA; High Frequency Inductor Case:1008 [2520 Metric]; Inductor Construction:Multilayer; DC Resistance Max:1.0
SVHC: No SVHC (04-Feb-2026)
Inductance: 330nH
Core Material: Ceramic
Product Range: CW252016 Series
Product Width: 2mm
Product Height: 1.6mm
Product Length: 2.5mm
DC Current Rating: 450mA
DC Resistance Max: 1.05ohm
Inductor Case Style: 1008 [2520 Metric]
Inductance Tolerance: ± 5%
Inductor Construction: Unshielded
Inductor Case / Package: 1008 [2520 Metric]
Self Resonant Frequency: 570MHz
Self Resonant Frequency Min: 570MHz

Delivery and price
Units per pack	2000
Price	0.137 €
Current stock	10+
Lead time	30 days

Datasheet

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*RoHS COMPLIANT<br>**----- End of picture text -----**<br>


## **Features** 

n 1008 size n Available in E12 series n High Q n High operating temperature of 125 °C n RoHS compliant* 

## **Applications** 

n Mobile phones n Cellular phones n CTV, VCR, HIC, FDD 

## POURNS ~~Ee~~ **CW252016 Series - High Q Chip Inductors** ~~**Electrical Specifcations General Specifcations**~~ 

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||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Bourns|[®]|Part No.|Inductance|Q|Test Freq. (MHz)|(MHzSRF )|(OhmsRDC|)|I rms(mA)|Temperature Rise  .................15 °C max. at rated current  .................15 °C max. at rated current|
|eee|nH|Tol. %|Min.|L|e|Q|Min.|ee|Max.|Max.|Operating Temperature  ................................-40 °C to +125 °C  ................................-40 °C to +125 °C|
|CW252016-10NK|10|±10|50|50|500|4100|0.08|1000|
|ee|CW252016-12NK|12|±10|50|50|500|3300|0.09|1000|Storage Temperature|
|................................-40 °C to +125 °C|
|CW252016-15NK|15|±10|50|50|500|2500|0.10|1000|
|CW252016-18NK|18|±10|50|50|350|2500|0.11|1000|Reflow Soldering .. 230 °C, 50 sec. max.|
|es|CW252016-22NK|22|ee|±10|eees|55|eeoe|50|350|e|2400|e|e|ee|0.12|1000|Resistance to Soldering Heat|
|ee|CW252016-27NK|27|±10|55|50|350|1600|0.13|1000|............................ +260 °C, 5 seconds|
|CW252016-33NK|33|ee|±10|ee|60|50|ee|350|1600|0.14|1000|
|Materials|
|ee|CW252016-39NK|39|±10|60|50|350|1500|0.15|1000|
|CW252016-47NK|47|ee|±10|ee|65|ee|50|350|ee|1500|ee|0.16|1000|Core Material|
|ee|CW252016-56NJ|56|±5|65|50|350|1300|0.18|1000|-10NK thru -R82J ...................Ceramic|
|CW252016-68NJ|68|ee|±5|ee|65|50|ee|350|1300|ee|0.20|1000|-1R0J thru -4R7J .......................Ferrite|
|ee|CW252016-82NJ|82|±5|60|50|350|1000|0.22|1000|Wire ........ Enameled copper (1W1E180)|
|CW252016-R10J|100|±5|ee|60|25.2|ee|350|ee|1000|ee|0.56|650|Terminal ...........................Mo/Mn+Ni+Au|
|ee|CW252016-R12J|120|±5|60|25.2|350|950|0.63|650|Packaging ................. 2,000 pcs. per reel|
|CW252016-R15J|150|±5|45|25.2|100|850|0.70|580|
|CW252016-R18J|180|±5|45|25.2|100|750|0.77|620|Product Dimensions|
|es|CW252016-R22J|220|ee|ee|±5|ee|45|25.2|e|e ee|100|e|700|e|eeee|0.84|500|
|CW252016-R27J|270|±5|45|25.2|100|600|0.91|500|0.5|1.6 ± 0.2|
|ee|CW252016-R33J|330|ee|±5|ee|45|25.2|ee|100|ee|570|ee|1.05|ee|450|(.020)|—|(.062 ± .008)|
|CW252016-R39J|390|±5|45|25.2|100|500|1.12|470|
|CW252016-R47J|470|±5|45|25.2|100|450|1.19|470|
|CW252016-R56J|560|±5|45|25.2|100|415|1.33|400|
|PooyeRe|OD|||iTy|Ne;|
|CW252016-R68J|680|±5|45|25.2|100|375|1.55|400|
|CW252016-R82J|820|±5|45|25.2|100|350|2.30|180|
|CW252016-1R0J|1000|±5|35|25.2|50|290|1.75|370|
|2.50 ± 0.2|
|CW252016-1R2J|1200|±5|35|7.96|50|250|2.00|310|(.098 ± .008)|
|CW252016-1R5J|1500|±5|28|7.96|50|200|2.30|330|
|CW252016-1R8J|1800|±5|28|7.96|50|160|2.60|300|
|CW252016-2R2J|2200|±5|28|7.96|50|160|2.80|280|2.0 ± 0.2|
|CW252016-2R7J|2700|±5|22|7.96|25|140|3.20|290|(.079 ± .008)|
|CW252016-3R3J|3300|±5|22|7.96|25|110|3.40|290|
|CW252016-3R9J|3900|±5|20|7.96|25|100|3.60|260|
|CW252016-4R7J|4700|±5|20|7.96|25|50|4.00|260|0.5|0.5|
|(.020)|(.020)|
|Typical Part Marking|
|BOURNS’|Recommended Layout|
|R12|0.65|0.65|
|REF.|REF.|
|Asia-Pacific:|(.026)|(.026)|
|Tel: +886-2 2562-4117|
|Email: asiacus@bourns.com|
|Europe:|milTr|
|Tel: +36 88 520 390|1.20|2.3|
|Email: eurocus@bourns.com|REF.|OU|(.047)|(.091)|[REF.]|
|The Americas:|
|MM|
|Tel: +1-951 781-5500|DIMENSIONS:|
|(INCHES)|

