BTB24-800BRG

Triac, 800 V, 25 A, TO-220AB, 1.3 V, 250 A, 80 mA

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Manufacturer: STMICROELECTRONICS
Product type:
Peak Repetitive Off-State Voltage, Vdrm:800V; On State RMS Current IT(rms):25A; Triac Case Style:TO-220AB; Gate Trigger Current Max (QI), Igt:50mA; Gate Trigger Voltage Max Vgt:1.3V; Peak Ga
MSL: MSL 1 - Unlimited
SVHC: No SVHC (25-Jun-2025)
No. of Pins: 3Pins
Product Range: Snubberless BTB
Triac Case Style: TO-220AB
Thyristor Mounting: Through Hole
Holding Current Max: 80mA
On State RMS Current: 25A
Peak On State Voltage: 1.55V
Gate Trigger Voltage Max: 1.3V
Operating Temperature Max: 125°C
Peak Non Repetitive Surge Current: 250A
Peak Repetitive Off State Voltage: 800V

Delivery and price
Units per pack	1000
Price	1.01 €
Current stock	500+
Lead time	30 days

Datasheet

**==> picture [61 x 39] intentionally omitted <==**

# **BTA24, BTB24, BTA25 BTA26, BTB26, T25** 

## 25 A standard and Snubberless™ triacs 

## **Features** 

- High current triac 

- Low thermal resistance with clip bonding 

- High commutation (4 quadrant) or very high commutation (3 quadrant) capability 

- BTA series UL1557 certified (File ref: 81734) 

- Packages are RoHS (2002/95/EC) compliant 

## **Applications** 

Applications include the ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits, etc., or for phase control operation in light dimmers, motor speed controllers, and silmilar. 

The snubberless versions (BTA/BTB...W and T25 series) are especially recommended for use on inductive loads, due to their high commutation performances. The BTA series provides an insulated tab (rated at 2500 VRMS). 

## **Description** 

Available either in through-hole or surface-mount packages, the **BTA24, BTB24, BTA25, BTA26, BTB26** and **T25** triac series is suitable for general purpose mains power AC switching. 

**==> picture [175 x 308] intentionally omitted <==**

**----- Start of picture text -----**<br>
A2<br>G<br>A1<br>A2<br>A1<br>A2 A1<br>G A2<br>G<br>TO-220AB Insulated TO-220AB<br>(BTA24) (BTB24)<br>A1<br>G A2<br>A1<br>A2<br>G<br>RD91 TOP3 Insulated<br>(BTA25) (BTA26)<br>A2<br>A2<br>A1 A2<br>G A1<br>A2<br>G<br>D [2] PAK TOP3<br>(T25) (BTB26)<br>**----- End of picture text -----**<br>


## **Table 1. Device summary** 

|**Symbol**|**Parameter**|**BTA24(1)**|**BTB24**|**BTA25(1)**<br>**B**|**TA26(1)**|**BTB26**|**T25**|**Unit**|
|---|---|---|---|---|---|---|---|---|
|IT(RMS)|RMS on-state<br>current|25|25|25|25|25|25|A|
|VDRM/VRRM|Repetitive peak<br>off-state voltage|600 / 800|600 / 800|600 / 800 60|0(2)/ 800|600|600 / 800|<br>V|
|IGT(Snubberless)|Triggering gate<br>current|35 / 50|35 / 50|50<br>|35 / 50|-|35|mA|
|IGT(Standard)|Triggering gate<br>current|-|50|50|50|50|-|mA|



1. Insulated packages 

2. 600 V version available only with IGT = 50 mA (Snubberless and Standard) 

TM: Snubberless is a trademark of STMicroelectronics 

1/12 

July 2007 

Rev 10 

_www.st.com_ 

**Characteristics** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

## **1 Characteristics** 

## **Table 2. Absolute maximum ratings** 

|**Table 2.**|**Absolute maximum ratings**|**Absolute maximum ratings**|**Absolute maximum ratings**|||
|---|---|---|---|---|---|
|**Symbol**|**Parameter**|||**Value**|**Unit**|
|IT(RMS)|RMS on-state current (full sine wave)|TOP3|Tc= 105° C|25|A|
|||D2PAK /<br>TO-220AB|Tc= 100° C|||
|||RD91 Ins/<br>TOP3 Ins.|Tc= 100° C|||
|||TO-220AB Ins.|Tc= 75° C|||
|ITSM|Non repetitive surge peak on-state<br>current  (full cycle, Tjinitial = 25° C)|F = 50 Hz|t = 20 ms|250|A|
|||F = 60 Hz|t = 16.7 ms|260||
|I²t|I²t Value for fusing|tp= 10 ms||340|A²s|
|dI/dt|Critical rate of rise of on-state current<br>IG= 2 x IGT, tr ≤100 ns|F = 120 Hz|Tj= 125° C|50|A/µs|
|VDSM/VRSM|Non repetitive surge peak off-state<br>voltage|tp= 10 ms|Tj= 25° C|VDRM/VRRM<br>+ 100|V|
|IGM|Peak gate current|tp= 20 µs|Tj= 125° C|4|A|
|PG(AV)|Average gate power dissipation||Tj= 125° C|1|W|
|Tstg<br>Tj|Storage junction temperature range<br>Operating junction temperature range|||- 40 to + 150<br>- 40 to + 125|° C|



