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BSG0813NDIATMA1
Dual MOSFET, Dual N Channel, 25 V, 50 A, 2400 µohm
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- Manufacturer: INFINEON
- Product type: Dual MOSFETs
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.745 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**BSG0813NDI** ## **Power Block** ## **Product Summary** **==> picture [474 x 187] intentionally omitted <==** **----- Start of picture text -----**<br> Q1 Q2<br>Features<br>• Dual asymmetric N-channel OptiMOS™5 MOSFET V DS 25 25 V<br>• Logic level (4.5V rated) R DS(on),max V GS=10 V 3 1.2 mW<br>• Optimized for high performance buck converters V GS=4.5 V 4 1.7<br>• Pb-free lead plating; RoHS compliant I D 50 50 A<br>• Qualified according to JEDEC [1)] for target applications S1/D2 (VPhase) (5) Q1 (9) (4) D1 (Vin)<br>S1/D2 (VPhase) e (6) e: (3) D1 (Vin)<br>AS ah Le<br>• Halogen-free according to IEC61249-2-21 S1/D2 (VPhase) (7) (2) S1 (VPhase)<br>Q2<br>• Monolithic integrated Schottky like diode G2 (GLS) | Pe (8) | (10) Gt) S2 (GND) pt |_| (1) O G1 (GHS)<br>Top view<br>**----- End of picture text -----**<br> **Type Package Marking** BSG0813NDI PG-TISON8-4 0813NDI ~~$+~~ ## **Maximum ratings,** at Tj=25°C, unless otherwise specified[2)] |**Maximum ratings,**at Tj=25°C, unless otherwise specified|at Tj=25°C, unless otherwise specified|at Tj=25°C, unless otherwise specified[2)]|Bottom<br>View|Bottom<br>View|| |---|---|---|---|---|---| |**Parameter**|**Symbol **|**Conditions**|**Value**||**Unit**| ||||**Q1**|**Q2**|| |Continuous drain current|_I_D|_T_C=70 °C,_V_GS=10 V|50|50|A| |||_T_C=70 °C,_V_GS=4.5 V|50|50|| |||_T_A=25 °C,<br>_V_GS=4.5 V3)|31|50|| |||_T_A=25 °C,<br>_V_GS=4.5 V4)|19|33|| |Pulsed drain current|_I_D,pulse|_T_C=70 °C|160|160|| |Avalanche energy, single pulse|_E_AS|Q1:_I_D=10 A,<br>Q2:_I_D=20 A,<br>_R_GS=25W|30|90|mJ| |Gate source voltage|_V_GS|_T_j=25 °C|±16||V| |Power dissipation|_P_tot|_T_A=25 °C3)|6.25|6.25|W| |||_T_A=25 °C4)|2.5|2.5|| |Operating and storage temperature|_T_j,_T_stg||-55 ... 150||°C| |IEC climatic category; DIN IEC 68-1|||55/150/56||| 1) J-STD20 and JESD22 Rev.2.1 page 1 2016-03-08 |**BSG0813NDI**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~2~~|**BSG0813NDI**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~2~~|**BSG0813NDI**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~2~~| |---|---|---| |**Thermal characteristics**||| |Thermal resistance, junction -|Q1 _R_thJC<br>-<br>-<br>4.3|K/W| |case|Q2<br>-<br>-<br>2.2|| |Thermal resistance, junction -<br>ambient2)|Q1 _R_thJA<br>Q2<br>20<br>-<br>-<br>Application specific<br>board3)|| ||Q1<br>Q2<br>50<br>-<br>-<br>6 cm2cooling area4)|| |**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified||| |**Static characteristics**||| |Drain-source breakdown