CPC1014N

**CPC1014N 60V, 400mA Normally-Open Single-Pole 4-Pin SOP Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Load Current|400|mArms/ mADC|
|On-Resistance (max)|2||
|LED Current to operate|2|mA|



## **Features** 

- Designed for use in security systems complying with EN50130-4 

- 1500Vrms Input/Output Isolation 

- Small 4-Pin SOP Package 

- Arc-Free With No Snubbing Circuits 

- No EMI/RFI Generation 

- Immune to radiated EM fields 

## **Description** 

The CPC1014N is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The super efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture. The optically coupled output is controlled by a highly efficient infrared LED. 

IXYS Integrated Circuits Division’s state of the art, double-molded vertical construction packaging makes the CPC1014N one of the world’s smallest relays. It offers board space savings over the competitor’s larger 4-pin SOP relay. 

- Tape & Reel Version Available 

- Flammability Rating UL 94 V-0 

## **Approvals** 

- UL Recognized Component: File E76270 

## **Applications** 

- Security 

- Passive Infrared Detectors (PIR) 

   - CSA Certified Component: Certificate 1172007 

   - EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 

- Data Signalling 

- Sensor Circuitry 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|CPC1014N|4-Pin SOP (100/tube)|
|CPC1014NTR|4-Pin SOP (2000/reel)|



- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment—Patient/Equipment Isolation 

- Aerospace 

- Industrial Controls 

## **Pin Configuration** 

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1 4<br>+ Control Load<br>2 3<br>– Control Load<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally-Open Devices** 

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Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>


**1** 

DS-CPC1014N-R06 

**www.ixysic.com** 

**CPC1014N** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation1|70|mW|
|Total Power Dissipation2|400|mW|
|Isolation Voltage, Input to Output|1500|Vrms|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC. 

2  Derate output power linearly 3.33 mW / ºC. 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**<br>~~ee~~|**Symbol**<br>~~ee~~|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~ey~~<br>~~eeee~~|||||||
|Load Current<br>Continuous1<br>Peak<br>~~ey~~|IF=2mA<br>~~ey~~<br>~~ee~~|IL<br>~~ey~~<br>~~ee~~|-<br>~~ey~~|-<br>~~ey~~|400<br>~~ey~~|mArms/ mADC<br>~~ey~~|
||t<10ms<br>~~ey~~<br>~~ee~~|ILPK<br>~~ey~~<br>~~ee~~|-<br>~~ey~~|-<br>~~ey~~|±1<br>~~ey~~|AP<br>~~ey~~|
|On-Resistance2<br>~~ey~~|IL=400mA<br>~~ey~~<br>~~ee ~~|RON<br>~~ey~~<br> ~~ee~~|-<br>~~ey~~|-<br>~~ey~~|2<br>~~ey~~|<br>~~ey~~|
|Off-State Leakage Current<br>~~es~~|VL=60VP<br>~~es~~|ILEAK<br>~~es~~|-<br>~~es~~|-<br>~~es~~|1<br>~~es~~|µA<br>~~es~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~es~~|IF=5mA, VL=10V<br>~~es~~|ton<br>~~es~~|-<br>~~es~~|0.47<br>~~es~~|2<br>~~es~~|ms<br>~~es~~|
|||toff<br>~~es~~|-<br>~~es~~|0.22<br>~~es~~|1<br>~~es~~||
|Output Capacitance|IF=0mA, VL=50V, f=1MHz|COUT|-|25|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate3|IL=400mA|IF|-|0.25|2|mA|
|Input Control Current to Deactivate|-|IF|0.1|0.2|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Common Characteristics**|||||||
|Capacitance, Input to Output|VIO=0V, f=1MHz|CIO|-|1|-|pF|



