BSL308CH6327XTSA1
Dual MOSFET, Complementary N and P Channel, 30 V, 30 V, 2.3 A, 2.3 A, 0.044 ohm
- Manufacturer: INFINEON
- Product type: Dual MOSFETs
- Transistor Polarity:N and P Complement; Continuous Drain Current Id:2.3A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.044ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs
- MSL: MSL 1 - Unlimited
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 6Pins
- Channel Type: Complementary N and P Channel
- Product Range: -
- Qualification: AEC-Q101
- Transistor Case Style: TSOP
- Operating Temperature Max: 150°C
- Power Dissipation N Channel: 500mW
- Power Dissipation P Channel: 500mW
- Drain Source Voltage Vds N Channel: 30V
- Drain Source Voltage Vds P Channel: 30V
- Continuous Drain Current Id N Channel: 2.3A
- Continuous Drain Current Id P Channel: 2.3A
- Drain Source On State Resistance N Channel: 0.044ohm
- Drain Source On State Resistance P Channel: 0.044ohm
| Delivery and price | |
|---|---|
| Units per pack | 1500 |
| Price | 0.201 € |
| Current stock | 1000+ |
| Lead time | 30 days |
**BSL308C**
## **OptiMOS™ P3 + Optimos™ 2 Small Signal Transistor**
|**OptiMOS™ P3 + Optimos™ 2 Small Signal Transistor**|**OptiMOS™ P3 + Optimos™ 2 Small Signal Transistor**|**OptiMOS™ P3 + Optimos™ 2 Small Signal Transistor**|**OptiMOS™ P3 + Optimos™ 2 Small Signal Transistor**|**OptiMOS™ P3 + Optimos™ 2 Small Signal Transistor**|
|---|---|---|---|---|
|**Product Summary**|||||
||||||
|||**P**|**N**||
||||||
|_V_DS||-30|30|V|
||_V_GS=±10 V||||
|_R_DS(on),max||80|57|mW|
||_V_GS=±4.5 V||||
|||130|93||
||||||
|_I_D||-2.0|2.3|A|
## **Features**
- Complementary P + N channel
- · Enhancement mode · Logic level (4.5V rated)
- · Avalanche rated
- Qualified according to AEC Q101
- 100% Lead-free; RoHS compliant
**==> picture [439 x 96] intentionally omitted <==**
**----- Start of picture text -----**<br>
PG-TSOP-6<br>·<br> Halogen free according to IEC61249-2-21<br>6<br>5<br>4<br>3 1<br>2<br>3<br>**----- End of picture text -----**<br>
|Kegs*|*S/&|**3**<br>&Halogen-Free<br>:|2|2<br>3||
|---|---|---|---|---|---|
|||**Tape and Reel Information**||||
|**Type**|**Package**||**Marking**|**Lead Free**|**Packing**|
|||H6327: 3000 pcs / reel||||
|BSL308C|PG-TSOP6||sPS|Yes|Non dry|
|**Parameter**|**Symbol **<br>~~_ |~~<br>~~EES~~|**Conditions**<br>~~|-{—~~<br>~~EES~~|**Value**<br>~~Po~~<br>~~-{—~~|**Value**<br>~~Po~~<br>~~-{—~~|**Unit**<br>~~Po~~<br>~~-{—~~|
|---|---|---|---|---|---|
||||**P**<br>~~Po~~<br>~~-{—~~<br>~~EES~~|**N**<br>~~Po~~<br>~~-{—~~<br>~~EES~~||
