CMF-SDP10-2
Resettable Fuse, PPTC, SMD Cube, CMF-SDP, 230 VAC, 180 mA, 360 mA, 3.8 s
- Manufacturer: BOURNS
- Product type: Surface Mount PPTCs
- Time to Trip: 3.8s
- Product Range: CMF-SDP
- Voltage Rating: 230VAC
- Holding Current: 180mA
- PPTC Case Style: SMD Cube
- Tripping Current: 360mA
- Current Rating Max: 1A
- Thermistor Mounting: SMD
- Operating Temperature Max: 125°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 0.295 € |
| Current stock | 10+ |
| Lead time | 7 days |
**==> picture [45 x 42] intentionally omitted <==** **----- Start of picture text -----**<br> *RoHS COMPLIANT<br>**----- End of picture text -----**<br> ## **Features** n Two resistance-matched PTCs in a plastic housing n Narrow resistance tolerance n RoHS compliant* ## **Applications** Used as a secondary overcurrent protection device in: n Customer Premise Equipment (CPE) n Central Office (CO) n Access equipment |**Model**<br>~~a~~|**Induction**<br>**Voltage**<br>**Withstand**<br>~~a~~|**Rated**<br>**Voltage**<br>~~a~~|**Rated**<br>**Resistance**<br>**(RN)**<br>~~a~~|**Rated**<br>**Resistance**<br>**(RN)**<br>~~a~~|**Resistance**<br>**Matching in**<br>**Housing**<br>~~a~~|**Hold**<br>**Current**<br>~~a~~|**Trip**<br>**Current**<br>~~a~~|**Imax @**<br>**230 VAC**<br>~~a~~|**Typ. Time**<br>**to Trip @**<br>**Imax / 230**<br>**VAC**<br>~~a~~| |---|---|---|---|---|---|---|---|---|---| ||VAC<br>~~a~~|Volts<br>~~a~~|Ohms<br>~~a~~|Tolerance<br>~~a~~|Ohms<br>~~a~~|Amps @25°C<br>~~a~~|Amps @25°C<br>~~a~~|Amps<br>~~a~~|Seconds<br>~~a~~| |CMF-SDP07<br>~~a~~|250<br>~~a~~|230<br>~~a~~|7<br>~~a~~|±20 %<br>~~a~~|<=1.0<br>~~a~~|0.080<br>~~a~~|0.200<br>~~a~~|3.0<br>~~a~~|0.45<br>~~a~~| |CMF-SDP10<br>~~a~~|250<br>~~a~~|230<br>~~a~~|10<br>~~a~~|±20 %<br>~~a~~|<=1.0<br>~~a~~|0.180<br>~~a~~|0.360<br>~~a~~|1.0<br>~~a~~|3.8<br>~~a~~| |CMF-SDP10A<br>~~ee~~|250<br>~~ee~~|230<br>~~ee~~|10<br>~~ee~~|±20 %<br>~~ee~~|<=1.0<br>~~ee~~|0.150<br>~~ee~~|0.360<br>~~ee~~|1.0<br>~~ee~~|3.8<br>~~ee~~| |CMF-SDP25<br>~~ee~~|250<br>~~ee~~|230<br>~~ee~~|25<br>~~ee~~|±20 %<br>~~ee~~|<=1.0<br>~~ee~~|0.130<br>~~ee~~|0.260<br>~~ee~~|2.8<br>~~ee~~|0.2<br>~~ee~~| |CMF-SDP25A<br>~~ee~~<br>~~ee~~|250<br>~~ee~~<br>~~ee~~|230<br>~~ee~~<br>~~ee~~|25<br>~~ee~~<br>~~ee~~|±20 %<br>~~ee~~<br>~~ee~~|<=1.0<br>~~ee~~<br>~~ee~~|0.130<br>~~ee~~<br>~~ee~~|0.260<br>~~ee~~<br>~~ee~~|2.8<br>~~ee~~<br>~~ee~~|0.3<br>~~ee~~<br>~~ee~~| |CMF-SDP35<br>~~ee~~|600<br>~~ee~~|230<br>~~ee~~|35<br>~~ee~~|+15/-20 %<br>~~ee~~|<=1.0<br>~~ee~~|0.110<br>~~ee~~|0.230<br>~~ee~~|4.6<br>~~ee~~|0.06<br>~~ee~~| |CMF-SDP35A<br>~~ee~~|600<br>~~ee~~|230<br>~~ee~~|35<br>~~ee~~|+15/-20 %<br>~~ee~~|<=1.0<br>~~ee~~|0.110<br>~~ee~~|0.230<br>~~ee~~|2.5<br>~~ee~~|0.2<br>~~ee~~| |CMF-SDP50<br>~~ee~~<br>~~ee~~|600<br>~~ee~~<br>~~ee~~|230<br>~~ee~~<br>~~ee~~|50<br>~~ee~~<br>~~ee~~|±15 %<br>~~ee~~<br>~~ee~~|<=1.0<br>~~ee~~<br>~~ee~~|0.090<br>~~ee~~<br>~~ee~~|0.190<br>~~ee~~<br>~~ee~~|2.5<br>~~ee~~<br>~~ee~~|0.13<br>~~ee~~<br>~~ee~~| |CMF-SDP50A<br>~~ee~~|600<br>~~ee~~|230<br>~~ee~~|50<br>~~ee~~|±15 %<br>~~ee~~|<=1.0<br>~~ee~~|0.090<br>~~ee~~|0.190<br>~~ee~~|2.5<br>~~ee~~|0.2<br>~~ee~~| |CMF-SDP75<br>~~ee~~|600<br>~~ee~~|230<br>~~ee~~|75<br>~~ee~~|±20 %<br>~~ee~~|<=2.0<br>~~ee~~|0.070<br>~~ee~~|0.150<br>~~ee~~|2.5<br>~~ee~~|0.12<br>~~ee~~| ## ~~**Test Procedures And Requirements For Model CMF-SDP Series**~~ **Primary Test Protection Test Condition Requirements** Mains Power Contact - ITU-T K.20, K.21 .... None .............. 