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BTB08-800TWRG
Triac, 800 V, 8 A, TO-220AB, 1.2 V, 80 A, 10 mA
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- Manufacturer: STMICROELECTRONICS
- Product type:
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 3Pins
- Product Range: Snubberless BTB08-xxxxW
- Triac Case Style: TO-220AB
- Thyristor Mounting: Through Hole
- Holding Current Max: 10mA
- On State RMS Current: 8A
- Peak On State Voltage: 1.55V
- Gate Trigger Voltage Max: 1.2V
- Operating Temperature Max: 125°C
- Peak Non Repetitive Surge Current: 80A
- Peak Repetitive Off State Voltage: 800V
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.366 € |
| Current stock | 500+ |
| Lead time | 30 days |
Datasheet
**BTA08, BTB08, T810 T835, T850** Datasheet Snubberless™, logic level and standard 8 A Triacs **==> picture [142 x 237] intentionally omitted <==** **----- Start of picture text -----**<br> A2<br>G<br>A2 a A1 hk<br>G G<br>A2 A2<br>A1 A1<br>TO-220AB TO-220AB Ins.<br>A2<br>A2 G<br>A1<br>D²PAK<br>A2<br>A2<br>A2 [G]<br>A1<br>G<br>A2<br>IPAK A1 DPAK<br>**----- End of picture text -----**<br> ## **Features** - On-state rms current, IT(RMS) 8 A - Repetitive peak off-state voltage, VDRM / VRRM 600 V to 800 V - Triggering gate current, IGT 5 to 50 mA ## **Description** Available either in through-hole and surface-mount packages, these devices are suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits or for phase control operation in light dimmers and motor speed controllers, etc. The Snubberless versions (BTA, BTB08_xxxxW and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performance. Logic level versions are designed to interface directly with low power drivers such as Microcontrollers. By using an internal ceramic pad, the BTA series provide voltage insulated tab (rated at 2500 VRMS) in compliance with UL standards (file ref.: E81734). |**Product status link**<br>~~LEE~~|**Product status link**<br>~~LEE~~| |---|---| ||BTA08| ||BTB08| ||T810| ||T835| ||T850| **DS2114** - **Rev 15** - **August 2018** For further information contact your local STMicroelectronics sales office. www.st.com **BTA08, BTB08, T810, T835, T850 Characteristics** **1** ## **Characteristics** **Table 1. Absolute maximum ratings (Tj = 25 °C unless otherwise stated)** |**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**| |---|---|---|---|---|---| |IT(RMS)|RMS on-state current (full sine wave)|IPAK, DPAK,TO-220AB, D²PAK|Tc= 110 °C|8|A| |||TO-220AB Ins.|Tc= 100 °C||| |ITSM|Non repetitive surge peak on-state current (full<br>cycle, Tjinitial = 25 °C)|f = 50 Hz|t = 20 ms|80|A| |||f = 60 Hz|tp= 16.7 ms|84|| |I2t|I2t value for fusing||tp= 10 ms|36|A2s| |dl/dt|Critical rate of rise of on-state current IG= 2 x<br>IGT, tr ≤ 100 ns|f = 120 Hz|Tj= 125 °C|50|A/µs| |IGM|Peak gate current|tp= 20 µs|Tj= 125 °C|4|A| |PG(AV)|Average gate power dissipation||Tj= 125 °C|1|W| |Tstg|Storage junction temperature range|||-40 to +150|°C| |Tj|Operating junction temperature range|||-40 to +125|°C| **Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Snubberless and logic level (3 quadrants)** |**Sbl**|**Pt**|**Qdt**||**T8**|**T8**|**T8**|**BTA08/BTB08**|**BTA08/BTB08**|**BTA08/BTB08**|**BTA08/BTB08**|**Uit**| |---|---|---|---|---|---|---|---|---|---|---|---| |**ymo**|**arameer**|**uaran**||**10**|**35**|**50**|**TW**|**SW**|**CW**|**BW**|**n**| |IGT (1)|VD= 12 V, RL= 30 Ω|I - II - III|Max.