CPC1972GSTR

**CPC1972 AC Power Switch** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|800|VP|
|Load Current|250|mArms|
|On State Voltage Drop|3|Vrms(at IL= 250 mArms)|
|Operating Voltage|550|Vrms|



## **Features** 

- Load Current up to 250mArms 

- 800VP Blocking Voltage 

- 5mA Sensitivity 

## **Description** 

The CPC1972 is an AC Solid State Switch using optical coupling with dual power silicon controlled rectifier (SCR) outputs to produce an alternative to optocoupler and Triac circuits. The CPC1972 switches are robust enough to provide a blocking voltage of up to 800V . P 

In addition, tightly controlled zero cross circuitry ensures switching of AC loads without the generation of transients. 

- Zero-Crossing Detection 

- DC Control, AC Output 

- Optically Isolated 

- Low EMI and RFI Generation 

- High Noise Immunity 

- Flammability Rating UL 94 V-0 

## **Applications** 

- Programmable Control 

- Process Control 

- Power Control Panels 

The input and output circuits are optically coupled to provide 3750Vrms of isolation and noise immunity between the control and load circuits. As a result the CPC1972 is well suited for industrial environments where electromagnetic interference could disrupt the operation of electromechanical relays. 

## **Approvals** 

   - UL Recognized Component: File E69938 

   - CSA Certified Component: Certificate 1172007 

- Remote Switching 

- Gas Pump Electronics 

- Contactors 

- Large Relays 

- Solenoids 

- Motors 

- Heaters 

## **Ordering Information** 

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Part Number Description<br>CPC1972G 6-Pin DIP (50/Tube)<br>CPC1972GS 6-Pin Surface Mount (50/Tube)<br>CPC1972GSTR 6-Pin Surface Mount (1000/Reel)<br>———<br>Pin Configuration<br>1 6<br>+ LED AC Load<br>2 5<br>– LED ZC N/C<br>3 4<br>N/C AC Load<br>=<br>**----- End of picture text -----**<br>


**1** 

DS-CPC1972-R06 

**www.ixysic.com** 

**CPC1972** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|800|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation1|150|mW|
|Total Package Dissipation2|800|mW|
|Isolation Voltage, Input to Output|3750|Vrms|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC 

2  Derate linearly 6.67 mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameters**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~ee~~|||||||
|Operating Voltage Range<br>~~ey~~|-<br>~~ey~~<br>~~ee~~|VL<br>~~ey~~|5<br>~~ey~~|-<br>~~ey~~|550<br>~~ey~~|Vrms<br>~~ey~~|
|Load Current<br>Continuous<br>Peak<br>~~ey~~|-<br>~~ey~~<br>~~ee~~|IL<br>~~ey~~|5<br>~~ey~~|-<br>~~ey~~|250<br>~~ey~~|mArms<br>~~ey~~|
||t = 10ms<br>~~ey~~<br>~~ee~~|ITSM<br>~~ey~~|-<br>~~ey~~|-<br>~~ey~~|2<br>~~ey~~|AP<br>~~ey~~|
|Off State Leakage Current|VL=800VP<br>~~ee~~|ILEAK|-|-|1|µA|
|On-State Voltage Drop|IL= 250mArms|VON|-|-|3|Vrms|
|Critical Rate of Rise<br>~~re~~|-<br>~~re~~|dV/dt<br>~~re~~|500<br>~~re~~|-<br>~~re~~|-<br>~~re~~|V/µs<br>~~re~~|
|Holding Current<br>~~re~~|IF=5mA<br>~~re~~|IH<br>~~re~~|-<br>~~re~~|300<br>~~re~~|-<br>~~re~~|µA<br>~~re~~|
|Switching Speeds<br>Turn-on<br>Turn-off<br>~~re~~|IF=5mA<br>~~re~~|ton<br>~~re~~|-<br>~~re~~|-<br>~~re~~|0.5<br>~~re~~|cycles<br>~~re~~|
|||toff<br>~~re~~|-<br>~~re~~|-<br>~~re~~|0.5<br>~~re~~||
|Zero-Cross Turn-On Voltage1<br>~~re~~<br>~~pe~~|1st half-cycle<br>~~re~~<br>~~pe~~|-<br>~~re~~<br>~~pe~~|-<br>~~re~~<br>~~pe~~|5<br>~~re~~<br>~~pe~~|20<br>~~re~~<br>~~pe~~|V<br>~~re~~<br>~~pe~~|
||Subsequent half-cycle<br>~~pe~~|-<br>~~pe~~|-<br>~~pe~~|1<br>~~pe~~|-<br>~~pe~~|V<br>~~pe~~|
|Operating Frequency<br>~~pe~~|-<br>~~pe~~|-<br>~~pe~~|20<br>~~pe~~|-<br>~~pe~~|500<br>~~pe~~|Hz<br>~~pe~~|
|Load Power Factor for Guaranteed Turn-On2<br>~~pe~~|f=60Hz<br>~~pe~~|PF<br>~~pe~~|0.25<br>~~pe~~|-<br>~~pe~~|-<br>~~pe~~|-<br>~~pe~~|
|**Input Characteristics**|||||||
|Input Control Current to Activate3|-|IF|-|-|5|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.5|V|
|Input Drop-out Voltage|-|-|0.8|-|-|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Common Characteristics**|||||||
|Input to Output Capacitance|VIO=0V, f=1MHz|CIO|-|3|-|pF|



