BTB24-800BWRG
Triac, 800 V, 25 A, TO-220AB, 1.3 V, 250 A, 75 mA
- Manufacturer: STMICROELECTRONICS
- Product type:
- Peak Repetitive Off-State Voltage, Vdrm:800V; On State RMS Current IT(rms):25A; Triac Case Style:TO-220AB; Gate Trigger Current Max (QI), Igt:50mA; Gate Trigger Voltage Max Vgt:1.3V; Peak Ga
- MSL: MSL 1 - Unlimited
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 3Pins
- Product Range: -
- Triac Case Style: TO-220AB
- Thyristor Mounting: Through Hole
- Holding Current Max: 75mA
- On State RMS Current: 25A
- Peak On State Voltage: 1.55V
- Gate Trigger Voltage Max: 1.3V
- Operating Temperature Max: 125°C
- Peak Non Repetitive Surge Current: 250A
- Peak Repetitive Off State Voltage: 800V
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 1.22 € |
| Current stock | 1000+ |
| Lead time | 30 days |
**BTA24, BTB24, T25** Datasheet ## 800 V and 600 V, 25 A standard and Snubberless Triacs **==> picture [132 x 183] intentionally omitted <==** **----- Start of picture text -----**<br> A2<br>G<br>A1<br>A2<br>G G<br>A2 A2<br>A1 A1<br>TO-220AB TO-220AB Ins.<br>A2<br>A2 G<br>A1<br>D²PAK<br>**----- End of picture text -----**<br> ## **Features** - High current 25 A RMS current Triac - Low thermal resistance - High commutation (4 quadrants) or very high commutation (3 quadrants) capability - BTA series UL1557 recognized components (file ref: 81734) - RoHS (2002/95/EC) compliant packages - UL-94, V0 flammability package resin compliance ## **Applications** - On/off function in static relays, heating regulation, induction motor starting circuits - Phase control operations in light dimmers and motor speed controllers ## **Description** Available either in through-hole or surface-mount packages, the BTA24, BTB24 and T25 are suitable for general purpose AC switching. |**Product status link**|**Product status link**|**Product status link**|**Product status link**| |---|---|---|---| |BTA24<br>i||TO-220AB<br>nsulated package|| |BTB24||TO-220AB<br>uninsulated<br>package|| |T25||D²PAK package|| ||||| |**Product summary**|||| ||**BTA2**|**4 BTB24**|**T25**| |**IT(RMS)**|25 A||| |**VDRM/VRRM**|600 V and 800 V||| |**IGT**<br>**Snubberless**|35 / 50 mA||35 mA| |**IGT standard**||50 mA|| **DS2112** - **Rev 12** - **September 2021** For further information contact your local STMicroelectronics sales office. www.st.com **BTA24, BTB24, T25 Characteristics** ## **1 Characteristics** **Table 1. Absolute maximum ratings** |**Symbol**|**Parameters**|||**Value**|**Unit**| |---|---|---|---|---|---| |IT(RMS)|RMS on-state current (full sine wave)|D2PAK /<br>TO-220AB|Tc= 100 °C|25|A| |||TO-220AB Ins.