|10|35|50|5|10|35|50|mA| |VGT||I - II - III|Max.|1.2|||||||V| |VGD|VD= VDRM, RL= 3.3 kΩ, Tj= 125 °C|I - II - III|Min.|0.2|||||||V| |IH (2)|IT= 100 mA|I - II - III|Max.|15|35|75|10|15|35|50|mA| |IL|IG= 1.2 x IGT|I - III|Max.|25|50|70|10|25|50|70|mA| |||II|Max.|30|60|110|15|30|60|80|| |dV/dt(2)|VD= 67% VDRM, gate open, Tj= 125 °C||Max.|40|400|1000|20|40|400|1000|V/µs| |(dl/dt)c(2)|(dV/dt)c = 0.1 V/µs, Tj= 125 °C||Min.|5.4|||3.5|5.4|||A/ms| ||(dV/dt)c = 10 V/µs, Tj= 125 °C||Min.|2.8|||1.5|2.98|||| ||Without snubber, Tj= 125 °C||Min.||4.5|7|||4.5|7|| _1. Minimum IGT is guaranteed at 5 % of IGT max._ _2. For both polarities of A2 referenced to A1_ **DS2114** - **Rev 15** **page 2/21** **BTA08, BTB08, T810, T835, T850 Characteristics** ## **Table 3. Standard (4 quadrants)** |**Sbl**|**Pt**|**Qdt**||**BTA08/BTB08**|**BTA08/BTB08**|**Uit**| |---|---|---|---|---|---|---| |**ymo**|**arameer**|**uaran**||**C**|**B**|**n**| |IGT (1)|VD= 12 V, RL= 33 Ω|I - II - III|Max.|25|50|mA| |||IV||50|100|| |VGT||All|Max.|1.3||V| |VGD|VD= VDRM, RL= 33 kΩ, Tj= 125 °C|All|Min.|0.2||V| |IH (2)|IT= 500 mA|I - II - III|Max.|25|50|mA| |IL|IG= 1.2 IGT|I - III - IV|Max.|40|50|mA| |||II||80|100|| |dV/dt(2)|VD= 67 % VDRMgate open, Tj= 125 °C||Min.|200|400|V/µs| |(dV/dt)c(2)|(dI/dt)c = 3.5 A/ms, Tj= 125 °C||Min.|5|10|V/µs| _1. Minimum IGT is guaranteed at 5 % of IGT max._ _2. For both polarities of A2 referenced to A1_ **Table 4. Static electrical characteristics** |**Symbol**|**Test conditions**|**Test conditions**|**Test conditions**|**Value**|**Unit**| |---|---|---|---|---|---| |VTM (1)|ITM= 11 A, tp= 380 µs|Tj= 25 °C|Max.|1.55|V| |VTO (1)|threshold on-state voltage|Tj= 125 °C|Max.|0.85|V| |RD (1)|Dynamic resistance|Tj= 125 °C|Max.|50|mΩ| |IDRMIRRM|VDRM= VRRM|Tj= 25 °C|Max.|5|µA| |||Tj= 125 °C|Max.|1|mA| _1. For both polarities of A2 referenced to A1_ **Table 5. Thermal resistance** |**Symbol**|**Parameter**|**Parameter**||**Value**|**Unit**| |---|---|---|---|---|---| |Rth(j-c)|Max. junction to case thermal resistance (AC)||IPAK / D2PAK / DPAK / TO-220AB|1.6|°C/W| ||||TO-220AB Insulated|2.5|| |Rth(j-a)|Junction to ambient (typ.)|S = 2 cm²(1)|D²PAK|45|°C/W| |||S = 1 cm²(1)|DPAK|70|| ||Junction to ambient (typ.)