CC12H1.5A-TR

CARTRIDGE FUSES

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Manufacturer: EATON / PARTNER STOCK
Product type: Cartridge Fuses

Delivery and price
Units per pack	9000
Price	0.484 €
Current stock	1000+
Lead time	30 days

Datasheet

Effective October 2020 Supersedes November 2017 

Technical Data **4309** 

## CC12H High I²t Chip fuses 

## **Applications** 

Secondary circuit protection 

- Laptop, notebook, netbook 

- Tablets, e-readers 

- Flat panel displays 

- High definition television (HDTV) 

- LCD/LED backlighting 

- Computers and peripherals 

## **Product features** 

   - Gaming console systems 

   - Handheld/portable equipment 

- High I²t 

- High inrush withstand capability 

- AEC-Q200 qualified: (750 mA to 30 A) 

- Excellent temperature and cycling characteristics 

- 1206 (3216 metric) compact design utilizes less board space 

- Compatible with solder reflow and wave solder 

- Mobile device chargers 

- Automotive 

- Central body control module 

- Heating ventilation and air conditioning controllers (HVAC) 

- Doors, window lift and seat control 

- Digital instrument cluster 

- In-vehicle infotainment (IVI) and navigation 

- Electric pumps, motor control and auxiliaries 

## **Environmental compliance** 

**==> picture [58 x 29] intentionally omitted <==**

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- Powertrain control module (PCU)/Engine Control unit (ECU) 

- Transmission Control Unit (TCU) 

## **Agency information** 

- cURus Recognition: File E19180, Guide JDYX2/JDYX8 

- AEC-Q200 qualified (750 mA to 30 A) 

## **Ordering** 

- Use ordering number (see page 6 for details) 

## **Packaging suffixes** 

- -TR (3000 parts per 7” diameter reel, tape width 8 mm) 

CC12H High I²t Chip fuses 

Technical Data 4309 Effective October 2020 

## **Electrical characteristics** 

|||**Amp rating**|||
|---|---|---|---|---|
|**Amp rating**||**condition**||**Opening time**|
|250 mA – 30 A||100%||4 hours minimum|
|1 A – 3 A||200%||1.0 s – 60 s|
|1 A – 5 A||250%||5 s max|
|1 A - 5 A||300%||0.1 - 3.0 s|
|250 mA – 750 mA||350%||5 s max|
|6 A - 30 A||350%||5 s max|



## **Product specifications** 

|||||||**Interrupting**||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Part number**||**Current rating**<br>**(A)**||**Voltage rating**<br>**(Vdc)**||**rating¹**<br>**(A)**||**Typical DC cold**<br>**resistance² (mΩ)**||**Typical pre-arcing³**<br>**I²t (A2s)**||**Typical voltage**<br>**drop (mV)**|**Part**<br>**marking**|
|CC12H250mA||0.25||63||50||3500||0.00038||1400|.25|
|CC12H375mA||0.375||63||50||1750||0.00077||730|A|
|CC12H500mA||0.5||63||50||980||0.0019||700|.5|
|CC12H750mA||0.75||63||50||800||0.15||700|E|
|CC12H1A||1||63||50||470||0.18||490|H|
|CC12H1.5A||1.5||63||50||218||0.4||355|K|
|CC12H2A||2||63||50||133||1.1||305|N|
|CC12H2.5A||2.5||63||50||79||1.7||240|O|
|CC12H3A||3||63||50||49||2.2||185|P|
|CC12H3.5A||3.5||63||50||37||2.7||180|R|
|CC12H4A||4||63||50||33||3.2||169|S|
|CC12H4.5A||4.5||32||100||28||4.2||160|X|
|CC12H5A||5||32||100||23||6||140|T|
|CC12H6A||6||32||100||15.5||12||150|F|
|CC12H7A||7||32||100||11.5||18||130|J|
|CC12H8A||8||32||100||7.3||18||110|V|
|CC12H10A||10||32||100||6.5||30||90|U|
|CC12H12A||12||32||100||4.7||45||90|W|
|CC12H15A||15||32||100||3||33||90|Y|
|CC12H20A||20||32||100||2||80||90|Q|
|CC12H25A||25||32/48||200/150||3||60||90|L|
|CC12H30A||30||32/48||200/150||2.1||100||90|Z|



