CG0402MLU-12G

## **Features** 

■ RoHS compliant* ■ ESD protection >25 kV ■ Low capacitance <0.05 pF 

- Low leakage current <5 nA 

## **Applications** 

■ HDMI 1.4 

- Digital Visual Interface (DVI) 

- USB 3.0 / USB OTG 

- Memory protection 

- SIM card ports ■  Automotive 

## **ChipGuard[®] MLU Series  - ESD Protectors** 

## ~~**General Information**~~ 

The ChipGuard[®] MLU Series has been specifi cally designed to protect sensitive electronic components from electrostatic discharge damage. The MLU family has been designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD specifi cations targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. 

## ~~**Device Symbol**~~ 

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The ChipGuard[®] MLU Series has been manufactured to provide low 0.05 pF capacitance and leakage currents less than 5 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. 

|**Parameter**<br>~~a~~|**CG0402MLU / CG0603MLU**<br>**Symbol**<br>~~ee~~|**CG0402MLU / CG0603MLU(Note 3)**<br>~~po~~<br>~~eeee ee~~|**CG0402MLU / CG0603MLU(Note 3)**<br>~~po~~<br>~~eeee ee~~|**CG0402MLU / CG0603MLU(Note 3)**<br>~~po~~<br>~~eeee ee~~|**CG0402MLU / CG0603MLU(Note 3)**<br>~~po~~<br>~~eeee ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|||**3.3x**<br>~~po~~<br>~~ee~~|**05x**<br>~~po~~<br>~~ee ee~~|**12x**<br>~~po~~<br>~~ee~~|**24x**<br>~~po~~<br>~~ee~~||
|Typical Continuous OperatingVoltage<br>~~po~~|VDC<br>~~ee~~<br>~~po~~|3.3<br>~~ee ~~<br>~~po~~|5<br> ~~ee ee~~<br>~~po~~|12<br>~~ee~~<br>~~po~~|24<br>~~ee~~<br>~~po~~|V<br>~~ee~~<br>~~po~~|
|Typical ClampingVoltage(Note 1)<br>~~pf~~|VC<br>~~pf~~|25<br>~~pf~~||||V<br>~~pf~~|
|Maximum Capacitance @ 1 VRMS 1 MHz<br>~~pf~~<br>~~a~~|CO<br>~~pf~~<br>~~a~~|0.05<br>~~pf~~<br>~~a~~||||pF<br>~~pf~~<br>~~a~~|
|Maximum Leakage Current @ Max. VDC<br>~~a~~<br>~~eG~~|IL<br>~~a~~<br>~~eG~~|5<br>~~a~~<br>~~eG~~||||nA<br>~~a~~<br>~~eG~~|
|Typical Trigger Voltage(Note 2)<br>~~pf~~|VT<br>~~pf~~|250<br>~~pf~~||||V<br>~~pf~~|
|Maximum ResponseTime<br>~~pf~~|RT<br>~~pf~~|1<br>~~pf~~||||ns<br>~~pf~~|
|ESD Protection: Per IEC 61000-4-2<br>Min. Contact Discharge (>1000 Reps)<br>Min. Air Discharge(>1000 Reps)||±8<br>±15||||kV<br>kV|
|OperatingTemperature<br>~~eG~~|TOPR<br>~~eG~~|-40 to +125<br>~~eG~~||||˚C<br>~~eG~~|
|Storage Temperature<br>~~DD~~|TSTG<br>~~DD~~|-55 to +150<br>~~DD~~||||˚C<br>~~DD~~|



Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 

2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 

3. Part number suffi x “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity. 

*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. 

## **ChipGuard[®] MLU Series  - ESD Protectors** 

## ~~**Product Dimensions**~~ 

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A<br>MM<br>W DIMENSIONS:<br>(INCHES)<br>B<br>L<br>**----- End of picture text -----**<br>


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Recommended Pad Layout<br>A<br>C B<br>D<br>**----- End of picture text -----**<br>


|**Dimension**||**CG0402**<br>**Series**||**CG0603**<br>**Series**||**Dim.**||**CG0402**<br>**Series**|**CG0603**<br>**Series**|**CG0603**<br>**Series**|
|---|---|---|---|---|---|---|---|---|---|---|
|L||1.00±0.15<br>(0.04 ± 0.006)||1.60±0.20<br>(0.064 ± 0.008)||A||0.51<br>(0.020)||0.76<br>(0.030)|
|W||0.50 ± 0.10<br>(0.02 ± 0.004)||0.80 ± 0.20<br>(0.032 ± 0.008)||B||0.61<br>(0.024)||1.02<br>(0.040)|
|A||0.36 ± 0.05<br>(0.014 ± 0.002)||0.45 ± 0.10<br>(0.018 ± 0.004)||C||0.51<br>(0.020)||0.50<br>(0.020)|
|B||0.25 ± 0.15<br>(0.10 ± 0.006)||0.30 ± 0.20<br>(0.012 ± 0.008)||D||1.70<br>(0.067)||2.54<br>(0.100)|



