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BTA208S-800E
Triac, 800 V, 8 A, TO-252 (DPAK), 1.5 V, 65 A, 25 mA
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- Manufacturer: WEEN SEMICONDUCTORS
- Product type:
- Peak Repetitive Off-State Voltage, Vdrm:800V; On State RMS Current IT(rms):8A; Triac Case Style:TO-252; Gate Trigger Current Max (QI), Igt:-; Gate Trigger Voltage Max Vgt:1.5V; Peak Gate Power:5W;
- MSL: -
- SVHC: No SVHC (17-Dec-2015)
- No. of Pins: -
- Product Range: -
- Triac Case Style: TO-252 (DPAK)
- Thyristor Mounting: Surface Mount
- Holding Current Max: 25mA
- On State RMS Current: 8A
- Peak On State Voltage: 1.65V
- Gate Trigger Voltage Max: 1.5V
- Operating Temperature Max: 150°C
- Peak Non Repetitive Surge Current: 65A
- Peak Repetitive Off State Voltage: 800V
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.253 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **BTA208S-800E 3Q Hi-Com Triac Rev. 05 — 14 April 2011 Product data sheet** a“ | ~~ee~~ ## **1. Product profile** ## **1.1 General description** Planar passivated high commutation three quadrant triac in a SOT428 surface-mountable plastic package. This "series E" triac balances the requirements of commutation performance and gate sensitivity. The "sensitive gate" "series E" is intended for interfacing with low power drivers including microcontrollers. ## **1.2 Features and benefits** 3Q technology for improved noise immunity Direct interfacing with low level power drivers and microcontrollers Good immunity to false turn-on by dV/dt High commutation capability maximum false trigger immunity High voltage capability Planar passivated for voltage ruggedness and reliability Surface-mountable package Triggering in three quadrants only ## **1.3 Applications** Electronic thermostats General purpose motor controls ## **1.4 Quick reference data** **Table 1. Quick reference data** |**Symbol**|**Parameter**|**Conditions**||||**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---|---|---|---| |VDRM|repetitive peak off-state|||||-|-|800|V| ||voltage||||||||| |ITSM|non-repetitive peak|full sine wave; Tj(init)= 25 °C;|||= 25 °C;|-|-|65|A| ||on-state current|tp= 20 ms; see Figure 4<br>;|||||||| |||see Figure 5|||||||| ||||||||||| |IT(RMS)|RMS on-state current|full sine wave; Tmb≤102 °C;|||≤102 °C;|-|-|8|A| |||see Figure 1<br>;see Figure 2|||Figure 2<br>;||||| |||see Figure 3|||||||| **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** **Table 1. Quick reference data** _…continued_ |**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |**Static characteristics**||||||| |IGT|gate trigger current|VD= 12 V; IT= 0.1 A; T2+ G+;|-|-|10|mA| |||Tj= 25 °C; seeFigure 7||||| |||VD= 12 V; IT= 0.1 A; T2+ G-;|-|-|10|mA| |||Tj= 25 °C; seeFigure 7||||| |||VD= 12 V; IT= 0.1 A; T2- G-;|-|-|10|mA| |||Tj= 25 °C; seeFigure 7||||| ## **2. Pinning information** |**Table**|**2.**|**Pinning**|**information**||||||||||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---| |**Pin**||**Symbol**|**Description**|**Simplified outline**|||||||**Graphic symbol**||| |1||T1|main terminal 1||||||||||| |2||T2|main terminal 2|||mb|||||T2||T1| |3||G|gate||||||||_sym051_||G| |mb||T2|mounting base; main terminal 2||||||||||| ||||||||||||||| |||||||1|2|3|||||| |||||**SOT428 (DPAK)**|||||||||| ## **3. Ordering information** ## **Table 3. Ordering information** |**Type number**|**Package**| |---|---| ||**Name**<br>**Description**<br>**Version**| |BTA208S-800E|DPAK<br>plastic single-ended surface-mounted package (DPAK); 3 leads<br>(one lead cropped)<br>SOT428| © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 05 — 14 April 2011** **2 