BZT52C15LP-7

## **BZT52C2V4LP - BZT52C39LP** OQ Co **SURFACE MOUNT ZENER DIODE** 

## **Features** 

## **Mechanical Data** 

- Ultra-Small Leadless Surface Mount Package 

- Ideally Suited for Automated Assembly Processes 

- **Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- Case: X1-DFN1006-2 

- Case Material: Molded Plastic, "Green" Molding Compound; UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminal Connections: See Marking Information 

- Terminals: Finish  NiPdAu over Copper Leadframe; Solderable per MIL-STD-202, Method 208 **e4** 

- Weight: 0.001 grams (Approximate) 

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Bottom View<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information** (Note 4)|(Note 4)|||
|---|---|---|---|
|**Part Number**|**Compliance**|**Case**|**Packaging**|
|(Type Number)-7*|Commercial|X1-DFN1006-2|3,000/Tape & Reel|
|(Type Number)-7B**|Commercial|X1-DFN1006-2|10,000/Tape & Reel|



- *Add “-7” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7. 

- **Add “-7B” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7B. 

- Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 

   2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

   3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

   4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

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 BZT52CxxLP-7  BZT52CxxLP-7B<br>xx xx xx = Product Type Marking Code<br>r |] hE<br>Top View  Top View<br>Dot Denotes  Bar Denotes<br>Cathode Side  Cathode Side<br>OR<br>xx<br>|<br>Top View<br>Bar Denotes<br>Cathode Side<br>**----- End of picture text -----**<br>


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BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 22 - 2 

May 2015 © Diodes Incorporated 

**BZT52C2V4LP - BZT52C39LP** 

**Maximum Ratings** (@TA = +25°C, unless otherwise specified.) 

**Characteristic Symbol Value Unit** ~~———————e~~ Forward Voltage (Note 5) @ IF = 10mA VF 0.9 V 

## **Thermal Characteristics** 

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||||||
|---|---|---|---|---|
|Characteristic|Symbol|Value|Unit|
|Power Dissipation|(Note 6) TA = +25°C|PD|250|mW|
|Thermal Resistance, Junction to Ambient Air|(Note 6)   TA = +25°C|RθJA|500|°C/W|
|Operating and Storage Temperature Range|TJ, TSTG|-65 to +150|°C|

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**Electrical Characteristics** (@TA = +25°C, unless otherwise specified.) 

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||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Maximum|
|Zener Voltage Range|Maximum Zener Impedance|Reverse|Temperature|Test|
|Coefficient|
|Type|Marking|(Note 5)|f = 1kHz|Current|Current|
|Number|Code|(Note|5)|@ ImV/°C ZTC|IZTC|
|VZ|@ IZT|IZT|ZZT  @|IZT|ZZK|@ IZK|IZK|IR|@ VR|
|Nom (V)|Min (V)|Max (V)|mA|Ω|mA|µA|V|Min|Max|mA|
||||BZT52C2V4LP|WX|et|2.4|2.20|2.60|5|100|600|1.0|||50|1.0|-3.5|0|5|
|BZT52C2V7LP|W1|2.7|2.5|2.9|5|100|600|1.0|20|1.0|-3.5|0|5|
|BZT52C3V0LP|W2|3.0|2.8|3.2|5|95|600|1.0|10|1.0|-3.5|0|5|
|BZT52C3V3LP|W3|3.3|3.1|3.5|5|95|600|1.0|5|1.0|-3.5|0|5|
|BZT52C3V6LP|W4|3.6|3.4|3.8|5|90|600|1.0|5|1.0|-3.5|0|5|
|BZT52C3V9LP|W5|3.9|3.7|4.1|5|90|600|1.0|3|1.0|-3.5|0|5|
|BZT52C4V3LP|W6|4.3|4.0|4.6|5|90|600|1.0|3|1.0|-3.5|0|5|
|BZT52C4V7LP|W7|4.7|4.4|5.0|5|80|500|1.0|3|2.0|-3.5|0.2|5|
|BZT52C5V1LP|9Y|5.1|4.8|5.4|5|60|480|1.0|2.0|2.0|-2.7|1.2|5|
|BZT52C5V6LP|9A|5.6|5.2|6.0|5|40|400|1.0|1.0|2.0|-2|2.5|5|
|BZT52C6V2LP|9B|6.2|5.8|6.6|5|10|150|1.0|3.0|4.0|0.4|3.7|5|
|BZT52C6V8LP|
|9C|6.8|6.4|7.2|5|15|80|1.0|2.0|4.0|1.2|4.5|5|
|(Note 7)|
|errr|BZT52C7V5LP|9D|7.5|7.0|7.9|5|15|80|1.0|1.0|5.0|2.5|5.3|5|
|BZT52C8V2LP|9E|8.2|7.7|8.7|5|15|80|1.0|0.7|5.0|3.2|6.2|5|
|BZT52C9V1LP|9F|9.1|8.5|9.6|5|15|100|1.0|0.5|6.0|3.8|7.0|5|
|BZT52C10LP|9G|10|9.4|10.6|5|20|150|1.0|0.2|7.0|4.5|8.0|5|
|BZT52C11LP|9H|11|10.4|11.6|5|20|150|1.0|0.1|8.0|5.4|9.0|5|
|BZT52C12LP|9J|12|11.4|12.7|5|25|150|1.0|0.1|8.0|6.0|10.0|5|
|BZT52C13LP|9K|13|12.4|14.1|5|30|170|1.0|0.1|8.0|7.0|11.0|5|
|BZT52C15LP|9L|15|13.8|15.6|5|30|200|1.0|0.1|10.5|9.2|13.0|5|
|BZT52C16LP|9M|16|15.3|17.1|5|40|200|1.0|0.1|11.2|10.4|14.0|5|
|BZT52C18LP|9N|18|16.8|19.1|5|45|225|1.0|0.1|12.6|12.4|16.0|5|
|BZT52C20LP|9P|20|18.8|21.2|5|55|225|1.0|0.1|14.0|14.4|-|5|
|BZT52C22LP|9R|22|20.8|23.3|5|55|250|1.0|0.1|15.4|16.4|-|5|
|BZT52C24LP|9S|24|22.8|25.6|5|70|250|1.0|0.1|16.8|18.4|-|5|
|BZT52C36LP|9W|36|34.0|38.0|2|90|350|0.5|0.1|25.2|36.5|-|5|
|BZT52C39LP|9X|39|37.0|41.0|2|130|350|0.5|0.1|27.3|36.8|-|5|

