CM1457-06CP

## CM1457 

## 4-, 6-,  8-Channel EMI Filter Array with ESD Protection 

## **Description** 

The CM1457 is an inductor-based (L-C) EMI filter array with ESD protection, which integrates four, six, or eight filters in a CSP form factor with 0.40 mm pitch. Each EMI filter channel of the CM1457 is implemented with the component value of 6 pF − 35 nH – 4.7 pF − 35 nH – 1.8 pF. The cut-off frequency at −3 dB attenuation is 300 MHz and can be used in applications where the data rates are as high as 160 Mbps, while providing greater than −35 dB attenuation over the 800 MHz to 2.7 GHz frequency range. The parts include ESD diodes on every I/O pin and provide a high level of protection against electrostatic discharge (ESD). The ESD protection diodes connected to the external filter ports are designed and characterized to safely dissipate ESD strikes of ±15 kV, which is beyond the maximum requirement of the IEC61000−4−2 international standard. 

This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its small package format and easy-to-use pin assignments. In particular, the CM1457 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in mobile handsets. 

The CM1457 incorporates _OptiGuard_ which results in improved reliability at assembly. It is manufactured with a 0.40 mm pitch and 0.25 mm CSP solder ball to provide up to 28% board space savings vs. competing CSP devices with 0.50 mm pitch and 0.30 mm CSP solder ball. 

## **Features** 

- Four, Six or Eight Channels of EMI Filtering 

- ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge) at External Pins 

- Greater than −40 dB of Attenuation at 1 GHz MIL−STD−883 International ESD Standard 

- Chip Scale Package (CSP) with 0.40 mm Pitch and 0.25 mm CSP Solder Ball which Features Extremely Low Parasitic Inductance for Optimum Filter and ESD Performance 

- _OptiGuard_ Coating for Improved Reliability at Assembly 

- These Devices are Pb−Free and are RoHS Compliant 

## **Applications** 

- LCD and Camera Data Lines in Mobile Handsets 

- I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs, etc. 

- EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers 

- Wireless Handsets 

- Handheld PCs/PDAs 

- LCD and Camera Modules 

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WLCSP10 WLCSP15 WLCSP20<br>CP SUFFIX CP SUFFIX CP SUFFIX<br>CASE 567BJ CASE 567BR CASE 567BV<br>**----- End of picture text -----**<br>


## **BLOCK DIAGRAM** 

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35 nH 35 nH<br>Cn* An*<br>(External (Internal<br>Pins) Pins)<br>GND<br>(Pins<br>B1−B4)<br>6 pF 4.7 pF 1.8 pF<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

|**MARKING DIAGRAM**|**MARKING DIAGRAM**|**MARKING DIAGRAM**|**MARKING DIAGRAM**|
|---|---|---|---|
|N57 yww<br>CM1457−06<br>N57 yyww<br>CM1457−08<br>N57 w<br>CM1457−04<br>PF JtJt]||||
|10−Bump CSP|||15−Bump CSP<br>20−Bump CSP|
|||N57|= CM1457−04CP|
|||N57|= CM1457−06CP|
|||N57|= CM1457−08CP|
|||w/yww/yyww = date code||



## **ORDERING INFORMATION** 

|**Device**<br>**Package**|**Package**|**Shipping**†|
|---|---|---|
|CM1457−04CP<br>(Pb−Free)|CSP−10<br>(Pb−Free)|3500/Tape & Reel|
|CM1457−06CP<br>(Pb−Free)|CSP−15<br>(Pb−Free)|3500/Tape & Reel|
|CM1457−08CP<br>(Pb−Free)|CSP−20<br>(Pb−Free)|3500/Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2013 **May, 2013 − Rev. 6** 

**CM1457/D** 

**CM1457** 

## **PACKAGE / PINOUT DIAGRAMS** 

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Top View Bottom View<br>(Bumps Down View) (Bumps Up View)<br>Orientation<br>Marking 1 2 3 4<br>A [+] C1 C2 C3 C4<br>B B1 B2<br>Orientation<br>C Marking A1 A2 A3 A4<br>A1<br>CM1457−04CP<br>10−Bump CSP<br>Orientation<br>Marking 1 2 3 4 5 6<br>+<br>A C1 C2 C3 C4 C5 C6<br>B B1 B2 B3<br>Orientation<br>C Marking A1 A2 A3 A4 A5 A6<br>A1<br>CM1457−06CP<br>15−Bump CSP<br>Orientation<br>Marking 1 2 3 4 5 6 7 8<br>+<br>A C1 C2 C3 C4 C5 C6 C7 C8<br>B B1 B2 B3 B4<br>Orientation<br>C Marking A1 A2 A3 A4 A5 A6 A7 A8<br>A1<br>CM1457−08CP<br>20−Bump CSP<br>**----- End of picture text -----**<br>


