CMWX1ZZABZ-078

Specification Number : BP-ABZ-C 

1/16 

## **Sub-G Module Data Sheet** 

**-** Sample Part Number: ~~SS~~ **CMWX1ZZABZ TEMP - - CMWX1ZZABZ TEMP 1** ~~et~~ **-** MP Part Number: **CMWX1ZZABZ 078** ~~SS~~ **- CMWX1ZZABZ 091** 

< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 2/16 

## ~~SS~~ **Revision History** 

## ~~SS~~ 

|Revision<br>Code|Date|Description|Comments|
|---|---|---|---|
|A|Dec 1,2016|Initial Draft||
|B|Jan 19,2017|Revise template||
|C|Oct 16, 2018|Updated the RF performance, Electrical Characteristics<br>and power up sequence.<br>Added weight info.<br>Updated P/N<br>Revised label info||
|||||



< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 3/16 

## **TABLE OF CONTENTS** 

1. Features ······················································································································· 4 2. Part Number ················································································································· 4 3. Block Diagram ··············································································································· 4 4. Label Information ·········································································································· 5 5. Absolute Maximum Ratings ····························································································· 5 6. Operating Condition ······································································································· 5 7. Electrical Characteristics ································································································ 6 7.1. FSK/OOK Transceiver Specification ············································································ 6 7.2. LoRa Transceiver Specification ··················································································· 6 7.3. SIGFOX Transceiver Specification ·············································································· 7 7.4. Low power mode current ···························································································· 7 8. Power Sequences ············································································································ 8 9. Reference circuit ············································································································ 9 10. Tape and Reel packing ·································································································· 11 11. Notice ························································································································ 14 CAUTION ················································································································ 16 

< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 

4/16 

## **1. Features** 

Interfaces : I2C, UART, USB, SPI Main ICs : STM32L, SX1276 Reference Clocks : Integrated 32MHz clock (TCXO with frequency error= `±` 2 ppm) and 32.768KHz clock (frequency error= `±` 20 ppm) Supported Frequencies : 868 MHz, 915 MHz Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max) Weight : 0.48g (Typ) Package : Metal Shield can RoHS : This module is compliant with the RoHS directive 

## **2. Part Number** 

|OrderingPart Number|MCU|Secure element|Description|
|---|---|---|---|
|CMWX1ZZABZ**-TEMP**|STM32L**082**|NA|Engineeringsample|
|CMWX1ZZABZ**-EVK**|STM32L**082**|NA|Evaluation board|
|CMWX1ZZABZ**-078**|STM32L**082**|NA|MP P/N|
|CMWX1ZZABZ**-TEMP-1**|STM32L**072**|NA|Engineeringsample|
|CMWX1ZZABZ**-EVK-1**|STM32L**072**|NA|Evaluation board|
|CMWX1ZZABZ**-091**|STM32L**072**|NA|MP P/N|



## **3. Block Diagram** 

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Specification Number : BP-ABZ-C 5/16 

## **4. Label Information** 

1 pin mark Product name FCC ID number IC ID number Inspection number TELEC logo KCC logo Murata Logo 

## **5. Absolute Maximum Ratings** 

**Table 3** Maximum ratings 

|Parameters|Parameters|Min|Typ|Max|Unit|
|---|---|---|---|---|---|
|StorageTemperature||-40|25|+90|degC|
|InputRF Level||-|-|10|dBm|
|Supply Voltage|VDD_USB|-0.3|-|3.9|V|
||VDD_MCU, VDD_RF, VDD_TCXO|-0.3|-|3.9|V|
||VREF+|-0.3|-|VDD_MCU+0.4|V|



## **6. Operating Condition** 

|Parameters|Parameters|Min|Typ|Max|Unit|
|---|---|---|---|---|---|
|OperatingTemperature<br>~~(1)~~||-40|25|+85|degC|
|Supply Voltage|VDD_USB (USBperipheral used) ~~(1)~~|3.0|-|3.6|V|
||VDD_USB(USB peripheral not used)(1)|VDD_MCU_minV|VDD_MCUV|VDD_MCU_max|V|
||VDD_MCU,VDD_RF,VDD_TCXO|2.2(3)|-|3.6|V|
||VREF+(2)|1.8|-|VDD_MCU|V|



(1) VDD_USB must respect the following conditions: 

- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU. 

- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU. 

- In operating mode, VDD_USB could be lower or higher than VDD_MCU. 

- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os. 

(2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is on the STM32L082*** datasheet and user guider. 

(3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V. 

< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 6/16 

## **7. Electrical Characteristics** 

## **7.1. FSK/OOK Transceiver Specification** 

## Conditions: 

Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx and Tx path matching, unless otherwise specified. 

## **FSK/OOK Receiver Specification** 

|**Symbol**|**Description**|**Conditions**|**Conditions**|**Min.**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|RF_OP|RF output power in 50 ohms<br>on RFO pin ( High efficiency<br>PA)|Programmable with<br>steps|Max<br>Min||14||dBm|
||||||-5||dBm|
|RF_OPH|RF output power in 50 ohms<br>on PA_BOOST pin( Regulated<br>PA)|Programmable with<br>1dB steps|Max<br>Min||18.5||dBm|
||||||2||dBm|
|ΔRF_<br>OPH_V|RF output power stability on<br>PA_BOOST pin versus voltage<br>supply.|VDD = 2.2 V to 3.6 V|||+/-1||dB|
|ΔRF_T|RF output power stability<br>versus temperature on<br>PA_BOOST pin.|From T = -40 °C to +85 °C|||+/-1.5||dB|
|IDDT (*)|Supply current in Transmit<br>mode with impedance<br>matching|RFOP = +20 dBm, on<br>PA_BOOST|||128||mA|
|||RFOP = +17 dBm, on<br>PA_BOOST|||106||mA|
|||RFOP = +14 dBm, on<br>RFO_HFpin|||47||mA|
|||RFOP = + 7 dBm, on<br>RFO_HF pin|||34||mA|



(*) IDDR and IDDT are total current consumption including MCU in active. 

## **7.2. LoRa Transceiver Specification** 

Conditions: 

The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes. With matched impedances 

## **LoRa Receiver Specification** 

|**Symbol**|**Description**|**Conditions**|**Min.**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|IDDR_L (*)|Supply current in receiver<br>LoRa mode, LnaBoost off|Band 1,BW = 125 kHz||21.5||mA|
|||Band 1,BW = 250 kHz||22.2||mA|
|||Band 1,BW = 500 kHz||23.6||mA|
|RFS_L125_HF|RF sensitivity, Long-Range<br>Mode, highest LNA gain,<br>LnaBoost for Band1, using<br>split Rx/Tx path<br>125 kHz bandwidth|SF = 6||-117.5||dBm|
|||SF = 7||-122.5||dBm|
|||SF = 8||-125.5||dBm|
|||SF = 9||-128.5||dBm|
|||SF = 10||-131.0||dBm|
|||SF = 11||-133.5|-133.5|dBm|
|||SF = 12||-135.5||dBm|
|RFS_L250_HF|RF sensitivity, Long-Range<br>Mode, highest LNA gain,<br>LnaBoost for Band1, using<br>split Rx/Tx path|SF = 6||-114.0||dBm|
|||SF = 7||-119.0|-119.0|dBm|
|||SF = 8||-122.0||dBm|
|||SF = 9||-125.0||dBm|



< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 7/16 

||250 kHz bandwidth|SF = 10||-127.5|-127.5|dBm|
|---|---|---|---|---|---|---|
|||SF = 11||-130.0|-130.0|dBm|
|||SF = 12||-133.0|-133.0|dBm|



## **LoRa Transmitter Specification** 

|**Symbol**|**Description**|**Conditions**|**Min.**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|IDDT_L (*)|Supply current in transmitter<br>mode|RFOP setting= 14 dBm||47||mA|
|||RFOP setting= 10 dBm||36||mA|
|IDDT_H_L (*)|Supply current in transmitter<br>mode|Using PA_BOOST pin<br>RFOP setting= 20 dBm||128||mA|



(*) IDDR_L, IDDT_L and IDDT_H_L are total current consumption including MCU in active. 