|Tc= 75 °C||| |ITSM|Non repetitive surge peak on-state current (full cycle,<br>Tjinitial = 25 °C)|f = 60 Hz|tp= 16,7 ms|260|A| |||f = 50 Hz|tp= 20 ms|250|| |I2t|I2t value for fusing|tp= 10 ms||340|A2s| |dl/dt|Critical rate of rise of on-state current<br>IG= 2 x IGT, tr≤ 100 ns|f = 120 Hz|Tj= 125 °C|50|A/µs| |VDSM, VRSM|Non repetitive surge peak off-state voltage|tp= 10 ms|Tj= 25 °C|VDRM, VRRM+<br>100|V| |VDRM, VRRM|Repetitive peak off-state voltage||Tj= 25 °C|600 or 800|V| |IGM|Peak gate current|tp= 20 µs|Tj= 125 °C|4|A| |PG(AV)|Average gate power dissipation||Tj= 125 °C|1|W| |Tstg|Storage junction temperature range|||-40 to +150|°C| |Tj|Operating junction temperature range|||-40 to +125|°C| |TL|Maximum lead temperature for soldering during 10 s|||260|°C| |VINS|Insulation RMS voltage, 1 minute|||2.5|kV| **Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Snubberless (3 quadrants) T25, BTA24-XXXXW, BTB24-XXXXW** |**Sbl**|**Pt**|**Qdt**||**T25**|**BTA/BTB**|**BTA/BTB**|**Uit**| |---|---|---|---|---|---|---|---| |**ymo**|**arameers**|**uaran**||**T2535**|**CW**|**BW**|**n**| |IGT(1)|VD= 12 V, RL= 33 Ω|I - II - III|Max.|35|35|50|mA| |VGT||I - II - III|Max.|1.3|||V| |VGD|VD= VDRM, RL= 3.3 kΩ, Tj= 125 °C|I - II - III|Min.|0.2|||V| |IH(2)|IT= 500 mA||Max.|50|50|75|mA| |IL|IG= 1.2 IGT|I - III|Max.|70|70|80|mA| |||II|Max.|80|80|100|| |dV/dt(2)|VD= 67 % VDRMgate open, Tj= 125 °C||Min.|500|500|1000|V/µs| |(dI/dt)c(2)|Without snubber||Min.|13|13|22|A/ms| _1. Minimum IGT is guaranteed at 5 % of IGT max._ _2. For both polarities of A2 referenced to A1_ **DS2112** - **Rev 12** **page 2/14** **BTA24, BTB24, T25 Characteristics** ## **Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - standard (4 quadrants) BTB24-800B, BTB24-600B** |**Symbol**|**Parameters**|**Quadrant**||**Value**|**Unit**| |---|---|---|---|---|---| |IGT(1)|VD= 12 V, RL= 33 Ω|I - II - III|Max.|50|mA| |||IV||100|| |VGT||All|Max.|1.3|V| |VGD|VD= VDRM, RL= 3.3 kΩ, Tj= 125 °C|All|Min.|0.2|V| |IH(2)|IT= 500 mA||Max.|80|mA| |IL|IG= 1.2 IGT|I - III - IV|Max.|70|mA| |||II|Max.|160|| |dV/dt(2)|VD= 67 % VDRMgate open, Tj= 125 °C||Min.|500|V/µs| |(dV/dt)c(2)|(dI/dt)c = 13.3 A/ms, Tj= 125 °C||Min.|10|V/µs| _1. Minimum IGT is guaranteed at 5 % of IGT max._ _2. For both polarities of A2 referenced to A1_ **Table 4. Static electrical characteristics** |**Symbol**|**Test conditions**|**Tj**||**Value**|**Unit**| |---|---|---|---|---|---| |VTM(1)|ITM= 35 A, tp= 380 µs|25 °C|Max.|1.55|V| |VTO(1)|threshold on-state voltage|125 °C|Max.|0.85|V| |RD(1)|Dynamic resistance|125 °C|Max.|16|mΩ| |IDRM/IRRM|VT= VDRM, VT= VRRM|25 °C|Max.|5|µA| |||125 °C||3|mA| _1. For both polarities of A2 referenced to A1_ **Table 5. Thermal resistance** |**Symbol**|**Parameters**|**Parameters**|**Parameters**|**Value**|**Unit**| |---|---|---|---|---|---| |Rth(j-c)|Junction to case (AC)|D2PAK / TO-220AB|Max.|0.8|°C/W| |||TO-220AB insulated||1.7|| |Rth(j-a)|Junction to ambient, S(1)= 2.5 cm²|D2PAK|Typ.