CPC1708J

**CPC1708 60V Single-Pole, Normally Open DC-Only Power Relay** 

INTEGRATED CIRCUITS DIVISION 

## **Characteristics** 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Load Current, TA=25°C:<br>With 5°C/W Heat Sink<br>No Heat Sink|11.85|ADC|
||4||
|On-Resistance (max)|0.08||
|Thermal Impedance,<br>Junction-to-Case,JC|0.35|°C/W|



## **Features** 

- 11.85ADC Load Current with 5°C/W Heat Sink 

- Low 0.08 On-Resistance 

- 60VP Blocking Voltage 

- 2500Vrms Input/Output Isolation 

- Low Thermal Impedance: JC = 0.35 °C/W 

- Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications 

- Low Drive Power Requirements 

- Arc-Free With No Snubbing Circuits 

- No EMI/RFI Generation 

- Flammability Rating UL 94 V-0 

## **Applications** 

## **Description** 

IXYS Integrated Circuits brings OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays. As part of this new family, the CPC1708 single-pole normally open (1-Form-A) DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. 

The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits’ patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Low on-resistance and high load current handling capability make this relay suitable for a variety of high performance DC switching applications. 

The unique i4-PAC package pioneered by IXYS enables solid state relays to achieve the highest load current and power ratings. This package features an IXYS-unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.35°C/W). 

- Industrial Controls / Motor Control 

- Robotics 

- Medical Equipment—Patient/Equipment Isolation 

- Instrumentation 

## **Ordering Information** 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Transportation Equipment 

|**Part**<br>~~———~~|**Description**<br>~~———~~|
|---|---|
|CPC1708J<br>~~———~~|i4-PAC Package (25 per tube)<br>~~———~~|



## **Switching Characteristics** 

- Aerospace/Defense 

## **Approvals** 

- UL 508 Certified Component: File E69938 

- CSA Certified Component: Certificate 1172007 

## **Pin Configuration** 

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1 2 3 4<br>+ - - +<br>**----- End of picture text -----**<br>


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Form-A<br>I<br>F<br>90%<br>10%<br>I<br>LOAD<br>t t<br>on off<br>**----- End of picture text -----**<br>


DS-CPC1708 - R08 

**www.ixysic.com** 

1 

**CPC1708** 

INTEGRATED CIRCUITS DIVISION 

## **1 Specifications** 

## **1.1 Absolute Maximum Ratings @ 25°C** 

|**Symbol**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation|150|mW|
|Isolation Voltage, Input to Output|2500|Vrms|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

## **1.2 Electrical Characteristics @ 25°C** 

|**Parameter**|**Conditions**|**Symbol**|**Minimum**|**Typical**|**Maximum**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Load Current1<br>Peak<br>Continuous<br>Continuous<br>Continuous<br>~~Ee~~|t10ms<br>~~Ee~~|IL<br>~~Ee~~|-<br>~~Ee~~|-<br>~~Ee~~|30<br>~~Ee~~|AP<br>~~Ee~~|
||No Heat Sink<br>~~Ee~~||||4<br>~~Ee~~|ADC<br>~~Ee~~|
||TC=25°C<br>~~Ee~~||||24<br>~~Ee~~||
||TC=99°C<br>~~Ee~~|IL(99)<br>~~Ee~~|||5.35<br>~~Ee~~||
|On-Resistance2<br>~~Ee~~<br>~~as~~|IF=10mA, IL=1A<br>~~Ee~~<br>~~as~~|RON<br>~~Ee~~<br>~~as~~|-<br>~~Ee~~<br>~~as~~|0.05<br>~~Ee~~<br>~~as~~|0.08<br>~~Ee~~<br>~~as~~|<br>~~Ee~~<br>~~as~~|
|Off-State Leakage Current<br>~~as~~|VL=60VP<br>~~as~~|ILEAK<br>~~as~~|-<br>~~as~~|-<br>~~as~~|1<br>~~as~~|A<br>~~as~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~as~~|IF=20mA, VL=10V<br>~~as~~|ton<br>~~as~~|-<br>~~as~~|5<br>~~as~~|20<br>~~as~~|ms<br>~~as~~|
|||toff<br>~~as~~|-<br>~~as~~|0.13<br>~~as~~|5<br>~~as~~||
|Output Capacitance<br>~~as~~|IF=0mA, VL=25V, f=1MHz<br>~~as~~|Cout<br>~~as~~|-<br>~~as~~|1250<br>~~as~~|-<br>~~as~~|pF<br>~~as~~|
|**Input Characteristics**<br>~~as~~|||||||
|Input Control Current to Activate3|IL=1A|IF|-|-|10|mA|
|Input Control Current to Deactivate|-|IF|0.6|-|-|mA|
|Input Voltage Drop|IF=10mA|VF|0.9|1.35|1.56|V|
|Reverse Input Current|VR=5V|IR|-|-|10|A|
|**Input/Output Characteristics**|||||||
|Capacitance, Input-to-Output|VIO=0V, f=1MHz|CIO|-|1|-|pF|