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** ## **4. Limiting values** ## **Table 4. Limiting values** _In accordance with the Absolute Maximum Rating System (IEC 60134)._ |**Symbol**|**Parameter**|**Conditions**||**Min**|**Max**|**Unit**| |---|---|---|---|---|---|---| |VDRM|repetitive peak off-state voltage|||-|800|V| |IT(RMS)|RMS on-state current|full sine wave; Tmb≤102 °C; see Figure 1<br>;||-|8|A| |||see Figure 2<br>;see Figure 3||||| |||||||| |ITSM|non-repetitive peak on-state|full sine wave; Tj(init)= 25 °C; tp= 20 ms;||-|65|A| ||current|see Figure 4<br>;see Figure 5||||| |||||||| |||full sine wave; Tj(init)= 25 °C; tp= 16.7 ms||-|72|A| |I2t|I2t for fusing|tp= 10 ms; sine-wave pulse||-|21|A2s| |dIT/dt|rate of rise of on-state current|IT= 12 A; IG= 0.2 A; dI|= 0.2 A; dIG/dt = 0.2 A/µs|-|100|A/µs| |IGM|peak gate current|||-|2|A| |VGM|peak gate voltage|||-|5|V| |PGM|peak gate power|||-|5|W| |PG(AV)|average gate power|over any 20 ms period||-|0.5|W| |Tstg|storage temperature|||-40|150|°C| |Tj|junction temperature|||-|125|°C| **==> picture [30 x 6] intentionally omitted <==** **----- Start of picture text -----**<br> 003aaf617<br>**----- End of picture text -----**<br> **==> picture [472 x 241] intentionally omitted <==** **----- Start of picture text -----**<br> 003aaf581<br>10 25<br>IT(RMS) IT(RMS)<br>Pt | tt ttt a<br>(A) 102 °C (A)<br>8 Pt 20 |<br>Pt ot| |Pt| tT | PNET<br>6 Pt 15 TTI TTT<br>et tt| te tt A |UN<br>4 Pt 10 NE |<br>Pt ot | TT ES<br>2 Pt | tt et Ty 5 a aDeee<br>Pt |tT t T ttT fttTTA a|<br>0 Pt ttt tty 0 aa<br>−50 0 50 100 150 10 [−][2] 10 [−][1] 1 10<br>Tmb (°C) surge duration (s)<br>f = 50 Hz; Ty, =102°C<br>Fig 1. RMS on-state current as a function of heatsink Fig 2. RMS on-state current as a function of surge<br>temperature; maximum values duration; maximum value<br>**----- End of picture text -----**<br> All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. **Rev. 05 — 14 April 2011 3 of 14** BTA208S-800E **Product data sheet** **3 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** **==> picture [481 x 484] intentionally omitted <==** **----- Start of picture text -----**<br> 003aaf618<br>12 101<br>P(W)tot10 | conduction(degrees)angle factorforma a α120 = 180° ° || 105Tmb(max)(°C)<br>30 4<br>| 60 2.8 a ea 90° |<br>8 90 2.2 α 109<br>120 1.9 60°<br>| 180 1.57 Co ed |<br>6 SSS a a 30° | 113<br>eo |<br>4 aee eeee aeeeeeeeae 117<br>2 eee 121<br>JZ Eee<br>0 125<br>0 2 4 6 8 10<br>IT(RMS) (A)<br>a =conduction angle<br>Fig 3. Total power dissipation as a function of RMS on-state current; maximum values<br>003aaa968<br>80<br>ITSM<br>ft TTT<br>(A)<br>60<br>ma<br>40 A |PHEE TET<br>IT ITSM<br>e C<br>20 eee eo<br>ee t<br>eee av T n<br>Tj(init) = 25 °C max<br>0<br>ft TT<br>1 10 10 [2] 10 [3]<br>number of cycles<br>f =50 Hz<br>Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum<br>values<br>**----- End of picture text -----**<br> **Fig 3. Total power dissipation as a function of RMS on-state current; maximum values** © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 05 — 14 April 2011** **4 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** **==> picture [438 x 187] intentionally omitted <==** **----- Start of picture text -----**<br> 003aab121<br>10 [3]<br>———— a IT ITSM<br>po t—“—‘iTSC“( SST UT<br>pT<br>ITSM a a ee ee eee t<br>(A) a eee a eee eee | tp<br>Tj(init) = 25 °C max<br>(1)<br>AOA TTT — ~~<br>10 [2] a | ee ee<br>SSe e<br>-PottEHH<br>a a a Oe Oe OO On GOO OO OO<br>10<br>10 [−][2] 10 [−][1] 1 10 10 [2]<br>tp (ms)<br>**----- End of picture text -----**<br> **Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values** © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 