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CG0603MLC-12E.
VARISTOR, 12V, 50V, 0603
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: BOURNS
- Product type: TVS Varistors
- Product Range: ChipGuard MLC Series
- Varistor Type: Multilayer Varistor (MLV)
- Voltage Rating VDC: 12V
- Varistor Case Style: 0603 [1608 Metric]
- Clamping Voltage Vc Max: 30V
- Operating Temperature Max: 85°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 10000 |
| Price | 0.134 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**==> picture [44 x 42] intentionally omitted <==** **----- Start of picture text -----**<br> *RoHS COMPLIANT<br>**----- End of picture text -----**<br> ## **Features** n RoHS compliant* n ESD protection >25 kV n Low capacitance <0.5 pF n Low leakage current <50 nA ## **Applications** n HDMI 1.4 n Digital Visual Interface (DVI) n USB 3.0 / USB OTG n Memory protection n SIM card ports ## BOURNS ~~ER~~ **ChipGuard[®] MLC Series - ESD Protectors** ## ~~**General Information**~~ The ChipGuard[®] MLC Series has been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLC family has been designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. ## ~~**Device Symbol**~~ **==> picture [13 x 14] intentionally omitted <==** **----- Start of picture text -----**<br> V<br>**----- End of picture text -----**<br> The ChipGuard[®] MLC Series has been manufactured to provide low 0.5 pF capacitance and leakage currents less than 5 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. ## ~~**Electrical Characteristics @ 25 °C (unless otherwise noted)**~~ ~~Cn~~ **CG0402MLCParameter Symbol Unit** ~~eC~~ **3.3LG 05LG 12LG 24LG 3.3LGA 05LGA 12LGA 24LGA** ~~nD~~ Typical Continuous Operating Voltage ~~nD~~ VDC ~~I~~ 3.3 ~~ID~~ 5 ~~RU~~ 12 ~~ID~~ 24 ~~(I~~ 3.3 5 ~~(I~~ 12 24 V ~~nD~~ Typical Clamping Voltage (Note 1) ~~nD~~ VC ~~RR~~ 25 V ~~nD~~ Maximum Capacitance @ 1 VRMS 1 MHz ~~nD~~ CO ~~RR~~ 0.5 pF ~~nD~~ Maximum Leakage Current @ Max. VDC ~~nD~~ IL ~~RR~~ 5 nA ~~nD~~ Typical Trigger Voltage (Note 2) ~~nD~~ VT ~~RR~~ 250 V ~~nD~~ Maximum Response Time ~~nD~~ RT ~~RR~~ 1 ns ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge ±8 kV Min. Air Discharge ±15 (Note 3) kV Min. Air Discharge ±25 kV ~~RD~~ Operating Temperature TOPR ~~ID UI~~ -40 to +85 ~~(I~~ -40 to +125 ˚C ~~nD~~ Storage Temperature ~~ID~~ TSTG -55 to +150 ˚C ~~Cn~~ **CG0603MLCParameter Symbol Unit** ~~eee~~ **3.3LE 05LE 12LE 24LE 3.3LEA 05LEA 12LEA 24LEA** ~~ED~~ Typical Continuous Operating Voltage V ~~I~~ DC ~~(S(O~~ 3.3 5 12 24 ~~(OR~~ 3.3 5 ~~S(O~~ 12 ~~I~~ 24 V ~~nn~~ Typical Clamping Voltage (Note 1) VC 25 25 25 V ~~I~~ Maximum Capacitance @ 1 VRMS 1 MHz CO 0.5 pF ~~nn~~ Maximum Leakage Current @ Max. VDC IL ~~**I**~~ 5 ~~**I**~~ 5 5 nA ~~I~~ Typical Trigger Voltage (Note 2) VT 250 250 250 V Maximum Response Time RT 1 ns ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge ±8 kV Min. Air Discharge ±15 (Note 3) kV Min. Air Discharge ±25 kV ~~I~~ Operating Temperature TOPR -40 to +85 -40 to +125 ˚C ~~nD~~ Storage Temperature TSTG ~~I~~ -55 to +150 ˚C Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. IEC 61000-4-2 ESD Performance will meet minimum 1000 reps without degradation in performance. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **ChipGuard[®] MLC Series - ESD Protectors** ||**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**|**ChipGuard® MLC Series - ESD Protectors**| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| ||~~**P Dii**~~||||||||||||~~**R P L**~~||||||||| ||~~**roduct mensons**~~<br>L|||||W|||||||~~**ecommended ad ayout**~~<br>A<br>C<br>B<br>D||||||||| ||||||||||||||||||||||| ||||||||||||||||||||||| ||||||||||||||||||||||| ||||||||||||||||||||||| ||||||||||||||||||||||| |||||||||||||||C|||||||| |||||||||||||||||D|||||| ||||||||||||||||||||||| ||**Dimension**|||||**CG0402**<br>**Series**|||||**CG0603**<br>**Series**||**Dim.