CPC1008N

**CPC1008N Single-Pole, Normally Open 4-Pin SOP OptoMOS[®] Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|BlockingVoltage|100|VP|
|Load Current|150|mArms/ mADC|
|On-Resistance(max)|8||



## **Features** 

## **Description** 

CPC1008N is a miniature, low-voltage, low on-resistance, single-pole, normally open (1-Form-A) solid state relay in a 4-Pin SOP package. It uses IXYS Integrated Circuits Division’s patented, optically coupled, OptoMOS architecture to provide 1500Vrms of input/output isolation. 

- 1500Vrms Input/Output Isolation 

- Small 4-Pin SOP Package 

- Low Drive Power Requirements 

- High Reliability 

- Arc-Free With No Snubbing Circuits 

- No EMI/RFI Generation 

- Wave Solderable 

- Tape & Reel Version Available 

Using IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging, the CPC1008N is one of the world’s smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays. 

## **Approvals** 

- UL Recognized Component: File E76270 

## **Applications** 

- Instrumentation 

- Multiplexers 

   - CSA Certified Component: Certificate 1172007 

   - EN/IEC 60950-1 Certified Component: Certificate B 13 12 82667 003 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment—Patient/Equipment Isolation 

- Security Systems 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|CPC1008N|4-Pin SOP(100/tube)|
|CPC1008NTR|4-Pin SOP(2000/reel)|



- Aerospace 

- Industrial Controls 

- Reed Relay Replacement 

## **Pin Configuration** 

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**----- Start of picture text -----**<br>
1 4<br>+ Control Load<br>2 3<br>– Control Load<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally Open Devices** 

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Form-A<br>IF<br>90%<br>ILOAD 10%<br>ton toff<br>**----- End of picture text -----**<br>


DS-CPC1008N-R10 

**1** 

**www.ixysic.com** 

**CPC1008N** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings **|**Units**|
|---|---|---|
|BlockingVoltage|100|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation|70|mW|
|Total Power Dissipation1|400|mW|
|Isolation Voltage, Input to Output(60 Seconds)|1500|Vrms|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

1  Derate linearly 3.33 mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~ey~~|||||||
|Load Current<br>Continuous1<br>Peak<br>~~ey~~|-<br>~~ey~~|IL<br>~~ey~~|~~ey~~|~~ey~~|150<br>~~ey~~|mArms/ mADC<br>~~ey~~|
||t=10ms<br>~~ey~~|ILPK<br>~~ey~~|-<br>~~ey~~|-<br>~~ey~~|±350<br>~~ey~~|mAP<br>~~ey~~|
|On-Resistance2<br>~~ey~~<br>~~es~~|IL=150mA<br>~~ey~~<br>~~ee~~|RON<br>~~ey~~<br>~~ee~~|-<br>~~ey~~<br>~~ee~~|4.8<br>~~ey~~<br>~~ee~~|8<br>~~ey~~<br>~~ee~~|<br>~~ey~~<br>~~ee~~|
|Off-State Leakage Current<br>~~es~~|VL=100VP<br>~~ee~~|ILEAK<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|1<br>~~ee~~|µA<br>~~ee~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~es~~|IF=5mA, VL=10V<br>~~ee~~|ton<br>~~ee~~|-<br>~~ee~~|1<br>~~ee~~|2<br>~~ee~~|ms<br>~~ee~~|
|||toff<br>~~ee~~|-<br>~~ee~~|0.17<br>~~ee~~|1<br>~~ee~~||
|Output Capacitance<br>~~es ~~|IF=0mA, VL=50V, f=1MHz<br> ~~ee~~|COUT<br>~~ee~~|-<br>~~ee~~|6<br>~~ee~~|-<br>~~ee~~|pF<br>~~ee~~|
|**Input Characteristics**|||||||
|Input Control Current to Activate3|IL=150mA|IF|-|0.45|2|mA|
|Input Control Current to Deactivate|-|IF|0.2|-|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.4|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Common Characteristics**|||||||
|Capacitance, Input to Output|-|CI/O|-|1|-|pF|



