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CPC1019N
MOSFET RELAY, SPST-NO, 0.75A, 60V, SMD
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- Manufacturer: IXYS SEMICONDUCTOR
- Product type: MOSFET Solid State Relays
- Contact Form:SPST-NO (1 Form A); Load Type:AC / DC; Load Voltage Max:60V; Load Current:750mA; MOSFET Relay Package Style:SOP-4; Relay Mounting:Surface Mount; Re 15R8752
- SVHC: No SVHC (25-Jun-2025)
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 1.16 € |
| Current stock | 50+ |
| Lead time | 30 days |
**CPC1019N 60V Normally-Open Single-Pole 4-Pin SOP OptoMOS[®] Relay** INTEGRATED CIRCUITS DIVISION |**Parameter**|**Rating**|**Units**| |---|---|---| |Blocking Voltage|60|VP| |Load Current|750|mA| |Load Current, Peak AC|1|A| |On-Resistance (max)|0.6|| |LED Current to operate|2|mA| ## **Features** ## **Description** CPC1019N is a miniature, low-voltage, low on-resistance, single-pole, normally-open (1-Form-A) solid state relay in a small 4-pin SOP package. Embodying IXYS Integrated Circuits' patented OptoMOS technology, the CPC1019N comprises a highly efficient infrared LED that is optically coupled to efficient MOSFET output switches to provide 1500Vrms of input-to-output isolation. - Low On-Resistance: 0.6 - Low Drive Current: 2mA - High Load Current: 750mA - 1500Vrms Input/Output Isolation - 100% Solid State - Compact 4-Pin SOP Package IXYS Integrated Circuits' state of the art double-molded vertical construction packaging produces a very compact solid state relay that is ideal for replacing larger, less-reliable reed and electromechanical relays. - Arc-Free With No Snubbing Circuits - No EMI/RFI Generation - Immune to Radiated EM Fields - Tape & Reel Version Available - Flammability Rating UL 94 V-0 ## **Approvals** - UL Recognized Component: File E76270 - CSA Certified Component: Certificate 1172007 - EN/IEC 60950-1 Certified Component: Certificate available on our website ## **Applications** - Security - Passive Infrared Detectors (PIR) - Data Signalling - Sensor Circuitry - Instrumentation ## **Ordering Information** |**Part #**|**Description**| |---|---| |CPC1019N|4-Pin SOP (100/tube)| |CPC1019NTR|4-Pin SOP (2000/reel)| - Multiplexers - Data Acquisition - Electronic Switching - I/O Subsystems - Utility Meters (gas, oil, electric and water) - Medical Equipment—Patient/Equipment Isolation - Aerospace - Industrial Controls ## **Pin Configuration** **==> picture [131 x 47] intentionally omitted <==** **----- Start of picture text -----**<br> 1 4<br>+ Control Load<br>2 3<br>- Control Load<br>**----- End of picture text -----**<br> - ATE ## **Switching Characteristics of Normally-Open Devices** **==> picture [125 x 81] intentionally omitted <==** **----- Start of picture text -----**<br> Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br> **1** DS-CPC1019N-R05 **www.ixysic.com** **CPC1019N** INTEGRATED CIRCUITS DIVISION ## **Absolute Maximum Ratings @ 25ºC** |**Parameter**|**Ratings**|**Units**| |---|---|---| |Blocking Voltage|60|VP| |Reverse Input Voltage|5|V| |Input Control Current<br>Peak (10ms)|50|mA| ||1|A| |Input Power Dissipation1|70|mW| |Total Power Dissipation2|400|mW| |Isolation Voltage, Input to Output|1500|Vrms| |Operational Temperature|-40 to +85|°C| |Storage Temperature|-40 to +125|°C| _Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ _Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC ## **Electrical Characteristics @ 25ºC** |**Parameter**|**Conditions**|**Symbol**<br>~~--~~|**Min**<br>~~--~~|**Typ**<br>~~--~~|**Max**|**Units**| |---|---|---|---|---|---|---| |**Output Characteristics**<br>~~—._.