CG0603MLC-3.3LE

TVS Varistor, 3.3 V, ChipGuard MLC, 25 V, 0603 [1608 Metric], Multilayer Varistor (MLV)

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Manufacturer: BOURNS
Product type: TVS Varistors
Voltage Rating VAC:-; Voltage Rating V DC:3.3V; Product Range:ChipGuard MLC Series; Clamping Voltage Vc Max:25V; Varistor Case Style:0603 [1608 Metric]; Varistor Type:ESD Protector; Peak Surge
SVHC: No SVHC (04-Feb-2026)
Product Range: ChipGuard MLC
Varistor Type: Multilayer Varistor (MLV)
Voltage Rating VAC: -
Voltage Rating VDC: 3.3V
Varistor Case Style: 0603 [1608 Metric]
Clamping Voltage Vc Max: 25V
Peak Energy (10/1000uS): -
Operating Temperature Max: 85°C
Operating Temperature Min: -40°C
Peak Surge Current @ 8/20µs: -
Automotive Qualification Standard: AEC-Q200

Delivery and price
Units per pack	5000
Price	0.083 €
Current stock	1000+
Lead time	30 days

Datasheet

## **Features** 

■ Select models are compliant with AEC-Q200 Rev-C Stress Test Qualifi cation for Passive Components in Automotive Applications (see chart below) 

■ RoHS compliant* 

- ESD protection >25 kV 

- Low capacitance <0.5 pF 

## **Applications** 

■ HDMI 1.4 

■ Digital Visual Interface (DVI) ■ USB 3.0 / USB OTG 

■  Memory protection 

■  SIM card ports 

   - Automotive 

- Low leakage current <50 nA 

## BOURNS ~~Ee~~ **ChipGuard[®] MLC Series  - ESD Protectors** 

## ~~**General Information**~~ 

The ChipGuard[®] MLC Series has been specifi cally designed to protect sensitive electronic components from electrostatic discharge damage. The MLC family has been designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD specifi cations targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. 

The ChipGuard[®] MLC Series has been manufactured to provide low 0.5 pF capacitance and leakage currents less than 50 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. 

~~**AEC Approved Models**~~ **Model AEC-Q200** CG0603MLC-05E ✓ Yes CG0603MLC-12E ✓ Yes ~~—a~~ ~~**Device Symbol**~~ yk **V** 

**==> picture [505 x 353] intentionally omitted <==**

**----- Start of picture text -----**<br>
Electrical Characteristics @ 25 °C (unless otherwise noted)<br>CG0402MLC-<br>Parameter Symbol Unit<br>3.3LG 05LG 12LG 24LG 3.3LGA 05LGA 12LGA 24LGA<br>= Typical Continuous Operating Voltage  VDC 3.3 5 12 24 3.3 5 12 24 V<br>Typical Clamping Voltage (Note 1) VC 25 V<br>Maximum Capacitance @ 1 VRMS 1 MHz CO  0.5 pF<br>Maximum Leakage Current @ Max. VDC  IL 5 nA<br>Typical Trigger Voltage (Note 2) VT 250 V<br>Maximum Response Time RT 1 ns<br>ESD Protection:<br>Per IEC 61000-4-2 Level 4<br>   Min. Contact Discharge ±8 kV<br>   Min. Air Discharge  ±15 (Note 3) kV<br>   Min. Air Discharge ±25 kV<br>| Operating Temperature TOPR -40 to +85   -40 to +125 ˚C<br>Storage Temperature TSTG -55 to +150 ˚C<br>CG0603MLC-<br>Parameter Symbol Unit<br>3.3LE 05E 05LE 12E 12LE 24LE 3.3LEA 05LEA 12LEA 24LEA<br>ee Typical Continuous Operating Voltage  VDC 3.3 5 5 12 12 24 3.3 5 12 24 V<br>Typical Clamping Voltage (Note 1) VC 25 20 25 30 25 V<br>Maximum Capacitance @ 1 VRMS 1 MHz CO  0.5 pF<br>Maximum Leakage Current @ Max. VDC  IL 5 50 5 50 5 nA<br>Typical Trigger Voltage (Note 2) VT 250 150 250 150 250 V<br>Maximum Response Time RT 1 ns<br>ESD Protection:<br>Per IEC 61000-4-2 Level 4<br>   Min. Contact Discharge ±8 kV<br>   Min. Air Discharge  ±15 (Note 3) kV<br>   Min. Air Discharge ±25 kV<br>a Operating Temperature TOPR -40 to +85 e -40 to +125 e ˚C<br>Storage Temperature TSTG -55 to +150 ˚C<br>**----- End of picture text -----**<br>


Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 

   2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 

   3. IEC 61000-4-2 ESD Performance for CG0603MLC-05E and CG0603MLC-12E devices will meet minimum 100 reps. Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance. 