1 Higher load currents possible with proper heat sinking. 

2 Measurement taken within 1 second of on-time. 

3 For applications requiring high temperature operation (> 60ºC) an LED drive current of 20mA is recommended. 

R08 

**www.ixysic.com** 

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**CPC1708** 

INTEGRATED CIRCUITS DIVISION 

## **2 Thermal Characteristics** 

|**Parameter**|**Conditions**|**Symbol**|**Rating**|**Units**|
|---|---|---|---|---|
|Thermal Impedance (Junction to Case)|-|JC|0.35|°C/W|
|Thermal Impedance (Junction to Ambient)|Free Air|JA|45|°C/W|
|Junction Temperature (Operating)|-|TJ|-40 to +100|°C|



## **2.1 Thermal Management** 

Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal impedance of 12.5°C/W. 

## **2.2 Heat Sink Calculation** 

Higher load currents are possible by using lower thermal impedance heat sink combinations. 

**Heat Sink Rating** 

**==> picture [144 x 37] intentionally omitted <==**

TJ = Junction Temperature (°C), TJ ≤ 100°C * 

- TA = Ambient Temperature (°C) 

- IL(99) = Load Current with Case Temperature @ 99°C (ADC) 

- IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX) 

- θ JC = Thermal Impedance, Junction to Case (°C/W) = 0.35°C/W 

- θ CA = Thermal Impedance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) 

- PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W 

- Elevated junction temperature reduces semiconductor lifetime. 

**NOTE:** The exposed surface of the DCB substrate is not to be soldered. 

**www.ixysic.com** 

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nail **CPC1708** INTEGRATED CIRCUITS DIVISION ~~a~~ 

## **3 Performance Data*** 

Unless otherwise specified, all data was collected without the use of a heat sink. 

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Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=10mA) (N=50, IF=20mA, IL=1ADC) (N=50, IF=20mA, IL=1ADC)<br>35 35 30<br>30 30 EF oT UT UT UT<br>24<br>25 25<br>20 20 FoPEER)oT UT LT| 18 EEE<br>15 15 = |e 12 72 ne<br>10 10<br>a3) See 6 s<br>5 5 ae 6§llh6£e | |<br>0 0 a a 0 mis rm<br>1.30 1.31 1.32 1.33 1.34 2.9 4.0 5.1 6.2 7.3 8.4 0.108 0.116 0.124 0.132 0.140 0.148<br>LED Forward Voltage (V) Turn-On (ms) Turn-Off (ms)<br>Typical On-Resistance Distribution<br>(N=50, IF=10mA, IL=1ADC)<br>35<br>30 Feo UT UT UT<br>25 FooT UT UT UT<br>20151050 27mi=ili”eeeRe| Tl  RhHmm<br>0.040 0.045 0.050 0.055 0.060 0.065<br>On-Resistance ( Ω )<br>Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>vs. Temperature (IL=1ADC) (IL=1ADC)<br>1.8 12 0.18<br>11 0.16<br>1.6 Ri | | | [ff 109 —I-H FFE 0.14 {tt tt<br>8 0.12<br>1.4 P———PSEEDET IF=50mA | 60 76 SOREEREEEEEERRrr 0.10 ERGi 7 AEEEEES<br>1.21.0 F SSSEN = IIFF=20mA=10mA 543 aINSEEa 0.080.060.04 EFPPP[7],! | | tT<br>2<br>1 0.02<br>0.8 E LE EE LLL 0 BSL EERSLL | 0.00  CCEFLL<br>-40 -20 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50<br>Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)<br>Typical IF for Switch Operation<br>vs. Temperature Typical Turn-On Time vs. Temperature Typical Turn-Off Time vs. Temperature<br>(IL=1ADC) (IL=1ADC) (IL=1ADC)<br>4.0 14 0.16<br>3.9 |} | {ff 12 r+ | | | [| [| f | 0.14 Et | | | | | |<br>3.83.7 Seeeee 10 IF=10mA 0.12 i<br>3.6 8 0.10<br>3.53.4 eeee 6 r+ | | | | | IF=20mA 0.08 treS| | | hf vIn<br>3.3 p> PT [oper 4 E+ | |_| —Jy 0.06 e+}| | | IF=20mA<br>3.2<br>2 0.04<br>3.13.0 en ee ee ee ee 0 tt tt ttt 0.02 tt tt [tt.] IF=10mA<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N)<br>Turn-On (ms) Turn-Off (ms)<br>LED Forward Voltage Drop (V)<br>Turn-On (ms) Turn-Off (ms)<br>LED Current (mA)<br>**----- End of picture text -----**<br>


* Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 

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call **CPC1708** INTEGRATED CIRCUITS DIVISION ~~a~~ 

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Typical On-Resistance Typical On-Resistance<br>vs. Temperature vs. Temperature Typical Load Current vs. Load Voltage<br>(IF=10mA, IL=1ADC) (IF=10mA, IL=max rated) (IF=10mA)<br>0.08 0.09 5.0<br>0.07 Foot. | | [ [| Pf 0.08 ee ee eeee<br>0.06 a 0.07 en 4.0<br>0.06<br>0.05 3.0<br>pf TP pp 0.05 Pf| er |<br>0.04<br>0.04<br>0.03 2.0<br>ppt fT 0.03 ee<br>0.02 0.02 1.0<br>0.01 0.01<br>0 FREE} 0.00 See ee 0.0<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 0.05 0.10 0.15 0.20 0.25 0.30<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Maximum Load Current Typical Leakage vs. Temperature<br>vs. Temperature with Heat Sink At Maximum Rated Voltage<br>(IF=20mA) Blocking Voltage vs. Temperature Measured Across Pins 1 & 2<br>25 185 0.07<br>S 1ºC/W S 180 2 0.06<br>20<br>175 0.05<br>15 170 0.04<br>165<br>10 5ºC/W 160 0.03<br>10ºC/W 0.02<br>155<br>5<br>S Free Air SS 150 SS 0.01 EES<br>0 Ff fr 145 TI td 0 PCC TT,<br>0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Energy Rating Curve<br>Free Air, No Heat Sink<br>3530 0<br>25<br>20 S EALAM TTTMAAT<br>15<br>10 TSTITTE ANALAMIN AT<br>50 2E YE EIN INLAY A ET CE<br>10µs 100µs 1ms 10ms 100ms 1s 10s 100s<br>Time<br>) Ω ) Ω Load Current (A)<br>On-Resistance ( On-Resistance (<br>)P<br>A)<br>μ<br>Leakage (<br>Load Current (A) Blocking Voltage (V<br>Load Current (A)<br>**----- End of picture text -----**<br>


Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 

**www.ixysic.com** 

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**CPC1708** 

INTEGRATED CIRCUITS DIVISION 

## **4 Manufacturing Information** 

## **4.1 Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of oy our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

||**Device**<br>**Moisture Sensitivity Level (MSL) Classification**<br>CPC1708J<br>MSL 1<br>~~—~~|
|---|---|
|**4.2 ESD Sensitivity**|**4.2 ESD Sensitivity**|



This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **4.3 Soldering Profile** 

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of **J-STD-020** must be observed. 

|**Device**<br>~~—————~~|**Classification Temperature (TC)**<br>~~—————~~|**Dwell Time (tp)**<br>~~—————~~|**Max Reflow Cycles**<br>~~—————~~|
|---|---|---|---|
|CPC1708J<br>~~—————~~|245°C<br>~~—————~~|30 seconds<br>~~—————~~|1<br>~~—————~~|



**NOTE:** The exposed surface of the DCB substrate is not to be soldered. 

## **4.4 Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 

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**CPC1708** 

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INTEGRATED CIRCUITS DIVISION<br>4.5 Mechanical Dimensions<br>5.029 ± 0.127 1.930 ± 0.381<br>19.914 ± 0.254 (0.198 ± 0.005) 1.181 ± 0.076 (0.076 ± 0.015)<br>(0.784 ± 0.010) (0.047 ± 0.003) 17.221 ± 0.254<br>(0.678 ± 0.010)<br>i |<br>20.879 ± 0.254 15.317 ± 0.254<br>(0.822 ± 0.010) (0.603 ± 0.010)<br>DCB Substrate<br>NOTE:  Not to be soldered<br>2.362 ± 0.381<br>20.396 ± 0.508<br>(0.093 ± 0.015)<br>(0.803 ± 0.020) DIMENSIONS<br>mm<br>(inches)<br>Se<br>3.810 ± 0.254<br>(0.150 ± 0.010) 0.635 ± 0.076<br>15.240 ± 0.508 (0.025 ± 0.003)<br>(0.600 ± 0.020) 1.270 TYP<br>am | 2.794 ± 0.127 om (0.050 TYP)<br>(0.110 ± 0.005)<br>**----- End of picture text -----**<br>


**NOTE:** Metallized external surface of DCB substrate maintains 2500V isolation to device internal structure and all external pins. rms 

## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits’ Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits’ product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 

Specification: DS-CPC1708-R08 ©Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/18/2018 

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