CPC1004N

**CPC1004N 100V Normally-Open Single-Pole 4-Pin SOP OptoMOS**[®] **Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|BlockingVoltage|100|VP|
|Load Current|300|mADC|
|On-Resistance(max)|4||



## **Features** 

- Operating Temperature Range: -40ºC to +110ºC 

- 1500Vrms Input/Output Isolation 

- Small 4-Pin SOP Package 

- Low Drive Power Requirements 

- High Reliability 

- Arc-Free With No Snubbing Circuits 

- No EMI/RFI Generation 

- Tape & Reel Version Available 

- Flammability Rating UL 94 V-0 

## **Applications** 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

## **Description** 

CPC1004N is a miniature, low-voltage, low on-resistance, normally-open (1-Form-A) DC solid state relay in a 4-pin SOP package. The relay uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switch and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. 

The CPC1004N uses IXYS Integrated Circuits' state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays. The CPC1004N is ideal for replacing larger, less-reliable reed and electromechanical relays. 

## **Approvals** 

   - UL Recognized Component: File E76270 

   - CSA Certified Component: Certificate 1172007 

   - EN/IEC 60950-1 Certified Component: Certificate available on our website 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment—Patient/Equipment Isolation 

- Security Systems 

- Aerospace 

- Industrial Controls 

- Reed Relay Replacement 

**Ordering Information** 

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**----- Start of picture text -----**<br>
Part # Description<br>CPC1004N 4-Pin SOP (100/tube)<br>ee CPC1004NTR 4-Pin SOP (2000/reel)<br>Pin Configuration<br>1  4<br>+ Control  DC +<br>2  3<br>– Control  DC -<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally-Open Devices** 

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Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>


**1** 

DS-CPC1004N-R09 

**www.ixysic.com** 

**CPC1004N** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|BlockingVoltage|100|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation1|70|mW|
|Total Power Dissipation2|400|mW|
|Capacitance Input to Output|1|pF|
|Isolation Voltage,Input to Output|ut<br>1500|Vrms|
|Operational Temperature|-40 to +110|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC 

2  Derate linearly 3.33 mW / ºC 

## **Electrical Characteristics @ 25°C (Unless Otherwise Specifi ed)** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**<br>~~Pe~~|||||||
|Load Current<br>Continuous1<br>Continuous<br>Peak<br>~~Pe~~|-<br>~~Pe~~|IL<br>~~Pe~~|-<br>~~Pe~~|-<br>~~Pe~~|300<br>~~Pe~~|mADC<br>~~Pe~~|
||T=110°C, IF=10mA<br>~~Pe~~||-<br>~~Pe~~|-<br>~~Pe~~|100<br>~~Pe~~||
||t=10ms<br>~~Pe~~|ILPK<br>~~Pe~~|-<br>~~Pe~~|-<br>~~Pe~~|500<br>~~Pe~~||
|On-Resistance2<br>~~Pe~~<br>~~ee~~|IL=300mA<br>~~Pe~~<br>~~ee~~|RON<br>~~Pe~~<br>~~ee~~|-<br>~~Pe~~<br>~~ee~~|-<br>~~Pe~~<br>~~ee~~|4<br>~~Pe~~<br>~~ee~~|<br>~~Pe~~<br>~~ee~~|
|Off-State Leakage Current<br>~~ee~~|VL=100VP<br>~~ee~~|ILEAK<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|1<br>~~ee~~|µA<br>~~ee~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~ee~~|IF=5mA, VL=10V<br>~~ee~~|ton<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|3<br>~~ee~~|ms<br>~~ee~~|
|||toff<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|1<br>~~ee~~||
|Output Capacitance<br>~~ee~~|IF=0mA, VL=50V, f=1MHz<br>~~ee~~|COUT<br>~~ee~~|-<br>~~ee~~|25<br>~~ee~~|-<br>~~ee~~|pF<br>~~ee~~|
|**Input Characteristics**|||||||
|Input Control Current to Activate|IL=300mA|IF|-|0.9|2|mA|
|Input Control Current to Deactivate|-|IF|0.3|0.8|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|



