CSD17313Q2

## **12500 TI Boulevard, MS 8640, Dallas, Texas 75243** 

## **PCN# 20190116000.1 Qualification of ASEN as Additional Assembly and Test Site for Select WSON Package Devices Change Notification / Sample Request** 

**Date:** February 01, 2019 **To:** PREMIER FARNELL  PCN 

Dear Customer: 

This is an announcement of a change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages. 

We request you acknowledge receipt of this notification within **30** days of the date of this notice.  Lack of acknowledgement of this notice within 30 days constitutes acceptance of the change.  If you require samples or additional data to support your evaluation, please request within 30 days. 

The proposed first ship date is indicated on page 3 of this notification, unless customer agreement has been reached on an earlier implementation of the change. 

This notice does not change the end-of-life status of any product.  Should product affected be on a previously issued product withdrawal/discontinuance notice, this notification does not extend the life of that product or change the life time buy offering/discontinuance plan. 

For questions regarding this notice, contact your local Field Sales Representative or the PCN Manager (PCN_ww_admin_team@list.ti.com). 

Sincerely, 

PCN Team 

SC Business Services 

PCN# 20190116000.1 

Texas Instruments, Inc. 

## **20190116000 Attachment: 1** 

## **Products Affected:** 

The devices listed on this page are a subset of the complete list of affected devices.  According to our records, these are the devices that you have purchased within the past twenty-four (24) months.  The corresponding customer part number is also listed, if available. 

**DEVICE CUSTOMER PART NUMBER** CSD16301Q2 null CSD17313Q2T null CSD85301Q2T null CSD87502Q2T null CSD17313Q2 null 

Technical details of this Product Change follow on the next page(s). 

PCN# 20190116000.1 

Texas Instruments, Inc. 

||**PCN Number:**|**PCN Number:**|**PCN Number:**|**PCN Number:**|20190116000.1|20190116000.1|20190116000.1|20190116000.1|20190116000.1|20190116000.1|20190116000.1|20190116000.1|20190116000.1|20190116000.1|20190116000.1|**PCN Date:**|**PCN Date:**|**PCN Date:**|Feb. 1,2019|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||Qualification of ASEN as Additional Assembly and Test Site for Select WSON Package<br>Devices||||||||||||||||
||**Title:**|||||||||||||||||||
|||||||||||||||||||||
||**Customer Contact:**||||PCN Manager||||||**Dept:**||QualityServices|||||||
|||||||May 1, 2019||||||**Estimated Sample**<br>**Availability:**||||Date Provided at Sample<br>request||||
||**Proposed 1st Ship Date:**|||||||||||||||||||
|||||||||||||||||||||
||**Change Type:**|||||||||||||||||||
||||Assembly Site||||||||Design|||||||Wafer Bump Site||
||||Assembly Process||||||||Data Sheet|||||||Wafer Bump Material||
||||Assembly Materials||||||||Part number change|||||||Wafer Bump Process||
||||Mechanical Specification||||||||Test Site|||||||Wafer Fab Site||
||||Packing/Shipping/Labeling||||||||Test Process|||||||Wafer Fab Materials||
|||||||||||||||||||Wafer Fab Process||
||**PCN Details**|||||||||||||||||||
||**Description of Change:**|||||||||||||||||||
||Texas Instruments Incorporated is announcing the qualification of ASEN as Additional Assembly<br>and Test Site for select devices listed in the “Product Affected” Section.  Current assembly sites<br>and Material differences are as follows.<br>**Assembly Site**<br>**Assembly Site Origin**<br>**Assembly Country Code**<br>**Assembly Site City**<br>UNIAT<br>UNM<br>MY<br>Ipoh<br>**ASEN**<br>**ASN **<br>**CN **<br>**Suzhou**<br>**Material Differences:**<br>**Group 1 Device:**<br>**UNIAT**<br>**ASEN**<br>Mount Compound<br>47000011<br>1400410101<br>Mold Compound<br>47160091<br>1800558151<br>Wire Type<br>Au<br>Cu<br>Lead finish<br>Matte Sn<br>NiPdAu<br>**Group 2 Device:**<br>**UNIAT**<br>**ASEN**<br>Mount Compound<br>47000011<br>1400410101<br>Mold Compound<br>47160155<br>1800558151<br>Lead finish<br>Matte Sn<br>NiPdAu<br>Test coverage, insertions, conditions will remain consistent with current testing and verified with<br>test MQ.|||||||||||||||||||
||**Reason for Change:**|||||||||||||||||||
||Continuityof supply.|||||||||||||||||||
||**Anticipated impact on Form, Fit, Function, Quality or Reliability (positive/ negative): **|||||||||||||||||||
||None|||||||||||||||||||
||**Anticipated impact on Material Declaration**|||||||||||||||||||
||||No Impact to the<br>Material Declaration|||||Material Declarations or Product Content reports are driven from<br>production data and will be available following the production<br>release.  Upon production release the revised reports can be<br>obtained from theTI Eco-Info website<br>.There is no impact to the<br>material meeting current regulatory compliance requirements<br>with this PCN change.||||||||||||
||**Changes to product identification resulting from this PCN:**|||||||||||||||||||



