CPC1706Y

**CPC1706 Single-Pole, Normally Open 4-Pin OptoMOS[®] DC Power SIP Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Load Current|4|ADC|
|On-Resistance(max)|0.09||



## **Features** 

- Handle Load Currents Up to 4ADC 

- 2500Vrms Input/Output Isolation 

- Power SIP Package 

- High Reliability 

- Low Drive Power Requirements 

- Arc-Free With No Snubbing Circuits 

- No EMI/RFI Generation 

## **Description** 

IXYS Integrated Circuits brings OptoMOS[®] technology, reliability, and compact size to a new family of high power solid state relays. The CPC1706, a DC-switching, normally open (1-Form-A) Solid State Relay, is part of that family. 

Employing optically coupled MOSFET technology, the CPC1706 provides 2500Vrms of input to output isolation. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits' patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. 

- Flammability Rating UL 94 V-0 

## **Applications** 

The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. 

- Industrial Controls 

- Motor Control 

- Robotics 

- Medical Equipment—Patient/Equipment Isolation 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

## **Approvals** 

- UL 508 Certified Component: File E69938 

- CSA Certified Component: Certificate 1172007 

## **Ordering Information** 

**Part # Description** ~~TT~~ CPC1706Y 4-Pin (8-Pin Body) Power SIP Package (25 per tube) 

- IC Equipment 

- Home Appliances 

## **Pin Configuration** 

## **Switching Characteristics of Normally Open Devices** 

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**1** 

DS-CPC1706-R05 

**www.ixysic.com** 

**CPC1706** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Min**|**Max**|**Units**|
|---|---|---|---|
|BlockingVoltage|-|60|VP|
|Reverse Input Voltage|-|5|V|
|Input control Current<br>Peak(10ms)|-|50|mA|
||-|1|A|
|Input Power Dissipation1|-|150|mW|
|Total Power Dissipation2|-|2400|mW|
|Isolation Voltage, Input to Output|-|2500|Vrms|
|Operational Temperature|-40|+85|°C|
|Storage Temperature|-40|+125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC 2  Derate linearly 20 mW / ºC 

## **Electrical Characteristics @ 25ºC (Unless Otherwise Noted)** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Load Current, Continuous|IF=5mA, Free air|IL|-|-|4|ADC|
|Peak Load Current|IF=5mA, t=10ms|ILPK|-|-|9|A|
|On-Resistance1|IF=5mA, IL=1A|RON|-|0.07|0.09||
|Off-State Leakage Current|IF=0mA, VL=60VP|ILEAK|-|-|1|µA|
|Switching Speeds<br>Turn-On<br>Turn-Off|IF=5mA, VL=10V|ton|-|0.5|5|ms|
|||toff|-|0.085|2||
|Output Capacitance|IF=0mA, VL=50V, f=1MHz|COUT|-|75|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate|IL=1A|IF|-|1.4|5|mA|
|Input Control Current to Deactivate|-|IF|0.4|-|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Input/Output Characteristics**|||||||
|Capacitance Input-to-Output|VIO=0V, f=1MHz|CIO|-|2|-|pF|



1   Measurement taken within 1 second of on-time. 

## **Thermal Characteristics** 

|**Parameter**<br>~~ee~~|**Conditions**<br>~~ee~~|**Symbol**<br>~~ee~~<br>~~esr~~|**Min**<br>~~ee~~<br>~~esrees~~|**Typ**<br>~~ee~~<br>~~ees~~|**Max**<br>~~ee~~<br>~~ees~~|**Units**<br>~~ee~~<br>~~ees~~|
|---|---|---|---|---|---|---|
|Thermal Impedance (junction to case)<br>~~ee~~|-<br>~~ee~~|JC<br>~~ee~~<br>~~esr~~|-<br>~~ee~~<br>~~esrees~~|1.5<br>~~ee~~<br>~~ees~~|-<br>~~ee~~<br>~~ees~~|°C/W<br>~~ee~~<br>~~ees~~|



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call INTEGRATED CIRCUITS DIVISION **CPC1706** ~~a~~ 

## **PERFORMANCE DATA*** 

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Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA) (N=50, IF=5mA, IL=75mA) (N=50, IF=5mA, IL=75mA)<br>30 25 20<br>25 20<br>Ht tt tt 15 a6" Gee<br>20 2<br>15<br>15 10<br>10<br>10<br>5<br>5 a || 5<br>0 fii__th 0 ih 0 anAh. | | Pe<br>1.235 1.240 1.245 1.250 1.255 1.260 1.265 0.290 0.375 0.460 0.545 0.630 0.715 0.800 0.075 0.080 0.085 0.090 0.095 0.100 0.105<br>LED Forward Voltage (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Device Count (N)<br>Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


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Typical IF for Switch Operation Typical On-Resistance Distribution<br>(N=50, IL=1A) (N=50, IF=5mA, IL=1A)<br>20 20<br>15 2"" ea 15<br>10550 2373 || =a 10550<br>0 mii2373 il 0<br>1.1 1.2 1.4 1.5 1.6 1.8 0.058 0.062 0.066 0.070 0.074 0.078 0.082<br>LED Current (mA) On-Resistance ( )<br>Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


