BTA10-800CWRG
Triac, 800 V, 10 A, TO-220AB, 1.3 V, 100 A, 35 mA
- Manufacturer: STMICROELECTRONICS
- Product type:
- Peak Repetitive Off-State Voltage, Vdrm:800V; On State RMS Current IT(rms):10A; Triac Case Style:TO-220AB; Gate Trigger Current Max (QI), Igt:35mA; Gate Trigger Voltage Max Vgt:1.3V; Peak Gate
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 3Pins
- Product Range: Snubberless BTA10
- Triac Case Style: TO-220AB
- Thyristor Mounting: Through Hole
- Holding Current Max: 35mA
- On State RMS Current: 10A
- Peak On State Voltage: 1.55V
- Gate Trigger Voltage Max: 1.3V
- Operating Temperature Max: 125°C
- Peak Non Repetitive Surge Current: 100A
- Peak Repetitive Off State Voltage: 800V
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.529 € |
| Current stock | 500+ |
| Lead time | 30 days |
**BTA10, BTB10 T1035, T1050** Datasheet ## 10 A Snubberless™, logic level and standard Triacs **==> picture [132 x 183] intentionally omitted <==** **----- Start of picture text -----**<br> A2<br>G<br>A1<br>A2<br>G G<br>A2 A2<br>A1 A1<br>TO-220AB TO-220AB Ins.<br>A2<br>A2 G<br>A1<br>D²PAK<br>**----- End of picture text -----**<br> ## **Features** - Medium current Triac - Low thermal resistance with clip bonding - Low thermal resistance insulation ceramic for insulated BTA - High commutation (4Q) or very high commutation (3Q, Snubberless™) capability - BTA series UL1557 certified (file ref: 81734) - Packages are RoHS (2002/95/EC) compliant ## **Description** Available either in through-hole or surface mount packages, the BTA10, BTB10 and T10xx Triac series are suitable for general purpose mains power AC switching. They can be used as ON/OFF function in applications such as static relays, heating regulation or induction motor starting circuit. They are also recommended for phase control operations in light dimmers and appliance motors speed controllers. The Snubberless™ versions (W suffix and T10xx) are especially recommended for use on inductive loads, because of their high commutation performance. By using an internal ceramic pad, the Snubberless™ series provide an insulated tab (rated at 2500 VRMS) complying with UL standards (file reference: E81734). ## **Product status link** ~~hs~~ |**Product status link**<br>~~hs~~| |---| |BTA10,BTB10,T1035,T1050| || |**Product summary**<br>~~hs~~| |**IT(RMS)**<br>10 A| |**VDRM/VRRM**<br>600 and 800 V| |**IGT**<br>25 to 50 mA| **DS3165** - **Rev 9** - **March 2019** For further information contact your local STMicroelectronics sales office. www.st.com **BTA10, BTB10, T1035, T1050 Characteristics** **1** ## **Characteristics** **Table 1. Absolute maximum ratings** |**Symbol**|**Parameters**|||**Value**|**Unit**| |---|---|---|---|---|---| |IT(RMS)|RMS on-state current (full sine wave)|TO-220AB|Tc= 105 °C|10|A| |||TO-220AB Ins.|Tc= 95 °C||| |ITSM|Non repetitive surge peak on-state current (full cycle, Tj<br>initial = 25 °C)|F = 50 Hz|tp= 20 ms|100|A| |||F = 60 Hz|tp= 16.7 ms|105|| |I2t|I2t value for fusing|tp= 10 ms||55|A2s| |dl/dt|Critical rate of rise of on-state current<br>IG= 2 x IGT, tr≤ 100 ns|F = 120 Hz|Tj= 125 °C|50|A/µs| |VDSM/VRSM|Non repetitive surge peak off-state voltage|tp= 10 ms|Tj= 25 °C|VDRM/VRRM+<br>100|V| |IGM|Peak gate current|tp= 20 µs|Tj= 125 °C|4|A| |PG(AV)|Average gate power dissipation||Tj= 125 °C|1|W| |Tstg|Storage junction temperature range|||-40 to +150|°C| |Tj|Operating junction temperature range|||-40 to +125|°C| **Table 2. Static electrical characteristics** |**Symbol**|**Test conditions**|**Tj**||**Value**|**Unit**| |---|---|---|---|---|---| |VT(1)|ITM= 14 A, tp= 380 µs|25 °C|Max.|1.55|V| |VTO|threshold on-state voltage|125 °C|Max.