BSS138TA

**A Product Line of** Diodes Incorporated 

**BSS138** || 

## **50V N-CHANNEL ENHANCEMENT MODE VERTICAL DMOS FET IN SOT23** 

## **Features and Benefits** 

- BVDSS > 50V 

- RDS(on) ≤ 3.5Ω @ VGS= 5V 

- Maximum continuous drain current ID = 200mA 

- **“Lead Free”, RoHS Compliant (Note 1)** 

- **Halogen and Antimony Free. "Green" Device (Note 2)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Mechanical Data** 

- Case: SOT-23 

- Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminals: Matt Tin Finish; Solderable per MIL-STD-202, Method 208 

- Weight: 0.008 grams (approximate) 

SOT-23 

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D<br>D)<br>G<br>&<br>S<br>Pin-Out<br>Device symbol<br>Top View<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 3) 

|**Part Number**|**Marking**|**Reel size (inches)**|**Tape width (mm)**|**Quantity per reel**|
|---|---|---|---|---|
|BSS138TA|SS|7|8|3000|



Notes: 1. No purposefully added lead 

2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com. 

3. For packaging details, go to our website at http://www.diodes.com. 

## **Marking Information** 

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SS = Product Type Marking Code<br>**----- End of picture text -----**<br>


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BSS138 Document number: DS35479 Rev. 4 - 2 

August 2011 © Diodes Incorporated 

**A Product Line of** Diodes Incorporated 

**BSS138** PT 

|**Maximum Ratings** @TA= 25°C unless otherwise specified|= 25°C unless otherwise specified|||
|---|---|---|---|
|**Characteristic **|**Symbol **|**Value **|**Unit **|
|Drain-Source Voltage|VDSS|50|V|
|Gate-Source Voltage|VGSS|±20|V|
|Continuous Drain Current|ID|200|mA|
|Pulsed Drain Current(Note 5)|IDM|800|mA|



**Thermal Characteristics** @TA = 25°C unless otherwise specified 

|**Thermal Characteristics**@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Thermal Characteristics**@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|||
|---|---|---|---|---|
|**Characteristic**||**Symbol **|**Value**|**Unit**|
|Power Dissipation|(Note 4)|PD|350|mW|
|Thermal Resistance, Junction to Ambient|(Note 4)|RθJA|357|°C/W|
|Thermal Resistance, Junction to Leads|(Note 6)|RθJL|195|°C/W|
|Operatingand Storage Temperature Range||TJ, TSTG|-55 to +150|°C|



Notes: 4. For a device mounted on 25mm X 25mm X 1.6mm FR-4 PCV with high coverage of single sided 1oz copper, in still air condition. 5. Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%. 

6. Thermal resistance from junction to solder-point (at the end of the collector lead). 

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BSS138 Document number: DS35479 Rev. 4 - 2 

August 2011 © Diodes Incorporated 

**A Product Line of** Diodes Incorporated 

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BSS138<br>**----- End of picture text -----**<br>


## **Thermal Characteristics** 

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BSS138 Document number: DS35479 Rev. 4 - 2 