230 V rms, 10 ohms, 15 Min. .....................................................(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21 ............. None .............. 600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. ......(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21 ............. GDT ............... 600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. .........(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21 ............. GDT ............... 600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. .........(Ri-Rf) / Ri < ±10 % Lightning Surge - ITU-T K.20, K.21 ..................................... 10/700 μs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. ................(Ri-Rf) / Ri < ±10 % Lightning Surge ................................................................... 10/1000 μs, 60 ohms, 1.5 kV, 30 Tests, every 3 Min. ...............(Ri-Rf) / Ri < ±10 % Ri = R initial Rf = R final ## ~~**Typical Part Marking**~~ Represents total content. Layout may vary. **==> picture [159 x 81] intentionally omitted <==** **----- Start of picture text -----**<br> PART MANUFACTURER'S<br>IDENTIFICATION: TRADEMARK<br>07P = CMF-SDP07<br>10P = CMF-SDP10<br>BI-WEEKLY<br>10PA = CMF-SDP10A 35P8G DATE CODE:<br>25P = CMF-SDP25<br>WEEK 13-14 = G<br>25PA = CMF-SDP25A<br>35PA = CMF-SDP35A35P = CMF-SDP35 | YEAR CODE:<br>50P = CMF-SDP50 8 = 2008<br>50PA = CMF-SDP50A<br>75P = CMF-SDP75<br>**----- End of picture text -----**<br> ## ~~**How to Order**~~ **==> picture [154 x 146] intentionally omitted <==** **----- Start of picture text -----**<br> CMF - SD P 35 A -XX - 2<br>Product Designator<br>Style<br>SD = Surface Mount<br> Dual Pkg.<br>Housing<br>P = Plastic<br>Rated Resistance (RN)<br>7-75 (7-75 Ohms)<br>Footprint and Height Option<br>Blank = Standard Product<br>A = Reduced Footprint and Height<br>Resistance Tolerance Option<br>Blank = Standard<br>-XX = XX %; e.g. -10 = ±10 %<br>Packaging<br>- 2 = Tape & Reel<br>**----- End of picture text -----**<br> **Asia-Pacific:** Tel: +886-2 2562-4117 Email: asiacus@bourns.com **Europe:** Tel: +36 88 520 390 Email: eurocus@bourns.com **The Americas:** Tel: +1-951 781-5500 Email: americus@bourns.com **www.bourns.com** *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **CMF-SDP Series - Telecom CPTC Resettable Fuses** ## ~~**Solder Refow Recommendations**~~ **==> picture [259 x 148] intentionally omitted <==** **----- Start of picture text -----**<br> 300 Preheating Soldering Cooling<br>250<br>200<br>150<br>100<br>50<br>0<br>160–220 10–20 120<br>Time (seconds)<br>C)ϒ<br>Temperature (<br>**----- End of picture text -----**<br> ## **Solder reflow** - Recommended reflow methods: IR, vapor phase oven, hot air oven. - Devices are not designed to be wave soldered to the bottom side of the board. - Gluing the devices is not recommended. - Recommended maximum paste thickness is 0.25 mm (.010 inch). - Devices can be cleaned using standard industry methods and solvents. ## **Note:** - If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. ## **Rework** - A device should not be reworked. ## ~~**Product Dimensions**~~ ## **CMF-SDP05, 07, 10, 25, 35, 50 & 75** **==> picture [199 x 133] intentionally omitted <==** **----- Start of picture text -----**<br> 11.5<br>(.453)<br>MAX.<br>9.0 2.6<br>(.354) [MAX.] (.102) 5.0<br>(.197)<br>11.0<br>(.433) [MAX.]<br>**----- End of picture text -----**<br> ## ~~**Recommended Pad Layout**~~ **==> picture [214 x 148] intentionally omitted <==** **----- Start of picture text -----**<br> 9.0<br>(.354)<br>11.0<br>(.433)<br>7.6<br>(.299)<br>5.0<br>(.197)<br>3.2 2.6<br>10.0 (.126) 2.0 (.102)<br>(.394) (.079)<br>Packaging - Tape and Reel: 350 pcs. per reel<br>**----- End of picture text -----**<br> ## **CMF-SDP10A, 25A, 35A, 50A & 75A** **==> picture [216 x 312] intentionally omitted <==** **----- Start of picture text -----**<br> 8.75<br>(.344) [MAX.]<br>10.2<br>(402)<br>MAX.<br>2.4 0.5 7.2<br>(.094)3.9 2 PLCS.(.020) (.283) MAX.<br>(.154)<br>7.2<br>(.283)<br>MAX.<br>MAX.<br>8.75<br>6.3<br>(.344)<br>(.248)<br>3.9<br>(.154)<br>2.4<br>3.2 (.094)<br>8.2 (.126) 2.0<br>(.323) (.079)<br>MM<br>DIMENSIONS:<br>(INCHES)<br>Packaging - Tape and Reel: 350 pcs. per reel<br>**----- End of picture text -----**<br> CMF-SDP SERIES, REV. E, 07/16 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **CMF-SDP Series Tape and Reel Specifications** |**Tape Dimensions per EIA 481-2**<br>**CMF-SDP10-2, CMF-SDP25-2,**<br>**CMF-SDP-35-2, CMF-SDP50-2,**<br>**CMF-SDP10A-2, CMF-SDP25A-2,**<br>**CMF-SDP75-2**<br>**CMF-SDP35A-2, CMF-SDP50A-2**|**Tape Dimensions per EIA 481-2**<br>**CMF-SDP10-2, CMF-SDP25-2,**<br>**CMF-SDP-35-2, CMF-SDP50-2,**<br>**CMF-SDP10A-2, CMF-SDP25A-2,**<br>**CMF-SDP75-2**<br>**CMF-SDP35A-2, CMF-SDP50A-2**|**Tape Dimensions per EIA 481-2**<br>**CMF-SDP10-2, CMF-SDP25-2,**<br>**CMF-SDP-35-2, CMF-SDP50-2,**<br>**CMF-SDP10A-2, CMF-SDP25A-2,**<br>**CMF-SDP75-2**<br>**CMF-SDP35A-2, CMF-SDP50A-2**|**Tape Dimensions per EIA 481-2**<br>**CMF-SDP10-2, CMF-SDP25-2,**<br>**CMF-SDP-35-2, CMF-SDP50-2,**<br>**CMF-SDP10A-2, CMF-SDP25A-2,**<br>**CMF-SDP75-2**<br>**CMF-SDP35A-2, CMF-SDP50A-2**| |---|---|---|---| |W<br>(|24.0 ±0.5<br>0.945 ±0.020)|24.0 ±0.5<br>(0.945 ±0.020)|| |P0|4.0<br>(0.157)||4.0<br>(0.157)| |P|16.0<br>(0.630)||16.0<br>(0.630)| |P2|2.0<br>(0.079)||2.0<br>(0.079)| |A0<br>(0|9.2 ± 0.2<br>.362 ± 0.008)|7.5 ± 0.2<br>(0.295 ± 0.008)|| |B0<br>(0|11.0 ± 0.2<br>.441 ± 0.008)|9.0 ± 0.2<br>(0.354 ± 0.008)|| |D|1.5<br>(0.059)||1.5<br>(0.059)| |F|11.5<br>(0.453)||11.5<br>(0.453)| |E|1.75<br>(0.069)||1.75<br>(0.069)| |t<br>(0|0.5 ± 0.15<br>.020 ± 0.006)|0.5 ± 0.15<br>(0.020 ± 0.006)|| |K0<br>(0|11.5 ± 0.2<br>.453 ± 0.008)|10.0 ± 0.2<br>(0.394 ± 0.008)|| **==> picture [365 x 295] intentionally omitted <==** **----- Start of picture text -----**<br> D P2 P0 E T -0.4<br>(-.016)<br>F<br>W<br>B0<br>P A0 K0<br>MM<br>DIMENSIONS:<br>(INCHES)<br>330 -2/+0<br>(12.99 -.079/+0)<br>DIA.<br>24.4 13.2 +0.2/-0<br>(.961) 30.4 (.520 +.008/-0<br>MIN.<br>(1.197) 100 ± 1.5<br>MAX. (3.94 ± .059)<br>DIA.<br>**----- End of picture text -----**<br> Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
Updated at February 9, 2023
Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.
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