~~<br>~~--~~||||||| |Load Current<br>Continuous<br>Continuous, AC Peak<br>Peak<br>~~—._.~~|IF=2mA<br>~~—._.~~|IL<br>~~—._.~~<br>~~--~~|-<br>~~—._.~~<br>~~--~~|-<br>~~—._.~~<br>~~--~~|750<br>~~—._.~~|mADC<br>~~—._.~~| ||||-<br>~~—._.~~<br>~~--~~|-<br>~~—._.~~<br>~~--~~|1<br>~~—._.~~|A<br>~~—._.~~| ||t<10ms<br>~~—._.~~|ILPK<br>~~—._.~~<br>~~--~~|-<br>~~—._.~~<br>~~--~~|-<br>~~—._.~~<br>~~--~~|3<br>~~—._.~~|AP<br>~~—._.~~| |On-Resistance1|IL=750mA|RON<br>~~--~~|-<br>~~--~~|0.35<br>~~--~~|0.6|| |Off-State Leakage Current<br>~~a~~|VL=60VP|ILEAK|-|-|1|A| |Switching Speeds<br>Turn-On<br>Turn-Off<br>~~a~~|IF=5mA, VL=10V|ton|-|0.4|3|ms| |||toff|-|0.4|3|ms| |Output Capacitance<br>~~a~~|IF=0mA, VL=50V, f=1MHz|COUT|-|60|-|pF| |**Input Characteristics**||||||| |Input Control Current to Activate2|IL=750mA|IF|-|0.15|2|mA| |Input Control Current to Deactivate|-|IF|0.1|0.14|-|mA| |Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.5|V| |Reverse Input Current|VR=5V|IR|-|-|10|A| |**Common Characteristics**||||||| |Capacitance, Input to Output|VIO=0V, f=1MHz|CIO|-|1|-|pF| 1 Measurement taken within 1 second of on-time. 2 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. R05 **www.ixysic.com** **2** cal INTEGRATED CIRCUITS DIVISION **CPC1019N** ~~iss~~ ## **PERFORMANCE DATA*** **==> picture [497 x 568] intentionally omitted <==** **----- Start of picture text -----**<br> LED Forward Voltage Distribution Typical IF for Switch Operation Typical On-Resistance Distribution<br>(N=50, IF=5mA) (N=50, IL=100mA) (N=50, IF=2mA, IL=0.75A)<br>2520 ee 2520 e 20<br>15<br>15 15<br>7 nee! a 10 oo<br>10 10<br>5 || in| | 5 coeoe lll 5 =| | =<br>0 — CLELvdeelC 0 < $;$W EE _ | 0 _eeee<br>1.250 1.255 1.260 1.265 1.270 0.105 0.120 0.135 0.150 0.165 0.180 0.31 0.32 0.33 0.34 0.35 0.36<br>LED Forward Voltage (V) LED Current (mA) On-Resistance ( )<br>Typical Turn-On Time Distribution Typical Turn-Off Time Distribution Typical Blocking Voltage Distribution<br>(N=50, IF=5mA, IL=100mA) (N=50, IF=5mA, IL=100mA) (N=50)<br>25 25 35<br>30<br>20 —“LLELL, 20 a<br>25<br>15 =o 15 20 ee<br>10 10 15<br>| =o 10 i<br>50 mmill1!) = 50 50 1ol ot ies<br>0.335 0.385 0.435 0.485 0.535 0.585 0.38 0.39 0.40 0.41 0.42 0.43 74.5 75.0 75.5 76.0 76.5 77.0<br>Turn-On Time (ms) Turn-Off Time (ms) Blocking Voltage (VP)<br>Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>1.61.5 | vs. Temperature IIFF=50mA=20mA 2.52.0 (IL=100mA) 0.410.40 (IL=100mA)<br>1.4 =anc IF 7 =10mA 0.39<br>1.5<br>0.38<br>1.3 SSEae<br>1.0 0.37<br>1.2 2<br>0.36<br>1.1 IIFF=5mA=2mA 0.5 0.35<br>1.0 P4 | AFP Ft tt 0.0 0.34<br>-40 -20 0 20 40 60 80 100 0 10 20 30 40 50 0 10 20 30 40 50<br>Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)<br>Typical LED Current to Operate<br>vs. Temperature Typical Turn-On Time vs. Temperature Typical Turn-Off Time vs. Temperature<br>0.30 (IL=500mA) 2.0 (IL=100mA) 0.8 (IL=100mA)<br>IF=2mA 0.7 NPR<br>0.25 1.5 IF=5mA<br>0.6 PN | ft ff<br>0.20 1.0 0.5 FIN<br>IF=2mA<br>0.15 0.5 IF=5mA 0.4 FOO INE| | ft<br>0.3 PoE AL<br>0.10 0 0.2 F ee LEE PR<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>Turn-On Time (ms) Turn-Off Time(ms)<br>LED Forward Voltage (V)<br>LED Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>**----- End of picture text -----**<br> *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. **www.ixysic.com** R05 **3** all INTEGRATED CIRCUITS DIVISION **CPC1019N** ~~ee~~ ## **PERFORMANCE DATA*** **==> picture [498 x 281] intentionally omitted <==** **----- Start of picture text -----**<br> Typical Load Current Maximum Load Current<br>vs. Load Voltage Typical On-Resistance vs. Temperature vs. Temperature<br>1000 (IF=2mA) 0.70 (IF=2mA, IL=500mA) 800 (IF=2mA)<br>750 0.65 750<br>500 FERRERS. 