BU406G
Bipolar (BJT) Single Transistor, NPN, 200 V, 7 A, 60 W, TO-220, Through Hole
- Manufacturer: ONSEMI
- Product type: Single Bipolar Junction Transistors - BJT
- Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:200V; Transition Frequency ft:10MHz; Power Dissipation Pd:60W; DC Collector Current:7A; DC Current Gain hFE:10hFE; Trans
- MSL: -
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 3Pins
- Product Range: -
- Qualification: -
- Power Dissipation: 60W
- Transistor Mounting: Through Hole
- Transistor Polarity: NPN
- Transition Frequency: 10MHz
- Transistor Case Style: TO-220
- DC Current Gain hFE Min: 10hFE
- Operating Temperature Max: 150°C
- Continuous Collector Current: 7A
- Collector Emitter Voltage Max: 200V
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.517 € |
| Current stock | 200+ |
| Lead time | 7 days |
BU406, BU407
## NPN Power Transistors
These devices are high voltage, high speed transistors for horizontal deflection output stages of TV’s and CRT’s.
## **Features**
- High Voltage
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- Fast Switching Speed
- Low Saturation Voltage
- These Devices are Pb−Free and are RoHS Compliant*
## **MAXIMUM RATINGS**
|**MAXIMUM RATINGS**|~~a~~|||
|---|---|---|---|
|**Rating**<br>~~ee~~|**Symbol**<br>~~ee~~<br>~~a~~|**Value**<br>~~ee~~|**Unit**<br>~~ee~~|
|Collector−Emitter Voltage<br>BU406<br>BU407<br>~~ee~~|VCEO<br>~~ee~~<br>~~a~~|200<br>150<br>~~ee~~|Vdc<br>~~ee~~|
|Collector−Emitter Voltage<br>BU406<br>BU407<br>~~ee~~<br>~~p_______|~~|VCEV<br>~~a~~<br>~~ee~~<br>~~p_______|{|~~|400<br>330<br>~~ee~~<br>~~{||~~|Vdc<br>~~ee~~<br>~~|~~|
|Collector−Base Voltage<br>BU406<br>BU407<br>~~p_______|~~|VCBO<br>~~p_______|{|~~|400<br>330<br>~~{||~~|Vdc<br>~~|~~|
|Emitter−Base Voltage<br>~~p_______|~~|VEBO<br>~~p_______|{|~~|6<br>~~{||~~|Vdc<br>~~|~~|
|Collector Current − Continuous<br>− Peak Repetitive<br>~~p_______|~~<br>~~pt~~|IC<br>~~p_______| {|~~<br>~~pt~~|7<br>10<br>~~{| |~~<br>~~pt~~|Adc<br>~~|~~<br>~~pt~~|
|Collector Current − Peak (10 ms)<br>~~pt~~|ICM<br>~~pt~~|15<br>~~pt~~|Adc<br>~~pt~~|
|Base Current|IB|4|Adc|
|Total Device Dissipation @ TC= 25 C<br>Derate above 25°C|PD|60<br>0.48|W<br>W/ C|
|Operating and Storage Junction<br>Temperature Storage|TJ, Tstg|−65 to 150|C|
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
## **THERMAL CHARACTERISTICS**
|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristics**<br>~~a~~|**Symbol**<br>~~a~~|**Max**<br>~~a~~|**Unit**<br>~~a~~|
|Thermal Resistance, Junction−to−Case|R JC|2.08|C/W|
|Thermal Resistance, Junction−to−Ambient|R JA|70|C/W|
|Maximum Lead Temperature for Soldering<br>Purposes1/8″from Case for 5 Seconds|TL|260|C|
**NPN SILICON POWER TRANSISTORS 7 AMPERES − 60 WATTS 150 AND 200 VOLTS**
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SCHEMATIC<br>COLLECTOR<br>2,4<br>1<br>BASE<br>©<br>3<br>EMITTER<br>MARKING<br>DIAGRAM<br>**----- End of picture text -----**<br>
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4<br>TO−220 BU40xG<br>CASE 221A AY WW<br>STYLE 1<br>1<br>2<br>3 1<br>BU40x = Specific Device Code<br>x = 6 or 7<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>G = Pb−Free Package<br>**----- End of picture text -----**<br>
## **ORDERING INFORMATION**
|**Device**|**Package**|**Shipping**|
|---|---|---|
|BU406G|TO−220AB<br>(Pb−Free)|50 Units / Rail|
|BU407G|TO−220AB<br>(Pb−Free)|50 Units / Rail|
- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Publication Order Number: **BU406/D**
**1**
© Semiconductor Components Industries, LLC, 2014 **November, 2014 − Rev. 11**
**BU406, BU407**
## ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ **ELECTRICAL CHARACTERISTICS** (TC = 25 � C unless otherwise noted)
|||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Sustaining Voltage (Note 1)<br>BU406<br>(IC= 100 mAdc, IB= 0)<br>BU407|VCEO(sus)|200<br>150|−<br>−|−<br>−|Vdc|
|Collector Cutoff Current<br>(VCE= Rated VCEV, VBE= 0)<br>(VCE= Rated VCEO+ 50 Vdc, VBE= 0)<br>(VCE= Rated VCEO+ 50 Vdc, VBE= 0, TC= 150�C)|ICES|−<br>−<br>−|−<br>−<br>−|5<br>0.1<br>1|mAdc|
|Emitter Cutoff Current<br>BU406, BU407<br>(VEB= 6 Vdc, IC= 0)|IEBO|−|−|1|mAdc|
|**ON CHARACTERISTICS**(Note 1)||||||
|Collector−Emitter Saturation Voltage<br>(IC= 5 Adc, IB= 0.5 Adc)|VCE(sat)|−|−|1|Vdc|
|Base−Emitter Saturation Voltage<br>(IC= 5 Adc, IB= 0.5 Adc)|VBE(sat)|−|−|1.2|Vdc|
|Forward Diode Voltage<br>(IEC= 5 Adc) “D” only|VEC|−|−|2|Volts|
|**DYNAMIC CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product<br>(IC= 0.5 Adc, VCE= 10 Vdc, ftest= 20 MHz)|fT|10|−|−|MHz|
|Output Capacitance<br>(VCB= 10 Vdc, IE= 0, f = 1 MHz)|Cob|−|80|−|pF|
|**SWITCHING CHARACTERISTICS**||||||
|Inductive Load Crossover Time<br>(VCC= 40 Vdc, IC= 5 Adc, IB1= IB2= 0.5 Adc, L = 150�H)|tc|−|−|0.75|�s|
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 1%.
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100 10<br>70 TJ = 100°C<br>dc<br>25°C<br>50<br>1 BONDING WIRE LIMIT<br>30 VCE = 5 V THERMAL LIMIT<br>SECOND BREAKDOWN LIMIT<br>0.1<br>20<br>TC = 25°C BU407BU406<br>10<br>0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10 2 3 5 7 10 20 30 50 70 100 200<br>IC, COLLECTOR CURRENT (AMPS) VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>hFE, DC CURRENT GAIN<br>IC, COLLECTOR CURRENT (AMP)<br>**----- End of picture text -----**<br>
**Figure 1. DC Current Gain**
**Figure 2. Maximum Rated Forward Bias Safe Operating Area**
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**2**
MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS**
**TO−220** CASE 221A−09 ISSUE AJ DATE 05 NOV 2019
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SCALE 1:1<br>**----- End of picture text -----**<br>
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STYLE 1: STYLE 2: STYLE 3: STYLE 4:<br>PIN 1. BASE PIN 1. BASE PIN 1. CATHODE PIN 1. MAIN TERMINAL 1<br>2. COLLECTOR 2. EMITTER 2. ANODE 2. MAIN TERMINAL 2<br>3. EMITTER 3. COLLECTOR 3. GATE 3. GATE<br>4. COLLECTOR 4. EMITTER 4. ANODE 4. MAIN TERMINAL 2<br>STYLE 5: STYLE 6: STYLE 7: STYLE 8:<br>PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE PIN 1. CATHODE<br>2. DRAIN 2. CATHODE 2. ANODE 2. ANODE<br>3. SOURCE 3. ANODE 3. CATHODE 3. EXTERNAL TRIP/DELAY<br>4. DRAIN 4. CATHODE 4. ANODE 4. ANODE<br>STYLE 9: STYLE 10: STYLE 11: STYLE 12:<br>PIN 1. GATE PIN 1. GATE PIN 1. DRAIN PIN 1. MAIN TERMINAL 1<br>2. COLLECTOR 2. SOURCE 2. SOURCE 2. MAIN TERMINAL 2<br>3. EMITTER 3. DRAIN 3. GATE 3. GATE<br>4. COLLECTOR 4. SOURCE 4. SOURCE 4. NOT CONNECTED<br>**----- End of picture text -----**<br>
|**DOCUMENT NUMBER:**|**98ASB42148B**|
|---|---|
|**DESCRIPTION:**|**TO−220**|
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## **PUBLICATION ORDERING INFORMATION**
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onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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