1 Zero Cross 1st half-cycle @ <100Hz 

2 Snubber circuits may be required at low power factors. 

3 For high noise environments an LED drive current of at least 10mA is recommended. 

R06 

**www.ixysic.com** 

**2** 

Saal INTEGRATED CIRCUITS DIVISION **CPC1972** ~~a~~ 

## **PERFORMANCE DATA*** 

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Typical On-State Output<br>Typical LED Forward Voltage Drop Forward Voltage Distribution Typical Blocking Voltage Distribution<br>(IF=5mA, TA=25ºC) (TA=25ºC) (TA=25ºC)<br>35 35 35<br>30 30 POODLE ELLI 8 30 fbbboood<br>25 25 25<br>20151050 20151050 Eee2|aiiERE|| 201510 o 50 A|Seeeofane||<br>1.21 1.22 1.23 1.24 1.25 1.89 1.91 1.93 1.95 1.97 1.99 2.01 857 858 859 860 861 862 863<br>LED Forward Voltage Drop (V) Output Voltage Drop (Vrms) Blocking Voltage (VP)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


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Typical IF for Switch Operation<br>(TA=25ºC)<br>25<br>201510 F2a2aT |ELLeeLI<br>5 |eh l ) lhe<br>0 m a [1sfsthilh6]<br>1.30 1.35 1.40 1.45 1.50 1.55 1.60<br>LED Current (mA)<br>Device Count (N)<br>**----- End of picture text -----**<br>


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Typical LED Forward Voltage Drop Typical IF for Switch Operation Typical Output Voltage Drop<br>vs. Temperature vs. Temperature vs. Temperature<br>1.6 2.4 3.1<br>2.1 2.8<br>1.5<br>st EE 1.8 E F ATNGERTT EE EER 2.5 ERE<br>1.4 1.5 IL=250mArms<br>meet 2.2<br>| ) 1.2  ERPS ee<br>1.3 SSE 0.9 ERS 1.9<br>1.6<br>0.6<br>1.2<br>FREESE 0.3 FEREERERRR 1.3 ERE<br>1.1 FLL 0.0 FLLELELLL 1.0 ELLELELLEL<br>-40 -20 0 20 40 60 80 100 120 -40 -10 20 50 80 -40 -10 20 50 80<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>IF = 50mA<br>IF = 30mA<br>IF = 20mA<br>IF = 10mA<br>IF = 5mA<br>)rms<br> (V<br>on<br>V<br>LED Current (mA)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 

**www.ixysic.com** 

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**3** 

**CPC1972** 

INTEGRATED CIRCUITS DIVISION 

## **PERFORMANCE DATA*** 

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Typical Maximum Load Current Typical Blocking Voltage Typical Leakage vs. Temperature<br>vs. Temperature vs. Temperature (VL=800VP)<br>450 975 0.7<br>400 Ffto.fsfStftfsftfttf 950 0.6 FET EE ET<br>350<br>300 SERRE 925 eeepc 0.5 eee eee<br>250 ee ee 0.4 FLLELLCLS<br>200 Saeee ee 900 ELLA 0.3<br>150 2 F 875 ELT Ler TT 0.2 FEEELLLLLLA<br>100<br>850 0.1<br>50 Seeeeere ELL tt |  Ep<br>0 2 ee 825 Zane 0.0 FEE Er [eee]<br>-40 -20 0 20 40 60 80 100 120 -40 -10 20 50 80 -40 -10 20 50 80<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>I  =5mA<br>)rms )P<br>Leakage (µA)<br>Load Current (mA Blocking Voltage (V<br>**----- End of picture text -----**<br>