||TO-220AB / TO-220AB Insulated|60|| ||||IPAK|100|| _1. S = Copper surface under tab._ **DS2114** - **Rev 15** **page 3/21** **BTA08, BTB08, T810, T835, T850 Characteristics (curves)** ## **1.1 Characteristics (curves)** **Figure 1. Maximum power dissipation versus on-state Figure 2. RMS on-state current versus temperature (full RMS current (full cycle) cycle)** **==> picture [224 x 136] intentionally omitted <==** **----- Start of picture text -----**<br> P(W)<br>10<br>9<br>8<br>7<br>6<br>5<br>4<br>3<br>2<br>1<br>IT(RMS)(A)<br>0<br>0 1 2 3 4 5 6 7 8<br>**----- End of picture text -----**<br> **==> picture [225 x 133] intentionally omitted <==** **----- Start of picture text -----**<br> IT(RMS)(A)<br>10<br>9<br>BTB/T8<br>8<br>7 BTA<br>6<br>5<br>4<br>3<br>2<br>1<br>Tc(°C)<br>0<br>0 25 50 75 100 125<br>**----- End of picture text -----**<br> **==> picture [513 x 205] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 3. RMS on-state current versus ambient Figure 4. Relative variation of thermal impedance versus<br>temperature (full cycle) pulse duration<br>IT(RMS)(A) K = [Zth/Rth]<br>3.5 1E+0<br>D²PAK Printed circuit board FR4, copper thickness: 35 µm Zth(j-c)<br>3.0 (S = 1 cm²)<br>DPAK/IPAK<br>Zth(j-a)<br>2.5<br>1E-1<br>2.0 TO-220AB/D²PAK<br>Zth(j-a)<br>1.5 DPAK<br>(S = 0.5 cm²) 1E-2<br>1.0<br>0.5<br>Tc(°C) tp(s)<br>0.0 1E-3<br>0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2<br>**----- End of picture text -----**<br> **DS2114** - **Rev 15** **page 4/21** **BTA08, BTB08, T810, T835, T850** **Characteristics (curves)** **Figure 5. On-state characteristics (maximum values)** **Figure 6. Surge peak on-state current versus number of cycles** **==> picture [225 x 137] intentionally omitted <==** **----- Start of picture text -----**<br> ITM(A)<br>100<br>Tj max. Tj = Tj max.<br>Vto = 0.85 V<br>Rd = 50 mΩ<br>a a a ee ee<br>POCO<br>10<br>PTT AAT Tj = 25 °C T EE<br>SSS ==<br>een ta a e e<br>JEEP eee ef<br>VTM(V)<br>1 PA PT PT T<br>0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br> **==> picture [213 x 138] intentionally omitted <==** **----- Start of picture text -----**<br> ITSM(A)<br>90<br>80<br>70 = t = 16.66 ms<br>Non repetitive<br>60 T j initial = 25 °C One cycle<br>50 es<br>Pry<br>40 Pt RE ETE<br>30 | Repetitive ATE)<br>TC = 110 °C<br>20<br>ee eee<br>10<br>PHT | Number of cycles<br>0 YE TLE CE EET<br>1 10 100 1000<br>**----- End of picture text -----**<br> **Figure 7. Non repetitive surge peak on-state current for a sinusoidal pulse (tp < 10 ms)** **Figure 8. Relative variation of gate trigger current** **==> picture [465 x 135] intentionally omitted <==** **----- Start of picture text -----**<br> ITSM(A) IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C]<br>2.5<br>1000<br>Tj initial=25°C Holding current and latching current versus junction temperature (typical values)<br>2.0<br>ee \<br>IGT<br>dI/dt limitation:50A/µs A | ITSM 1.5 P LN<br>100 360° TA SAT PrN EET EE<br>1.0 IH and IL<br>= SE Seeee<br>α<br>[|= I==Titi aTT 0.5 Ppp) Sca |<br>a BRR<br>Tj (°C)<br>10 i m i tp(ms) 0.0-40 a -20 0 20 40 60 80 100 120 140<br>0.01 0.10 1.00 10.00<br>**----- End of picture text -----**<br> **Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values)** **Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values)** **==> picture [480 x 136] intentionally omitted <==** **----- Start of picture text -----**<br> (dl/dt)c [(dV/dt)c / specified (dl/dt)c (dl/dt)c [(dV/dt)c] / specified (dl/dt)c<br>2.2 2.0<br>2.0 TW Snubberless and logic level types 1.8 Standard types<br>1.8 S S E e 1.6 eCS C T<br>1.6 a a PS SC<br>Reh Pe<br>1.4 1.4<br>1.2 NE T835/T850/CW/SW/BW P SOE<br>1.0 PSSe S ER 1.2 ESSE B NOtEt<br>0.8 P—++ A EHH HH 1.0 a a<br>T810/SW<br>0.6<br>0.8<br>0.4 SSS[EoSEet S EHH |) e sEEesee<br>0.2 a 0.6 i<br>(dV/dt)c (V/µs) (dV/dt)c (V/µs)<br>0.0 ee ee ee eee 0.4 e n ee ee<br>0.1 1.0 10.0 100.0 0.1 1.0 10.0 100.0<br>**----- End of picture text -----**<br> **DS2114** - **Rev 15** **page 5/21** **BTA08, BTB08, T810, T835, T850 Characteristics (curves)** **==> picture [513 x 205] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 11. Relative variation of critical rate of decrease of Figure 12. DPAK and D2PAK thermal resistance junction<br>main current versus junction temperature to ambient versus copper surface under tab<br>(dl/dt)c [Tj] / [Tj specified] Rth(j-a)(°C/W)<br>6 100<br>90 Printed circuit board FR4, copper thickness: 35 µm<br>5<br>80<br>70<br>4<br>60<br>DPAK<br>3 50<br>40<br>2 30 D²PAK<br>20<br>1<br>10<br>Tj(°C) S(cm²)<br>0 0<br>0 25 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40<br>**----- End of picture text -----**<br> **DS2114** - **Rev 15** **page 6/21** **BTA08, BTB08, T810, T835, T850 Package information** **2 Package information** In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. **DS2114** - **Rev 15** **page 7/21** **BTA08, BTB08, T810, T835, T850 DPAK package information** ## **2.1 DPAK package information** - Epoxy meets UL94, V0 - Lead-free package - Recommended torque: 0.4 to 0.6 N·m ## **Figure 13. DPAK package outline** **==> picture [439 x 487] intentionally omitted <==** **----- Start of picture text -----**<br> E<br>b4 c2<br>E1<br>A1<br>e b c<br>e1<br>L<br>V2<br>A<br>2<br>L<br>D1<br>D<br>H<br>4<br>L<br>A2<br>**----- End of picture text -----**<br> **DS2114** - **Rev 15** **page 8/21** **BTA08, BTB08, T810, T835, T850 DPAK package information** **Table 6. DPAK package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|2.18||2.40|0.0858||0.0945| |A1|0.90||1.10|0.0354||0.0433| |A2|0.03||0.23|0.0012||0.0091| |b|0.64||0.90|0.0252||0.354| |b4|4.95||5.46|0.1949||0.2150| |c|0.46||0.61|0.0181||0.0240| |c2|0.46||0.60|0.0181||0.0236| |D|5.97||6.22|0.2350||0.2449| |D1|5.10|||0.2008||| |E|6.35||6.73|0.2500||0.2650| |E1|4.32|||0.1701||| |e||2.29|||0.0900|| |e1||4.57|||0.1800|| |H|9.35||10.40|0.3681||0.4094| |L|1.00||1.78|0.0394||0.0701| |L2|||1.27|||0.0500| |L4|0.60||1.02|0.0236||0.0402| |V2|0°||+8°|0°||+8°| _1. Dimensions in inches are given for reference only_ _Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ **Figure 14. DPAK recommended footprint (dimensions are in mm)** **==> picture [291 x 174] intentionally omitted <==** **----- Start of picture text -----**<br> 12.7<br>6.7 3.0 3.0<br>A<br>4.572<br>6.7<br>B<br>1.6<br>The device must be positioned within 0.05 AB<br>**----- End