CB61F10A-TR2

Effective April 2024 Supersedes December 2020 

Technical Data **4377** 

## CB61F Fast-acting surface mount Brick™ fuses 

## **Applications** 

Primary circuit protection 

- Power supplies 

- Servers 

- Medical equipment 

- White goods 

- Battery chargers 

- Consumer electronics 

## **Product features** 

- Fast-acting 

   - Test equipment 

   - Battery pack protection 

- 2410 (6125 metric) compact footprint 

- Designed to UL 248 

- High interrupting ratings 

- Current ratings from 2 A to 40 A 

- Reflow and wave solder compatible 

- Wire-in-air design 

## **Agency information** 

> • UL Listed cULus:  File E19180, Guide JDYX (2 A - 15 A) 

   - UL Recognized cURus:  File E19180, Guide JDYX2 (20 A - 40 A) 

   - CQC: CQC09012040316 (2 A - 6.3 A & 8 A - 10 A) 

- Moisture sensitivity level (MSL): 1 

## **Environmental compliance** 

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HALOGEN<br>HF Pb<br>FREE SO<br>**----- End of picture text -----**<br>


## **Ordering code** 

The ordering code is the part number replacing the “.” with a “-” plus adding the packaging suffix. 

## **CB61F  6-3A** 

Product code Ampere rating 

## **Packaging suffix** 

- **-TR1** 1000 fuses on a 7” diameter tape and reel 

- **-TR2** 5000 fuses on a 13” diameter tape and reel  (2 A to 15 A only) 

CB61F Fast-acting surface mount Brick™ fuses 

Technical Data 4377 Effective April 2024 

## **Electrical characteristics** 

|**Amp Rating**||**% of Amp Rating**||**Opening Time**|
|---|---|---|---|---|
|2 A – 40 A||100%||4 hours minimum|
|2 A – 15 A||200%||5 seconds maximum|
|20 A – 40 A||200%||60 seconds maximum|



## **Product specifications** 

|||||||||||||**Typical DC**||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Part Number**||**Current**<br>**rating**<br>**(A)**||**Voltage**<br>**rating**<br>**(Vac)**||**Voltage**<br>**rating**<br>**(Vdc)**||**Interrupting rating1,2**<br>**(A) @ rated voltage**<br>**(Vac)       (Vdc)**||||**cold**<br>**resistance3**<br>**(mΩ)**||**Typical**<br>**melting4**<br>**I²t (A2s)**||**Typical**<br>**voltage**<br>**drop5 (mV)**||**Part**<br>**marking**|**cULus**<br>**cURus**<br>**Agency approval**||||**CQC**|
|CB61F2A||2.0||125||125||100||300||39||0.85||100||2|x||||x|
|CB61F3A||3.0||125||125||100||300||25||2.08||100||3|x||||x|
|CB61F4A||4.0||125||125||100||300||17||4.4||93||4|x||||x|
|CB61F5A||5.0||125||125||100||300||13||7.7||90||5|x||||x|
|CB61F6.3A||6.3||125||125||100||300||10||13.7||90||6.3|x||||x|
|CB61F7A||7.0||125||125||100||300||9||15.6||85||7|x|||||
|CB61F8A||8.0||125||125||100||300||8||19.5||90||8|x||||x|
|CB61F10A||10||125||125||100||300||6||36||90||10|x||||x|
|CB61F12A||12||125||125||50||200||5||40||90||12|x|||||
|CB61F15A||15||125||125||50||200||4||56||85||15|x|||||
|CB61F20A||20||-||72||-||500||2.3||210||60||20|||x|||
|CB61F25A||25||-||72||-||500||1.7||400||55||25|||x|||
|CB61F30A||30||-||72||-||500||1.2||900||50||30|||x|||
|CB61F40A||40||-||63||-||500||0.9||1600||50||40|||x|||



1. AC Interrupting rating: Measured at rated voltage, 100% power factor 

2. DC Interrupting rating: Measured at rated voltage, time constant of less than 50 microseconds, battery source 

3. Typical DC cold resistance:  Measured at 10% of rated current 

4.    Typical Pre-arcing I[2] t are measured at 10In Current 

5.     Typical voltage drop:  Measured at rated current after temperature stabilizes 

## **Dimensions–mm** 

## **2 A to 15 A** 

**Recommended pad layout** 

**20 A to 40 A** 

**Recommended pad layout** 

2 

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CB61F Fast-acting surface mount Brick™ fuses 

Technical Data 4377 Effective April 2024 

## **Time current curve** 

## **2 A to 15 A** 

## **20 A to 40 A** 

## **Temperature derating curve** 

## **General specifications** 

Operating temperature: -55 °C to +125 °C (with derating) 

Storage temperature: -55 °C to +125 °C 

Thermal shock: 2 A to 15 A - MIL-STD-202, Method 107G,  -65 °C/+125 °C, number of cycles :10 20 A to 40 A - MIL-STD-202, Method 107G  -55 °C/+125 °C, number of cycles: 100 

Bias humidity: 2 A to 15 A -  MIL-STD-202, Method 103  +85 °C/85%RH. ,100 hours 20 A to 40 A -  MIL-STD-202, Method 103  +85 °C/85%RH. ,1000 hours 

Mechanical shock: 2 A to 40 A - MIL-STD-202G, Method 213B, Test condition C, 100 g’s peak for 6 ms; Half-sine waveform 