1   Load current derates linearly from 300mA @ 25oC to 100mA @ 110oC. 

2   Measurement taken within 1 second of on-time. 

R09 

**www.ixysic.com** 

**2** 

**CPC1004N** 

INTEGRATED CIRCUITS DIVISION 

## **PERFORMANCE DATA*** 

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Typical LED Forward Voltage Drop Typical IF for Switch Operation Typical IF for Switch Dropout<br>(N=50, IF=5mA) (N=50, IL=300mA) (N=50, IL=300mA)<br>35 25 25<br>30 20 PTTTET EL) h 20 UEELLL TL<br>25<br>20 15 =e 15 6h<br>15 10 || [iim]] | | lUC<“ 10 iéCLCOR<br>10<br>5 a1s||Eee 5 |ae<br>50 0 Hae|| 0 | § =6Lfeeee<br>1.17 1.19 1.21 1.23 1.25 0.70 0.75 0.80 0.85 0.90 0.95 1.0 0.75 0.80 0.85 0.90 0.95 1.00 1.05<br>LED Forward Voltage Drop (V) LED Current (mA) LED Current (mA)<br>Typical On-Resistance Distribution Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=2mA, IL=300mA) (N=50, IF=5mA, IL=300mA) (N=50, IF=5mA, IL=200mA)<br>35 25 25<br>30<br>20 20<br>25<br>20 PEACE 15 EARLE 15<br>15 Frrreyryrl] 6 6 10 ELd|ddP 10<br>10<br>5 5<br>5 || aoe<br>0 ae 0 m wifsitlig | oe 0<br>2.9 3.0 3.1 3.2 3.3 3.4 3.5 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.21 0.22 0.23 0.24 0.25 0.26 0.27<br>On-Resistance ( ) Turn-On Time (ms) Turn-Off Time (ms)<br>Typical Blocking Voltage Distribution<br>(N=50)<br>35<br>30 TOP PLL hy<br>252015 PTOTES2ee<br>1050 t=Ee | n |<br>106 109 112 115 118 121 124<br>Blocking Voltage (VP)<br>Typical LED Forward Voltage Drop Typical Ivs. TemperatureF for Switch Operation Typical Ivs. TemperatureF for Switch Dropout<br>vs. Temperature (IL=100mA) (IL=100mA)<br>1.8 3.0 3.0<br>1.6 2.5 2.5<br>SH 2.0 EEE] 2.0 GEE<br>1.4<br>1.5 1.5<br>1.2 eae ER ee<br>1.0 1.0<br>oS P| | | cbr 2a =e<br>1.0<br>PEEL) 0.5 eee eC 0.5 eee<br>0.8 PLE  LLL 0 FET EET 0 FT et tT cE Tt<br>-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>IF=50mA<br>IIFF=10mA=5mA<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N)<br>LED Current (mA) LED Current (mA)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

**www.ixysic.com** 

R09 

**3** 

call INTEGRATED CIRCUITS DIVISION **CPC1004N** ~~a~~ 

**CPC1004N** 

## **PERFORMANCE DATA*** 

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Typical Load Current vs. Load Voltage Turn-On Time vs. LED Forward Current Turn-Off Time vs. LED Forward Current<br>300 (IF=5mA) 2.0 (IL=100mA) 0.7 (IL=100mA)<br>1.8<br>200 1.6 0.6<br>1.4 A 0.5 --H---H-HHH<br>100<br>1.2 0.4<br>0 1.0 FAL FT tt EET TE TT Tt<br>0.8 aN 0.3 SERRE<br>-100 0.6 SSS 0.2 FLT TEE ET ee<br>0.4<br>-200 a 0.1 Pe<br>0.2 a [a<br>-300 0 Fledhohochoshsshsshohouhol 0 ‘A<br>-1.5 -1.0 -0.5 0 0.5 1.0 1.5 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50<br>Load Voltage (V) LED Forward Current (mA) LED Forward Current (mA)<br>Load Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>**----- End of picture text -----**<br>