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Maximum Surge Current (Non-Repetitive)<br>(TJ=50ºC max)<br>3.0<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>0<br>10 50 100<br>Pulse Duration (ms)<br>Peak Surge Current (A)P<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 

R06 

**www.ixysic.com** 

**4** 

**CPC1972** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of % the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~———————~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~———————~~|
|---|---|
|CPC1972G / CPC1972GS<br>~~———————~~|MSL 1<br>~~———————~~|



## **ESD Sensitivity** 

This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of **J-STD-020** must be observed. 

**Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles** CPC1972G 250ºC 30 seconds 1 CPC1972GS 250ºC 30 seconds 3 ~~pp~~ **Board Wash** IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 

**www.ixysic.com** 

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**CPC1972** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **CPC1972G** 

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(0.330 ± 0.015)8.382 ± 0.381 2.54 ± 0.127 (0.285 TYP)7.239 TYP PCB Hole Pattern<br>(0.100 ± 0.005)<br>6 - 0.800 DIA.<br>2.540 ± 0.127<br>(6 - 0.031 DIA.)<br>6.350 ± 0.127 9.144 ± 0.508 (0.100 ± 0.005)<br>(0.360 ± 0.020)<br>(0.250 ± 0.005)<br>7.620 ± 0.127<br>(0.300 ± 0.005)<br>7.620 ± 0.254<br>Pin 1 1.651 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127<br>e (0.065 ± 0.010) (0.010 ± 0.0005) e 6.350 ± 0.127 5.080 ± 0.127<br>(0.250 ± 0.005)<br>(0.200 ± 0.005)<br>3.302 ± 0.051 4.064 TYP<br>(0.130 ± 0.002) P i nna (0.160 TYP) | 7 Dimensions<br>0.457 ± 0.076 mm<br>(0.018 ± 0.003) (inches)<br>**----- End of picture text -----**<br>


## **CPC1972GS** 

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0.635 ± 0.127<br>8.382 ± 0.381 (0.025 ± 0.005)<br>(0.330 ± 0.015) 2.54 ± 0.127<br>(0.100 ± 0.005)<br>9.524 ± 0.508 6.350 ± 0.127<br>(0.375 ± 0.020) (0.250 ± 0.005)<br>7.620 ± 0.254 0.254 ± 0.0127<br>Pin 1 lL (0.018 ± 0.003)0.457 ± 0.076 (0.300 ± 0.010) (0.010 ± 0.0005)<br>1.651 ± 0.254<br>(0.065 ± 0.010) — ti<br>3.302 ± 0.051<br>(0.130 ± 0.002)<br>4.445 ± 0.254<br>(0.175 ± 0.010)<br>1.651 ± 0.254<br>a<br>(0.065 ± 0.010)<br>**----- End of picture text -----**<br>


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PCB Land Pattern<br>2.54<br>(0.10)<br>8.90<br>1.65 (0.3503)<br>(0.0649)<br>7 ;<br>0.65<br>(0.0255)<br>Dimensions<br>mm<br>-<br>(inches)<br>**----- End of picture text -----**<br>


R06 

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**6** 

**CPC1972** 

INTEGRATED CIRCUITS DIVISION 

## **CPC1972GSTR Tape & Reel** 

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330.2 Dia<br>(13.00 Dia)<br>Top Cover W=16.00<br>Tape Thickness (0.63)<br>0.102 Max<br>(0.004 Max) B0 = 10.10<br>(0.398)<br>K0 = 4.90 P1 = 12.00(0.472) A0(0.398) = 10.10<br>       (0.19)<br>K1 = 3.80 Dimensions<br>       (0.15) [aes] User Direction of Feed [ <][i] mm<br>EmbossedCarrier (inches)<br>an [:] NOTES: [|] Ge<br>1. All dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>**----- End of picture text -----**<br>


## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.  Neither circuit patent licenses nor indemnity are expressed or implied.  Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage.  IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 

Specification:  DS-CPC1972-R06 ©Copyright 2018, IXYS Integrated Circuits All rights reserved.  Printed in USA. 6/20/2018 

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