05 — 14 April 2011** **5 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** ## **5. Thermal characteristics** ## **Table 5. Thermal characteristics** **==> picture [497 x 309] intentionally omitted <==** **----- Start of picture text -----**<br> Symbol Parameter Conditions Min Typ Max Unit<br>Rth(j-mb) thermal resistance from junction full cycle; see Figure 6 - - 2 K/W<br>to mounting base half cycle; see Figure 6 - - 2.4 K/W<br>Rth(j-a) thermal resistance from junction in free air; printed circuit board - 75 - K/W<br>to ambient (FR4) mounted<br>003aaf584<br>10<br>Zth(j-mb)<br>(K/W)<br>1 unidirectional<br>bidirectional<br>10 [−][1] P<br>tp t<br>10 [−][2]<br>10 [−][5] 10 [−][4] 10 [−][3] 10 [−][2] 10 [−][1] 1 10<br>tp (s)<br>Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width<br>**----- End of picture text -----**<br> © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 05 — 14 April 2011** **6 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** ## **6. Characteristics** |**Table 6.**<br>**Characteristics**|| |---|---| |**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**| |**Static characteristics**|| |IGT<br>gate trigger current|VD= 12 V; IT= 0.1 A; T2+ G+;<br>Tj= 25 °C; seeFigure 7<br>-<br>-<br>10<br>mA| ||VD= 12 V; IT= 0.1 A; T2+ G-;<br>Tj= 25 °C; seeFigure 7<br>-<br>-<br>10<br>mA| ||VD= 12 V; IT= 0.1 A; T2- G-;<br>Tj= 25 °C; seeFigure 7<br>-<br>-<br>10<br>mA| |IL<br>latching current|VD= 12 V; IG= 0.1 A; T2+ G+;<br>Tj= 25 °C; seeFigure 8<br>-<br>-<br>25<br>mA| ||VD= 12 V; IG= 0.1 A; T2+ G-;<br>Tj= 25 °C; seeFigure 8<br>-<br>-<br>30<br>mA| ||VD= 12 V; IG= 0.1 A; T2- G-;<br>Tj= 25 °C; seeFigure 8<br>-<br>-<br>30<br>mA| |IH<br>holding current|VD= 12 V; Tj= 25 °C; see Figure 9<br>-<br>-<br>25<br>mA| |VT<br>on-state voltage|IT= 10 A; Tj= 25 °C; seeFigure 10<br>-<br>-<br>1.65<br>V| |VGT<br>gate trigger voltage|VD= 12 V; IT= 0.1 A; Tj= 25 °C;<br>see Figure 11<br>-<br>-<br>1.5<br>V| ||VD= 400 V; IT= 0.1 A; Tj= 125 °C;<br>see Figure 11<br>0.25<br>-<br>-<br>V| |ID<br>off-state current|VD= 800 V; Tj= 125 °C<br>-<br>-<br>0.5<br>mA| |**Dynamic characteristics**|| |dVD/dt<br>rate of rise of off-state<br>voltage|VDM= 535 V; Tj= 110 °C; exponential<br>waveform; gate open circuit<br>60<br>-<br>-<br>V/µs| |dIcom/dt<br>rate of change of<br>commutating current|VD= 400 V; Tj= 125 °C; IT(RMS)= 8 A;<br>dVcom/dt = 0.1 V/µs; gate open circuit<br>10<br>-<br>-<br>A/ms| ||VD= 400 V; Tj= 125 °C; IT(RMS)= 8 A;<br>dVcom/dt = 10 V/µs; gate open circuit;<br>see Figure 12<br>5<br>-<br>-<br>A/ms| © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 05 — 14 April 2011** **7 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** **==> picture [233 x 204] intentionally omitted <==** **----- Start of picture text -----**<br> 003aac888<br>3<br>(1)<br>IGT<br>IGT(25°C)<br>2<br>(2)<br>(3)<br>1<br>0<br>−50 0 50 100 150<br>Tj (°C)<br>(1) T2- G-<br>**----- End of picture text -----**<br> **==> picture [233 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 001aab100<br>3<br>IL<br>IL(25°C)<br>2<br>1<br>0<br>−50 0 50 100 150<br>Tj (°C)<br>**----- End of picture text -----**<br> (2) T2+ G- (3) T2+ G+ **Fig 7. Normalized gate trigger current as a function of junction temperature** **==> picture [233 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 001aab099<br>3<br>IH<br>IH(25°C)<br>2<br>1<br>0<br>−50 0 50 100 150<br>Tj (°C)<br>**----- End of picture text -----**<br> **Fig 8. Normalized latching current as a function of junction temperature** **==> picture [233 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> 003aaa971<br>25<br>IT<br>(A)<br>20<br>15<br>10<br>5<br>(1) (2) (3)<br>0<br>0 1 2 3<br>VT (V)<br>**----- End