of picture text -----**<br> **DS2114** - **Rev 15** **page 9/21** **BTA08, BTB08, T810, T835, T850 IPAK package information** ## **2.2 IPAK package information** **Figure 15. IPAK package outline** **==> picture [214 x 294] intentionally omitted <==** **----- Start of picture text -----**<br> E A<br>b4 c2<br>L2 V1<br>D<br>L1<br>H<br>A1<br>b2<br>L<br>e<br>B5 b<br>c<br>e1<br>**----- End of picture text -----**<br> _Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ **DS2114** - **Rev 15** **page 10/21** **BTA08, BTB08, T810, T835, T850 IPAK package information** ## **Table 7. IPAK package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|2.20||2.40|0.0866||0.0945| |A1|0.90||1.10|0.0354||0.0433| |b|0.64||0.90|0.0252||0.0354| |b2|||0.95|||0.0374| |b4|5.20||5.43|0.2047||0.2138| |B5||0.30|||0.0118|| |c|0.45||0.60|0.0177||0.0236| |c2|0.46||0.60|0.0181||0.0236| |D|6.00||6.20|0.2362||0.2441| |E|6.40||6.65|0.2520||0.2618| |e||2.28|||0.0898|| |e1|4.40||4.60|0.1732||0.1811| |H||16.10|||0.6339|| |L|9.00||9.60|0.3545||0.3780| |L1|0.80||1.20|0.0315||0.0472| |L2||0.80|1.25||0.0315|0.0492| |V1||10°|||10°|| _1. Inch dimensions are for reference only._ **DS2114** - **Rev 15** **page 11/21** **BTA08, BTB08, T810, T835, T850 TO-220AB insulated package information** ## **2.3 TO-220AB insulated package information** ## **Figure 16. TO-220AB insulated package outline** **==> picture [418 x 429] intentionally omitted <==** **----- Start of picture text -----**<br> B C<br>b2<br>Resin gate 0.5 mm I<br>max. protusion [(1)]<br>L<br>F<br>A<br>I4<br>l3<br>c2<br>a1<br>l2<br>a2<br>M<br>c1<br>b1 Resin gate 0.5 mm<br>max. protusion [(1)]<br>e<br>**----- End of picture text -----**<br> (1)Resin gate position accepted in one of the two positions or in the symmetrical opposites. **DS2114** - **Rev 15** **page 12/21** **BTA08, BTB08, T810, T835, T850 TO-220AB insulated package information** **Table 8. TO-220AB insulated package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|15.20||15.90|0.5984||0.6260| |a1||3.75|||0.1476|| |a2|13.00||14.00|0.5118||0.5512| |B|10.00||10.40|0.3937||0.4094| |b1|0.61||0.88|0.0240||0.0346| |b2|1.23||1.32|0.0484||0.0520| |C|4.40||4.60|0.1732||0.1811| |c1|0.49||0.70|0.0193||0.0276| |c2|2.40||2.72|0.0945||0.1071| |e|2.40||2.70|0.0945||0.1063| |F|6.20||6.60|0.2441||0.2598| |I|3.73||3.88|0.1469||0.1528| |L|2.65||2.95|0.1043||0.1161| |I2|1.14||1.70|0.0449||0.0669| |I3|1.14||1.70|0.0449||0.0669| |I4|15.80|16.40|16.80|0.6220|0.6457|0.6614| |M||2.6|||0.1024|| _1. Inch dimensions are for reference only._ **DS2114** - **Rev 15** **page 13/21** **BTA08, BTB08, T810, T835, T850 D²PAK package information** ## **2.4 D²PAK package information** ## **Figure 17. D²PAK package outline** **==> picture [427 x 367] intentionally omitted <==** **----- Start of picture text -----**<br> A E1<br>E<br>c2 E2<br>b2<br>Resin gate<br>e<br>b 0.5 mm max.