PCN# 20190116000.1 

Texas Instruments, Inc. 

|Assembly Site||||||||
|---|---|---|---|---|---|---|---|
|UNIAT||Assembly Site Origin (22L)|Assembly Site Origin (22L)||||ASO: UNM|
|ASEN||Assembly Site Origin (22L)|Assembly Site Origin (22L)||||ASO:ASN|
|Sample product shipping label||Sample product shipping label (not actual product label)||||||
|TeTES rs<br>MADE IN: Malaysia<br>aaa <br>OPT:|ey <br> a|etlBe<br>Lert:<br>&2250<br>V's,Fey&chtte<br> ieee:<br>SSS pl|(+P)SNTALSOTARR<br>(Q) 2000<br>(D) 0336<br>(aw)TRYC:3959047MLA<br>4W)TKY(1T) 7523483812<br>a)|||||
|LBL:<br>5A<br>(L)T0:|1750||(22L} ASO: MLA||(23L)||ACO:MYS|
|**Product Affected Group 1:**||||||||
|||||||||
|CSD16301Q2|CSD17313Q2<br>CSD17313Q2T|||||||
|||||||||
|**Product Affected Group 2:**||||||||
|||||||||
|CSD85301Q2|CSD85301Q2T<br>CSD87502Q2|||||CSD87502Q2T||