Mechanical vibration: 2 A to 15 A - MIL-STD-202G, Method 201, Test condition A (10 - 55 Hz, 0.06 inch, 2 hours each of 3 mutually perpendicular direction, total 6 hours), high Freguency: 20 g’s for 20 min., 12 cycles each of 3orientations. ,10 - 2000 Hz.10 to 55 Hz, 0.06 inch, total excursion 20 A to 40 A - MIL-STD-202G, Method 201, 2 hours each of 3 orientations. Test from 10 -5 5 Hz in 1 minute 

Resistance to solder heat: 2 A to 40 A - MIL-STD-202G, Method 210F , condition D (+260 °C, 10s) 

3 

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CB61F Fast-acting surface mount Brick™ fuses 

Technical Data 4377 Effective April 2024 

## **Wave solder profile** 

|**Temperature**<br>Tsmin<br>Tsmax<br>Tstyp<br>Tp<br>**Reference EN 61760-1:2006**<br>**Profile feature**|tp<br>First Wave<br>Second Wave<br>Preheat area<br>Cool down area|tp<br>First Wave<br>Second Wave<br>Preheat area<br>Cool down area|
|---|---|---|
||**Time**||
|Preheat                    • Temperature min.|(Tsmin)|100 °C<br>100 °C|
|• Temperature typ. (Tstyp)||120 °C<br>120 °C|
|• Temperature max. (Tsmax)||130 °C<br>130 °C|
|• Time (Tsminto Tsmax) (ts)||70 seconds<br>70 seconds|
|D preheat tomax Temperature||150 °C max.<br>150 °C max.|
|Peak temperature (TP)*||235 °C – 260 °C<br>250 °C – 260 °C|
|Time at peak temperature (tp)||10 seconds max<br>5 seconds max each wave<br>10 seconds max<br>5 seconds max each wave|
|Ramp-down rate||~ 2 K/s min<br>~3.5 K/s typ<br>~5 K/s max<br>~ 2 K/s min<br>~3.5 K/s typ<br>~5 K/s max|
|Time 25 °C to 25 °C||4 minutes<br>4 minutes|



## **Manual solder** 

+350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended 

4 

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CB61F Fast-acting surface mount Brick™ fuses 

Technical Data 4377 Effective April 2024 

## **Solder reflow profile** 

## **Table 1 - Standard SnPb solder (Tc)** 

|TP|||||||Max. Ramp Up Rate = 3°C/s<br>Max. Ramp Down Rate = 6°C/s|Max. Ramp Up Rate = 3°C/s<br>Max. Ramp Down Rate = 6°C/s|Max. Ramp Up Rate = 3°C/s<br>Max. Ramp Down Rate = 6°C/s|tP|tP|TC-5°C||**Table 1 - Standard SnPb solder (Tc)**<br>**Package**<br>**thickness**|**Table 1 - Standard SnPb solder (Tc)**|**Table 1 - Standard SnPb solder (Tc)**|**Table 1 - Standard SnPb solder (Tc)**<br>**Volume**<br>**mm3**<br>**<350**|**Table 1 - Standard SnPb solder (Tc)**<br>**Volume**<br>**mm3**<br>**<350**|**Table 1 - Standard SnPb solder (Tc)**|**Table 1 - Standard SnPb solder (Tc)**<br>**Volume**<br>**mm3**<br>**≥350**||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Temperature**<br>TL||Tsmin<br>Tsmax<br>_a<br>|||a|a|t<br>ts<br>Preheat<br>A<br>a*"<br>a|||||||<2.5 mm)<br>≥2.5 mm<br>**Table 2 - Lead (Pb) free solder (Tc)**<br>**Package**<br>**thickness**<br><1.6 mm<br>~~—$~~||235 °C<br>220 °C<br>220 °C<br>220 °C<br>**Table 2 - Lead (Pb) free solder (Tc)**<br>**Volume**<br>**mm3**<br>**<350**<br>**Volume**<br>**mm3**<br>**350 - 2000**<br>260 °C<br>260 °C||||||||**Volume**<br>**mm3**<br>**>2000**<br>260 °C|
|||||||||||||||1.6 – 2.5 mm||||260 °C||250 °C|||245 °C|
|||||||||||||||>2.5 mm||||250 °C||245 °C|||245 °C|
|25°C||||||Time 25°C to Peak|||Time|||||||||||||||



## **Reference J-STD-020** 

|**Profile feature**||**Standard SnPb solder**||**Lead (Pb) free solder**|
|---|---|---|---|---|
|Preheat and soak     • Temperature min. (Tsmin)||100 °C||150 °C|
|• Temperature max. (Tsmax)||150 °C||200 °C|
|• Time (Tsminto Tsmax) (ts)||60-120 seconds||60-120 seconds|
|Ramp up rate TLto Tp||3 °C/ second max.||3 °C/ second max.|
|Liquidous temperature (Tl)||183 °C||217 °C|
|Time (tL) maintained above TL||60-150 seconds||60-150 seconds|
|Peak package body temperature (TP)*||Table 1||Table 2|
|Time (tp)* within 5 °C of the specified classification temperature (Tc)||20 seconds*||30 seconds*|
|Ramp-down rate (Tpto TL)||6 °C/ second max.||6 °C/ second max.|
|Time 25 °C to peak temperature||6 minutes max.||8 minutes max.|



* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. 

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. 

**Eaton Electronics Division** 1000 Eaton Boulevard Cleveland, OH 44122 United States Eaton.com/electronics © 2024 Eaton All Rights Reserved Printed in USA Publication No. 4377 PCN24012 April 2024 

Eaton is a registered trademark. All other trademarks are property of their respective owners. 

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