## **7.3. SIGFOX Transceiver Specification** 

Conditions: 

The table below gives the electrical specifications for the transceiver operating with SIGFOX modulation. Following conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C. With matched impedances. 

Notes: To operate as SIGFOX mode, the following configuration is required. 

- TCXO_OUT (Pin 47) must be connected to PH0-OSC_IN (Pin46). 

- PA12 (Pin 1) must be connected to TXCO_VCC (Pin48). 

- SX1276_DIO4 (Pin10) must be connected to PA5 (Pin21). 

## **SIGFOX Receiver Specification** 

|**Symbol**|**Description**|**Conditions**|**Min.**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RFS_F_HF||AT$SB=x,1,<br>AT$SF=x,1,<br>AT$SR PER<0.1||-122||dBm|
|IDDR_S|Supply current in Receive<br>mode|AT$TM=3,10|<br>|23|<br>|mA|



## **SIGFOX Transmitter Specification** 

|**Symbol**|**Description**|**Conditions**|**Conditions**|**Min.**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|RF_OP_S|RF output power in 50 ohms<br>on RF pin|Programmable with<br>steps<br>AT$SF|Max<br>Min||18.5||dBm|
||||||4.5||dBm|
|IDDT_S|Supply current in Transmit<br>mode with impedance<br>matching|Output power setting 20 dBm<br>AT$SF|||128||mA|
|||Output power setting 14 dBm<br>AT$SF|||44||mA|



## **7.4. Low power mode current** 

Conditions: 

|**Mode**|**Description**<br>~~(*1) (*3)~~|**Min.**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|Mode0|STM32L0 in Stop mode with RTC (Real Time Clock)~~(*1) (*3)~~<br>SX1276 in Sleep mode<br>~~(*2)~~||1.65||uA|
|Mode1|STM32L0 in Standby mode with RTC (Real Time Clock)~~(*2)~~<br>SX1276inSleepmode||1.40||uA|



(*1) The Stop mode achieves the lowest power consumption while retaining the RAM and register contents and real time clock. All clocks in the VCORE domain are stopped, the PLL, MSI RC, HSE crystal and HSI RC oscillators are disabled. The LSE or LSI is still running. The voltage regulator is in the low-power mode. 

Some peripherals featuring wakeup capability can enable the HSI RC during Stop mode to detect their wakeup condition. The device can be woken up from Stop mode by any of the EXTI line, in 3.5us, the processor can serve the interrupt or resume the code. The EXTI line source can be any GPIO. It can be the PVD output, the comparator 1 event or comparator 2 event (if internal reference voltage is on), it can be the RTC alarm/tamper/timestamp/wakeup events, the USB/USART/I2C/LPUART/LPTIMER wakeup events. 

(*2) The Standby mode is used to achieve the lowest power consumption and real time clock. The internal voltage regulator is switched off so that the entire VCORE domain is powered off. The PLL, MSI RC, HSE crystal and HSI RC oscillators are also switched off. The LSE or LSI is still running. After entering Standby mode, the RAM and register contents are lost except for registers in the Standby circuitry (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32 KHz oscillator, RCC_CSR register). The device exits Standby mode in 60 μs when an external reset (NRST pin), an 

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Specification Number : BP-ABZ-C 8/16 

IWDG reset, a rising edge on one of the three WKUP pins, RTC alarm (Alarm A or Alarm B), RTC tamper event, RTC timestamp event or RTC Wakeup event occurs. 

(*3) STM SigFox Firmware is always in stop mode by default, it wakes up automatically when receiving one character. Else it wakes up automatically when an interrupt is to be processed and returns in stop mode when finished. 

## **8. Power Sequences** 

## **8.1 Power Up Sequence** 

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Specification Number : BP-ABZ-C 9 / 16 

## **9. Reference circuit** 

In case of using the module as LoRa 

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VDD<br>J1<br>1<br>SWCLK 2 1<br>3 2<br>SWDIO 4 5 34 SWD connector<br>6 5<br>For VDD_TCXO connection 6<br>Option1:Connect VDD_TCXO to VDD Optional R1<br>Option2:Connect VDD_TCXO to PA12 so  10K<br>that MCU can control TCXO on/off<br>So Module reset do not need<br>VDD_TCXO external pull up resistor.<br>Because there is an about<br>45K permanent pull up<br>resistor inside of module.<br>The VDD_USB is the power supply for<br>PA11 and PA12.<br>5455 GND Button11 2 Notes for VREF+:<br>—— VDD_USB — = 5657 GNDGNDGND lf: | = 1. VREF+ can be grounded or floating when DAC and ADC function are not active.<br>2. VREF+ should be connected to VDD<br>C110uF C20.1uF 1 36 C6 0.1uF if module is battery powered and need to<br>2 PA12/USB_DP PB9/I2C1_SDA 35 monitor the battery voltage<br>3 PA11/USB_DM PB8/I2C1_SCL 34 module reset<br>4 GND MCU_nRST 33<br>VDD 5 VDD_USB PA0/WKUP1 32 VREF+<br>6 VDD_MCU VREF+ 31 V DD<br>7 VDD_RF STSAFE_nRST 30 C7<br>C3 C4 C5 8 GND DBG_CRF2 29<br>10uF 1uF 0.1uF 9 DBG_SX1276_DIO2 DBG_CRF3 28 1uF<br>10 DBG_SX1276_DIO3 DBG_CRF1 27 J2<br>11 SX1276_DIO4 GND 26 2<br>12 DBG_SX1276_DIO5 ANT 25<br>DBG_SX1276_DIO1 GND 1 3<br>L1<br>5 4<br>C8 C9<br>To y ‘ = = a Fe<br>U1<br>CMWX1ZZABZ-078/091 SMA connector<br>USART2_TX<br>USART2_RX<br>USART1_TX<br>USART1_RX<br>53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37<br>GND GND GND GND GND VDD_TCXO TCXO_OUT PH0-OSC_IN PH1-OSC_OUT GND BOOT0 PA14/SWCLK/LPUART1_TX PA13/SWDIO/LPUART1_RX PB5/LPTIM1_IN1 PB6/LPTIM1_ETR PB7/LPTIM1_IN2 PB2/LPTIM1_OUT<br>DBG_SX1276_DIO0 PB15/SPI2_MOSI PB14/SPI2_MISO PB13/SPI2_SCK PB12/SPI2_NSS PA10/USART1_RX PA9/USART1_TX PA8/MCO PA5/ADC5/DAC2 PA4/ADC4/DAC1 PA3/ADC3/USART2_RX/LPUART1_RX PA2/ADC2/USART2_TX/LPUART1_TX<br>13 14 15 16 17 18 19 20 21 22 23 24<br>**----- End of picture text -----**<br>


< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 

10/ 16 

In case of using the module as SigFox modem with STM SigFox firmware 

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VDD<br>J1<br>1<br>SWCLK 2 1<br>3 2<br>SWDIO 45 34 SWD connector<br>6 5<br>6<br>R1<br>10K<br>Module reset do not need<br>VDD_TCXO external pull up resistor.<br>Because there is an about<br>45K permanent pull up<br>resistor inside of module.<br>m 54 at ll a Button1<br>55 GND 1 2<br>56 GND<br>= 57 GND<br>The VDD_USB is must. GND<br>Because it is the power<br>C1 0.1uF ;<br>supply for PA11 and PA12. 1 36<br>2 PA12/USB_DP PB9/I2C1_SDA 35<br>3 PA11/USB_DM PB8/I2C1_SCL 34 module reset<br>VDD — 45 GNDVDD_USB PA0/WKUP1MCU_nRST 33 32 : VREF+<br>6 VDD_MCU VREF+ 31 V DD<br>C3 C4 C5 78 VDD_RFGND STSAFE_nRSTDBG_CRF2 30 29 : C6<br>10uF 1uF 0.1uF 109 DBG_SX1276_DIO2DBG_SX1276_DIO3 DBG_CRF3DBG_CRF1 2827 1uF J2<br>11 SX1276_DIO4 GND 26 2<br>tL : 12 DBG_SX1276_DIO5 ANT = 25 + 5<br>DBG_SX1276_DIO1 GND 1 3<br>L1<br>5 4<br>C8 C9<br>U1 SMA connector<br>t o a -<br>CMWX1ZZABZ-099<br>Host Interf ace USART_TX<br>Host Interf ace USART_RX<br>53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37<br>GND GND GND GND GND VDD_TCXO TCXO_OUT PH0-OSC_IN PH1-OSC_OUT GND BOOT0 PA14/SWCLK/LPUART1_TX PA13/SWDIO/LPUART1_RX PB5/LPTIM1_IN1 PB6/LPTIM1_ETR PB7/LPTIM1_IN2 PB2/LPTIM1_OUT<br>DBG_SX1276_DIO0 PB15/SPI2_MOSI PB14/SPI2_MISO PB13/SPI2_SCK PB12/SPI2_NSS PA10/USART1_RX PA9/USART1_TX PA8/MCO PA5/ADC5/DAC2 PA4/ADC4/DAC1 PA3/ADC3/USART2_RX/LPUART1_RX PA2/ADC2/USART2_TX/LPUART1_TX<br>13 14 15 16 17 18 19 20 21 22 23 24<br>**----- End of picture text -----**<br>


< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 11/ 16 

## **10. Tape and Reel packing** 

## **10.1 Dimension of Tape (Plastic tape)** 

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2.0±0.1<br>4.0±0.1 * [1] 1.5+0.1/-0.0 0.30±0.05<br>—— oF 6 PO T;O HO OO00000<br>1.5+0.1/-0 24.0±0.1 12.1±0.1<br>AGGIE}<br>ne: 2±0.15<br>feeding direction<br>Label<br>Wits<br>R80<br>R135<br>φ<br>R5<br>a 22<br>120<br>W1<br>W2<br>:<br>Reel inside width W1: 25.5±1.0<br>Reel outside width W2: 29.5±1.0<br>Unit: mm<br>1.75±0.10<br>11.5±0.1<br>24.0±0.3<br>13±0.1<br>2<br>±<br>1<br>330 0.2<br>±<br>φ ±<br> 80 13<br>φ φ<br>**----- End of picture text -----**<br>


(unit : mm) 

## **10.2 Dimensions of Reel** 

< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

**==> picture [443 x 461] intentionally omitted <==**

**----- Start of picture text -----**<br>
Specification Number : BP-ABZ-C<br>  12/ 16<br>[1] Feeding Hole : As specified in (1)<br>[2] Hole for chip : As specified in (1)<br>[3] Cover tape  : 62μm in thickness<br>[4] Base tape  : As specified in (1)<br>.<br>[3]<br>[1]<br>[2]<br>[3]<br>N E:<br>[4]<br>Feeding Hole<br>O OO O<br>Feeding Direction<br>Chip<br>+<br>**----- End of picture text -----**<br>


## **10.3 Taping Diagrams** 

## **10.4 Leader and Tail tape** 

Tail tape (No components) Components No components 

Leader tape (Cover tape alone) 

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(Cover tape alone)<br>HOGIL<br>40 to 200mm 150mm min. 250mm min.<br>Feeding direction<br>**----- End of picture text -----**<br>


< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 13/ 16 

- The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. 

- The cover tape and base tape are not adhered at no components area for 250mm min. 

- Tear off strength against pulling of cover tape : 5N min. 