|0.85|V| |RD|Dynamic resistance|125 °C|Max.|40|mΩ| |IDRM/IRRM|VDRM= VRRM|25 °C|Max.|5|µA| |||125 °C||1|mA| _1. For both polarities of A2 referenced to A1_ **Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Snubberless™ (3 quadrants)** |**Symbol**|**Parameters**|**Quadrant**||**T1035**|**BTA10-xCW**<br>**BTB10-xCW**|**T1050**<br>**BTA10-xBW**<br>**BTB10-xBW**|**Unit**| |---|---|---|---|---|---|---|---| |IGT|VD= 12 V, RL= 33 Ω|I - II - III|Max.|35||50|mA| |VGT||I - II - III|Max.|1.3|||V| |VGD|VD= VDRM, RL= 3,3 kΩ, Tj= 125 °C|I - II - III|Min.|0.2|||V| |IH|IT= 500 mA|I - II - III|Max.|35||50|mA| |IL|IG= 1.2 IGT|I - III|Max.|50||70|mA| |||II|Max.|80|60|80|| |dV/dt(2)|VD= 67 % VDRMgate open, Tj= 125 °C||Min.|500||1000|V/µs| **DS3165** - **Rev 9** **page 2/12** **BTA10, BTB10, T1035, T1050 Characteristics** |**Symbol**|**Parameters**|**Quadrant**||**T1035**|**BTA10-xCW**<br>**BTB10-xCW**|**T1050**<br>**BTA10-xBW**<br>**BTB10-xBW**|**Unit**| |---|---|---|---|---|---|---|---| |(dI/dt)c(2)|Without snubber, Tj= 125 °C||Min.|5.5||9|A/ms| _1. Minimum IGT is guaranteed at 5 % of IGT max._ _2. For both polarities of A2 referenced to A1_ **Table 4. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - standard Triac (4 quadrants)** |**Sbl**|**Pt**|**Qdt**||**Value**|**Value**|**Uit**| |---|---|---|---|---|---|---| |**ymo**|**arameers**|**uaran**||**C**|**B**|**n**| |IGT(1)|VD= 12 V, RL= 33 Ω|I - II - III|Max.|25|50|mA| |||IV|Max.|50|100|| |VGT||All|Max.|1.3||V| |VGD|VD= VDRM, RL= 3,3 kΩ, Tj= 125 °C|I - II - III|Min.|0.2||V| |IH(2)|IT= 500 mA|I - II - III|Max.|25|50|mA| |IL|IG= 1.2 IGT|I - III|Max.|40|50|mA| |||II|Max.|80|100|| |dV/dt(2)|VD= 67 % VDRMgate open, Tj= 125 °C||Min.|200|400|V/µs| |(dV/dt)c(2)|(dI/dt)c = 4.4 A/ms, Tj= 125 °C||Min.|5|10|V/µs| _1. Minimum IGT is guaranteed at 5 % of IGT max._ _2. For both polarities of A2 referenced to A1_ ## **Table 5. Thermal resistance** |**Symbol**|**Parameters**|**Parameters**|**Value**|**Unit**| |---|---|---|---|---| |Rth(j-c)(typ.)|Junction to case (AC)|TO-220AB / D²PAK|1.5|°C/W| |||TO-220AB insulated|2.4|| |Rth(j-a)(max.)|Junction to ambient (S(1)= 2 cm²)|D²PAK|45|| ||Junction to ambient|TO-220AB / TO-220AB ins|60|| _1. Copper surface under tab._ **DS3165** - **Rev 9** **page 3/12** **BTA10, BTB10, T1035, T1050 Characteristics (curves)** ## **1.1 Characteristics (curves)** **==> picture [513 x 191] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 2. Maximum power dissipation versus on-state Figure 3. RMS on-state current versus case temperature<br>RMS current (full cycle) (full cycle)<br>P(W) IT(RMS) [(A)]<br>13 12<br>12 11<br>11 10 BTB/T10<br>10 9<br>9 8 BTA<br>8<br>7<br>7<br>6<br>6<br>5 5<br>4 4<br>3 3<br>2 2<br>1 IT(RMS)(A) 1 Tc(°C)<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 0 2 5 50 75 100 125<br>**----- End of picture text -----**<br> **==> picture [513 x 191] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 4. Relative variation of thermal impedance versus<br>pulse duration Figure 5. On-state characteristics (maximum values)<br>ITM(A)<br>K = [Zth/Rth] 100<br>Tj = Tj max.<br>1E+0 Tj max.