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Typical On-Resistance vs. Temperature Typical Turn-On Time vs. Temperature Typical Turn-Off Time vs. Temperature<br>(IL=300mA) (IL=200mA) (IL=300mA)<br>12 5.0 1.0<br>4.5 0.9<br>o 108 fPiet | | tT |  dt | dT |  dt[JYt IF = 5mA 4.03.5 SSee SSE 0.80.7 SSSeeSEE<br>3.0 0.6<br>6 2.5 0.5<br>pt tT | | | ee Set Set<br>4 rT tT | aeLoe IF = 10mA 2.01.5 Po2 ft rT IF=5mA 0.40.3 Sree<br>2 | | [ba7TtI | fd 1.0 eea 0.2 PS SS IF=10mA<br>0.5 0.1<br>0 L T | 0 en a IF=10mA 0 enee IF=5mA<br>-40 -20 0 20 40 60 80 100 110 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical Leakage vs. Temperature<br>Typical Maximum Load Current Typical Blocking Voltage Measured Across Pins 3 & 4<br>vs. Temperature vs. Temperature (VL=100V)<br>500 122 0.016<br>450 121 0.014<br>400 SSS 120 FES 0.012<br>350 po] [| | f ft ft 7 a 0.010 ee<br>300 2 119 2a<br>0.008<br>250 118<br>200 a 0.006<br>150 p | | fT F PS F 117 Fo | ae] fod 0.004 ae<br>100 S2 ee ECC 116 LZ 0.002 p |pet=<br>50 PIT 115 Pitt tT tt 0 e s es<br>-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Energy Rating Curve<br>1.0<br>0.9 SUNG ASN A<br>0.8 005/000 00<br>0.7 STISTCT TT<br>0.6 0010/0000,<br>0.5 20010 0000 aS0<br>0.4 250100000 00<br>0.3 0010/0000 O00<br>0.2 0010/0000 0<br>0.1 0010/0000 00<br>0 0010000008000 00 0<br>10μs 100μs 1ms 10ms 100ms 1s 10s 100s<br>Time<br>I  =5mA I  =10mA<br>On-Resistance () Turn-On Time (ms) Turn-Off Time (ms)<br>)P<br>A)<br>Leakage (<br>Load Current (mA) Blocking Voltage (V<br>Load Current (A)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 

R09 

**www.ixysic.com** 

**4** 

**CPC1004N** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of % the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~——————~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~——————~~|
|---|---|
|CPC1004N<br>~~——————~~|MSL 3<br>~~——————~~|



## **ESD Sensitivity** 

This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of **J-STD-020** must be observed. 

**Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles** CPC1004N 260ºC 30 seconds 3 ~~———————~~ **Board Wash** IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 

**www.ixysic.com** 

R09 

**5** 

**CPC1004N** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **CPC1004N** 

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4.089  ±  0.025 Recommended PCB Land Pattern<br>(0.161  ±  0.001)<br>0.203 ± 0.025<br>0.60<br>(0.008 ± 0.001)<br>(0.024)<br>3.810  ±  0.025 6.096  ±  0.102<br>(0.150  ±  0.001) ea t (0.240  ±  0.004) S 4p<br>0.559  ±  0.127<br>(0.022  ±  0.005) 3.85<br>Pin 1 0.910  ±  0.025 (0.152)<br>Ly, 2.54 Typ (0.036  ±  0.001) ia 1.54 rs ,<br>(0.100 Typ) (0.061)<br>ia<br>2.030 ±  0.025 2.54<br>(0.080 ±  0.001) Dimensions (0.10)<br>Package standoff: ee mm<br>0.064 ± 0.040 (inches)<br>0.481 (0.0025 ± 0.0015)<br>(0.019)<br>0.381  ±  0.025 Note:<br>(0-0.004)0-0.1 aa (0.015  ±  0.001) 1. Lead dimensions do not include plating: 1000 microinches max.<br>330.2 Dia<br>(13.00 Dia)<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>. K(0.106)0=2.70 A(0.256)0=6.50 P1=8.00(0.315)<br>K1=2.30<br>(0.091)<br>User Direction of Feed<br>: a Dimensions<br>Embossed mm<br>Carrier (inches)<br>an Meera<br>Embossment NOTE:  All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br>


**CPC1004NTR Tape & Reel** 

## **For additional information please visit our website at: www.ixysic.com** 

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.  Neither circuit patent licenses nor indemnity are expressed or implied.  Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. 

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage.  IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 

Specification:  DS-CPC1004N-R09 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved.  Printed in USA. 

**6** 

6/1/2018