|45|| ||Junction to ambient|TO-220AB / TO-220AB insulated||60|| _1. S = Copper surface under tab._ **DS2112** - **Rev 12** **page 3/14** **BTA24, BTB24, T25 Characteristics (curves)** ## **1.1 Characteristics (curves)** **==> picture [513 x 191] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 1. Maximum power dissipation versus on-state Figure 2. RMS on-state current versus case temperature<br>RMS current (full cycle) (full cycle)<br>P(W) 30 IT(RMS) (A)<br>30<br>25 BTB24/T25<br>25<br>BTA24<br>20<br>20<br>15<br>15<br>10 10<br>5 5<br>I T(RMS) (A) TC ( ° C)<br>0 0<br>0 5 10 15 20 25 0 25 50 75 100 125<br>**----- End of picture text -----**<br> **==> picture [513 x 191] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 3. RMS on-state current versus ambient Figure 4. Relative variation of thermal impedance versus<br>temperature (full cycle) D²PAK pulse duration<br>4.0IT(RMS) (A) 1.E+00 K=[Z th/Rth]<br>3.5<br>Zth(j-c)<br>3.0<br>1.E-01<br>2.5<br>2.0<br>Zth(j-a)<br>1.5 . 1.E-02 BTA / BTB / T25<br>1.0<br>0.5<br>Ta ( ° C) t p (s)<br>0.0 1.E-03<br>0 25 50 75 100 125 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br> **==> picture [513 x 192] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 6. Surge peak on-state current versus number of<br>Figure 5. On-state characteristics (maximum values)<br>cycles<br>1000 ITM(A) ITSM (A)<br>300<br>T j max.<br>Vto = 0.85V<br>Rd = 16 mΩ 250<br>100 Non repetitive t=20ms<br>[T] j [= 150 ] [°] [C] 200 Tj initial=25°C One cycle<br>150<br>10 Tj = 25°C. 100 Repetitive TC= 75 °C<br>50<br>V TM (V)<br>1 0 Number of cycles<br>0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5<br>1 10 100 1000<br>**----- End of picture text -----**<br> **DS2112** - **Rev 12** **page 4/14** **BTA24, BTB24, T25 Characteristics (curves)** **Figure 7. Non-repetitive surge peak on-state current for a Figure 8. Relative variation of gate trigger current, holding sinusoidal pulse with width tP < 10 ms and latching current versus junction temperature** **==> picture [476 x 148] intentionally omitted <==** **----- Start of picture text -----**<br> ITSM(A) IGT, IH, IL [T j] / IGT, IH, IL [T j = 25 °C]<br>2.5<br>10000<br>2.0<br>[T] j [initial=25 °C] IGT<br>dI/dt limitation: 50A/µs IITSM 1.5<br>1000 IH & IL<br>1.0<br>0.5<br>tp(ms) T j (°C)<br>100 0.0<br>0.01 0.10 1.00 10.00 -40 -20 0 20 40 60 80 100 120<br>**----- End of picture text -----**<br> **Figure 9. Relative variation of critical rate of decrease of Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) main current versus junction temperature (typical values)** **==> picture [479 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 2.4 (dI/dt)c [(dV/dt)c] / specified (dI/dt)c 8 (dI/dt)c [Tj ] / (dI/dt)c [Tj = 125 °C]<br>2.2<br>7<br>2.0<br>1.8 6<br>1.6<br>5<br>1.4 Snuberless (3 quadrants) T25, BTA24-XXXXW, BTB24-XXXXW<br>1.2 4<br>1.0<br>Standard (4 quadrants) BTA24/BTB24-XXXB 3<br>0.8<br>0.6 2<br>0.4<br>1<br>0.20.0 (dV/dt) (V/µs) 0 T j (°C)<br>0.1 1.0 10.0 100.0 0 25 50 75 100 125<br>**----- End of picture text -----**<br> **Figure 11. D²PAK thermal resistance junction to ambient versus copper surface under tab** **==> picture [225 x 143] intentionally omitted <==** **----- Start of picture text -----**<br> Rth(j-a) (°C/W)<br>60<br>D²PAK<br>50<br>40<br>30<br>20<br>10<br>SCu(cm²)<br>0<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br> **DS2112** - **Rev 