<br>Zth(j-c) Vto = 0.85 V<br>Rd = 40 mΩ<br>Zth(j-a) 10<br>1E-1 Tj = 25 °C<br>VTM(V)<br>1E-2 tp(s) 1<br>0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2<br>**----- End of picture text -----**<br> **==> picture [513 x 206] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 6. Surge peak on-state current versus number of<br>Figure 7. Non repetitive surge peak on-state current<br>cycles<br>versus sinusoidal pulse width (tP < 10 ms)<br>ITSM(A)<br>ITSM(A) 1000<br>110 Tj initial=25°C<br>100<br>90<br>80 Non repetitive t=20ms ITSM<br>70 Tj initial=25°C One cycle dI/dt limitation:50A/µs<br>60 100<br>50<br>40 RepetitiveTC=95°C<br>30<br>20<br>10 Number of cycles tp(ms)<br>0 10<br>1 10 100 1000 0.01 0.10 1.00 10.00<br>**----- End of picture text -----**<br> **DS3165** - **Rev 9** **page 4/12** **BTA10, BTB10, T1035, T1050 Characteristics (curves)** **Figure 8. Relative variation of gate trigger current, holding Figure 9. Relative variation of critical rate of decrease of current and latching current versus junction temperature main current versus (dV/dt)c (typical values) (typical values)** **==> picture [480 x 138] intentionally omitted <==** **----- Start of picture text -----**<br> IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C] (dl/dt)c [(dV/dt)c / specified (dl/dt)c<br>2.5 2.0<br>1.8<br>2.0 C<br>1.6<br>IGT B<br>1.4<br>1.5<br>1.2 BW/CW/T10xx<br>1.0 IH and IL 1.0<br>0.8<br>0.5<br>0.6<br>0.0 Tj (°C) 0.4 (dV/dt)c (V/µs)<br>-40 -20 0 20 40 60 80 100 120 140 0.1 1.0 10.0 100.0<br>**----- End of picture text -----**<br> **==> picture [513 x 204] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 10. Relative variation of critical rate of decrease of Figure 11. D²PAK thermal resistance junction to ambient<br>main current versus junction temperature versus copper surface under tab<br>(dl/dt)c [Tj] / (dl/dt)c [Tj = 125 °C] 80 Rth(j-a) (°C/W)<br>6 D²PAK<br>70 Epoxy printed board FR4, copper thickness = 35 µm<br>5<br>60<br>4 50<br>3 40<br>30<br>2<br>20<br>1<br>Tj(°C) 10 SCu(cm²)<br>0 0<br>0 25 50 75 100 125 0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br> **DS3165** - **Rev 9** **page 5/12** **BTA10, BTB10, T1035, T1050 Package information** **2 Package information** In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. ## **2.1 D²PAK package information** ## **Figure 12. D²PAK package outline** **==> picture [320 x 292] intentionally omitted <==** **----- Start of picture text -----**<br> E A E1<br>c2 E2<br>1 2 3<br>b2<br>e<br>b Max resin gate protrusion: 0.5 mm (1)<br>G<br>A1<br>A2<br>A3<br>R<br>Gauge Plane<br>c<br>V2<br>L2<br>D1<br>D<br>H<br>D2<br>L3<br>L<br>**----- End of picture text -----**<br> (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. **Table 6. D²PAK package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|4.30||4.60|0.1693||0.1811| |A1|2.49||2.69|0.0980||0.1059| |A2|0.03||0.23|0.0012||0.0091| |A3||0.25|||0.0098|| |b|0.70||0.93|0.0276||0.0366| |b2|1.25||1.7|0.0492||0.0669| **DS3165** - **Rev 9** **page 6/12** **BTA10, BTB10, T1035, T1050 D²PAK package information** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |c|0.45||0.60|0.0177||0.0236| |c2|1.21||1.36|0.0476||0.0535| |D|8.95||9.35|0.3524||0.3681| |D1|7.50||8.00|0.2953||0.3150| |D2|1.30||1.70|0.0512||0.0669| |e|2.54|||0.1||| |E|10.00||10.28|0.3937||0.4047| |E1|8.30||8.70|0.3268||0.3425| |E2|6.85||7.25|0.2697||0.2854| |G|4.88||5.28|0.1921||0.2079| |H|15||15.85|0.5906||0.6240| |L|1.78||2.28|0.0701||0.0898| |L2|1.27||1.40|0.0500||0.0551| |L3|1.40||1.75|0.0551||0.0689| |R||0.40|||0.0157|| |V2|0°||8°|0°||8°| _1. Dimensions in inches are given for reference only_ ## **Figure 13. D²PAK recommended footprint (dimensions are in mm)** **==> picture [207 x 125] intentionally omitted <==** **----- Start of picture text -----**<br> 16.90<br>10.30 5.08<br>1.30<br>3.70<br>8.90<br>**----- End of picture text -----**<br> **DS3165** - **Rev 9** **page 7/12** **BTA10, BTB10, T1035, T1050 TO-220AB non ins. and insulated package information** ## **2.2 TO-220AB non ins. and insulated package information** **Figure 14. TO-220AB non ins. and insulated package outline** **==> picture [382 x 395] intentionally omitted <==** **----- Start of picture text -----**<br> B C<br>b2<br>Resin gate 0.5 mm I<br>max. protusion [(1)]<br>L<br>F<br>A<br>I4<br>l3<br>c2<br>a1<br>l2<br>a2<br>M<br>b1 Resin gate 0.5 mm c1<br>max. protusion [(1)]<br>e<br>(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.