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- Notes: 5. Short duration pulse test used to minimize self-heating effect. 

   6. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can     be found on our website at http://www.diodes.com. 

   7. Device can withstand a repetitive, 1A pulse with tp = 300μs and T = 3s (forward or reverse direction). 

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BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 22 - 2 

May 2015 © Diodes Incorporated 

**BZT52C2V4LP - BZT52C39LP** 

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300<br>Note 6<br>250<br>200<br>150<br>100<br>50<br>0<br>0 25 50 75 100 125 150<br>TA, AMBIENT TEMPERATURE (°C)<br>Fig. 1  Power Derating Curve<br>100<br>pF | | | [| [| fT ft ft | yf ty<br>10 TA = 25°C<br>psp e eee fl<br>1 a<br>C4V7LP<br>Pf otfA<br>0.1<br>ee ee ee | ee<br>0.01<br>-EEEEEALLELLL<br>0 1 2 3 4 5 6<br>VZ, ZENER VOLTAGE (V)<br>Fig. 3 Typical Reverse Characteristics<br>30<br>C10LP<br>PT eT pt eee T Ly<br>C12LP<br>C15LP<br>meeeLT Et ty ft tt |<br>20<br>C18LP<br>FEE EH EEEE<br>SEEEEPA C22LP<br>SERRE ECE EEE<br>10 Ei tT tT eet ye eT<br>Test Current IZ<br>rt tT tT tT eT TE 5.0mA<br>2<br>AREER FAE EEE<br>0<br>0 FECES 10  EEE 20 30<br>VZ, ZENER VOLTAGE (V)<br>Fig. 5  Typical Zener Breakdown Characteristics<br>, POWER DISSIPATION (mW)<br>P<br>D<br>, ZENER CURRENT (mA)<br>IZ<br>, ZENER CURRENT (mA)<br>Z<br>I<br>**----- End of picture text -----**<br>


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1000<br>TA= 150°C T A = 25°C<br>TA= 125°C<br>100<br>TA= -40°C<br>T A = 105°C<br>10 TA= 85°C<br>TA= -65°C<br>ee ee 0 2 fe ee 2<br>1<br>0.1 PAPE TP<br>0 0.3 0.6 0.9 1.2 1.5<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Fig. 2 Typical Forward Characteristics<br>50<br>C5V6LP<br>C6V8LP<br>40<br>C6V2LP C8V2LP<br>30 TT TTEITEE<br>20<br>10 Test Current I Z<br>5.0mA<br>0 SUASRRCCEPA ERINEE<br>0 1 2 3 4 5 6 7 8 9 10<br>VZ, ZENER VOLTAGE (V)<br>Fig. 4  Typical Zener Breakdown Characteristics<br>8<br>C36LP<br>C39LP<br>6 TA<br>EEE<br>PLL<br>THT Test Current I Z TTT<br>2.0mA<br>2<br>aie<br>||<br>ALT TL<br>VZ, ZENER VOLTAGE (V)<br>Fig. 6  Typical Zener Breakdown Characteristics<br>, INSTANTANEOUS FORWARD VOLTAGE (mA)<br>IF<br>, ZENER CURRENT (mA)<br>IZ<br>Z<br>, ZENER CURRENT (mA)<br>I<br>**----- End of picture text -----**<br>


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BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 22 - 2 

May 2015 © Diodes Incorporated 

**BZT52C2V4LP - BZT52C39LP** 

## **Package Outline Dimensions** 

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. 

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|||||||
|---|---|---|---|---|---|
|A|
|X1-DFN1006-2|
|glo|A1|Dim|Min|Max|Typ|
|A|0.47|0.53|0.50|
|D|
|A1|0|0.05|0.03|
|b|0.45|0.55|0.50|
|D|0.95|1.075|1.00|
|E|0.55|0.675|0.60|
|e|-|-|0.40|
|E|b|
|L|0.20|0.30|0.25|
|R|0.05|0.15|0.10|
|All Dimensions in mm|
|ft|
|HD|L|e|

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## **Suggested Pad Layout** 

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 

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X1<br>X<br><I<br>Y<br>tpc oe<br>G<br>C<br>**----- End of picture text -----**<br>


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|||
|---|---|
|Dimensions|Value (in mm)|
|C|0.70|
|G|0.30|
|X|0.40|
|X1|1.10|
|Y|0.70|

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BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 22 - 2 

May 2015 © Diodes Incorporated 

**BZT52C2V4LP - BZT52C39LP** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference.  Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

- B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2015, Diodes Incorporated 

**www.diodes.com** 

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BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 22 - 2 

May 2015 © Diodes Incorporated