<br>protrusion(1)<br>G<br>A1<br>A2<br>A3<br>R<br>Gauge Plane<br>c<br>V2<br>L2<br>D1<br>D<br>H<br>D2<br>L3<br>L<br>**----- End of picture text -----**<br> (1) Resin gate position accepted in one of the two positions or in the symmetrical opposites **DS2114** - **Rev 15** **page 14/21** **BTA08, BTB08, T810, T835, T850 D²PAK package information** ## **Table 9. D²PAK package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|4.30||4.60|0.1693||0.1811| |A1|2.49||2.69|0.0980||0.1059| |A2|0.03||0.23|0.0012||0.0091| |A3||0.25|||0.0098|| |b|0.70||0.93|0.0276||0.0366| |b2|1.25||1.7|0.0492||0.0669| |c|0.45||0.60|0.0177||0.0236| |c2|1.21||1.36|0.0476||0.0535| |D|8.95||9.35|0.3524||0.3681| |D1|7.50||8.00|0.2953||0.3150| |D2|1.30||1.70|0.0512||0.0669| |e|2.54|||0.1||| |E|10.00||10.28|0.3937||0.4047| |E1|8.30||8.70|0.3268||0.3425| |E2|6.85||7.25|0.2697||0.2854| |G|4.88||5.28|0.1921||0.2079| |H|15||15.85|0.5906||0.6240| |L|1.78||2.28|0.0701||0.0898| |L2|1.27||1.40|0.0500||0.0551| |L3|1.40||1.75|0.0551||0.0689| |R||0.40|||0.0157|| |V2|0°||8°|0°||8°| _1. Dimensions in inches are given for reference only_ **DS2114** - **Rev 15** **page 15/21** **BTA08, BTB08, T810, T835, T850 D²PAK package information** ## **Figure 18. D²PAK recommended footprint (dimensions are in mm)** **==> picture [259 x 156] intentionally omitted <==** **----- Start of picture text -----**<br> 16.90<br>10.30 5.08<br>1.30<br>3.70<br>8.90<br>**----- End of picture text -----**<br> **DS2114** - **Rev 15** **page 16/21** **BTA08, BTB08, T810, T835, T850 Ordering information** ## **3 Ordering information** **Figure 19. Ordering information scheme (BTA08 and BTB08 series)** BT A 08 - 600 BW (RG) Triac Insulation A = Insulated B = Non-insulated Current 08 = 8A Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA BW = 50 mA Snubberless™ C = 25 mA standard CW = 35 mA Snubberless™ SW = 10 mA logic level TW = 5 mA logic level Packing mode RG = Tube **Figure 20. Ordering information scheme (T8 series)** T 8 10 - 600 B (-TR) Triac series Current 08 = 8A Sensitivity 10 = 10 mA 35 = 35 mA 50 = 50 mA Voltage 600 = 600 V 800 = 800 V Package B = DPAK H = IPAK G = D²PAK Packing mode Blank = Tube TR = Tape and reel **DS2114** - **Rev 15** **page 17/21** **BTA08, BTB08, T810, T835, T850 Ordering information** ## **Table 10. Product selector** |**Pt Nb**|**Voltage (xxx)**|**Voltage (xxx)**|**Sitiit**|**T**|**Pk**| |---|---|---|---|---|---| |**ar umer**|**600**|**800**|**ensvy**|**ype**|**acage**| |T810-xxxB|X|X|10 mA|Logic Level|DPAK| |T835-xxxH|X||35 mA|Snubberless™|IPAK| |T810-xxxG|X||10 mA|Logic Level|D2PAK| |T835-xxxG|X|X|35 mA|Snubberless™|D2PAK| |T850-xxxG|X|X|50 mA|Snubberless™|D2PAK| |BTA08-xxxS|X||10 mA|Logic Level|TO-220AB Ins.| |BTA08-xxxC|X|X|35 mA|Standard|TO-220AB Ins.| |BTA08-xxxB|X||50 mA|Standard|TO-220AB Ins.| |BTA08-xxxTW|X||5 mA|Logic Level|TO-220AB Ins.| |BTA08-xxxSW|X||10 mA|Logic Level|TO-220AB Ins.| |BTA08-xxxCW|X||35 mA|Snubberless™|TO-220AB Ins.| |BTA08-xxxBW|X|X|50 mA|Snubberless™|TO-220AB Ins.