BTM511

## Bluetooth® Audio Modules **BTM510/511** 

## Innovative **Technology** for a **Connected** World 

The BTM510 and BTM 511 are low-power Bluetooth[®] modules designed for adding robust audio and voice capabilities.  Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide exceptionally low power consumption with outstanding range.  Supporting the latest Bluetooth Version 2.1+EDR specification, these modules provide the important advantage of secure simple pairing that improves security and enhances easy use. 

At only 14mm x 20mm for the BTM510 and 14mm x 25mm for the BTM511, the compact size of the modules makes them ideal for battery-powered or headset form factor audio and voice devices.  With a 16-bit stereo codec and microphone inputs to support both stereo and mono applications, these modules also contain a full, integrated Bluetooth-qualified stack along with SPP, HFP 1.5, HSP, AVRCP, and A2DP profiles.  (Customers using these modules may list and promote their products free of charge on the Bluetooth website.) 

The BTM510/511 modules include an embedded 32-bit, 64-MIPS DSP core within the BC05.  This allows designers to add significant product enhancements including features such as echo cancellation, noise reduction, and audio enhancement using additional soft codecs.  The availability of the 16MB of flash memory in the module allows complex functionality to be included.  DSP routines can be licensed through a number of specialist partners. 

To speed product development and integration, Laird Technologies has developed a comprehensive AT command interface that simplifies application development, including support for audio and headset functionality. Combined with a low-cost development kit, Laird Technologies’ Bluetooth modules provide faster time to market. 

## FEATURES 

- Fully featured Bluetooth multimedia chipset 

- Bluetooth v2.1+EDR 

- Supports mono and stereo headset applications 

- Adaptive frequency hopping to cope with interference from other wireless devices 

- 32bit Kalimba DSP for enhanced audio applications 

- Support for secure simple pairing 

- External or internal antenna options 

- HSP, HFP, A2DP, and AVRCP audio profiles 

- 16-bit stereo codec and microphone input 

- Integrated audio amplifiers for driving stereo speaker 

- Comprehensive AT interface for simple programming 

- Bluetooth End product qualified 

- Compact size 

- Class 2 output – 4dBm 

- Low power operation 

- Wi-Fi co-existence hardware support 

## APPLICATION AREAS 

- High-quality stereo headsets 

- Mono voice headsets 

- Hands-free devices 

- Wireless audio cable replacement 

- MP3 and music players 

- Phone accessories 

- VoIP products 

- Cordless headsets 

- Aftermarket automotive applications 

## **global solutions: local support TM** 

USA: +1.800.492.2320 Europe: +44.1628.858.940 Asia: +852.2268.6567 

wirelessinfo@lairdtech.com **www.lairdtech.com/wireless** 

Innovative **Technology** for a **Connected** World 

## Bluetooth® Audio Modules **BTM510/511** 

|**CATEGORIES**<br>**FEATURE**<br>**IMPLEMENTATION**<br>PO|**CATEGORIES**<br>**FEATURE**<br>**IMPLEMENTATION**<br>PO|**CATEGORIES**<br>**FEATURE**<br>**IMPLEMENTATION**<br>PO|
|---|---|---|
|**Wireless Specification**|Bluetooth®|Version 2.1+EDR|
||Frequency|2.402 – 2.480 GHz|
|||Class 2|
||Max Transmit Power|4dBm (at antenna pad – BTM510)|
|||4dBmi (from integrated antenna – BTM511)|
||Receive Sensitivity|Better than -86dBm|
||Range|30 meters|
||Data Rates|Upto 3Mbps (over the air)|
||UART Data Transfer Rate|Greater than 300 Kbps|
|**Host Interface**|UART|Supports DTR, DSR, DCD and RI, multiplexed with other functionality.|
|**Audio Interfaces**|Codec|Internal 16 bit Stereo Codec<br>Integrated Amplifiers for drivingStereo Speaker|
||Microphone|Stereo microphone input|
|**DSP**|Integrated Kalimba DSP|32bit, 64MIPS|
|||SPP – Serial Port Profile|
|||HSP|
|**Profiles**||HFP – Audio Gateway and Handset|
|||A2DP – Source and Sink|
|||AVRCP – Target and Controller|
|**Supply Voltage**|Supply|3.0V – 3.6V DC|
||I/O|1.7V – 3.6V DC|
|**Power Consumption**|Current Consumption|Operational - Less than 70 mA (including speaker amplifiers)<br>Idle(sleep)< 1.0mA|
|**Coexistence /**<br>**Compatibility**|802.11 (Wi-Fi)|2 wire and 3 wire schemes supported|
|**Connections**|External Antenna|Connection via SMTpad – BTM510|
||Internal Antenna|Multilayer ceramic antenna – BTM511|
|**Programming API**||AT Command Set (extended for audio and headset functions)|
|**Physical**|Dimensions|14.0mm x 20.0mm x 3.4mm (integrated antenna – BTM510)<br>14.0mm x 25.0mm x 3.4mm(integrated antenna – BTM511)|
|**Environmental**|OperatingTemperature|-30°C to +70°C|
||Storage Temperature|-40°C to +85°C|
|**Miscellaneous**|Lead free|Lead-free and RoHS compliant|
||Warranty|1 Year|
|**Development Tools**|Development Kit|Development board and software tools|
|**Approvals**|Bluetooth|End Product Approved|
||FCC/IC & CE|BTM510 - Limited Modular Approval<br>BTM511 - Full Modular Approval|



## ORDERING INFORMATION 

BTM510 Bluetooth Multimedia Module (external antenna) BTM511 Bluetooth Multimedia Module (with integrated antenna) DVK- BTM510 Development Kit (external antenna) DVK- BTM511 Development Kit (with integrated antenna) 

**global solutions: local support TM** USA: +1.800.492.2320 Europe: +44.1628.858.940 Asia: +852.2268.6567 

The details contained within the document are subject to change. Download the product specification from www.lairdtech.com/wireless for the most current specification. 

## LWS-DS-BTM510-511 0310 

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses.  Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind.  All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request.  © Copyright 2010 Laird Technologies, Inc. All Rights Reserved.  Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof.  Other product or service names may be the property of third parties.  Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. 

wirelessinfo@lairdtech.com **www.lairdtech.com/wireless**