**Typical Blocking Voltage Distribution (N=50)** 

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20 20 20<br>15 2"" ea 15 15 FT LL lel |<br>73 | 10 || ie<br>10550 mii2373 || il =a 10550 50 |an”| | | @<br>1.1 1.2 1.4 1.5 1.6 1.8 0.058 0.062 0.066 0.070 0.074 0.078 0.082 81.0 81.5 82.0 82.5 83.0 83.5 84.0<br>LED Current (mA) On-Resistance ( ) Blocking Voltage (VP)<br>Typical Turn-On Typical Turn-Off<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>1.6 vs. Temperature 1200 (IL=75mA) 105 (IL=75mA)<br>1.5 ~<a 1000 100<br>800<br>1.4<br><b. 05 s -<br>600 95<br>1.3 SRN LT<br>IF=50mA 400<br>1.2 IIFF=20mA=10mA 200 90<br>IF=5mA<br>1.1 Vas|| tL RE 0 85<br>-40 -20 0 20 40 60 80 100 0 10 20 30 40 50 0 10 20 30 40 50<br>Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)<br>Typical IF for Switch Operation<br>vs. Temperature Typical Turn-On vs. Temperature Typical Turn-Off vs. Temperature<br>1.8 (IL=1A) 650 (IL=75mA) 130 (IL=75mA)<br>600<br>1.7 550 IF=5mA 120<br>500 110<br>1.6 FEREHZ4<br>- 450  GEEGEEZE<br>100<br>1.5 400 IF=10mA<br>350 FPR 90 ECR<br>1.4 FA 300 IF=10mA . 80  Sse IF=5mA<br>250<br>1.3 PET 200 EEoOO—O C 70 —CO=@EE<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>s) s)<br>Turn-On Time ( Turn-Off Time (<br>LED Forward Voltage (V)<br>s) s)<br>Turn-On Time ( Turn-Off Time (<br>LED Forward Current (mA)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 

**www.ixysic.com** 

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Saal INTEGRATED CIRCUITS DIVISION **CPC1706** ~~a~~ 

## **PERFORMANCE DATA*** 

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DC-Only On-Resistance Typical Load Current<br>vs. Temperature vs. Load Voltage Maximum Load Current<br>0.10 (IF=5mA, IL=1A) 4.0 (IF=5mA) 4.5 vs. Temperature<br>3.5<br>0.09 [Se er4ez5q 4.0 pepo<br>3.0<br>: 0.08 2.5 ttt 3.5 FPN Tr<br>2.0 3.0<br>0.07 1.5<br>2.5<br>1.0<br>0.06 ee 2.0<br>0.5<br>0.05 FEE 0.0 4kBee 1.5 =PENE<br>-40 -20 0 20 40 60 80 100 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Load Voltage (V) Temperature (ºC)<br>Typical Leakage vs. Temperature<br>Measured Across Pins 3 & 4<br>86 Blocking Voltage vs. Temperature 70 (VL=60V) 500 Output Capacitance vs. Load Voltage<br>60 450<br>84 400<br>50<br>350<br>82 40 Foto | | hE hE LF 300 2 a<br>80 30 FT Tl UT hE CUTZ 250 yt | | | |.<br>200<br>20<br>78 150<br>10 HoH 100 NS<br>76 0 on 4 50 ene ee<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 10 20 30 40 50 60<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Energy Rating Curve<br>16<br>12<br>By YU<br>8<br>ws<br>40 AA TTIC T TMC<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time<br>On-Resistance () Load Current (A) Load Current (A)<br>)Blocking Voltage (VP Leakage Current (nA)<br>Output Capacitance (pF)<br>Load Current (A)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 

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**www.ixysic.com** 

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**CPC1706** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of 1) the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~EE~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~EE~~|
|---|---|
|CPC1706Y<br>~~EE~~|MSL 1<br>~~EE~~|



## **ESD Sensitivity** 

This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of **J-STD-020** must be observed. 

|**Device**<br>**Classifi cation Temperature (Tc)**<br>**Dwell Time (tp)**<br>**Max Refl ow Cycles**<br>CPC1706Y<br>245ºC<br>30 seconds<br>1<br>~~———————~~|
|---|
|**Board Wash**|



IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. Cleaning methods that employ ultrasonic energy should not be used. 

**www.ixysic.com** 

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**5** 

**CPC1706** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

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(0.830±0.015)21.082±0.381 3.302±0.051 PCB Hole Pattern<br>(0.130±0.002)<br>1.150 DIA. x4<br>1.75 (0.045 DIA. x4)<br>(0.069)<br>10.160±0.127<br>(0.400±0.005) 7º TYP<br>4 Places<br>5.080<br>(0.200)<br>Pin 1<br>1.016±0.127 10.160<br>Pin 1<br>(0.040±0.005) (0.400)<br>1.778<br>4.572±0.127<br>(0.070) 2.540<br>(0.180±0.005)<br>0.381±0.013 (0.100)<br>0.762±0.076 10.160±0.127 (0.015±0.0005)<br>(0.030±0.003) (0.400±0.005) 1.651±0.102<br>2.540±0.12 7 5.080±0.127 (0.065±0.004) 1.778<br>(0.100±0.005) rie (0.200±0.005) (0.070) ye<br>7º TYP<br>4 Places<br>Note: Pin-to-pin tolerances are non-cumulative.<br>Dimensions<br>mm<br>__ 7 (inches)<br>**----- End of picture text -----**<br>


## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.  Neither circuit patent licenses nor indemnity are expressed or implied.  Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage.  IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 

Specification:  DS-CPC1706-R05 ©Copyright 2018, IXYS Integrated Circuits OptoMOS[®] is a registered trademark of IXYS Integrated Circuits All rights reserved.  Printed in USA. 

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6/18/2018