## **Table 3. Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless and logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W** 

|**Symbol**|**Test Conditions**|**Quadrant**||**T25**|**BTA/BTB**|**BTA/BTB**|**Unit**|
|---|---|---|---|---|---|---|---|
|||||**T2535**|**CW**|**BW**||
|IGT<br>(1)|VD= 12 V   RL= 33Ω|I - II - III|MAX.|35|35|50|mA|
|VGT||I - II - III|MAX.|1.3|||V|
|VGD|VD= VDRMRL= 3.3 kΩ<br>Tj= 125° C|I - II - III|MIN.|0.2|||V|
|IH<br>(2)|IT= 500 mA||MAX.|50|50|75|mA|
|IL|IG= 1.2 IGT|I - III|MAX.|70|70|80|mA|
|||II||80|80|100||
|dV/dt<br>(2)|VD=  67 %VDRMgate open|Tj= 125° C|MIN.|500|500|1000|V/µs|
|(dI/dt)c<br>(2)|Without snubber|Tj= 125° C|MIN.|13|13|22|A/ms|



1. minimum IGT is guaranted at 5% of IGT max. 

2. for both polarities of A2 referenced to A1. 

2/12 

**Characteristics** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

**Table 4. Electrical characteristics (Tj = 25° C, unless otherwise specified), standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B** 

|**Symbol**|**Test Conditions**|**Quadrant**||**Value**|**Unit**|
|---|---|---|---|---|---|
|IGT<br>(1)|VD= 12 V       RL= 33Ω|I - II - III|MAX.|50|mA|
|||IV||100||
|VGT||ALL|MAX.|1.3|V|
|VGD|VD= VDRMRL= 3.3 kΩTj= 125° C|ALL|MIN.|0.2|V|
|IH<br>(2))|IT= 500 mA||MAX.|80|mA|
|IL|IG= 1.2 IGT|I - III - IV|MAX.|70|mA|
|||II||160||
|dV/dt(2)|VD=  67 %VDRMgate open|Tj= 125° C|MIN.|500|V/µs|
|(dV/dt)c<br>(2)|(dI/dt)c = 13.3 A/ms|Tj= 125° C|MIN.|10|V/µs|



1. minimum IGT is guaranted at 5% of IGT max. 

2. for both polarities of A2 referenced to A1. 

## **Table 5. Static characteristics** 

|**Symbol**|**Test Conditions**|**Test Conditions**|**Test Conditions**|**Test Conditions**|**Test Conditions**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|---|---|---|---|
|VTM<br>(1)|ITM= 35 A        tp= 380 µs||Tj= 25° C||MAX.|1.55||V|
|Vt0<br>(1)|Threshold voltage||Tj= 125° C||MAX.|0.85||V|
|Rd<br>(1)|Dynamic resistance||Tj= 125° C||MAX.|16||mΩ|
|IDRM<br>IRRM|VDRM= VRRM||Tj= 25° C||MAX.|5||µA|
||||Tj= 125° C|||3||mA|
|1.<br>for both polarities of A2 referenced to A1.<br>**Table 6.**<br>**Thermal resistance**|||||||||
|**Symbol**||**Parameter**|||||**Value**|**Unit**|
|Rth(j-c)|Junction to case (AC)|||TOP 3|||0.6|° C/W|
|||||D2PAK / TO-220AB|||0.8||
|||||RD91 Insulated / TOP3 Insulated|||0.9||
|||||TO-220AB Insulated|||1.7||
|Rth(j-a)|Junction to ambient|(1)S = 1 cm²||D2PAK|||45|° C/W|
|||||TOP3 / TOP3 Insulated|||50||
|||||TO-220AB / TO-220AB Insulated|||60||



1. S = Copper surface under tab. 

3/12 

**Characteristics** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

**Figure 1. Maximum power dissipation versus Figure 2. RMS on-state current versus case RMS on-state current (full cycle) temperature (full cycle)** 