- *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifi cations are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. 

||**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**|**ChipGuard® MLC Series  - ESD Protectors**||~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|~~**Recommended Pad Layout**~~<br>**CG0402**<br>**CG0603**<br>**Dim.**<br>**Series**<br>**Series**<br>A<br>0.51<br>0.76<br>(0.020)<br>(0.030)<br>B<br>0.61<br>1.02<br>(0.024)<br>(0.040)<br>C<br>0.51<br>0.50<br>(0.020)<br>(0.020)<br>D<br>1.70<br>2.54<br>(0.067)<br>(0.100)<br>A<br>C<br>B<br>D|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||~~**P Dii**~~||||||||||||||MM||||||||||
||~~**roduct mensons**~~<br>L|||||W||||||DIMENSIONS:<br>A|||||||||||||
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||||||||||||||||(INCHES)||||||||||
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||**Dimension**|||||**CG0402**<br>**Series**||||||**CG0603**<br>**Series**||||**Dim.**|**CG0402**<br>**Series**||||**CG0603**<br>**Series**||||
||L|||||1.00 ± 0.15<br>(0.04 ± 0.006)||||||1.60 ± 0.20<br>(0.064 ± 0.008)||||A|(||0.51<br>0.020)||0.76<br>(0.030)||||
||W|||||0.50±0.10<br>(0.02 ± 0.004)||||||0.80±0.20<br>(0.032 ± 0.008)||||B|(||0.61<br>0.024)||1.02<br>(0.040)||||
||A|||||0.36 ± 0.05<br>(0.014 ± 0.002)||||||0.45 ± 0.10<br>(0.018 ± 0.004)||||C|(||0.51<br>0.020)||0.50<br>(0.020)||||
||B|||||0.25 ± 0.15<br>(0.10 ± 0.006)||||||0.30 ± 0.20<br>(0.012 ± 0.008)||||D|(||1.70<br>0.067)||2.54<br>(0.100)||||



## ~~**Solder Ref ow Recommendations**~~ 

|300<br>250<br>200<br>150<br>100<br>50<br>0<br>Temperature (°C)|**Preheat Stages 1-3**<br>**Soldering**|**Preheat Stages 1-3**<br>**Soldering**|**Preheat Stages 1-3**<br>**Soldering**|**Cooling**||||||
|---|---|---|---|---|---|---|---|---|---|
|||||||A|Stage 1 Preheat|Ambient to Preheating<br>Temperature|30 s to 60 s|
|||||||||||
|||||||B|Stage 2 Preheat|140 °C to 160 °C|60 s to 120 s|
|||||||C|Stage 3 Preheat|Preheat to 200 °C|20 s to 40 s|
|||||||D|Main Heating|200 °C<br>210 °C<br>220 °C<br>230 °C<br>240 °C<br>250 °C to 255 °C|60 s to 70 s<br>55 s to 65 s<br>50 s to 60 s<br>40 s to 50 s<br>30 s to 40 s<br>5 s|
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||110 sec. (min.)|30-70<br>sec.<br>Time (seconds)||120 sec. (min.)||E|Cooling|200 °C to 100 °C|1 °C/s to 4 °C/s|
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- This product can be damaged by rapid heating, cooling or localized heating. 

- Heat shocks should be avoided. Preheating and gradual cooling recommended. 

- Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. 

- Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. 

Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. 

## **ChipGuard[®] MLC Series  - ESD Protectors** 

## ~~**Packaging Dimensions**~~ 

**==> picture [498 x 199] intentionally omitted <==**

**----- Start of picture text -----**<br>
13.0 ± 1.0<br>8.00 ± 0.30 (0.52 ± 0.04)<br>(0.32 ± 0.012)<br>4.00 ± 0.10<br>C<br>(0.16 ± 0.004) 1.50 ± 0.10<br>(0.06 ± 0.004) 2.0 ± 0.50 62.0 ± 1.50<br>(0.08 ± 0.02) (2.48 ± 0.06)<br>L<br>13.0 ± 0.50<br>(0.52 ± 0.02)<br>TOP G D<br>TAPE 21.0 ± 0.80<br>3.50 ± 0.05 (0.84 ± 0.032) 180.8 ± 2.0<br>W (0.14 ± 0.002) (7.12 ± 0.08)<br>NOTES: TAPE MATERIAL IS PAPER.<br>0.48 ± 0.03<br>TAPE THICKNESS IS MM<br>(0.019 ± 0.0012) DIMENSIONS:<br>COVER TAPE ADHESION IS 40 ± 15 GRAMS. (INCHES) 9.0 ± 0.50<br>(0.36 ± 0.02)<br>**----- End of picture text -----**<br>


|**Dimension**||**CG0402**<br>**Series**||**CG0603**<br>**Series**|
|---|---|---|---|---|
|C||1.75 ± 0.05<br>(0.04 ± 0.002)||1.75 ± 0.10<br>(0.04 ± 0.004)|
|D||2.00 ± 0.02<br>(0.08 ± 0.0008)||2.00 ± 0.05<br>(0.08 ± 0.002)|
|L|1.12 ± 0.03<br>(0.045 ± 0.0012)|||1.80 ± 0.20<br>(0.072 ± 0.008)|
|W|0.62 ± 0.03<br>(0.025 ± 0.0012)|||0.90 ± 0.20<br>(0.036 ± 0.008)|
|G||2.0 ± 0.05<br>(0.08 ± 0.002)||4.0 ± 0.05<br>(0.16 ± 0.002)|



## ~~**How to Order**~~ 

**CG 0n0n MLC - n.n x x x** 

ChipGuard[®] Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage** 3.3 = 3.3 V 05 =  5 V 12 =  12 V 24 =  24 V Low Leakage Current Option L = Low Leakage Current Blank = Standard Product Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) Operating Temperature Option A = Higher +125 °C Operating Temperature Blank = Standard Product 

- **  Only models lower than 10 volts require decimal point. 

**Asia-Pacifi c:** Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 **Europe:** Tel: +41-41 768 5555 • Fax: +41-41 768 5510 **The Americas:** Tel: +1-951 781-5500 • Fax: +1-951 781-5700 **www.bourns.com** 

REV. S 06/13 

Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications.

Updated at June 6, 2026

Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.

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