1   Load current derates linearly from 150mA @ 25oC to 120mA @ 85oC. 

2   Measurement taken within 1 second of on time. 

3   For high temperature operation (>60ºC) a minimum LED drive current of 4mA is recommended. 

R10 

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**2** 

**CPC1008N** 

INTEGRATED CIRCUITS DIVISION 

## **PERFORMANCE DATA (@ 25ºC Unless Otherwise Specified)*** 

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**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA) (N=50, IF=5mA, IL=100mA) (N=50, IF=5mA, IL=100mA)<br>25 20 20<br>20 Se 15 e 15 6ee<br>15<br>a3) Bee 10 | Ge 10 e |<br>10 inp<br>50 -= —EEne)lhClU| | pe 50 $ek Ce| | = 50 e) h =—lhe lUL | Ae<br>1.250 1.255 1.260 1.265 1.270 1.275 0.85 0.90 0.95 1.00 1.05 1.10 1.15 0.166 0.168 0.170 0.172 0.174 0.176 0.178<br>LED Forward Voltage (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Typical IF for Switch Operation Typical On-Resistance Distribution Typical Blocking Voltage Distribution<br>(N=50, IL=100mA) (N=50, IF=2mA, IL=150mA) (N=50)<br>2015 ti TE U 2015 E EL [EEL)] 2015 LL<br>1050 IRR728] || GeSt | e e 1050 ”)$ke FWiase | |eeeeee 1050 )EH| |eele |<br>0.38 0.40 0.42 0.45 0.47 0.50 0.53 4.4 4.6 4.8 5.0 5.2 5.4 5.6 106 109 112 115 118 121 124<br>LED Current (mA)  On-Resistance ( ) Blocking Voltage (VP)<br>Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>vs. Temperature vs. LED Forward Current vs. LED Forward Current<br>1.6 2.5 0.25<br>1.5 =< 2.0 0.20<br>1.4 RI |ee|<br>1.5 0.15<br>1.3 Seer| 7<br>1.2 IIFF=50mA=20mA 1.0 0.10<br>1.1 IFI=10mAF=5mA 0.5 0.05<br>1.0 IF=2mA eePEt tt 0.0 REEEE 0.00 aeeee<br>-40 -20 0 20 40 60 80 100 0 10 20 30 40 50 0 10 20 30 40 50<br>Temperature (ºC) LED Current (mA) LED Current (mA)<br>Typical Ivs. TemperatureF for Switch Operation Typical Turn-On Time Typical Turn-Off Time<br>1.0 (IL=120mA) 1.6 vs. Temperature 1.0 vs. Temperature<br>1.4 tf | [| | [| Jf Gf]<br>0.80.6 1.21.0 SEER IF=5mA 0.80.6 EE IIFF=10mA=5mA<br>0.8<br>0.4 0.6 scpeteee] 0.4 ONY<br>0.2 0.4 ee IF=10mA 0.2 |<br>0.2<br>0.0 0.0 SEE 0.0 LLL<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>Turn-On Time (ms) Turn-Off Time (ms)<br>LED Forward Voltage (V)<br>LED Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>**----- End of picture text -----**<br>


*The Performance data shown in the graphs above is typical of device performance.  For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

R10 

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**3** 

cal INTEGRATED CIRCUITS DIVISION **CPC1008N** ~~a~~ 

## **PERFORMANCE DATA (@ 25ºC Unless Otherwise Specified)*** 

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**----- Start of picture text -----**<br>
Typical On-Resistance Typical Load Current Maximum Load Current<br>vs. Temperature vs. Load Voltage vs. Temperature<br>10 (IF=2mA, IL=120mA) 200 (IF=2mA) 160 (IF=5mA)<br>150<br>8 150<br>° 6 10050 140 FFETt fT [| | lt<br>0 130 FE IN, |<br>4 -50<br>120 FE tT LT LIN LO<br>-100<br>2<br>-150 110 FT TT| ET htcE LINct<br>0 -200 100 FET TL LL<br>-40 -20 0 20 40 60 80 100 -1.0 -0.5 0.0 0.5 1.0 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Load Voltage (V) Temperature (ºC)<br>Output Capacitance<br>Typical Blocking Voltage Typical Leakage vs. Temperature vs. Load Voltage<br>120 vs. Temperature 25 (VL=100V) 50 (IF=2mA, f=1MHz)<br>118 TTT), 20 SOO 40<br>116<br>PPP Ter 15 Peery 30<br>114<br>Soeseee) 10 = 20<br>112<br>110108 eePCLEELL | =0 50 6EET 100<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Energy Rating Curve<br>1.0<br>0.8<br>TT<br>0.6<br>ARTIC<br>0.4<br>aN)SA<br>0.2 B000S<br>0.0 CM CC<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time (s)<br>)<br>On-Resistance ( Load Current (mA) Load Current (mA)<br>)P<br>Leakage (nA)<br>Blocking Voltage (V<br>Output Capacitnace (pF)<br>Load Current (A)<br>**----- End of picture text -----**<br>


*The Performance data shown in the graphs above is typical of device performance.  For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

R10 

**www.ixysic.com** 

**4** 

**CPC1008N** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to ¢) the latest version of the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL) rating** as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~—~~|**Moisture Sensitivity Level (MSL) Rating**<br>~~eee~~|
|---|---|
|CPC1008N<br>~~—~~|MSL 3<br>~~eee~~|



## **ESD Sensitivity** 

This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **Reflow Profile** 

This product has a maximum body temperature and time rating as shown below. All other guidelines of **J-STD-020** must be observed. 

|**Device**<br>~~EE~~|**Maximum Temperature x Time**<br>~~EE~~|
|---|---|
|CPC1008N<br>~~EE~~|260ºC for 30 seconds<br>~~EE~~|



## **Board Wash** 

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 

R10 

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**CPC1008N** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **CPC1008N** 

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**----- Start of picture text -----**<br>
4.089  ±  0.203 Recommended PCB Land Pattern<br>(0.161  ±  0.008) 0.200  ±  0.025<br>(0.008  ±  0.001) 0.60<br>(0.0217)<br>3.810  ±  0.076 6.096  ±  0.102<br>(0.150  ±  0.003) (0.240  ±  0.004)<br>0.432  ±  0.127<br>(0.017  ±  0.005) 5.60<br>Pin 1 1.02  ±  0.025 (0.2205)<br>(0.040  ±  0.001)<br>2.54 Typ 1.30<br>(0.100 Typ) (0.0512)<br>2.184 Max 10 0~<br>2.54<br>(0.086 Max)<br>(0.10)<br>Lead to package standoff:<br>0.0637 ± 0.0383<br>=, (0.0025 ± 0.0015)<br>(0.030 0.762  ±±  0.004) 0.102 Jhb (0.015 TYP.)0.381 TYP. ee Dimensionsmm<br>(inches)<br>330.2 Dia<br>(13.00 Dia)<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>K(0.106)0=2.70 A(0.256)0=6.50 P=8.00(0.315)<br>K1=2.30<br>(0.091)<br>oO User Direction of Feed<br>Dimensions<br>Embossed mm<br>Carrier (inches)<br>Oy EE<br>Embossment NOTE:  All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br>


**CPC1008NTR Tape & Reel** 

## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.  Neither circuit patent licenses nor indemnity are expressed or implied.  Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage.  IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 

Specification:  DS-CPC1008N-R10 ©Copyright 2014, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved.  Printed in USA. 

8/18/2014 

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