## ~~**Solder Ref ow Recommendations**~~ 

|300<br>250<br>200<br>150<br>100<br>50<br>0<br>Temperature (°C)|**Preheat Stages 1-3**<br>**Soldering**|**Preheat Stages 1-3**<br>**Soldering**|**Preheat Stages 1-3**<br>**Soldering**|**Cooling**||||||
|---|---|---|---|---|---|---|---|---|---|
|||||||A|Stage 1 Preheat|Ambient to Preheating<br>Temperature|30 s to 60 s|
|||||||||||
|||||||B|Stage 2 Preheat|140 °C to 160 °C|60 s to 120 s|
|||||||C|Stage 3 Preheat|Preheat to 200 °C|20 s to 40 s|
|||||||D|Main Heating|200 °C<br>210 °C<br>220 °C<br>230 °C<br>240 °C|60 s to 70 s<br>55 s to 65 s<br>50 s to 60 s<br>40 s to 50 s<br>30 s to 40 s|
|||||||||||
|||||||||||
|||||||||||
|||||||E|Cooling|200 °C to 100 °C|1 °C/s to 4 °C/s|
||110 sec. (min.)|30-70<br>sec.<br>Time (seconds)||120 sec. (min.)||||||
|||||||||||



- This product can be damaged by rapid heating, cooling or localized heating. 

- Heat shocks should be avoided. Preheating and gradual cooling recommended. 

- Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. 

- Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. 

Specifi cations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications. 

## **ChipGuard[®] MLU Series  - ESD Protectors** 

## ~~**Packaging Dimensions**~~ 

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13.0 ± 1.0<br>8.00 ± 0.30 (0.52 ± 0.04)<br>(0.32 ± 0.012)<br>4.00 ± 0.10<br>C<br>(0.16 ± 0.004) 1.50 ± 0.10<br>(0.06 ± 0.004) 2.0 ± 0.50 62.0 ± 1.50<br>(0.08 ± 0.02) (2.48 ± 0.06)<br>L<br>13.0 ± 0.50<br>(0.52 ± 0.02)<br>TAPETOP G D 21.0 ± 0.80<br>3.50 ± 0.05 (0.84 ± 0.032) 180.8 ± 2.0<br>W (0.14 ± 0.002) (7.12 ± 0.08)<br>NOTES: TAPE MATERIAL IS PAPER.<br>0.60 ± 0.05<br>TAPE THICKNESS IS<br>(0.024 ± 0.002) MM<br>COVER TAPE ADHESION IS 40 ± 15 GRAMS. DIMENSIONS: (INCHES) 9.0 ± 0.50<br>(0.36 ± 0.02)<br>**----- End of picture text -----**<br>


|**Dimension**||**CG0402**<br>**Series**||**CG0603**<br>**Series**|
|---|---|---|---|---|
|C||1.75 ± 0.05<br>(0.04 ± 0.002)||1.75 ± 0.10<br>(0.04 ± 0.004)|
|D||2.00 ± 0.02<br>(0.08 ± 0.0008)||2.00 ± 0.05<br>(0.08 ± 0.002)|
|L|1.12 ±0.03<br>(0.045 ± 0.0012)|||1.80±0.20<br>(0.072 ± 0.008)|
|W|0.62 ± 0.03<br>(0.025 ± 0.0012)|||0.90 ± 0.20<br>(0.036 ± 0.008)|
|G||2.0 ± 0.05<br>(0.08 ± 0.002)||4.0 ± 0.05<br>(0.16 ± 0.002)|



## ~~**How to Order**~~ 

## **CG 0n0n MLU - n.n x** 

ChipGuard[®] Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage** 3.3 =  3.3 V 05 =   5 V 12 =  12 V 24 =  24 V 

**Asia-Pacifi c:** Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 **Europe:** Tel: +41-41 768 5555 • Fax: +41-41 768 5510 **The Americas:** Tel: +1-951 781-5500 • Fax: +1-951 781-5700 **www.bourns.com** 

Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) 

- **  Only models lower than 10 volts require decimal point. 

## REV. K 06/13 

Specifi cations are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi c applications.