**==> picture [463 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
30 P(W) 30 IT(RMS)(A)<br>BTB26<br>25 25<br>BTA24<br>20 20<br>15 15 BTB24 / T25xx /<br>BTA25 / BTA26<br>10 10<br>5 5<br>IT(RMS)(A) TC(°C)<br>0 0<br>0 5 10 15 20 25 0 25 50 75 100 125<br>**----- End of picture text -----**<br>


**Figure 3. D[2] PAK RMS on-state current versus Figure 4. ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle)** 

## **Relative variation of thermal impedance versus pulse duration** 

**==> picture [463 x 328] intentionally omitted <==**

**----- Start of picture text -----**<br>
IT(RMS)(A) K=[Zth/Rth []]<br>4.0 1E+0<br>3.5 (S=1cmD2PAK2) Zth(j-c)<br>3.0<br>2.5 1E-1 BTA / BTB24 / T25Zth(j-a)<br>2.0<br>1.5<br>1E-2 Zth(j-a)<br>BTA26<br>1.0<br>0.5<br>Tamb(°C) tp(s)<br>0.0 1E-3<br>0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2<br>Figure 5. On-state characteristics  Figure 6. Surge peak on-state current<br>(maximum values) versus number of cycles<br>ITM(A) ITSM(A)<br>300 300<br>100 RVdtoT= 16 mj= 0.85Vmax. Ω Tj = Tj max. 250<br>t=20ms<br>200 One cycle<br>Non repetitive<br>Tj initial=25°C<br>150<br>10 Tj = 25°C. 100 RepetitiveTC=75°C<br>50<br>1 VTM(V) 0 Number of cycles<br>0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1 10 100 1000<br>**----- End of picture text -----**<br>


4/12 

**Characteristics** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

**Figure 7. Non-repetitive surge peak on-state Figure 8. Relative variation of gate trigger current for a sinusoidal pulse with current, holding current and width tp < 10 ms and corresponding latching current versus junction value of I[2] t temperature (typical values)** 

**==> picture [463 x 340] intentionally omitted <==**

**----- Start of picture text -----**<br>
3000 ITSM(A), I t (A s)2 2 2.5 IGT,IH,IL[T ] /j IGT,IH,IL[T =25°C]j<br>dI/dt limitation: Tj initial=25°C<br>50A/µs 2.0<br>1000 IGT<br>ITSM 1.5<br>IH & IL<br>I t2 1.0<br>0.5<br>tp(ms) T (°C)j<br>100 0.0<br>0.01 0.10 1.00 10.00 -40 -20 0 20 40 60 80 100 120 140<br>Figure 9. Relative variation of critical rate of  Figure 10. Relative variation of critical rate of<br>decrease of main current versus  decrease of main current versus T<br>j<br>(dV/dt)c (typical values)<br>(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c (dI/dt)c [T ] /j (dI/dt)c [Tj specified]<br>2.4 6<br>2.2<br>5<br>2.0<br>1.8 4<br>1.6<br>T2535/CW/BW<br>1.4 B 3<br>1.2<br>1.0 2<br>0.8<br>1<br>0.6 (dV/dt)c (V/µs) T (°C)j<br>0.4 0<br>0.1 1.0 10.0 100.0 0 25 50 75 100 125<br>**----- End of picture text -----**<br>


**Figure 11. D[2] PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm)** 

**==> picture [205 x 122] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>80<br>70 D2PAK<br>60<br>50<br>40<br>30<br>20<br>10<br>S(cm²)<br>0<br>0 4 8 12 16 20 24 28 32 36 40<br>**----- End of picture text -----**<br>


5/12 

**Ordering information scheme** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

## **2 Ordering information scheme** 

## **Figure 12. BTA and BTB series** 

**BT   A   24  -  600   BW   RG Triac series Insulation** A = insulated B = non insulated **Current** 24 = 25 A in TO-220AB 25 = 25 A in RD91 26 = 25 A in TOP3 **Voltage** 600 = 600 V 800 = 800 V **Sensitivity and type** B = 50 mA Standard BW = 50 mA Snubberless CW = 35 mA Snubberless **Packing mode** RG = Tube 

## **Figure 13. T25 series** 

**==> picture [324 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
T   25   35  -  600   G   (-TR)<br>Triac series<br>Current<br>25 = 25 A<br>Sensitivity<br>35 = 35 mA<br>Voltage<br>600 = 600 V<br>800 = 800 V<br>Package<br>G = D PAK2<br>Packing mode<br>Blank = Tube<br>-TR = Tape and Reel<br>**----- End of picture text -----**<br>