|Continuous drain current|_I_D<br>~~|~~<br>~~EES~~|_T_A=25 °C<br>~~|~~<br>~~EES~~|-2.0<br><br>~~EES~~|2.3<br><br>~~EES~~|A<br><br>~~ee~~<br>~~re~~|
|||_T_A=70 °C<br>~~EES~~<br>~~ee~~|-1.6<br>~~EES~~<br>~~ee~~<br>~~ee~~|1.8<br>~~EES~~<br>~~ee~~||
|Pulsed drain current|_I_D,pulse<br>~~EES~~<br>~~re~~|_T_A=25 °C<br>~~EES~~<br>~~re~~|-8.0<br>~~EES~~<br>~~re~~<br>~~ee~~|9<br>~~EES~~<br>~~re~~||
|Avalanche energy, single pulse|_E_AS|P:_I_D=-2.0 A,<br>N:_I_D=2.3 A,<br>_R_GS=25W|10.7<br>~~ee~~|10.8|mJ|
|Gate source voltage|_V_GS<br>~~ee~~<br>~~es~~|~~ee~~<br>~~es~~|±20<br>~~ee~~<br>~~ee~~||V<br>~~ee~~<br>~~ee~~|
|Power dissipation2)|_P_tot<br>~~es~~|_T_A=25 °C<br>~~es~~|0.5<br>~~ee~~||W<br>~~ee~~|
|Operating and storage temperature|_T_j,_T_stg<br>~~es~~<br>~~ee~~<br>~~es~~|~~es~~<br>~~ee~~<br>~~es~~|-55 ... 150<br>~~ee~~<br>~~ee~~<br>~~ee~~||°C<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|ESD class|~~es~~|JESD22-A114-HBM<br>~~es~~|class 0 (<250V)<br>~~ee~~||~~ee~~|
|Soldering temperature|_T_solder<br>~~es~~<br>~~ee~~|~~es~~<br>~~ee~~|260<br>~~ee~~<br>~~ee~~||°C<br>~~ee~~<br>~~ee~~|
|IEC climatic category; DIN IEC 68-1|~~a ~~|~~a~~|55/150/56<br>~~ee~~||~~ee~~|
1) Remark: only one of both transistors active
Rev.2.1
page 1
2013-11-07
|**Static characteristics**||||||||
|---|---|---|---|---|---|---|---|
|Drain-source breakdown voltage|P<br>~~ee~~|_V_(BR)DSS <br>~~ee~~|_V_GS=0 V,_I_D=-250 µA<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|-30<br>~~ee~~|V<br>~~fe~~|
||N<br>~~ee~~|~~ee~~|_V_GS=0 V,_I_D=250 µA<br>~~ee~~|30<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~||
|Gate threshold voltage|P<br>~~{|~~|_V_GS(th)<br>~~{||__|~~<br>|_V_DS=_V_GS,_I_D=-11µA<br>~~|__|~~|-2<br>~~|__|~~|-1.5<br>~~}—~~|-1<br>~~}—~~||
||N<br>~~{|~~<br>~~ee ~~||_V_DS=_V_GS,_I_D=11 µA<br>~~|__|~~<br> ~~ee~~|1.2<br>~~|__|~~<br>~~ee~~<br>~~|~~|1.6<br>~~}—~~<br>~~ee~~<br>~~|fe~~|2<br>~~}—~~<br>~~ee~~<br>~~fe~~||
|Zero gate voltage drain current|P<br>~~{|~~<br>~~| ~~|_I_DSS<br>~~{| |__|~~<br> <br>~~ee~~<br>~~ee~~|_V_DS=-30 V,_V_GS=0 V,<br>_T_j=25 °C<br>~~|__|~~<br> ~~if]~~|-<br>~~|__| ~~<br>~~if]~~<br>~~|~~|-<br> ~~}—~~<br>~~if]~~<br>~~|fe~~|-1<br>~~}—~~<br>~~if]~~<br>~~fe~~|µA<br>~~fe~~|
||N<br>~~ee~~||_V_DS=30 V,_V_GS=0 V,<br>_T_j=25 °C<br>~~ee~~|-<br>~~|~~<br>~~ee~~|-<br>~~| fe~~<br>~~ee~~|1<br>~~fe~~<br>~~ee~~||
||P<br>~~ee~~<br>~~a~~||_V_DS=-30 V,_V_GS=0 V,<br>_T_j=150 °C<br>~~ee ~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-100<br>~~ee~~||