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Temperature Rise  .................15 °C max. at rated current  .................15 °C max. at rated current Operating Temperature  ................................-40 °C to +125 °C  ................................-40 °C to +125 °C Storage Temperature ................................-40 °C to +125 °C Reflow Soldering .. 230 °C, 50 sec. max. Resistance to Soldering Heat ............................ +260 °C, 5 seconds 

Core Material -10NK thru -R82J ...................Ceramic -1R0J thru -4R7J .......................Ferrite Wire ........ Enameled copper (1W1E180) Terminal ...........................Mo/Mn+Ni+Au Packaging ................. 2,000 pcs. per reel 

**Asia-Pacific:** Tel: +886-2 2562-4117 Email: asiacus@bourns.com **Europe:** Tel: +36 88 520 390 Email: eurocus@bourns.com **The Americas:** Tel: +1-951 781-5500 Email: americus@bourns.com **www.bourns.com** 

*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **CW252016 Series - High Q Chip Inductors** 

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Soldering Profle<br>Temperature<br>Rising Area Preheat Area Reflow Area Forced Cooling Area<br>+2.0~4.0 °C /<br>rT +4.0 °C / sec. max. 150~200 °C / 60~120 sec. TT sec. max. -(1.0~5.0) °C / sec. max. ;<br>250 | | | 230 °C |<br>200 Aino) 50 sec. max. Peak Temperature:<br>260 °C max.<br>| 70 sec. max. |<br>150<br>Time Above 230 °C:<br>— —=— —+———~+—-———-L—- L<br>50 sec. max.<br>100 = fe<br>Time Above 200 °C:<br>50 70 sec. max.<br>0 50 100 150 200 250<br>Time (Seconds)<br>Packaging Specifcations<br>2.0 ± 0.5<br>178.0 (.079 ± .020)<br>(7.00) 12.5<br>7 DIA. Tt (.492) A<br>THICKNESS<br>0.10<br>13.0 ± 0.5 (.004)<br>(.827 21.0 ±± .031) 0.8 (.512 DIA.± .020) MAX.<br>EMBOSSED<br>“ | » A G % i CAVITY<br>50.0<br>(1.969)<br>13.0 ± 0.5<br>(.512 ± .020) [DIA.]<br>EMBOSSED<br>a O CARRIER e 8.0 o<br>(.315)<br>10.0<br>—-<br>(.393)<br>MM<br>DIMENSIONS:<br>(INCHES)<br>Temperature (°C)<br>**----- End of picture text -----**<br>


REV. 01/17 

Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

Updated at April 27, 2026

Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.

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