**|**CG0402**<br>**Series**||||**CG0603**<br>**Series**|||| ||L|||||1.00 ± 0.15<br>(0.04 ± 0.006)|||||1.60 ± 0.20<br>(0.064 ± 0.008)||A|(||0.51<br>0.020)|||0.76<br>(0.030)||| ||||||||||||||||||||||| ||||||||||||||||||||||| ||W|W||||0.50±0.10<br>(0.02 ± 0.004)|||||0.80±0.20<br>(0.032 ± 0.008)||B|(||0.61<br>0.024)|||1.02<br>(0.040)||| ||||||||||||||||||||||| ||||||||||||||||||||||| ||A|||||0.36 ± 0.05<br>(0.014 ± 0.002)|||||0.45 ± 0.10<br>(0.018 ± 0.004)||C|(||0.51<br>0.020)|||0.50<br>(0.020)||| ||B|||||0.25 ± 0.15<br>(0.10 ± 0.006)|||||0.30 ± 0.20<br>(0.012 ± 0.008)||D|(||1.70<br>0.067)|||2.54<br>(0.100)||| ||||||||||||||||||||||| ## ~~**Solder Refow Recommendations**~~ |300<br>250<br>200<br>150<br>100<br>50<br>0<br>Temperature (ϒC)|**Preheat Stages 1-3**<br>**Soldering**|**Preheat Stages 1-3**<br>**Soldering**|**Preheat Stages 1-3**<br>**Soldering**|**Cooling**|||||| |---|---|---|---|---|---|---|---|---|---| |||||||A|Stage 1 Preheat|Ambient to Preheating<br>Temperature|30 s to 60 s| ||||||||||| |||||||B|Stage 2 Preheat|140 °C to 160 °C|60 s to 120 s| |||||||C|Stage 3 Preheat|Preheat to 200 °C|20 s to 40 s| |||||||D|Main Heating|200 °C<br>210 °C<br>220 °C<br>230 °C<br>240 °C<br>250 °C to 255 °C|60 s to 70 s<br>55 s to 65 s<br>50 s to 60 s<br>40 s to 50 s<br>30 s to 40 s<br>5 s| ||||||||||| ||||||||||| ||||||||||| ||110 sec. (min.)||30-70|||E|Cooling|200 °C to 100 °C|1 °C/s to 4 °C/s| ||||||||||| |||sec.<br>Time (seconds)|||||||| - This product can be damaged by rapid heating, cooling or localized heating. - Heat shocks should be avoided. Preheating and gradual cooling recommended. - Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. - Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. ## **ChipGuard[®] MLC Series - ESD Protectors** ## ~~**Packaging Dimensions**~~ **==> picture [498 x 199] intentionally omitted <==** **----- Start of picture text -----**<br> 13.0 ± 1.0<br>8.00 ± 0.30 (0.52 ± 0.04)<br>(0.32 ± 0.012)<br>4.00 ± 0.10<br>C<br>(0.16 ± 0.004) 1.50 ± 0.10<br>(0.06 ± 0.004) 2.0 ± 0.50 62.0 ± 1.50<br>(0.08 ± 0.02) (2.48 ± 0.06)<br>L<br>13.0 ± 0.50<br>(0.52 ± 0.02)<br>TOP G D<br>TAPE 21.0 ± 0.80<br>3.50 ± 0.05 (0.84 ± 0.032) 180.8 ± 2.0<br>W (0.14 ± 0.002) (7.12 ± 0.08)<br>NOTES: TAPE MATERIAL IS PAPER.<br>0.48 ± 0.03<br>TAPE THICKNESS IS MM<br>(0.019 ± 0.0012) DIMENSIONS:<br>COVER TAPE ADHESION IS 40 ± 15 GRAMS. (INCHES) 9.0 ± 0.50<br>(0.36 ± 0.02)<br>**----- End of picture text -----**<br> |**Dimension**||**CG0402**<br>**Series**||**CG0603**<br>**Series**| |---|---|---|---|---| |C||1.75 ± 0.05<br>(0.04 ± 0.002)||1.75 ± 0.10<br>(0.04 ± 0.004)| |D||2.00 ± 0.02<br>(0.08 ± 0.0008)||2.00 ± 0.05<br>(0.08 ± 0.002)| |L|1.12 ± 0.03<br>(0.045 ± 0.0012)|||1.80 ± 0.20<br>(0.072 ± 0.008)| |W|0.62 ± 0.03<br>(0.025 ± 0.0012)|||0.90 ± 0.20<br>(0.036 ± 0.008)| |G||2.0 ± 0.05<br>(0.08 ± 0.002)||4.0 ± 0.05<br>(0.16 ± 0.002)| ## ~~**How to Order**~~ **CG 0n0n MLC - n.n x x x** ChipGuard[®] Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage** 3.3 = 3.3 V 05 = 5 V 12 = 12 V 24 = 24 V - Low Leakage Current Option L = Low Leakage Current Blank = Standard Product - Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) Operating Temperature Option - A = Higher +125 °C Operating Temperature Blank = Standard Product - ** Only models lower than 10 volts require decimal point. Tel: +886-2 2562-4117 • Email: asiacus@bourns.com **Asia-Pacific: EMEA:** Tel: +36 88 520 390 • Email: eurocus@bourns.com **The Americas:** Tel: +1-951 781-5500 • Email: americus@bourns.com **www.bourns.com** ## REV. T 01/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
Updated at February 9, 2023
Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.
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