## **Qualification Report** Q2 Package offload to ASEN - Phase 2 Dual die Approved Date 12-Dec-2018 

## **Qualification Results** 

Data Displayed as: Number of lots / Total sample size / Total failed 

|**Type**|**Test Name / Condition**|**Duration**|**Qual**<br>**Device:**<br>**CSD85301Q2**|**Qual**<br>**Device:**<br>**CSD87502Q2**|**Qual**<br>**Device:**<br>**CSD58902Q2**|**Qual**<br>**Device:**<br>**CSD87502Q2**|
|---|---|---|---|---|---|---|
|HTGB<br>~~a~~|High Temp. Gate Bias, 150C<br>~~GG~~|1000 Hours<br>~~GG~~|-<br>~~GG~~|-<br>~~GG~~|1/77/0<br>~~GG~~|1/77/0<br>~~GG~~|
|HTRB<br>~~a OG~~|High Temp. Reverse Bias, 150C<br>~~OG~~|1000 Hours<br>~~OG~~|-<br>~~OG~~|-<br>~~OG~~|1/77/0<br>~~OG~~|1/77/0<br>~~OG~~|
|IOL<br>~~a OG~~<br>~~a a~~<br>~~es~~|IOL 2min Cycle<br>~~OG~~<br>~~a~~<br>~~GG~~|10000 Cycles<br>~~OG~~<br>~~GG~~<br>~~GG~~|-<br>~~OG~~<br>~~GG~~<br>~~GG~~|3/231/0<br>~~OG~~<br>~~GG~~<br>~~GG~~|-<br>~~OG~~<br>~~GG~~<br>~~GG~~|-<br>~~OG~~<br>~~GG~~<br>~~GG~~|
|AC<br>~~es~~<br>~~es~~|Autoclave 121C<br>~~GG~~<br>~~DG~~|96 Hours<br>~~GG~~<br>~~DG~~|-<br>~~GG~~<br>~~DG~~|3/231/0<br>~~GG~~<br>~~DG~~|-<br>~~GG~~<br>~~DG~~|-<br>~~GG~~<br>~~DG~~|
|HBM<br>~~es~~<br>~~es~~<br>~~ee~~|ESD - HBM<br>~~GG~~<br>~~DG~~<br>~~DG~~|400 V<br>~~GG~~<br>~~DG~~<br>~~DG~~|-<br>~~GG~~<br>~~DG~~<br>~~DG~~|-<br>~~GG~~<br>~~DG~~<br>~~DG~~<br>~~GO~~|1/3/0<br>~~GG~~<br>~~DG~~<br>~~DG~~<br>~~GO~~|-<br>~~GG~~<br>~~DG~~<br>~~DG~~|
|CDM<br>~~es~~<br>~~ee~~|ESD - CDM<br>~~DG~~<br>~~DG~~|2000 V<br>~~DG~~<br>~~DG~~|-<br>~~DG~~<br>~~DG~~|-<br>~~DG~~<br>~~DG~~<br>~~GO~~|1/3/0<br>~~DG~~<br>~~DG~~<br>~~GO~~|-<br>~~DG~~<br>~~DG~~|
|PD<br>~~ee~~|Physical Dimensions<br>~~DG~~|(per mechanical<br>drawing)<br>~~DG~~|-<br>~~DG~~|3/30/0<br>~~DG~~<br>~~GO~~|-<br>~~DG~~<br>~~GO~~|-<br>~~DG~~|
|SD|Solderability|8 Hours Steam<br>Age, Pb-Free|-|-<br>~~GOO~~|3/30/0<br>~~GOO~~|-|
|TC<br>~~a~~|Temperature Cycle, -55/125C<br>~~eG~~|700 Cycles<br>~~eG~~|-<br>~~eG~~|3/231/0<br>~~eG~~<br>~~GOO~~|-<br>~~eG~~<br>~~GOO~~|-<br>~~eG~~|
|THB|Biased Temperature and Humidity,<br>85C/85%RH|1000 Hours|-|3/231/0<br>~~GOO~~|-<br>~~GOO~~|-|
|WBP|Bond Pull|76 Wires, 5units<br>min|-|3/228/0|-|-|
|WBS|Ball Bond Shear|76 balls, 5 units<br>min|-|3/228/0|-|-|
|YLD<br>~~a~~|FTY and Bin Summary<br>~~FC~~|-<br>~~FC~~|1/Pass<br>~~FC~~|3/Pass<br>~~FC~~|-<br>~~FC~~|-<br>~~FC~~|



- Preconditioning was performed for Autoclave, Unbiased HAST, THB/Biased HAST, Temperature Cycle, Thermal Shock, and HTSL, as applicable 

- The following are equivalent HTOL options based on an activation energy of 0.7eV : 125C/1k Hours, 140C/480 Hours, 150C/300 Hours, and 155C/240 Hours 

PCN# 20190116000.1 

Texas Instruments, Inc. 

- The following are equivalent HTSL options based on an activation energy of 0.7eV : 150C/1k Hours, and 170C/420 Hours - The following are equivalent Temp Cycle options per JESD47 : -55C/125C/700 Cycles and -65C/150C/500 Cycles Quality and Environmental data is available at TI's external Web site: http://www.ti.com/ 

## **Green/Pb-free Status:** 

Qualified Pb-Free(SMT) and Green 

THIS INFORMATION RELATING TO QUALITY AND RELIABILITY IS PROVIDED "AS IS."   Product information detailed in this report may not accurately reflect TI's current product materials,  processes and testing used in the construction of the TI products. Customers are solely responsible to   conduct sufficient engineering and additional qualification testing to determine whether a device is   suitable for use in their applications.  Using TI products outside limits stated in TI’s datasheet may   void TI's warranty.  See TI's Terms of Sale at "http://www.ti.com/lsds/ti/legal/termsofsale.page" 

For questions regarding this notice, e-mails can be sent to the regional contacts shown below or your local Field Sales Representative. 

|**Location**|**E-Mail**|
|---|---|
|USA|PCNAmericasContact@list.ti.com|
|Europe|PCNEuropeContact@list.ti.com|
|<br>Asia Pacific|PCNAsiaContact@list.ti.com|
|Japan|PCNJapanContact@list.ti.com|



PCN# 20190116000.1 

Texas Instruments, Inc.