0.60 en2<br>700<br>250 PLL 0.55 Geese 4K<br>0.50 650<br>0<br>-250 ept ft EELIAtT e y TtTL! 0.45 IT—++-TAT+44 600 F——eeETTTN [4<br>0.40<br>-500 27 0.35 oS 550<br>-750 E Pat | tt 0.30 eeFo7—Od| 500 eee<br>-1000 Fo TET 0.25 ne ee CE ee CUT CU 450 P et oT tt [TN]<br>-0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Load Voltage (V) Temperature (ºC) Temperature (ºC)<br>Typical Leakage Current<br>Typical Blocking Voltage vs. Temperature Energy Rating Curve<br>79 vs. Temperature 80 (VL=60V) 3.5 (IF=2mA)<br>78 Za 70 FE-LITselLte 3.0 TTT<br>60<br>77 = 2.5 oT oT<br>a 50 fe ff TST<br>2.0<br>76 aan 40 + + +A 20} 0 0) 0<br>LA y, 1.5 01 ON a<br>75 ean 30 ee .<br>1.0<br>20<br>74 S_ ee 10 FEREDoto UE UY 0.5 negm<br>73 F tL LET tt 0 Pry 0 0 1 AA EN AT<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Temperature (ºC) Temperature (ºC) Time<br>)<br>Load Current (mA) On-Resistance ( Load Current (mA)<br>)P<br>Blocking Voltage (V Leakage Current (nA) Load Current (A)<br>**----- End of picture text -----**<br> *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. R05 **www.ixysic.com** **4** **CPC1019N** INTEGRATED CIRCUITS DIVISION ## **Manufacturing Information** ## **Moisture Sensitivity** All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of ) the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . |**Device**<br>~~——EEEE~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~——EEEE~~| |---|---| |CPC1019N<br>~~——EEEE~~|MSL 3<br>~~——EEEE~~| ## **ESD Sensitivity** This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . ## **Soldering Profile** Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of **J-STD-020** must be observed. **Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles** CPC1019N 260ºC 30 seconds 3 ~~—————EEE~~ **Board Wash** IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. **www.ixysic.com** R05 **5** **CPC1019N** INTEGRATED CIRCUITS DIVISION ## **MECHANICAL DIMENSIONS** ## **CPC1019N** **==> picture [386 x 170] intentionally omitted <==** **----- Start of picture text -----**<br> 4.089 ± 0.025 Recommended PCB Land Pattern<br>(0.161 ± 0.001)<br>0.203 ± 0.025<br>0.60<br>(0.008 ± 0.001)<br>(0.024)<br>3.810 ± 0.025 aay 6.096 ± 0.102 ra 7”<br>(0.150 ± 0.001) (0.240 ± 0.004)<br>0.559 ± 0.127<br>(0.022 ± 0.005) 3.85<br>Pin 1 0.910 ± 0.025 (0.152)<br>Ly, 2.54 Typ (0.036 ± 0.001) ia 1.54 r s<br>(0.100 Typ) (0.061)<br>ia<br>2.030 ± 0.025 2.54<br>(0.080 ± 0.001) Dimensions (0.10)<br>ee<br>Package standoff: mm<br>0.064 ± 0.040 (inches)<br>0.481 (0.0025 ± 0.0015)<br>(0.019)<br>0.381 ± 0.025 Note:<br>(0-0.004)0-0.1 cal (0.015 ± 0.001) 1. Lead dimensions do not include plating: 1000 microinches max.<br>**----- End of picture text -----**<br> ## **CPC1019NTR Tape & Reel** **==> picture [421 x 180] intentionally omitted <==** **----- Start of picture text -----**<br> 330.2 Dia<br>(13.00 Dia)<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>K0=2.70 A0=6.50 P1=8.00(0.315)<br>(0.106) (0.256)<br>K1=2.30<br>(0.091)<br>iN | SL<br>User Direction of Feed<br>Dimensions<br>Embossed mm<br>Carrier (inches)<br>a oy —<br>Embossment NOTE:<br>**----- End of picture text -----**<br> **==> picture [256 x 9] intentionally omitted <==** **----- Start of picture text -----**<br> NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br> ## **For additional information please visit our website at: www.ixysic.com** IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1019N-R05 ©Copyright 2018, IXYS Integrated Circuits OptoMOS[®] is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. **6** 6/1/2018
Updated at April 22, 2026
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