CC06FA1A-TR

Technical Data **11003** Effective November 2019 

## CC06FA 

## Automotive grade fast-acting chip fuse 

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## **Applications** 

Automotive 

- Battery management systems (BMS) 

- Central body control module 

- Doors, window lift and seat control 

- Digital instrument cluster 

- In-vehicle infotainment (IVI) and navigation 

- Electric pumps, motor control and auxiliaries 

## **Product features** 

- AEC-Q200 qualified 

- 0603 (1608 metric) compact design utilizes less board space 

- Rapid interruption of excessive current 

- Compatible with reflow and wave solder 

- Powertrain control module (PCU)/engine control unit (ECU) 

- Transmission control unit (TCU) 

## **Agency information** 

   - UL Recognized File: File E19180 

   - AEC-Q200 qualifed 

- Rugged ceramic and glass construction 

- Excellent environmental integrity 

- One time positive disconnect 

## **Ordering** 

   - Use ordering codes (see page 3 for details) 

- High breaking capacity up to 63 V 

- Moisture sensitivity level (MSL) :1 

## **Packaging sufixes** 

- -TR (5,000 parts in paper tape on a 178 mm (7”) reel) 

CC06FA Automotive grade fast-acting chip fuse 

Technical Data 11003 Effective November 2019 

## **Electrical characteristics** 

|**Amp Rating**||**% of Amp Rating**||**Opening Time**|
|---|---|---|---|---|
|500 mA – 1.5 A||100%||4 hours minimum|
|500 mA – 1.5 A||200%||60 seconds maximum|



## **Product specifications** 

|||||||**Interrupting**||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Part Number5**||**Current rating**<br>**(A)**||**Voltage rating**<br>**(Vdc)**||**rating¹**<br>**(A)**||**Typical DC cold**<br>**resistance² (Ω)**||**Typical pre-arcing³**<br>**I²t (A2s)**||**Typical voltage**<br>**drop (V)**|**Part**<br>**marking**|
|CC06FA500mA||0.5||63||50||1.025||0.0019||0.60|F|
|CC06FA750mA||0.75||63||50||0.510||0.003||0.50|G|
|CC06FA1A||1||63||50||0.150||0.007||0.211|H|
|CC06FA1.25A||1.25||63||50||0.132||0.008||0.201|J|
|CC06FA1.5A||1.5||63||50||0.086||0.0319||0.138|K|



1. DC interrupting rating measured at rated voltage, time constant less than 50 microseconds, battery source 

2. DC cold resistance measured at <10% of rated current 

3. Typical pre-arcing I²t measured with a battery bank at rated dc voltage, 10x-rated current, not to exceed IR, time constant of calibrated circuit less than 50 microsecond 

4. Typical voltage drop measured at rated current after temperature stabilizes 

5. Part Number Definition: CC06FAxxx-R 

CC06FA = Product code and size 

xxx - Ampere rating (mA or A) 

**Dimensions–mm in** 

## Recommended pad layout 

Fuse to be installed with ceramic side up (white/marking) 

2 

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Technical Data 11003 Effective November 2019 

CC06FA Automotive grade fast-acting chip fuse 

## **Temperature derating curve** 

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08<br>06<br>04<br>02<br>0<br>55 35 15 5 25 45<br>Ambient temperature (°C)<br>Derating factor<br>**----- End of picture text -----**<br>


## **Environmental data** 

Operating temperature: -55 °C to +125 °C (with derating) Storage temperature (component): -55 °C to +125 °C Life test: MIL-STD-202, Method 108A, except circulating air environment at +125 °C ±2 °C, apply 60% rated current for 1000 hours Load humidity test: MIL-STD-202, Method 103B except: environmental chamber 85%+2% relative humidity at +85 °C ±2 °C, 10% of rated dc current, at any voltage less than or equal to rated voltage for 1000 hours 

Terminal strength test: Force of 1.8 kg for  60 seconds 

TBoard flex test: Downward force is applied to cause a 2 mm deflection for 1 minute (no physical evidence of mechanical or physical damage, change in resistance < 5%) 

Thermal shock test: MIL-STD-202, Method 107D, -55 °C to +125 °C, 200 cycles 

Mechanical shock test: MIL-STD-202, Method 213 condition C, 100 g’s half-sine for 6 seconds 

High frequency vibration test: MIL-STD-202, Method 204, 5 g’s for 20 minutes, 12 cycles each of 3 orientations ,10 to 2000 Hz 

Resistance to solvents test: MIL-STD-202, Method 215A 

High temperature exposure: 1000 hours at +125 °C unpowered 

Resistance to solder heat: MIL-STD-202 Method 210 condition B 

Solderability: ANSI/J-STD-002, Dip and look test: Test B Wetting balance test: Test F Resistance to dissolution of metalization test: Test D 

## **Ordering codes** 

The ordering code is the part number replacing the “.” with a “-” plus adding the packaging suffix. 