12** **page 5/14** **BTA24, BTB24, T25 Package information** **2 Package information** In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. ## **2.1 TO-220AB package information** - Molding compound resin is halogen free and meets UL94 flammability standard, level V0 - Lead-free plating package leads - Recommended torque: 0.4 to 0.6 N·m **Figure 12. TO-220AB package outline** **==> picture [279 x 308] intentionally omitted <==** **DS2112** - **Rev 12** **page 6/14** **BTA24, BTB24, T25 TO-220AB package information** **Table 6. TO-220AB package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|15.20||15.90|0.5984||0.6260| |a1||3.75|||0.1476|| |a2|13.00||14.00|0.5118||0.5512| |B|10.00||10.40|0.3937||0.4094| |b1|0.61||0.88|0.0240||0.0346| |b2|1.23||1.32|0.0484||0.0520| |C|4.40||4.60|0.1732||0.1811| |c1|0.49||0.70|0.0193||0.0276| |c2|2.40||2.72|0.0945||0.1071| |e|2.40||2.70|0.0945||0.1063| |F|6.20||6.60|0.2441||0.2598| |I|3.73||3.88|0.1469||0.1528| |L|2.65||2.95|0.1043||0.1161| |I2|1.14||1.70|0.0449||0.0669| |I3|1.14||1.70|0.0449||0.0669| |I4|15.80|16.40|16.80|0.6220|0.6457|0.6614| |M||2.6|||0.1024|| _1. Inch dimensions are for reference only._ **DS2112** - **Rev 12** **page 7/14** **BTA24, BTB24, T25 D²PAK package information** ## **2.2 D²PAK package information** - ECOPACK2 compliant - Lead-free package leads finishing - Molding compound resin is halogen-free and meets UL94 flammability standard level V0 ## **Figure 13. D²PAK package outline** **==> picture [320 x 313] intentionally omitted <==** **----- Start of picture text -----**<br> E A E1<br>c2 E2<br>1 2 3<br>b2<br>e<br>b Max resin gate protrusion: 0.5 mm (1)<br>G<br>A1<br>A2<br>A3<br>R<br>Gauge Plane<br>c<br>V2<br>L2<br>D1<br>D<br>H<br>D2<br>L3<br>L<br>**----- End of picture text -----**<br> - (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. **DS2112** - **Rev 12** **page 8/14** **BTA24, BTB24, T25 D²PAK package information** **Table 7. D²PAK package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|4.30||4.60|0.1693||0.1811| |A1|2.49||2.69|0.0980||0.1059| |A2|0.03||0.23|0.0012||0.0091| |A3||0.25|||0.0098|| |b|0.70||0.93|0.0276||0.0366| |b2|1.25||1.7|0.0492||0.0669| |c|0.45||0.60|0.0177||0.0236| |c2|1.21||1.36|0.0476||0.0535| |D|8.95||9.35|0.3524||0.3681| |D1|7.50||8.00|0.2953||0.3150| |D2|1.30||1.70|0.0512||0.0669| |e|2.54|||0.10000||| |E|10.00||10.28|0.3937||0.4047| |E1|8.30||8.70|0.3268||0.3425| |E2|6.85||7.25|0.2697||0.2854| |G|4.88||5.28|0.1921||0.2079| |H|15||15.85|0.5906||0.6240| |L|1.78||2.28|0.0701||0.0898| |L2|1.19||1.40|0.0468||0.0551| |L3|1.40||1.75|0.0551||0.0689| |R||0.40|||0.0157|| |V2(2)|0°||8°|0°||8°| _1. Dimensions in inches are given for reference only_ _2. Degrees_ **DS2112** - **Rev 12** **page 9/14** **BTA24, BTB24, T25 D²PAK package information** **Figure 14. D²PAK recommended footprint (dimensions are in mm)** **==> picture [311 x 187] intentionally omitted <==** **----- Start of picture text -----**<br> 16.90<br>=<br>10.30 5.08<br>1.30<br>aa --.: —<br>3.70<br>8.90<br>**----- End of picture text -----**<br> **Figure 15. D²PAK stencil definitions (dimensions are in mm)** **DS2112** - **Rev 12** **page 10/14** **BTA24, BTB24, T25 Ordering information** ## **3 Ordering information** **Figure 16. Ordering information scheme (BTA24 and BTB24 series)** **==> picture [314 x 204] intentionally omitted <==** **----- Start of picture text -----**<br> BT A 24 - 600 BW RG<br>Triac<br>Insulation<br>A = Insulated<br>B = Non-insulated<br>Current<br>24 = 25 A<br>Voltage<br>600 = 600 V<br>800 = 800 V<br>Sensitivity and type<br>B = 50 mA Standard<br>BW = 50 mA Snubberless<br>CW = 35 mA Snubberless<br>Packing mode<br>RG = Tube<br>**----- End of picture text -----**<br> **Figure 17. Ordering information scheme (T25 series)** **==> picture [322 x 200] intentionally omitted <==** **----- Start of picture text -----**<br> T 25 35 - 800 G (-TR)<br>Triac<br>Current<br>25 = 25 A<br>Sensitivity<br>35 = 35 mA<br>Voltage<br>800 V<br>600 V<br>Package<br>G = D²PAK<br>Packing mode<br>(blank) = Tube<br>-TR = Tape and reel<br>**----- End of picture text -----**<br> **DS2112** - **Rev 12** **page 11/14** **BTA24, BTB24, T25 Ordering information** ## **Table 8. Ordering information** |**Order code**|**Marking**|**Package**|**Weig**<br>**ht**|**Base**<br>**qty.**|**Delivery mode**| |---|---|---|---|---|---| |BTA24-600BWRG|BTA24 600BW|TO-220AB insulated|2.3 g|50|Tube| |BTA24-600CWRG|BTA24 600CW||||| |BTA24-800BWRG|BTA24 800BW||||| |BTA24-800CWRG|BTA24 800CW||||| |BTB24-600BRG|BTB24 600B|TO-220AB|||| |BTB24-600BWRG|BTB24 600BW||||| |BTB24-600CWRG|BTB24 600CW||||| |BTB24-800BRG|BTB24 800B||||| |BTB24-800BWRG|BTB24 800BW||||| |BTB24-800CWRG|BTB24 800CW||||| |T2535-600G|T2535 600G|D²PAK|1.5 g|50|Tube| |T2535-600G-TR|T2535 600G|||2500|Tape and reel| |T2535-800G|T2535 800G|||50|Tube| |T2535-800G-TR|T2535 800G|||2500|Tape and reel| **DS2112** - **Rev 12** **page 12/14** **BTA24, BTB24, T25** ## **Revision history** **Table 9. Document revision history** |**Date**|**Revision**|**Changes**| |---|---|---| |Oct-2002|6A|Previous update.| |13-Feb-2006|7|TO-220AB delivery mode changed from bulk to tube.<br>ECOPACK statement added.| |31-May-2006|8|Reformatted to current standard. Tc in figure 3 changed to Tamb| |31-Jul-2006|9|Typing error corrected on page 1 (BTB124 instead of BTB24)| |05-Jul-2007|10|Added BTB26-600BRG. Restructured cover page and section 2: Ordering<br>information scheme on page 6 to simplify product selection.<br>Thermal resistance values updated in Table 6 and Figure 2. Graphic for I2t<br>updated in Figure 7.| |28-Jul-2021|11|Removed RD91, TOP3 insulated and TOP3 package information. Put in<br>separate specification.<br>Minor text changes.| |29-Sep-2021|12|UpdatedTable 2.| **DS2112** - **Rev 12** **page 13/14** **BTA24, BTB24, T25** ## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved **DS2112** - **Rev 12** **page 14/14**
Updated at June 10, 2026
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