<br>**----- End of picture text -----**<br> **Table 7. TO-220AB non ins. and insulated package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches1**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|15.20||15.90|0.5984||0.6260| |a1||3.75|||0.1476|| |a2|13.00||14.00|0.5118||0.5512| |B|10.00||10.40|0.3937||0.4094| |b1|0.61||0.88|0.0240||0.0346| |b2|1.23||1.32|0.0484||0.0520| |C|4.40||4.60|0.1732||0.1811| **DS3165** - **Rev 9** **page 8/12** **BTA10, BTB10, T1035, T1050 TO-220AB non ins. and insulated package information** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches1**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |c1|0.49||0.70|0.0193||0.0276| |c2|2.40||2.72|0.0945||0.1071| |e|2.40||2.70|0.0945||0.1063| |F|6.20||6.60|0.2441||0.2598| |I|3.73||3.88|0.1469||0.1528| |L|2.65||2.95|0.1043||0.1161| |I2|1.14||1.70|0.0449||0.0669| |I3|1.14||1.70|0.0449||0.0669| |I4|15.80|16.40|16.80|0.6220|0.6457|0.6614| |M||2.6|||0.1024|| _1. Inch dimensions are for reference only._ **DS3165** - **Rev 9** **page 9/12** **BTA10, BTB10, T1035, T1050 Ordering information** **3** ## **Ordering information** ## **Figure 15. BTA10 and BTB10 series ordering information scheme** **==> picture [206 x 128] intentionally omitted <==** **----- Start of picture text -----**<br> BT A 10 - 600 BW RG<br>Triac<br>Insulation<br>A = Insulated<br>B = Non-insulated<br>Current<br>10 = 10 A<br>Voltage<br>600 = 600 V<br>800 = 800 V<br>Sensitivity and type<br>B = 50 mA standard BW = 50 mA Snubberless™<br>C = 25 mA standard CW = 35 mA Snubberless™<br>Packing mode<br>RG = Tube<br>**----- End of picture text -----**<br> ## **Figure 16. T10xx series ordering information scheme** **==> picture [206 x 134] intentionally omitted <==** **----- Start of picture text -----**<br> T 10 50 - 8 G - TR<br>Triac<br>Current<br>10 = 10 A<br>Sensitivity<br>50 = 50 mA<br>35 = 35 mA<br>Voltage<br>800 V<br>600 V<br>Package<br>G = D²PAK<br>Packing mode<br>(blank) = Tube<br>-TR = Tape and reel<br>**----- End of picture text -----**<br> **Table 8. Ordering information** |**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**| |---|---|---|---|---|---| |BTA10-600BRG|BTA10-600B|TO-220AB Ins.|2.3 g|50|Tube| |BTA10-600CRG|BTA10-600C||||| |BTA10-600BWRG|BTA10-600BW||||| |BTA10-600CWRG|BTA10-600CW||||| |BTA10-800BWRG|BTA10-800BW||||| |BTA10-800CWRG|BTA10-800CW||||| |BTB10-600BWRG|BTB10-600BW|TO-220AB|||| |BTB10-800BWRG|BTB10-800BW||||| |T1035-6G|T1035-6G|D²PAK|1.50 g||| |T1050-8G|T1050-8G||||| |T1035-6G-TR|T1035-6G|||1000|Tape and reel 13"| |T1050-8G-TR|T1050-8G||||| **DS3165** - **Rev 9** **page 10/12** **BTA10, BTB10, T1035, T1050** ## **Revision history** **Table 9. Document revision history** |**Date**|**Revision**|**Changes**| |---|---|---| |Sep-2002|5A|Last update.| |13-Feb-2006|6|TO-220AB delivery mode changed from bulk to tube. ECOPACK statement<br>added.| |06-Feb-2017|7|Added D²PAK package information.| |15-Mar-2018|8|Updated Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise<br>specified) - Snubberless™ (3 quadrants), Section 3 Ordering information and<br>Section 2.1 D²PAK package information.<br>Added RPNs T1035 and T1050.| |01-Mar-2019|9|Updated Links syntax.| **DS3165** - **Rev 9** **page 11/12** **BTA10, BTB10, T1035, T1050** ## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved **DS3165** - **Rev 9** **page 12/12**
Updated at June 10, 2026
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