August 2011 © Diodes Incorporated 

**A Product Line of** Diodes Incorporated ~~|ZETEX~~ **BSS138** ~~—~~ 

**Electrical Characteristics** @TA = 25°C unless otherwise specified 

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|||||||||
|---|---|---|---|---|---|---|---|
|Characteristic|Symbol|Min|Typ|Max|Unit|Test|Condition|
|OFF CHARACTERISTICS|
|Drain-Source Breakdown Voltage|BVDSS|50|-|-|V|VGS = 0V, ID = 0.25mA|
|0.5|µA|VDS = 50V, VGS = 0V|
|Zero Gate Voltage Drain Current|IDSS|-|-|5|µA|VDS = 50V, VGS = 0V, TA = 125°C|
|100|nA|VDS = 20V, VGS = 0V|
|ttf|Gate-Source Leakage|IGSS|-|-|±100|nA|VGS = ±20V, VDS = 0V|
|ON CHARACTERISTICS|
|Gate Threshold Voltage|VGS(th)|0.5|-|1.5|V|VDS = VGS, ID = 1mA|
|Static Drain-Source On-Resistance (Note 7)|RDS (on)|-|-|3.5|Ω|VGS = 5V, ID = 200mA|
|Forward Transconductance (Note 7 & 8)|gfs|120|-|-|mS  VDS = 25V, ID = 200mA|
|DYNAMIC CHARACTERISTICS (Note 8)|
|Input Capacitance|Ciss|-|-|50|pF|
|Output Capacitance|Coss|-|-|25|pF|VDS = 25V, VGS = 0V,|
|f = 1.0MHz|
|Reverse Transfer Capacitance|Crss|-|-|8|pF|
|Turn-On Delay Time (Note 9)|tD(on)|-|10|-|ns|
|Turn-On Rise Time (Note 9)|tr|-|10|-|ns|
|VDD = 30V, ID|= 280mA|
|Turn-Off Delay Time (Note 9)|tD(off)|-|15|-|ns|
|Turn-Off Fall Time (Note 9)|tf|-|25|-|ns|

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**Notes:** 7. Measured under pulsed conditions. Width = 300µs. Duty cycle ≤ 2%. 

8. Sample test. 

9. Switching times measured with 50Ω source impedance and <5ns rise time on a pulse generator. 

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BSS138 Document number: DS35479 Rev. 4 - 2 

August 2011 © Diodes Incorporated 

**A Product Line of** Diodes Incorporated 

**BSS138** 

## **Electrical Characteristics** 

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BSS138 Document number: DS35479 Rev. 4 - 2 

August 2011 © Diodes Incorporated 

**A Product Line of** Diodes Incorporated 

**BSS138** 

## **Electrical Characteristics – (Continuous)** 

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BSS138 Document number: DS35479 Rev. 4 - 2 

August 2011 © Diodes Incorporated 

**A Product Line of** Diodes Incorporated **BSS138** | ~~[|]~~ 

## **Package Outline Dimensions** 

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A<br>SOT23<br>Dim  Min  Max  Typ<br>A  0.37  0.51  0.40<br>B C ==== B  1.20 1.40 1.30<br>C 2.30 2.50 2.40<br>D  0.89 1.03 0.915<br>F  0.45  0.60  0.535<br>=== H G  1.78  2.05  1.83<br>H  2.80 3.00 2.90<br>K K1 M J 0.013 0.10 0.05<br>K  0.903 1.10 1.00<br>D<br>J F G L K1  -  -  0.400<br>L  0.45  0.61  0.55<br>M  0.085 0.18 0.11<br>α 0°  8°  -<br>All Dimensions in mm<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

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Y<br>“ae<br>Z<br>C<br>X E<br>Rab<br>**----- End of picture text -----**<br>


|**Dimensions**<br>**Z**<br>**X**<br>**Y**<br>**C**<br>**E**|**Value (in mm)**|
|---|---|
||2.9|
||0.8|
||0.9|
||2.0|
||1.35|



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BSS138 Document number: DS35479 Rev. 4 - 2 

August 2011 © Diodes Incorporated 

**A Product Line of** Diodes Incorporated ~~ZETEX~~ **BSS138** ~~—~~ 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

|A.   Life support devices or systems are devices or systems which:|A.   Life support devices or systems are devices or systems which:|
|---|---|
||1. are intended to implant into the body, or|
||2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the|
||labeling can be reasonably expected to result in significant injury to the user.|
|B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the|B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the|
|failure of the life support device or to affect its safety or effectiveness.|failure of the life support device or to affect its safety or effectiveness.|



Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated **www.diodes.com** 

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BSS138 Document number: DS35479 Rev. 4 - 2 

August 2011 © Diodes Incorporated