**Table 1. PIN DESCRIPTIONS** 

||**Pin Number**||**Pin Description**|||**Pin Number**||**Pin Description**|
|---|---|---|---|---|---|---|---|---|
|**−04**|**−06**|**−08**|||**−04**|**−06**|**−08**||
|A1|A1|A1|Filter #1 (Internal)||C1|C1|C1|Filter #1 (External)|
|A2|A2|A2|Filter #2 (Internal)||C2|C2|C2|Filter #2 (External)|
|A3|A3|A3|Filter #3 (Internal)||C3|C3|C3|Filter #3 (External)|
|A4|A4|A4|Filter #4 (Internal)||C4|C4|C4|Filter #4 (External)|
|−|A5|A5|Filter #5 (Internal)||−|C5|C5|Filter #5 (External)|
|−|A6|A6|Filter #6 (Internal)||−|C6|C6|Filter #6 (External)|
|−|−|A7|Filter #7 (Internal)||−|−|C7|Filter #7 (External)|
|−|−|A8|Filter #8 (Internal)||−|−|C8|Filter #8 (External)|
|B1, B2|B1−B3|B1−B4|GND||||||



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**2** 

**CM1457** 

## **SPECIFICATIONS** 

## **Table 2. ABSOLUTE MAXIMUM RATINGS** 

|**Table 2. ABSOLUTE MAXIMUM RATINGS**|||
|---|---|---|
|**Parameter**|**Rating**|**Units**|
|Storage Temperature Range|−65 to +150|°C|
|DC current per Inductor|15|mA|
|DC Package Power Rating|0.5|W|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

## **Table 3. STANDARD OPERATING CONDITIONS** 

|**Table 3. STANDARD OPERATING CONDITIONS**|||
|---|---|---|
|**Parameter**|**Rating**|**Units**|
|Operating Temperature Range|−40 to +85|°C|



## **Table 4. ELECTRICAL OPERATING CHARACTERISTICS** (Note 1) 

|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|LTOT|Total Channel Inductance|||70||nH|
|RTOT|Total Channel DC Resistance|||45||�|
|CTOT_0V|Total Channel Capacitance, 0 V bias|0 V dc; 1 MHz, 30 mV rms||20|24|pF|
|CTOT_2.5V|Total Channel Capacitance, 2.5 V bias|2.5 V dc; 1 MHz,<br>30 mV rms||12.5||pF|
|VST|Stand−off Voltage|I = 10�A|5.5|||V|
|ILEAK|Diode Leakage Current|VIN= +3.3 V||0.1|0.5|�A|
|VSIG|Signal Clamp Voltage<br>Positive Clamp<br>Negative Clamp|ILOAD= 10 mA<br>ILOAD= −10 mA|5.6<br>−1.5|6.8<br>−0.8|9.0<br>−0.4|V|
|VESD|In−system ESD Withstand Voltage<br>a) Contact Discharge per IEC 61000−4−2 standard,<br>Level 4**(External Pins)**<br>b) Contact Discharge per IEC 61000−4−2 standard,<br>Level 4**(Internal Pins)**|(Notes 2 and 3)|±15<br>±2|||kV|
|fC|Cut−off Frequency<br>ZSOURCE= 50�, ZLOAD= 50�|||300||MHz|



1. TA = 25 ° C unless otherwise specified. 

2. ESD applied to input and output pins with respect to GND, one at a time. 

3. Unused pins are left open. 

## **APPLICATION INFORMATION** 

Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by ON Semiconductor. 

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**3** 

**CM1457** 

**PERFORMANCE INFORMATION** 

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0 dB<br>−10 dB SUmeUTLMIieeePETTITTa TETaSPEa obaapelere<br>−20 dB Oe a |<br>UU TLEPENI<br>−30 dB<br>a |<br>−40 dB CUI PLEPE<br>ee<br>−50 dB<br>PLUM FP PLP AD<br>3 10 100 1000 2000 6000<br>FREQUENCY (MHz)<br>LOSS<br>INSERTION<br>**----- End of picture text -----**<br>


**Figure 1. Insertion Loss vs. Frequency (0 V Bias)** 

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0 dB met EL<br>−10 dB SLULNPETTERSTT Ser<br>−20 dB PU ETPU TI E ELPAEEeho spedae<br>SL TEE EET EL<br>−30 dB SLU|PEEPEE<br>−40 dB CUA PET PE IN er<br>CU PETEP<br>−50 dB OU |<br>3 10 100 1000 2000 6000<br>FREQUENCY (MHz)<br>LOSS<br>INSERTION<br>**----- End of picture text -----**<br>