of picture text -----**<br> Vo = 1.264 V; Rs = 0.0378 Ω (1) Tj = 125 °C; typical values - (2) Tj = 125 °C; maximum values - (3) Tj = 25 °C; maximum values **Fig 9. Normalized holding current as a function of junction temperature** **Fig 10. On-state current as a function of on-state voltage** All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. **Rev. 05 — 14 April 2011 8 of 14** BTA208S-800E **Product data sheet** **8 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** **==> picture [497 x 250] intentionally omitted <==** **----- Start of picture text -----**<br> 1.6 001aab101 10 [3] 003aag069<br>VGT dlcom/dt<br>VGT(25°C) (A/ms)<br>1.2 10 [2]<br>0.8 10<br>0.4 1<br>−50 0 50 100 Tj (°C) 150 20 60 100 Tj (°C) 140<br>Fig 11. Normalized gate trigger voltage as a function of Fig 12. Rate of change of commutating current as a<br>junction temperature function of junction temperature; minimum<br>values<br>**----- End of picture text -----**<br> © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 05 — 14 April 2011** **9 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** ## **7. Package outline** **==> picture [480 x 8] intentionally omitted <==** **----- Start of picture text -----**<br> Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) SOT428<br>**----- End of picture text -----**<br> **==> picture [481 x 565] intentionally omitted <==** **----- Start of picture text -----**<br> y<br>E A A<br>b2 A1 E1<br>mounting<br>base D2<br>D1<br>HD<br>2<br>L2 L<br>1 3 L1<br>b1 b w M A c<br>e<br>e1<br>0 5 10 mm<br>scale<br>DIMENSIONS (mm are the original dimensions)<br>UNIT A A1 b b1 b2 c D1 minD2 E minE1 e e1 HD L minL1 L2 w maxy<br>2.38 0.93 0.89 1.1 5.46 0.56 6.22 6.73 10.4 2.95 0.9<br>mm 4.0 4.45 2.285 4.57 0.5 0.2 0.2<br>2.22 0.46 0.71 0.9 5.00 0.20 5.98 6.47 9.6 2.55 0.5<br>OUTLINE REFERENCES EUROPEAN<br>ISSUE DATE<br>VERSION IEC JEDEC JEITA PROJECTION<br>06-02-14<br>SOT428 TO-252 SC-63<br>06-03-16<br>**----- End of picture text -----**<br> **Fig 13. Package outline SOT428 (DPAK)** All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. BTA208S-800E **Product data sheet** **Rev. 05 — 14 April 2011** **10 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** ## **8. Revision history** ## **Table 7. Revision history** |**Document ID**|**Release date**<br>**Data sheet status**|**Change notice**<br>**Supersedes**| |---|---|---| |BTA208S-800E v.5|20110414<br>Product data sheet|-<br>BTA208S_SERIES_D_E_F v.4| |Modifications:|**•** The format of this data sheet has|been redesigned to comply with the new identity| ||guidelines of NXP Semiconductors.|| ||**•** Legal texts have been adapted to|the new company name where appropriate.| ||**•** Type number BTA208S-800E separated from data sheet|| ||BTA208S_SERIES_D_E_F v.4.|| |BTA208S_SERIES_D_E_F v.4|20020301<br>Product specification|-<br>BTA208S_SERIES_D_E_F v.3| © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Rev. 05 — 14 April 2011** **Product data sheet** **11 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** ## **9. Legal information** ## **9.1 Data sheet status** |**Document status[1]**<br> **[2]**|**Product status[3]**|**Definition**| |---|---|---| |Objective [short] data sheet|Development|This document contains data from the objective specification for product development.| |Preliminary [short] data sheet|Qualification|This document contains data from the preliminary specification.| |Product [short] data sheet|Production|This document contains the product specification.