||N<br>~~a~~||_V_DS=30 V,_V_GS=0 V,<br>_T_j=150 °C<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|100<br>~~ee~~||
|Gate-source leakage current|P<br>~~a~~<br>~~a~~|_I_GSS<br>~~fT~~|_V_GS=±20 V,_V_DS=0 V<br>~~ee~~<br>~~fT~~|-<br>~~ee ~~<br>~~fT~~|-<br> ~~ee~~<br>~~fT~~|±100<br>~~ee~~<br>~~fT~~|nA|
||N<br>~~a~~|||||||
|Drain-source on-state<br>resistance|P<br>~~PoE~~|_R_DS(on)<br>~~PoE~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|_V_GS=-4.5 V,<br>_I_D=-1.7 A<br>~~PoE~~|-<br>~~PoE~~<br>~~ee~~|88<br>~~PoE~~<br>~~ee~~|130<br>~~PoE~~|mW|
||N<br>~~ee~~||_V_GS=4.5 V,_I_D=1.85 A<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|67<br>~~ee~~<br>~~ee~~|93<br>~~ee~~||
||P<br>~~ee~~||_V_GS=-10 V,<br>_I_D=-2.0 A<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~|62<br> ~~ee~~<br>~~ee~~|80<br>~~ee~~||
||N<br>~~ee~~||_V_GS=10 V,_I_D=2.3 A<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|44<br>~~ee~~|57<br>~~ee~~||
|Transconductance|P<br>~~fp~~<br>~~ie~~|_g_fs<br>~~fp~~||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=-1.6 A<br>~~fp~~<br>~~ee~~|-<br>~~|~~<br>~~ee~~|4.6<br>~~ee~~|-<br>~~ee~~|S|
||N<br>~~fp~~<br>~~ie~~|||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=1.8 A<br>~~fp~~<br>~~ee~~|-<br>~~|~~<br>~~ee~~|5<br>~~ee~~|-<br>~~ee~~||
> 2) Performed on 40mm2 FR4 PCB. The traces are 1mm wide, 70 μ m thick and 20mm long; they are present on both sides of the PCB
Rev.2.1
page 2
2013-11-07
|cinfineon||||||
|---|---|---|---|---|---|
|cinfineon||||**BSL308C**||
|||||||
|**Parameter**||**Symbol **|**Conditions**|**Values**|**Unit**|
|||||**min.**<br>**typ.**<br>**max.**||
|**Dynamic characteristics**||||||
|Input capacitance<br>Output capacitance<br>Reverse transfer capacitance<br>Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time|P<br>_C_iss<br>N<br>P<br>_C_oss<br>N<br>P<br>Crss<br>N<br>P<br>_t_d(on)<br>N<br>P<br>_t_r<br>N<br>P<br>_t_d(off)<br>N<br>P<br>_t_f<br>N<br>~~a~~<br>~~-~~<br>~~fp~~<br>~~4~~<br>~~a~~<br>~~yf~~<br>~~a~~<br>~~yf~~<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~<br>~~a~~||_V_GS=0 V,<br>P:_V_DS=-15 V,<br>N:_V_DS= 15 V,<br>_f_=1 MHz<br>P:_V_DD=-15 V,<br>_V_GS=-10 V,_R_G=6W,<br>_I_D=-2 A<br>N:_V_DD=15 V,<br>_V_GS=10 V,_R_G=6W,<br>_I_D=2.3 A|-<br>376<br>500<br>-<br>207<br>275<br>-<br>196<br>261<br>-<br>75<br>100<br>-<br>12<br>18<br>-<br>12<br>17<br>-<br>5.6<br>-<br>-<br>4.4<br>-<br>-<br>7.7<br>-<br>-<br>2.3<br>-<br>-<br>15.3<br>-<br>-<br>8.3<br>-<br>-<br>2.8<br>-<br>-<br>1.4<br>-<br>=-2 A<br>=15 V,<br>~~[| fo~~<br>~~T=~~<br>~~[| |~~<br>~~**[**| ft~~<br>~~|~~<br>~~|~~<br>~~**[**| ft~~<br>~~|~~<br>~~**|**~~<br>~~**[**|~~<br>~~|~~<br>~~|~~<br>~~[|~~<br>~~|~~<br>~~[|~~<br>~~|~~<br>~~[|~~<br>~~ft~~<br>~~[|~~<br>~~|~~|pF<br>ns|