6/12 

**Package information** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

## **3 Package information** 

- Epoxy meets UL94,V0 

- Cooling method: C 

- Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91) 

- Maximum torque value for BTB24 is 0.5 Nm 

## **Table 7. D[2] PAK dimensions** 

|**L**|||||**A**<br>**D**<br>**R**<br>**V2**|**REF.**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||**Millimeters**|||**Inches**|||
||||||||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
||**L2**|||**2mm min.**<br>**FLAT ZONE**<br>**C2**<br>**A2**<br>**C**<br>**A1**|||||||||
|||||||A|4.30||4.60|0.169||0.181|
|||||||A1<br>A2|2.49<br>003||2.69<br>023|0.098<br>0001||0.106<br>0009|
||||||||||||||
||**L3**||||||.||.|.||.|
|||||||B|0.70||0.93|0.027||0.037|
|||||||B2|1.25|1.40||0.048|0.055||
|||||||C|0.45||0.60|0.017||0.024|
||||||||||||||
|||||||C2|1.21||1.36|0.047||0.054|
|||||||D|8.95||9.35|0.352||0.368|
|||||||E|10.00||10.28|0.393||0.405|
|||||||G|4.88||5.28|0.192||0.208|
|||||||L|15.00||15.85|0.590||0.624|
|||||||L2|1.27||1.40|0.050||0.055|
||||||||||||||
|||||||L3|1.40||1.75|0.055||0.069|
|||||||R||0.40|||0.016||
|||||||V2|0°||8°|0°||8°|



**Figure 14. D[2] PAK footprint dimensions (in millimeters)** 

**==> picture [169 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
16.90<br>10.30 5.08<br>1.30<br>3.70<br>8.90<br>**----- End of picture text -----**<br>


7/12 

**Package information** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

|**Table 8.**|||**RD91**|**RD91**|**dimensions**|**dimensions**|**dimensions**|**dimensions**||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**B2**||||||||||**N1**<br>**B**<br>**F**<br>**I**<br>**B1**<br>**L1**<br>**C1**|**REF.**|**DIMENSIONS**||||
|||||||||||||**Millimeters**||**Inches**||
|||||||||||||**Min.**|**Max.**|**Min.**|**Max.**|
||||||||||||A||40.00||1.575|
|||||**L2**||**A2**||||||||||
||||||||||||A1|29.90|30.30|1.177|1.193|
|||||||||||||||||
|||**C**|||||||||A2||22.00||0.867|
|||||||||||||||||
||||||||||||B||27.00||1.063|
||||||||||||B1|13.50|16.50|0.531|0.650|
||**N**||**2**<br>**C2**|||**A1**|||||B2||24.00||0.945|
||||||||||||C||14.00||0.551|
|||||||||||**N1**<br>**F**|C1||3.50||0.138|
||||||||||||C2|1.95|3.00|0.077|0.118|
|||||||||||||||||
||||||||||||E3|0.70|0.90|0.027|0.035|
||||**E3**|||**A**|||||F|4.00|4.50|0.157|0.177|
|||||||||||||||||
||||||||||||I|11.20|13.60|0.441|0.535|
||||||||||||L1|3.10|3.50|0.122|0.138|
||||||||||||L2|1.70|1.90|0.067|0.075|
||||||||||||N1|33°|43°|33°|43°|
||||||||||||N2|28°|38°|28°|38°|



8/12 

**Package information** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

**Table 9. TOP3 (insulated and non_insulated) dimensions** 

|**K**|||||**D**<br>**A**|**REF.**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||**Millimeters**|||**Inches**|||
||||||||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
||||**H**|**G**<br>**F**<br>**E**<br>**B**<br>**C**||A|4.4||4.6|0.173||0.181|
|||**R**|**ØL**||||||||||
|||||||B|1.45||1.55|0.057||0.061|
|||||**F**||C|14.35||15.60|0.565||0.614|
||||||||||||||
||**P**|||||D|0.5||0.7|0.020||0.028|
|||||||E|2.7||2.9|0.106||0.114|
|||||||F|15.8||16.5|0.622||0.650|
|||**J**|**J**||||||||||
|||||||G|20.4||21.1|0.815||0.831|
|||||||H|15.1||15.5|0.594||0.610|
|||||||J|5.4||5.65|0.213||0.222|
|||||||K|3.4||3.65|0.134||0.144|
||||||||||||||
|||||||ØL|4.08||4.17|0.161||0.164|
|||||||P|1.20||1.40|0.047||0.055|
|||||||R||4.60|||0.181||