| [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. ## **9.2 Definitions** **Draft** — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. **Short data sheet** — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. **Product specification** — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ## **9.3 Disclaimers** **Limited warranty and liability** — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the _Terms and conditions of commercial sale_ of NXP Semiconductors. **Right to make changes** — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. **Suitability for use** — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. **Quick reference data** — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. **Applications** — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. **Limiting values** — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. **Terms and conditions of commercial sale** — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 05 — 14 April 2011** **12 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. **No offer to sell or license** — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. **Export control** — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. **Non-automotive qualified products** — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. ## **9.4 Trademarks** Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. **Adelante** , **Bitport** , **Bitsound** , **CoolFlux** , **CoReUse** , **DESFire** , **EZ-HV** , **FabKey** , **GreenChip** , **HiPerSmart** , **HITAG** , **I²C-bus** logo, **ICODE** , **I-CODE** , **ITEC** , **Labelution** , **MIFARE** , **MIFARE Plus** , **MIFARE Ultralight** , **MoReUse** , **QLPAK** , **Silicon Tuner** , **SiliconMAX** , **SmartXA** , **STARplug** , **TOPFET** , **TrenchMOS** , **TriMedia** and **UCODE** — are trademarks of NXP B.V. **HD Radio** and **HD Radio** logo — are trademarks of iBiquity Digital Corporation. ## **10. Contact information** For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com © NXP B.V. 2011. All rights reserved. BTA208S-800E All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 05 — 14 April 2011** **13 of 14** **BTA208S-800E** **NXP Semiconductors** **3Q Hi-Com Triac** ## **11. Contents** |**11. **|**Contents**| |---|---| |**1**|**Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1**| |1.1|General description . . . . . . . . . . . . . . . . . . . . . .1| |1.2|Features and benefits. . . . . . . . . . . . . . . . . . . . .1| |1.3|Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1| |1.4|Quick reference data . . . . . . . . . . . . . . . . . . . . .1| |**2**|**Pinning information. . . . . . . . . . . . . . . . . . . . . . .2**| |**3**|**Ordering information. . . . . . . . . . . . . . . . . . . . . .2**| |**4**|**Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3**| |**5**|**Thermal characteristics . . . . . . . . . . . . . . . . . . .6**| |**6**|**Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .7**| |**7**|**Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10**| |**8**|**Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11**| |**9**|**Legal information. . . . . . . . . . . . . . . . . . . . . . . .12**| |9.1|Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12| |9.2|Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12| |9.3|Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12| |9.4|Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13| |**10**|**Contact information. . . . . . . . . . . . . . . . . . . . . .13**| Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. **© NXP B.V. 2011.** **All rights reserved.** For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com **Date of release: 14 April 2011 Document identifier: BTA208S-800E**
Updated at June 10, 2026
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