|Gate Charge Characteristics||||||
|Gate to source charge|P|_Q_gs||-<br>-1.2<br>-|nC|
|Gate to drain charge||_Q_gd|_V_DD=-15 V,|-<br>-0.6<br>-||
||||_I_D=-2 A,_V_GS=0 to|||
|Switching charge||_Q_g|-10 V|-<br>-5.0<br>-||
|Gate plateau voltage||_V_plateau||-<br>-3.1<br>-||
|Gate to source charge|N|_Q_gs||-<br>0.65<br>-||
|Gate to drain charge||_Q_gd|_V_DD=15 V,<br>_I_D=2.3 A,|-<br>0.45<br>-||
|Switching charge||_Q_g|_V_GS=0 to 10 V|1.5<br>-||
|Gate plateau voltage||_V_plateau||3.1<br>-||
Rev.2.1
page 3
2013-11-07
||Cinfineon||
|---|---|---|
||Cinfineon|**BSL308C**|
|**Parameter**<br>~~ee~~||**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|
||**Reverse Diode**||
||Diode continuous forward current|P<br>_I_S<br>-<br>-<br>-0.4<br>A|
||Diode pulse current<br>Diode forward voltage<br>Reverse recovery time<br>Reverse recovery charge|N<br>-<br>-<br>0.5<br>P<br>_I_S,pulse<br>-<br>-<br>-8.4<br>N<br>-<br>-<br>9<br>P<br>_V_SD<br>_V_GS=0 V,_I_F=-2 A,<br>_T_j=25 °C<br>-<br>-0.8<br>-1.1<br>V<br>N<br>_V_GS=0 V,_I_F=2.3 A,<br>_T_j=25 °C<br>-<br>0.83<br>1.1<br>P<br>_t_rr<br>-<br>14<br>-<br>ns<br>_Q_rr<br>-<br>-5.9<br>-<br>nC<br>N<br>_t_rr<br>-<br>14.4<br>-<br>ns<br>_Q_rr<br>-<br>2.9<br>-<br>nC<br>_V_R=-15 V,_I_F=-2A,<br>d_i_F/d_t_=-100 A/µs<br>_V_R=15 V,_I_F=2.3A<br>d_i_F/d_t_=100 A/µs<br>_T_C=25 °C<br>~~a~~<br>~~|~~<br>~~|~~<br>~~4~~<br>~~|~~<br>~~|~~<br>~~a~~<br>~~|~~<br>~~|~~<br>~~eee~~<br>~~Pfft~~<br>~~|~~<br>~~ED EEE~~<br>~~ee~~|
|Rev.2.1|Rev.2.1|page 4<br>2013-11-07|
Rev.2.1
2013-11-07
**BSL308C**
## **1 Power dissipation (P)**
_P_ tot=f( _T_ A)
## **2 Power dissipation (N)**
_P_ tot=f( _T_ A)
**==> picture [467 x 267] intentionally omitted <==**
**----- Start of picture text -----**<br>
0.6 0.6<br>0.5 0.5<br>0.4 0.4<br>0.3 0.3<br>0.2 0.2<br>0.1 0.1<br>0 0<br>0 40 80 120 160 0 40 80 120 160<br>T A [°C] T A [°C]<br> [W] [W]<br>tot tot<br>P P<br>**----- End of picture text -----**<br>
## **3 Drain current (P)**
_I_ D=f( _T_ A) parameter: _V_ GS≤-10 V
## **4 Drain current (N)**
_I_ D=f( _T_ A) parameter: _V_ GS≥10 V
**==> picture [467 x 267] intentionally omitted <==**
**----- Start of picture text -----**<br>
2.4 2.4<br>2.2 2.2<br>2 2<br>1.8 1.8<br>1.6 1.6<br>1.4 1.4<br>1.2 1.2<br>1 1<br>\<br>0.8 A 0.8<br>0.6 0.6<br>0.4 0.4<br>0.2 0.2<br>“\|<br>0 0<br>0 40 80 120 160 0 40 80 120 160<br>T A [°C] T A [°C]<br> [A] -I D [A] I D<br>**----- End of picture text -----**<br>
Rev.2.1
2013-11-07