1. DC interrupting rating measured at rated voltage, time constant of less than 50 microseconds, battery source. 

2. Typical DC cold resistance measured at <10% of rated current. 

3. Typical pre-arcing I²t value is measured at 10In rated current. 

2 

www.eaton.com/electronics 

Technical Data 4309 Effective October 2020 

CC12H High I²t Chip fuses 

## **Dimensions–mm** 

**==> picture [482 x 158] intentionally omitted <==**

## **Packaging information- mm** 

Supplied in tape and reel packaging, 3000 parts per 7” diameter reel. (EIA-481 compliant) 

**==> picture [368 x 243] intentionally omitted <==**

3 

www.eaton.com/electronics 

CC12H High I²t Chip fuses 

Technical Data 4309 Effective October 2020 

## **I[2] t vs. time curve** 

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**==> picture [47 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Time (s)<br>**----- End of picture text -----**<br>


4 

www.eaton.com/electronics 

Technical Data 4309 Effective October 2020 

CC12H High I²t Chip fuses 

## **Time vs. current curve** 

**==> picture [10 x 39] intentionally omitted <==**

**----- Start of picture text -----**<br>
Time (s)<br>**----- End of picture text -----**<br>


5 

www.eaton.com/electronics 

CC12H High I²t Chip fuses 

Technical Data 4309 Effective October 2020 

## **Temperature derating curve** 

## **General specifications** 

Operating temperature: -55 °C to +125 °C (with derating) Thermal shock: MIL- STD- 202G, Method 107, (300 cycles -55 °C to +125 °C) Vibration: MIL-STD- 202G, Method 204, (20 g's for 20 minutes, 12 cycles in each of 3 orientations, 10- 2000 Hz) Humidity: MIL- STD- 202G, Method 103, (+85 °C, 85% relative humidty, 1000 hours 10% of operating power Mechanical shock: MIL-STD- 202G, Method 213, Condition C 

## **Ordering codes** 

The ordering code is the part number replacing the “.” with a “-” plus adding the packaging suffix. 

## **Packaging suffix** 

- -TR (3000 parts on a 7” reel, tape width 8 mm). 

|||**Ordering code**|
|---|---|---|
|**Part number**||**-TR option**|
|CC12H250mA||CC12H250mA-TR|
|CC12H375mA||CC12H375mA-TR|
|CC12H500mA||CC12H500mA-TR|
|CC12H750mA||CC12H750mA-TR|
|CC12H1A||CC12H1A-TR|
|CC12H1.5A||CC12H1-5A-TR|
|CC12H2A||CC12H2A-TR|
|CC12H2.5A||CC12H2-5A-TR|
|CC12H3A||CC12H3A-TR|
|CC12H3.5A||CC12H3-5A-TR|



|||**Ordering code**|
|---|---|---|
|**Part number**||**-TR option**|
|CC12H4A||CC12H4A-TR|
|CC12H4.5A||CC12H4-5A-TR|
|CC12H5A||CC12H5A-TR|
|CC12H6A||CC12H6A-TR|
|CC12H7A||CC12H7A-TR|
|CC12H8A||CC12H8A-TR|
|CC12H10A||CC12H10A-TR|
|CC12H12A||CC12H12A-TR|
|CC12H15A||CC12H15A-TR|
|CC12H20A||CC12H20A-TR|
|CC12H25A||CC12H25A-TR|
|CC12H30A||CC12H30A-TR|