| |BTB08-xxxS|X||10 mA|Logic Level|TO-220AB| |BTB08-xxxC|X||35 mA|Standard|TO-220AB| |BTB08-xxxB|X||50 mA|Standard|TO-220AB| |BTB08-xxxTW|X|X|5 mA|Logic Level|TO-220AB| |BTB08-xxxSW|X||10 mA|Logic Level|TO-220AB| |BTB08-xxxCW|X|X|35 mA|Snubberless™|TO-220AB| |BTB08-xxxBW|X||50 mA|Snubberless™|TO-220AB| **DS2114** - **Rev 15** **page 18/21** **BTA08, BTB08, T810, T835, T850 Ordering information** ## **Table 11. Ordering information** |**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**| |---|---|---|---|---|---| |T810-600B|T8 1060|DPAK|0.30|75|Tube| |T835-600B|T8 3560||||| |T835-800B|T8 3580||||| |T810-600B-TR|T8 1060|||2500|Tape&Reel 13"| |T810-800B-TR|T8 1080||||| |T835-600B-TR|T8 3560||||| |T835-800B-TR|T8 3580||||| |T835-600H|T8 3560|IPAK|0.40|75|Tube| |T835-600G|T835-600G|D2PAK|1.50|50|Tube| |T835-8G|T835-8G||||| |T850-6G|T850-6G||||| |T850-8G|T850-8G||||| |T810-600G-TR|T810-600G|||1000|Tape&Reel 13"| |T835-600G-TR|T835-600G||||| |T835-8G-TR|T835-8G||||| |T850-6G-TR|T850-6G||||| |T850-8G-TR|T850-8G||||| |BTA08-600SRG|BTA08-600S|TO-220AB Ins.|2.30|50|Tube| |BTA08-600BRG|BTA08-600B||||| |BTA08-600CRG|BTA08-600C||||| |BTA08-800CRG|BTA08-800C||||| |BTA08-600BWRG|BTA08-600BW||||| |BTA08-600CWRG|BTA08-600CW||||| |BTA08-600SWRG|BTA08-600SW||||| |BTA08-600TWRG|BTA08-600TW||||| |BTA08-800BWRG|BTA08-800BW||||| |BTB08-600BRG|BTB08-600B|TO-220AB|||| |BTB08-600CRG|BTB08-600C||||| |BTB08-600SRG|BTB08-600S||||| |BTB08-600BWRG|BTB08-600BW||||| |BTB08-600CWRG|BTB08-600CW||||| |BTB08-600SWRG|BTB08-600SW||||| |BTB08-600TWRG|BTB08-600TW||||| |BTB08-800CWRG|BTB08-800CW||||| |BTB08-800TWRG|BTB08-800TW||||| **DS2114** - **Rev 15** **page 19/21** **BTA08, BTB08, T810, T835, T850** **Table 12. Document revision history** |**Date**|**Revision**|**Changes**| |---|---|---| |Apr-2002|5A|Last update.| |13-Feb-2006|6|TO-220AB delivery mode changed from bulk to tube. ECOPACK statement<br>added.| |10-Mar-2010|7|Updated ECOPACK statement and Figure 26| |02-Jun-2014|8|Updated DPAK and IPAK package information and reformatted to current<br>standard.| |07-Nov-2016|9|Updated Table 1 and reformatted to current standard.| |06-Jan-2017|10|Updated Figure 20: "Ordering information scheme (T8 series)", Table 10:<br>"Product selector" and Table 11: "Ordering information".| |09-Feb-2017|11|Added T850 package information.| |24-Apr-2017|12|Updated Figure 6..<br>Minor text changes to improve readability.| |14-Mar-2018|13|UpdatedTable 2. Electrical characteristics (Tj= 25 °C, unless otherwise<br>specified) Snubberless and logic level (3 quadrants), cover image,Figure<br>9. Relative variation of critical rate of decrease of main current versus (dV/dt)c<br>(typical values)andFigure 20. Ordering information scheme (T8 series).| |14-May-2018|14|Updated product status links.| |09-Aug-2018|15|UpdatedTable 3. Standard (4 quadrants).| **DS2114** - **Rev 15** **page 20/21** **BTA08, BTB08, T810, T835, T850** ## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved **DS2114** - **Rev 15** **page 21/21**
Updated at June 10, 2026
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