page 5
**BSL308C**
## **5 Safe operating area (P)**
_I_ D=f( _V_ DS); _T_ A=25 °C; _D_ =0
parameter: _t_ p
## **6 Safe operating area (N)**
_I_ D=f( _V_ DS); _T_ A=25 °C; _D_ =0
parameter: _t_ p
**==> picture [466 x 267] intentionally omitted <==**
**----- Start of picture text -----**<br>
10 [1 ] 10 [1 ]<br>1 µs 1 µs<br>10 µs 100 µs 10 µs<br>100 µs 1 ms<br>10 ms<br>1 ms<br>10 [0 ] 10 [0 ]<br>10 ms<br>DC<br>10 [-1 ] DC 10 [-1 ]<br>10 [-2 ] 10 [-2 ]<br>10 [-3 ] 10 [-3 ]<br>10 [-4 ] 10 [-4 ]<br>10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ] 10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ]<br>V DS [V] V DS [V]<br> [A] I D [A] I D<br>**----- End of picture text -----**<br>
## **7 Max. transient thermal impedance (P)**
_Z_ thJA=f( _t_ p)
parameter: _D_ = _t_ p/ _T_
**8 Max. transient thermal impedance (N)**
_Z_ thJA=f( _t_ p)
parameter: _D_ = _t_ p/ _T_
**==> picture [466 x 268] intentionally omitted <==**
**----- Start of picture text -----**<br>
10 [3 ] 10 [3 ]<br>0.5 0.5<br>10 [2 ] 10 [2 ]<br>0.2 0.2<br>0.1<br>0.1<br>0.05<br>0.02<br>0.05<br>10 [1 ] 10 [1 ]<br>0.02 0.01<br>0.01 single pulse<br>single pulse<br>10 [0 ] 10 [0 ]<br>10 [-5 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ]<br>t p [s] t p [s]<br> [K/W] [K/W]<br>thJA thJA<br>Z Z<br>**----- End of picture text -----**<br>
Rev.2.1
page 6
2013-11-07
**BSL308C**
## **9 Typ. output characteristics (P)**
_I_ D=f( _V_ DS); _T_ j=25 °C
parameter: _V_ GS
## **10 Typ. output characteristics (N)**
_I_ D=f( _V_ DS); _T_ j=25 °C
parameter: _V_ GS
**==> picture [464 x 609] intentionally omitted <==**
**----- Start of picture text -----**<br>
6 6<br>-10 V<br>4.5 V<br>5 -4.5 V 5<br>10 V 4 V<br>3.5 V<br>-4 V -3.5 V<br>4 4<br>-3.3 V<br>3.3 V<br>3 3<br>2 2<br>-3 V 3 V<br>1 1<br>-2.8 V 2.8 V<br>0 0<br>0 1 2 3 0 1 2 3<br>-V DS [V] V DS [V]<br>11 Typ. drain-source on resistance (P) 12 Typ. drain-source on resistance (N)<br> DS(on)=f(=f( I D); ); T j=25 °C=25 °C R DS(on)=f( I D); T j=25 °C<br>parameter: V GS parameter: V GS<br>200 200<br>3.5 V 3 V<br>3.3 V<br>175 175<br>3.3 V<br>150 150<br>3.5 V<br>125 125<br>4 V<br>100 100<br>4.5 V<br>5 V 4 V<br>75 75<br>4.5 V<br>10 V 5 V<br>50 50<br>10 V<br>25 25<br>0 0<br>0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 8<br>I D [A] I D [A]<br> [A] -I D [A] I D<br>] ]<br>W W<br> [m [m<br>DS(on) DS(on)<br>R R<br>**----- End of picture text -----**<br>
## **11 Typ. drain-source on resistance (P)**
_R_ DS(on)=f(=f( _I_ D); ); _T_ j=25 °C=25 °C parameter: _V_ GS
Rev.2.1
2013-11-07
page 7