1   Load current derates linearly from 400mA @ 25oC to 200mA @85oC. 

2   Measurement taken within 1 second of on-time. 

3   For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. 

R06 

**www.ixysic.com** 

**2** 

all INTEGRATED CIRCUITS DIVISION **CPC1014N** ~~a~~ 

## **PERFORMANCE DATA*** 

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Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA) (N=50, IF=5mA, IL=100mA) (N=50, IF=5mA, IL=100mA)<br>25 25 30<br>20 FEET ET] 20 ELL LL 25<br>20<br>15 | eee 15 ! ee<br>15<br>10 2 || 10 eee! | ee<br>10<br>5 mm | | 5 eee 5<br>0 |Hn | + $ 0 $msiitte| | 0<br>1.250 1.255 1.260 1.265 1.270 1.275 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.55 0.65 0.75 0.85 0.95 1.05<br>LED Forward Voltage (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Typical IF for Switch Operation Typical IF for Switch Dropout Typical On-Resistance Distribution<br>25 (N=50, IL=400mA) 25 (N=50, IL=400mA) 25 (N=50, IF=1mA, IL=400mA)<br>20 || | gf [ti] 20 20<br>1510 2222 eeee 1510 1510<br>5 a1! aa 5 5<br>0 mii |  l= 0 0<br>0.16 0.18 0.20 0.22 0.24 0.26 0.28 0.16 0.18 0.20 0.22 0.24 0.26 0.505 0.510 0.515 0.520 0.525 0.530 0.535<br>LED Current (mA)  LED Current (mA)  On-Resistance ( )<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


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Typical Blocking Voltage Distribution<br>(N=50)<br>3530 TT<br>2520151050 ||=|||—_ 11/2 |el<br>63.5 64.0 64.5 65.0 65.5 66.0 66.5<br>Blocking Voltage (VP)<br>Typical LED Forward Voltage Drop Turn-On Time vs. LED Forward Current<br>vs. Temperature (IL=80mA)<br>1.6 2.0 0.7<br>1.5 ae IIFF=50mA=20mA 1.81.61.4 a 0.60.50.5 FLLELLELLLLL&L<br>1.4<br>1.2 0.4<br>1.3 1.0<br>0.8 0.3<br>1.21.1 2S IFI=10mAF=5mA 0.60.4 BSE EEeS 0.20.10.1 SEE<br>IF=2mA 0.2<br>1.0 ESPt ttt 0 PASeS SSS 0 ZOCLEPelee EET<br>-40 -20 0 20 40 60 80 100 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15<br>Time LED Forward Current (mA)<br>Device Count (N)<br>Turn-On Time (ms) Turn-Off Time (ms)<br>LED Forward Voltage (V)<br>**----- End of picture text -----**<br>


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Turn-Off Time vs. LED Forward Current<br>0.7 (IL=80mA)<br>FLLELLELLLLL&L<br>0.60.50.5<br>0.4<br>0.3<br>SEE EEL<br>0.20.10.1<br>0 ZOCLEPelee EET i TT<br>0 5 10 15 20 25 30 35 40 45 50<br>LED Forward Current (mA)<br>Turn-Off Time (ms)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