**Figure 2. Insertion Loss vs. Frequency (2.5 V Bias)** 

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**4** 

**CM1457** 

## **PACKAGE DIMENSIONS** 

# **WLCSP10, 1.67x1.05** CASE 567BJ−01 ISSUE O 

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NOTES:<br>D A B 1. DIMENSIONING AND TOLERANCING PER<br>PIN A1 ASME Y14.5M, 1994.<br>REFERENCE 2. CONTROLLING DIMENSION: MILLIMETERS.<br>È 3. COPLANARITY APPLIES TO SPHERICAL<br>CROWNS OF SOLDER BALLS.<br>È E MILLIMETERS<br>2X 0.05 C DIM MIN MAX<br>A 0.54 0.69<br>A1 0.17 0.24<br>2X 0.05 C A2 0.42 REF<br>TOP VIEW b 0.24 0.29<br>D 1.67 BSC<br>OptiGuard Option A2 E 1.05 BSC<br>eD 0.400 BSC<br>0.05 C ÉÉÉÉ eE 0.347 BSC<br>A RECOMMENDED<br>SOLDERING FOOTPRINT*<br>0.05 C<br>NOTE 3 A1 SIDE VIEW C SEATINGPLANE A1 PACKAGEOUTLINE<br>eD/2<br>0.35<br>10X b eD<br>0.05 C A B eE 0.35 10X<br>0.03 C C 0.40 0.25<br>B PITCH<br>DIMENSIONS: MILLIMETERS<br>A<br>1 2 3 4 5 6 *For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>BOTTOM VIEW Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


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**CM1457** 

## **PACKAGE DIMENSIONS** 

# **WLCSP15, 2.47x1.05** CASE 567BR−01 ISSUE O 

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NOTES:<br>D A B 1. DIMENSIONING AND TOLERANCING PER<br>PIN A1 ASME Y14.5M, 1994.<br>REFERENCE 2. CONTROLLING DIMENSION: MILLIMETERS.<br>È 3. COPLANARITY APPLIES TO SPHERICAL<br>CROWNS OF SOLDER BALLS.<br>È E MILLIMETERS<br>2X 0.05 C DIM MIN MAX<br>A 0.54 0.69<br>A1 0.17 0.24<br>2X 0.05 C A2 0.42 REF<br>TOP VIEW b 0.24 0.29<br>D 2.47 BSC<br>OptiGuard Option A2 E 1.05 BSC<br>eD 0.400 BSC<br>0.05 C ÉÉÉÉÉÉ eE 0.347 BSC<br>A RECOMMENDED<br>SOLDERING FOOTPRINT*<br>0.05 C<br>NOTE 3 A1 SIDE VIEW C SEATINGPLANE A1 PACKAGEOUTLINE<br>eD/2<br>0.35<br>15X b eD<br>0.05 C A B eE 0.35 15X<br>0.03 C C 0.40 0.25<br>B PITCH<br>DIMENSIONS: MILLIMETERS<br>A<br>1 2 3 4 5 6 7 8 9 *For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>BOTTOM VIEW Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


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**CM1457** 

## **PACKAGE DIMENSIONS** 

**WLCSP20, 3.27x1.05** CASE 567BV−01 ISSUE O 

NOTES: 

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NOTES:<br>D A B 1. DIMENSIONING AND TOLERANCING PER<br>PIN A1 ASME Y14.5M, 1994.<br>REFERENCE 2. CONTROLLING DIMENSION: MILLIMETERS.<br>ÈÈ 3. COPLANARITY APPLIES TO SPHERICAL<br>ee CROWNS OF SOLDER BALLS.<br>ÈÈ E MILLIMETERS<br>2X 0.05 C DIM MIN MAX<br>A 0.54 0.69<br>A1 0.17 0.24<br>2X 0.05 C A2 0.42 REF<br>fe ._T y TOP VIEW b 0.24 0.29<br>D 3.27 BSC<br>OptiGuard Option A2 E 1.05 BSC<br>eD 0.400 BSC<br>an 0.05 C e ‘vs2 a eE 0.347 BSC<br>ÉÉÉÉÉÉÉÉ<br>A<br>0.05 C<br>NOTE 3 A1 poole SIDE VIEW C SEATINGPLANE<br>eD/2<br>20X b eD<br>0.05 C A B eE<br>C<br>— 0.03 C B<br>A<br>1 2 3 4 5 6 7 8 9 101112<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


## **RECOMMENDED SOLDERING FOOTPRINT*** 

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t666O0666". A1 P OUTLINEACKAGE<br>0.35<br>0.35 20X<br>0.25<br>0.40<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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**CM1457/D** 

**7**