**BSL308C**
## **13 Typ. transfer characteristics (P)**
_I_ D=f( _V_ GS); | _V_ DS |>2 | ID| RDS(on)max parameter: _T_ j
## **14 Typ. transfer characteristics (N)**
_I_ D=f( _V_ GS); _|V DS |>2 | I D | R DS(on)max_ parameter: _T_ j
**==> picture [467 x 611] intentionally omitted <==**
**----- Start of picture text -----**<br>
5 5<br>4 | 4<br>3 2 | | 25 °C 3 2 |<br>150 °C<br>150 °C<br>25 °C<br>1 | 1 |<br>0 0<br>0 1 DD 2 3 4 5 0 1 J} 2 3 4 5<br>-V GS [V] V GS [V]<br>15 Drain-source on-state resistance (P) 16 Drain-source on-state resistance (N)<br> DS(on)=f(=f( T j); ); I D=-2.0 A; =-2.0 A; V GS=-10 V=-10 V R DS(on)=f( T j); I D=2.3 A; V GS=10 V<br>120 120<br>98%<br>80 80<br>2%<br>98%<br>2%<br>40 40<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C] T j [°C]<br> [A] [A]<br>-I D I D<br>] ]<br>W W<br>[m [m<br>DS(on) DS(on)<br>R R<br>**----- End of picture text -----**<br>
## **15 Drain-source on-state resistance (P)**
_R_ DS(on)=f(=f( _T_ j); ); _I_ D=-2.0 A; =-2.0 A; _V_ GS=-10 V=-10 V
Rev.2.1
page 8
2013-11-07
**BSL308C**
## **17 Typ. gate threshold voltage (P)**
_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=-11 µA
## **18 Typ. gate threshold voltage (N)**
_V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=11 µA
**==> picture [467 x 609] intentionally omitted <==**
**----- Start of picture text -----**<br>
2.8 2.8<br>2.4 2.4<br>max<br>2 2<br>max<br>1.6 1.6<br>typ<br>typ<br>1.2 1.2<br>min<br>min<br>0.8 0.8<br>0.4 0.4<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C] T j [°C]<br>19 Typ. capacitances (P) 20 Typ. capacitances (N)<br> =f( V DS); ); V GS=0 V; =0 V; f =1 MHz C =f( V DS); V GS=0 V; f =1 MHz<br>10 [3 ] 10 [3 ]<br>Ciss<br>Ciss<br>Coss<br>10 [2 ] 10 [2 ]<br>Coss<br>=<br>10 [1 ] Crss 10 [1 ] Crss<br>m d fe] aeee e<br>10 [0 ]<br>0 10 20 30 0 10 20 30<br>-V DS [V] V DS [V]<br> [V] [V]<br>GS(th) GS(th)<br>-V V<br> [pF] [pF]<br>C C<br>**----- End of picture text -----**<br>
## **19 Typ. capacitances (P)**
_C_ =f( _V_ DS); ); _V_ GS=0 V; =0 V; _f_ =1 MHz
Rev.2.1
page 9
2013-11-07
**BSL308C**
## **21 Forward characteristics of reverse diode (P)**
_I_ F=f( _V_ SD) parameter: _T_ j
**22 Forward characteristics of reverse diode (N)**
_I_ F=f( _V_ SD)
parameter: _T_ j