9/12 

**Package information** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

**Table 10. TO-220AB (insulated and non-insulated) dimensions** 

|**I**||||**C**<br>**b2**<br>**c2**<br>**F**<br>**L**<br>**A**<br>**a1**<br>**a2**<br>**b1**<br>**c1**<br>**M**|**REF.**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|
|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||**Millimeters**|||**Inches**|||
|||||||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
||||||A|15.20||15.90|0.598||0.625|
||||||a1||3.75|||0.147||
||||**B**||a2|13.00||14.00|0.511||0.551|
|||**Ø**|**I**|||||||||
||||||B|10.00||10.40|0.393||0.409|
||**4**<br>**l3**||||b1|0.61||0.88|0.024||0.034|
||||||b2|1.23||1.32|0.048||0.051|
|||||||||||||
||||||C|4.40||4.60|0.173||0.181|
|||**e**|||c1|0.49||0.70|0.019||0.027|
||**l2**||||c2|2.40||2.72|0.094||0.107|
||||||e|2.40||2.70|0.094||0.106|
||||||F|6.20||6.60|0.244||0.259|
||||||ØI|3.75||3.85|0.147||0.151|
|||||||||||||
||||||I4|15.80|16.40|16.80|0.622|0.646|0.661|
||||||L|2.65||2.95|0.104||0.116|
||||||l2|1.14||1.70|0.044||0.066|
||||||l3|1.14||1.70|0.044||0.066|
||||||M||2.60|||0.102||



In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 

10/12 

**Ordering information** 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

## **4 Ordering information** 

## **Table 11. Ordering information** 

|**Ordering type**|**Marking**|**Package**|**Weight**|**Base qty **|**Delivery mode**|
|---|---|---|---|---|---|
|BTA/BTB24-xxxyzRG|BTA/BTB24 xxxyz|TO-220AB|2.3 g|50|Tube|
|BTA25-xxxyz|BTA25xxxyz|RD91|20 g|25|Bulk|
|BTA26-xxxyRG|BTA26xxxyz|TOP3 Ins.|4.5 g|30|Tube|
|BTB26-600BRG|BTB26600B|TOP3|4.5 g|30|Tube|
|T2535-xxxG|T2535 xxxG|D2PAK|1.5 g|50|Tube|
|T2535-xxxG-TR|T2535 xxxG|||1000|Tape and reel|



**Note:** xxx = voltage, y = sensitivity,  z = type 

## **5 Revision history** 

## **Table 12. Revision history** 

|**Date**|**Revision**|**Description of changes**|
|---|---|---|
|Oct-2002|6A|Previous update.|
|13-Feb-2006|7|TO-220AB delivery mode changed from bulk to tube.<br>ECOPACK statement added.|
|31-May-2006|8|Reformatted to current standard. Tcin figure 3 changed to Tamb|
|31-Jul-2006|9|Typing error corrected on page 1 (BTB124 instead of BTB24)|
|05-Jul-2007|10|Added BTB26-600BRG. Restructured cover page and section_2:_<br>_Ordering information scheme on page 6_to simplify product selection.<br>Thermal resistance values updated in_Table 6_and_Figure 2_. Graphic<br>for I2t updated in_Figure 7_.|



11/12 

**BTA24, BTB24, BTA25, BTA26, BTB26, T25** 

## **Please Read Carefully:** 

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 

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Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 

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Updated at June 10, 2026

STMicroelectronics is a global leader in the semiconductor industry, recognized for developing highly integrated, energy-efficient solutions that power modern electronics. With a strong focus on innovation, ST provides a comprehensive portfolio of microelectronics that address the demanding requirements of industrial, automotive, communications, and consumer applications. Our extensive selection of STMicroelectronics components is built around a robust lineup of discrete semiconductors and circuit protection devices. We offer a wide variety of single MOSFETs, Schottky diodes, and fast and ultrafast recovery rectifier diodes, designed to deliver exceptional efficiency and thermal performance in power management and conversion systems. For robust circuit protection, our inventory features hundreds of transient voltage suppressors and TVS diodes that safeguard sensitive electronic components against destructive voltage spikes. In addition to core power discretes like TRIACs, SCRs, bipolar transistors, and single IGBTs, our STMicroelectronics range includes specialized integrated passive filters and MEMS sensors. Furthermore, ST offers advanced integrated passive devices, such as baluns and RF filters, which utilize high-quality monolithic RF IPD processes on glass or high-resistance silicon substrates. These components provide competitive cost structures, reduced power losses, and simplified RFIC-to-antenna matching, ensuring optimal system performance and delivering the reliability required for next-generation wireless and power designs.

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