**www.ixysic.com** 

R06 

**3** 

al INTEGRATED CIRCUITS DIVISION **CPC1014N** ~~Pee~~ 

## **PERFORMANCE DATA*** 

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Turn-On Time vs. Temperature Turn-Off Time vs. Temperature Typical On-Resistance vs. Temperature<br>(IL=80mA) (IL=80mA) (IL=200mA)<br>2.0 0.60 0.9<br>1.81.6 0.550.50 0.8 IF=5mA<br>1.41.21.0 aeaees a a IF=5mA 0.450.400.35 oeee2e eaee a ee 0.70.6 2pt Steady State tt a|? dd IF=10mA e<br>0.8 0.30<br>0.6 aa 0.25 rr IF=5mA 0.5 to prtSi<br>0.4 0.20<br>0.2 py er IF=10mA 0.15 —————es 0.4 Poet<br>0.0 SS ee 0.10 oro bobo IF=10mA 0.3 Anntt tt<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical IF for Switch Operation Typical IF for Switch Dropout<br>vs. Temperature vs. Temperature Typical Load Current vs. Load Voltage<br>0.36 (IL=200mA) 0.36 (IL=200mA) 500 (IF=2mA)<br>400<br>0.32 Ft tT | tt yb 0.32 F t [| tt ll 300 Se eet a<br>200<br>0.28 0.28 100<br>SCOOP) EC 0 eee<br>0.24 0.24 -100<br>Se<br>-200<br>0.20 0.20 -300<br>et Lea -400<br>0.16 0.16 -500<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Typical Leakage vs. Temperature<br>Maximum Load Current vs. Temperature Typical Blocking Voltage Measured Across Pins 3&4<br>500 (IF=2mA) 72 vs. Temperature 0.016 (VL=60V)<br>70 Pot Tt TT rT re 0.014 i<br>400<br>68 rot UF UT UE CUT 0.012 f+ | | UT UT [CT]<br>300 66 a A 0.010 ptf<br>0.008<br>200 64 se 0.006 tt ft<br>62 iL 1 ae 0.004 f+f+ | | | | hEhE CUTCT UE CU<br>100 60 Zee 0.002 CU<br>0 58 eee 0 Foyess | PeoTT<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Output Capacitance vs. Load Voltage Energy Rating Curve<br>(IF=0mA, f=1MHz) (IF=2mA)<br>200 1100<br>175 es ee ee 1000 S010 AT<br>900<br>150125 aCee 800700 FLUIMCCUMCCTD ECCT<br>600<br>100 Aff | 500 HPIREIIEEA<br>75 a fT 400 ETI TA CTE TTT SUT TTT TT<br>50 300<br>200<br>25 — ee ee ee 100 CMEC<br>0 S000 USER+}EU EETE — 0 PLU MEIM C UMC C ITTTE CC CT 1<br>0 10 20 30 40 50 10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Load Voltage (V) Time<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ()<br>LED Current (mA) LED Current (mA) Load Current (mA)<br>)P<br>Leakage (µA)<br>Load Current (mA) Blocking Voltage (V<br>Load Current (mA)<br>Output Capacitance (pF)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

R06 

**www.ixysic.com** 

**4** 

**CPC1014N** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest ¢) version of the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~—~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~eee~~|
|---|---|
|CPC1014N<br>~~—~~|MSL 3<br>~~eee~~|



## **ESD Sensitivity** 

This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of **J-STD-020** must be observed. 

|**Device**<br>**Classifi cation Temperature (Tc)**<br>**Dwell Time (tp)**<br>**Max Refl ow Cycles**<br>CPC1014N<br>260ºC<br>30 seconds<br>3<br>~~————————E~~|
|---|
|**Board Wash**|



IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 

**www.ixysic.com** 

R06 

**5** 

**CPC1014N** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **CPC1014N** 

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4.089  ±  0.025 Recommended PCB Land Pattern<br>(0.161  ±  0.001)<br>0.203 Typ 0.55<br>(0.008 Typ)<br>(0.022)<br>3.810  ±  0.025 6.096  ±  0.102<br>(0.150  ±  0.001) (0.240  ±  0.004)<br>0.559  ±  0.127<br>(0.022  ±  0.005) 5.50<br>Pin 1 0.910  ±  0.025 (0.217)<br>G (0.036  ±  0.001) §<br>2.54 Typ 1.45<br>(0.100 Typ) (0.057)<br>10 0<br>2.030 ±  0.025<br>2.54<br>(0.080 ±  0.001)<br>(0.10)<br>Package standoff:<br>0.064 ± 0.040<br>0.481 (0.0025 ± 0.0015)<br>(0.019) Dimensions<br>0.381 TYP.<br>0-0.1 Lt _ mm<br>(0-0.004) (0.015 TYP.)<br>(inches)<br>CPC1014NTR Tape & Reel<br>330.2 Dia<br>(13.00 Dia)<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>K0=2.70 A0=6.50 P1=8.00(0.315)<br>(0.106) (0.256)<br>K1=2.30<br>(0.091)<br>Oy o User Direction of Feed o ,<br>_ Dimensions<br>Embossed mm<br>Carrier (inches)<br>Embossment NOTE:  All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br>


## **CPC1014NTR Tape & Reel** 

## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.  Neither circuit patent licenses nor indemnity are expressed or implied.  Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage.  IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 

Specification:  DS-CPC1014N-R06 ©Copyright 2018, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved.  Printed in USA. 

1/30/2018 

**6**