**==> picture [466 x 610] intentionally omitted <==**
**----- Start of picture text -----**<br>
10 [1 ] 10 [1 ]<br>25 °C<br>10 [0 ] 150 °C, 98% 10 [0 ]<br>150 °C 150 °C<br>25 °C<br> 150°C, 98%<br>10 [-1 ] 10 [-1 ]<br>25 °C, 98% 25 °C, 98%<br>a n ak<br>10 [-2 ] 10 [-2 ]<br>0 0.5 1 1.5 0 0.5 1 1.5<br>-V SD [V] V SD [V]<br>23 Avalanche characteristics (P) 24 Avalanche characteristics (N)<br>=f( t AV); ); R GS=25 W=25 WW I AS=f( t AV); R GS=25 W<br>parameter: T j(start) parameter: T j(start)<br>10 [1 ] 10 [1 ]<br>25 °C<br>25 °C<br>100 °C<br>100 °C<br>10 [0 ] 125 °C 10 [0 ] 125 °C<br>10 [-1 ] 10 [-1 ]<br>10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ] 10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ]<br>t AV [µs] t AV [µs]<br> [A] -I F [A] I F<br> [A] [A]<br>-I AV I AV<br>**----- End of picture text -----**<br>
## **23 Avalanche characteristics (P)**
_I_ AS=f( _t_ AV); ); _R_ GS=25 W=25 WW parameter: _T_ j(start)
Rev.2.1
page 10
2013-11-07
**BSL308C**
## **25 Typ. gate charge (P)**
## _V_ GS=f( _Q_ gate); _I_ D=-2.0 A pulsed
parameter: _V_ DD
**==> picture [224 x 268] intentionally omitted <==**
**----- Start of picture text -----**<br>
10<br>8<br>-24 V<br>6 VA<br>-15 V<br>-6 V<br>4<br>UY<br>2<br>0 /<br>0 1 2 3 4 5 6<br>-Q gate [nC]<br> [V]<br>GS<br>-V<br>**----- End of picture text -----**<br>
## **27 Drain-source breakdown voltage (P)**
_V_ BR(DSS)=f( _T_ j); _I_ D=-250 µA
**==> picture [228 x 268] intentionally omitted <==**
**----- Start of picture text -----**<br>
36<br>34<br>32<br>30<br>28<br>26<br>24<br>-60 -20 20 60 100 140 180<br>T j [°C]<br> [V]<br>BR(DSS)<br>-V<br>**----- End of picture text -----**<br>
## **26 Typ. gate charge (N)**
_V_ GS=f( _Q_ gate); _I_ D=2.3 A pulsed
parameter: _V_ DD
**==> picture [224 x 267] intentionally omitted <==**
**----- Start of picture text -----**<br>
10<br>8<br>15 V<br>A<br>6<br>6 V<br>24 V<br>4<br>/<br>2<br>[<br>0<br>0 1 2 3 4 5 6<br>Q gate [nC]<br> [V]<br>GS<br>V<br>**----- End of picture text -----**<br>
**28 Drain-source breakdown voltage (N)** _V_ BR(DSS)=f( _T_ j); _I_ D=250 µA
**==> picture [227 x 267] intentionally omitted <==**
**----- Start of picture text -----**<br>
36<br>34<br>32<br>30<br>28<br>26<br>24<br>-60 -20 20 60 100 140 180<br>T j [°C]<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>
Rev.2.1
page 11
2013-11-07
**BSL308C**
## **TSOP-6**
## **Package Outline:**
## **Footprint:**
## **Packaging:**
Dimensions in mm
Rev.2.1
page 12
2013-11-07
**BSL308C**
**Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved.**
## **Legal Disclaimer**
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.
## **Information**
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).
## **Warnings**
Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Rev.2.1
page 13
2013-11-07
Updated at June 9, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →