CM322522-R68ML

POWER INDUCTORS-SMD .68UH 20 WIREW

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Manufacturer: BOURNS / PARTNER STOCK
Product type: Wirewound Inductors
SVHC: No SVHC (04-Feb-2026)

Delivery and price
Units per pack	6000
Price	0.121 €
Current stock	1000+
Lead time	30 days

Datasheet

**Applications** n Mobile phones n Cellular phones 

## **Features** 

**==> picture [509 x 727] intentionally omitted <==**

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|||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|n|High resistance to heat and humidity|n|Mobile phones|
|n|Resistance to mechanical shock and|n|Cellular phones|
|pressure|n|CTV, VCR, HIC, FDD|
|n|Accurate dimensions for automatic|
|surface mounting|
|n|Inductance range: 0.12 to 150 µH|
|n|RoHS compliant*|
|CM322522 Series - Chip Inductor|
|BOURNS|Ee|
|Electrical Specifcations @25 °C|General Specifcations|
|Operating Temperature|
|Inductance|
|................................-40 °C to +125 °C|
|Standard|Other|Q|Test|SRF|DCR|
|Bourns|Tol.|Tol.|Min.|Frequency|Min.|Max.|IDC|(Temperature rise included)|
|Part No.|µH|(%)|(%)|(MHz)|(MHz)|(|W|)|(mA)|Storage Temperature|
|................................-40 °C to +125 °C|
|CM322522-R12ML|0.12|± 20|N/A|30|25.2|500|0.22|450|
|||CM322522-R15ML|feet]|0.15|± 20|N/A|30|25.2|tt|450|0.25|450|Resistance to Soldering Heat|
|.............................. 245 °C, 5 seconds|
|CM322522-R18ML|0.18|± 20|N/A|30|25.2|400|0.28|450|Temperature Rise ..........................20 °C|
|CM322522-R22*L|0.22|± 20|± 10|30|25.2|350|0.32|450|Rated Current .... Inductance drops 10 %|
|CM322522-R27*L|0.27|± 20|± 10|30|25.2|320|0.36|450|Moisture Sensitivity Level .....................3|
|CM322522-R33*L|0.33|± 20|± 10|30|25.2|300|0.4|450|
|ESD Classification (HBM)...................3B|
|CM322522-R39*L|0.39|± 20|± 10|30|25.2|250|0.45|450|
|CM322522-R47*L|0.47|± 20|± 10|30|25.2|220|0.5|450|Materials|
|CM322522-R56*L|0.56|± 20|± 10|30|25.2|180|0.55|450|
|Core ..............................................Ferrite|
|CM322522-R68*L|0.68|± 20|± 10|30|25.2|160|0.6|450|
|Wire ...........................Enamelled copper|
|CM322522-R82*L|0.82|± 20|± 10|30|25.2|140|0.65|450|Enclosure.............................Epoxy resin|
|CM322522-1R0*L|1|± 10|± 5|30|7.96|120|0.7|400|Terminal Finish ...................................Sn|
|CM322522-1R2*L|1.2|± 10|± 5|30|7.96|100|0.75|390|Packaging ...... 2,000 pcs. per 7-inch reel|
|CM322522-1R5*L|1.5|± 10|± 5|30|7.96|85|0.85|370|
|CM322522-1R8*L|1.8|± 10|± 5|30|7.96|80|0.9|350|
|Product Dimensions|
|CM322522-2R2*L|2.2|± 10|± 5|30|7.96|75|1|320|
|CM322522-2R7*L|2.7|± 10|± 5|30|7.96|70|1.1|290|2.90 ± 0.2|
|CM322522-3R3*L|3.3|± 10|± 5|30|7.96|60|1.2|260|(.114 ± .008)|
|CM322522-3R9*L|3.9|± 10|± 5|30|7.96|55|1.3|250|
|CM322522-4R7*L|4.7|± 10|± 5|30|7.96|50|1.5|220|
|CM322522-5R6*L|5.6|± 10|± 5|30|7.96|45|1.6|200|
|—|CM322522-6R8*L|6.8|± 10|± 5|30|7.96|40|1.8|180|
|CM322522-8R2*L|8.2|± 10|± 5|30|7.96|35|2|170|
|CM322522-100*L|10|± 10|± 5|30|2.52|30|2.1|150|
|—|CM322522-120*L|12|± 10|± 5|30|2.52|20|2.5|140|2.20 ± 0.2|
|CM322522-150*L|15|± 10|± 5|30|2.52|20|2.8|130|(.087 ± .008)|
|CM322522-180*L|18|± 10|± 5|30|2.52|20|3.3|120|
|=|CM322522-220*L|eeeSESS|22|± 10|± 5|30|2.52|20|3.7|110|0.60 +0.3/-0.0|bn=||0.60 +0.3/-0.0|
|CM322522-270*L|27|± 10|± 5|30|2.52|20|5|80|(.024 +.012/-.000)|(.024 +.012/-.000)|
|3.20 ± 0.4|
|CM322522-330*L|33|± 10|± 5|30|2.52|17|5.6|70|(.126 ± .016)|
|SS|CM322522-390*L|39|± 10|± 5|30|2.52|16|6.4|65|Ea|
|CM322522-470*L|47|± 10|± 5|30|2.52|15|7|60|
|CM322522-560*L|56|± 10|± 5|30|2.52|13|8|55|
|CM322522-680*L|68|± 10|± 5|30|2.52|12|9|50|
|CM322522-820*L|82|± 10|± 5|30|2.52|11|10|45|
|SSS|CM322522-101*L|100|± 10|± 5|20|SSS|0.796|10|11|40|0.75 +0.2|0.75 +0.2|
|(.030 +.008)|(.030 +.008)|
|CM322522-121*L|120|± 10|± 5|20|0.796|10|11|70|1.00 ± 0.2|
|CM322522-151*L|150|± 10|± 5|20|0.796|8|15|65|2.50 ± 0.2|(.039 ± .008)|
|rr|(.098 ± .008)|me|
|* Enter Standard or Other Tolerance Code:|
|M = ±20 %, K = ±10 %, J = ±5 %|Schematic|
|Recommended Layout|
|1.9 ~ 2.4|
|(.075 ~ .094)|
|*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.|
|Specifications are subject to change without notice.The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.|oe|DIMENSIONS:(.047 ~ .051)|—t|_|1.2 ~ 1.3|Mr|MM|fee|Dh|(.063 ~ .079)1.6 ~ 2.0(.047 ~ .051)|—|1.2 ~ 1.3|
|(INCHES)|