## **Packaging suffix** 

-TR (5,000 parts in paper tape on a 178 mm (7”) reel) 

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|||
|---|---|
|Ordering code|
|Part Number|-TR option|
|CC06FA500mA|CC06FA500mA-TR|
|CC06FA750mA|CC06FA750mA-TR|
|CC06FA1A|CC06FA1A-TR|
|CC06FA1.25A|CC06FA1-25A-TR|
|CC06FA1.5A|CC06FA1-5A-TR|

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CC06FA Automotive grade fast-acting chip fuse 

Technical Data 11003 Effective November 2019 

## **Wave solder profile** 

|**Reference EN 61760-1:2006**<br>**Profile feature**<br>**Temperature**<br>Tsmin<br>Tsmax<br>Tstyp<br>Tp|tp<br>First Wave<br>Second Wave<br>Preheat area<br>Cool down area|tp<br>First Wave<br>Second Wave<br>Preheat area<br>Cool down area|
|---|---|---|
||**Time**||
|Preheat                    • Temperature min. (Tsmin)||100 °C<br>100 °C|
|• Temperature typ. (Tstyp)||120 °C<br>120 °C|
|• Temperature max. (Tsmax)||130 °C<br>130 °C|
|• Time (Tsminto Tsmax) (ts)||70 seconds<br>70 seconds|
|D preheat tomax Temperature||150 °C max.<br>150 °C max.|
|Peak temperature (TP)*||235 °C – 260 °C<br>250 °C – 260 °C|
|Time at peak temperature (tp)||10 seconds max<br>5 seconds max each wave<br>10 seconds max<br>5 seconds max each wave|
|Ramp-down rate||~ 2 K/s min<br>~3.5 K/s typ<br>~5 K/s max<br>~ 2 K/s min<br>~3.5 K/s typ<br>~5 K/s max|
|Time 25°C to 25°C||4 minutes<br>4 minutes|



## **Manual solder** 

+350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended 

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CC06FA Automotive grade fast-acting chip fuse 

Technical Data 11003 Effective November 2019 

## **Solder reflow profile** 

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TP<br>TC -5°C<br>Max. Ramp Up Rate = 3°C/s tP<br>Max. Ramp Down Rate = 6°C/s<br>TL<br>Preheat t |<br>"= A<br>Tsmax<br>Tsmin<br>   ts<br>25°C<br>Time 25°C to Peak  Time<br>Temperature<br>**----- End of picture text -----**<br>


## **Table 1 - Standard SnPb solder (Tc)** 

|**Package**<br>**thickness**||**Volume**<br>**mm3**<br>**<350**||**Volume**<br>**mm3**<br>**≥350**|
|---|---|---|---|---|
|<2.5 mm)<br>≥2.5 mm||235 °C<br>220 °C||220 °C<br>220 °C|



## **Table 2 - Lead (Pb) free solder (Tc)** 

|**Package**<br>**thickness**||**Volume**<br>**mm3**<br>**<350**||**Volume**<br>**mm3**<br>**350 - 2000**||**Volume**<br>**mm3**<br>**>2000**|
|---|---|---|---|---|---|---|
|<1.6 mm||260 °C||260 °C||260 °C|
|1.6 – 2.5 mm||260 °C||250 °C||245 °C|
|>2.5 mm||250 °C||245 °C||245 °C|



## **Reference J-STD-020** 

|**Profile feature**||**Standard SnPb solder**||**Lead (Pb) free solder**|
|---|---|---|---|---|
|Preheat and soak     • Temperature min. (Tsmin)||100 °C||150 °C|
|• Temperature max. (Tsmax)||150 °C||200 °C|
|• Time (Tsminto Tsmax) (ts)||60-120 seconds||60-120 seconds|
|Ramp up rate TLto Tp||3 °C/ second max.||3 °C/ second max.|
|Liquidous temperature (Tl)||183 °C||217 °C|
|Time (tL) maintained above TL||60-150 seconds||60-150 seconds|
|Peak package body temperature (TP)*||Table 1||Table 2|
|Time (tp)* within 5 °C of the specified classification temperature (Tc)||20 seconds*||30 seconds*|
|Ramp-down rate (Tpto TL)||6 °C/ second max.||6 °C/ second max.|
|Time 25 °C to peak temperature||6 minutes max.||8 minutes max.|



* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. 

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. 

**Eaton Electronics Division** 1000 Eaton Boulevard Cleveland, OH 44122 United States Eaton.com/electronics © 2019 Eaton All Rights Reserved Printed in USA Publication No. 11003 BU-MC19130 November 2019 

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