- Packaging unit : 1000 pcs/ reel 

- - Material 

   - Base tape : Plastic 

   - Reel : Plastic 

- Cover tape, cavity tape and reel are made the anti-static processing. 

- - Peeling of force: 1.3N max. in the direction of peeling as shown below. 

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165 to 180 °<br>**----- End of picture text -----**<br>


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1.3 N max.<br>0.7 N max.<br>Cover tape<br>Base tape<br>**----- End of picture text -----**<br>


- Packaging (Humidity proof Packing) 

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Label<br>表示ラべル<br>Desiccant<br>乾燥剤<br>Humidity<br>湿度<br>Indicatorインジケ－タ<br>-<br>// 表示ラベルLabel  E<br>Anti-humidity 防湿梱包袋<br>Plastic Bag<br>**----- End of picture text -----**<br>


Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 

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Specification Number : BP-ABZ-C 14/ 16 

## **11. Notice** 

## **11.1 Storage Conditions** 

Please use this product within 6month after receipt. 

- The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH. 

(Packing materials, in particular, may be deformed at the temperature over 40 °C) 

- The product left more than 6months after reception, it needs to be confirmed the solderbility before used. 

- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). 

- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. 

This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) 

- After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be used within 168 hours. 

- When the color of the indicator in the packing changed, the product shall be baked before soldering. 

Baking condition: 125 +5/-0 °C, 24 hours, 1 time 

The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 

## **11.2 Handling Conditions** 

Be careful in handling or transporting products because excessive stress or mechanical shock may break products. 

Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability. 

## **11.3 Standard PCB Design (Land Pattern and Dimensions)** 

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. 

The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 

## **11.4 Notice for Chip Placer :** 

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. 

## **11.5 Soldering Conditions** ： 

The recommendation conditions of soldering are as in the following figure. 

When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C.  Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. 

Contact Murata before use if concerning other soldering conditions. 

< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 15/ 16 

**==> picture [371 x 220] intentionally omitted <==**

**----- Start of picture text -----**<br>
Reflow Soldering Standard Conditions (Example)<br>Within 3 s<br>240 ~ 250 °C<br>220 °C [\ Cooling down<br>Slowly<br>180 °C<br>150 °C V ELL<br>Pre-heating<br>F a<br>Within 120 s Within 60 s  time(s)<br>**----- End of picture text -----**<br>


Please use the reflow within 2 times. 

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 

## **11.6 Cleaning :** 

Since this Product is Moisture Sensitive, any cleaning is not permitted. 

## **11.7 Operational Environment Conditions :** 

Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. 

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx  etc.). 

- In an atmosphere containing combustible and volatile gases. 

- Dusty place. 

- Direct sunlight place. 

- Water splashing place. 

- Humid place where water condenses. 

- Freezing place. 

If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. 

As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 

## **11.8 Input Power Capacity :** 

Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. 

< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd. 

Specification Number : BP-ABZ-C 16/ 16 

## CAUTION 

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. 

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. 

All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. 

Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. 

WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. 

The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. 

Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. 

- Aircraft equipment. 

- Aerospace equipment 

- Undersea equipment. 

- Power plant control equipment 

- Medical equipment. 

- Transportation equipment (vehicles, trains, ships, elevator, etc.). 

- Traffic signal equipment. 

- Disaster prevention / crime prevention equipment. 

- Burning / explosion control equipment 

- Application of similar complexity and/ or reliability requirements to the applications listed in the above. 

We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and reproducing our product.  Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. 

We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. 

Please do not use our products, our technical information and other  data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. 

Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. 

Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. 

Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for consumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the defect was caused by components in Products supplied to Murata from a third party). 

By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. 

When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. 

Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. 

In particular we disclaim liability for damages caused by 

- `・` the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, 

- `・` deviation or lapse in function of engineering sample, 

- `・` improper use of engineering samples. 

We disclaims any liability for consequential and incidental damages. 

If you can’t agree the above contents, you should inquire our sales. 

< Specification may be changed by Murata without notice > Murata (China) Investment Co., Ltd.