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The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SRF0504 Series - Line FilterCM322522 Series - Chip Inductor** 

## ~~**Soldering Profle**~~ 

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Temperature Preheat Reflow Forced<br>Rising Area Area Area Cooling Area<br>a 150~200 °C / 60~180 Sec. 6 °C/Sec. Max.<br>250 Peak Temperature: 250 °C Peak Temperature<br>245 250   max.<br>217<br>200 Max. Time Above 245<br>20~40 Sec.<br>20~40 sec. max.<br>150<br>60~150 Sec. Max. Time Above 217  . :<br>100 60~150 sec. max.<br>50 200 °C ~ 250 °C Average Ramp-up Rate:<br>3 °C / sec. max.<br>0 50 100 150 200 250<br>Time (Seconds)<br>Temperature (°C)<br>**----- End of picture text -----**<br>


## ~~**Packaging Specifcations**~~ 

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e (7.008)178 e [DIA.] (.079 2.0 ±± 0.5 .020) a (.492)12.5<br>DIA.<br>21.0 ± 0.8 13.0<br>(.827 ± .031) (.512)<br>| sy UG IS vesOO<br>50.0 -0<br>(1.97 -0)<br>= 13.0 O<br>(.512) [DIA.]<br>8.0<br>10 +0<br>(.315)<br>(.394 +0)<br>4.0 4.0<br>END es (.157) (.157) START<br>O00 O o|o|o 6 © 00 0 d/o 0 0<br>LL [DUBIEIIOIOIOIOIOD)] LL<br>LEADER COMPONENTS TRAILER<br>200 160<br>a<br>(7.874) (6.299)<br>MIN. MIN.<br>NO COMPONENT SEE USER DIRECTION OF FEED ee NO COMPONENT<br>QTY: 2000 PCS. PER REEL<br>MM<br>DIMENSIONS:<br>(INCHES)<br>100 100 100 100 100 100 100 100<br>**----- End of picture text -----**<br>


REV. 06/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

Updated at April 26, 2026

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