6 

www.eaton.com/electronics 

Technical Data 4309 Effective October 2020 

CC12H High I²t Chip fuses 

## **Wave solder profile** 

|**Temperature**<br>Tsmin<br>Tsmax<br>Tstyp<br>Tp<br>**Reference EN 61760-1:2006**<br>**Profile feature**|tp<br>First Wave<br>Second Wave<br>Preheat area<br>Cool down area|tp<br>First Wave<br>Second Wave<br>Preheat area<br>Cool down area|
|---|---|---|
||**Time**||
|Preheat                    • Temperature min.|(Tsmin)|100 °C<br>100 °C|
|• Temperature typ. (Tstyp)||120 °C<br>120 °C|
|• Temperature max. (Tsmax)||130 °C<br>130 °C|
|• Time (Tsminto Tsmax) (ts)||70 seconds<br>70 seconds|
|D preheat tomax Temperature||150 °C max.<br>150 °C max.|
|Peak temperature (TP)*||235 °C – 260 °C<br>250 °C – 260 °C|
|Time at peak temperature (tp)||10 seconds max<br>5 seconds max each wave<br>10 seconds max<br>5 seconds max each wave|
|Ramp-down rate||~ 2 K/s min<br>~3.5 K/s typ<br>~5 K/s max<br>~ 2 K/s min<br>~3.5 K/s typ<br>~5 K/s max|
|Time 25 °C to 25 °C||4 minutes<br>4 minutes|



## **Manual solder** 

+350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended. 

7 

www.eaton.com/electronics 

CC12H High I²t Chip fuses 

Technical Data 4309 Effective October 2020 

## **Solder reflow profile** 

**==> picture [328 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
TP<br>TC -5°C<br>Max. Ramp Up Rate = 3°C/s tP<br>Max. Ramp Down Rate = 6°C/s<br>TL Preheat t |<br>ee" A<br>Tsmax<br>Tsmin<br>   ts<br>25°C<br>Time 25°C to Peak  Time<br>Temperature<br>**----- End of picture text -----**<br>


## **Table 1 - Standard SnPb solder (Tc)** 

|**Package**<br>**thickness**<br>**Volume**<br>**mm3**<br>**<350**<br>**Volume**<br>**mm3**<br>**≥350**|
|---|
|<2.5 mm<br>235 °C<br>220 °C<br>≥2.5 mm<br>220 °C<br>220 °C<br>~~a~~|



## **Table 2 - Lead (Pb) free solder (Tc)** 

|**Package**<br>**thickness**||**Volume**<br>**mm3**<br>**<350**||**Volume**<br>**mm3**<br>**350 - 2000**||**Volume**<br>**mm3**<br>**>2000**|
|---|---|---|---|---|---|---|
|<1.6 mm||260 °C||260 °C||260 °C|
|1.6 – 2.5 mm||260 °C||250 °C||245 °C|
|>2.5 mm||250 °C||245 °C||245 °C|



## **Reference J-STD-020** 

|**Profile feature**||**Standard SnPb solder**||**Lead (Pb) free solder**|
|---|---|---|---|---|
|Preheat and soak     • Temperature min. (Tsmin)||100 °C||150 °C|
|• Temperature max. (Tsmax)||150 °C||200 °C|
|• Time (Tsminto Tsmax) (ts)||60-120 seconds||60-120 seconds|
|Ramp up rate TLto Tp||3 °C/ second max.||3 °C/ second max.|
|Liquidous temperature (Tl)||183 °C||217 °C|
|Time (tL) maintained above TL||60-150 seconds||60-150 seconds|
|Peak package body temperature (TP)*||Table 1||Table 2|
|Time (tp)* within 5 °C of the specified classification temperature (Tc)||20 seconds*||30 seconds*|
|Ramp-down rate (Tpto TL)||6 °C/ second max.||6 °C/ second max.|
|Time 25 °C to peak temperature||6 minutes max.||8 minutes max.|



* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. 

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. 

**Eaton Electronics Division** 1000 Eaton Boulevard Cleveland, OH 44122 United States Eaton.com/electronics © 2020 Eaton All Rights Reserved Printed in USA Publication No. 4309  BU-MC20177 October 2020 

Follow us on social media to get the Eaton is a registered trademark. latest product and support information. All other trademarks are property of their respective owners. f/¥iinjo

Updated at April 27, 2026

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