voltage|Q1<br>Q2<br>_V_(BR)DSS _V_GS=0 V,_I_D=1 mA<br>-<br>-<br>256)<br>~~TTT~~|V| |Breakdown voltage temperature<br>coefficient|Q1<br>Q2<br>d_V_(BR)DSS<br>/d_T_j<br>_I_D=10 mA, referenced<br>to 25 °C<br>-<br>15<br>-<br>~~yp~~|mV/K| |Gate threshold voltage<br>Zero gate voltage drain current|Q1<br>Q2<br>Q1 _I_DSS<br>-<br>-<br>1<br>Q2<br>-<br>-<br>500<br>Q1<br>-<br>-<br>100<br>Q2<br>-<br>1<br>-<br>_V_GS(th)<br>_V_DS=_V_GS,_I_D=250 µA<br>_V_DS=25 V,_V_GS=0 V,<br>_T_j=25 °C<br>2<br>1.2<br>1.6<br>_V_DS=20 V,_V_GS=0 V,<br>_T_j=125 °C<br>~~oe~~<br>~~oon~~<br>~~a eo~~|µA<br>mA<br>V| |Gate-source leakage current<br>Gate resistance<br>Transconductance<br>Drain-source on-state<br>resistance|Q1 _I_GSS<br>Q2<br>Q1 _R_DS(on)<br>-<br>3.2<br>4.0<br>Q2<br>-<br>1.2<br>1.7<br>Q1<br>-<br>2.4<br>3.0<br>Q2<br>-<br>0.9<br>1.2<br>Q1 _R_G<br>-<br>0.7<br>1.2<br>Q2<br>-<br>1<br>1.7<br>Q1 _g_fs<br>46<br>93<br>-<br>Q2<br>70<br>140<br>-<br>100<br>_V_GS=4.5 V,_I_D=20 A<br>_V_GS=10 V,_I_D=20 A<br>|_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=20 A<br>-<br>_V_GS=16 V,_V_DS=0 V<br>-<br>~~oe~~<br>~~fee~~<br>~~eee~~<br>~~eee~~<br>~~==~~|mW<br>W<br>S<br>nA| 2) Only one of both transistors active Rev.2.1 page 2 2016-03-08 |Cinfineon||||| |---|---|---|---|---| |Cinfineon||**BSG0813NDI**|**BSG0813NDI**|| |||||| |**Parameter**|**Symbol **|**Conditions**|**Values**|**Unit**| ||||**min.**<br>**typ.**<br>**max.**|| |**Dynamic characteristics**||||| |Input capacitance<br>Output capacitance<br>Reverse transfer capacitance<br>Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time<br>**Gate Charge Characteristics**|Q1 _C_iss<br>Q2<br>Q1 _C_oss<br>Q2<br>Q1 Crss<br>Q2<br>Q1 _t_d(on)<br>Q2<br>Q1 _t_r<br>Q2<br>Q1 _t_d(off)<br>Q2<br>Q1 _t_f<br>Q2<br>~~a~~<br>~~|~~<br>~~a~~<br>~~|~~<br>~~4~~<br>~~|~~<br>~~4~~<br>~~|~~<br>~~4~~<br>~~|~~<br>~~4~~<br>~~|~~<br>~~4~~<br>~~|~~|_V_GS=0 V,<br>_V_DS= 12 V,_f_=1 MHz<br>_V_IN=12 V,<br>_V_DRV=5 V,<br>_F_SW=500 KHz,<br>_I_OUT=20 A5)|-<br>780<br>1100<br>-<br>2200<br>2900<br>-<br>390<br>520<br>-<br>1300<br>1700<br>-<br>38<br>-<br>-<br>71<br>-<br>-<br>4.3<br>-<br>-<br>3.6<br>-<br>-<br>4.7<br>-<br>-<br>2.8<br>-<br>-<br>4.3<br>-<br>-<br>5.7<br>-<br>-<br>1.4<br>-<br>-<br>1.7<br>-<br>5)<br>~~Pt ~~~~**|**~~<br>~~Pt~~<br>~~Pt ~~~~**|**~~<br>~~Pt~~<br>~~Pt ~~~~**|**~~<br>~~Pt~~<br>~~Pt ~~~~**|**~~<br>~~Pt~~<br>~~Pt ~~~~**|**~~<br>~~Pt~~<br>~~Pt ~~~~**|**~~<br>~~Pt~~<br>~~Pt ~~~~**|**~~<br>~~Ft~~|pF<br>ns| |Gate to source charge<br>Gate to drain charge<br>Gate charge total<br>Gate plateau voltage<br>Gate to source charge<br>Gate to drain charge<br>Gate charge total|Q1 _Q_gs<br>-<br>2.0<br>_Q_gd<br>-<br>1.4<br>-<br>_Q_g<br>-<br>5.6<br>8.4<br>_V_plateau<br>-<br>2.6<br>-<br>Q2 _Q_gs<br>-<br>5.2<br>-<br>_Q_gd<br>-<br>3.1<br>-<br>_Q_g<br>-<br>15<br>22<br>_V_DD=12 V,<br>_I_D=20 A,<br>_V_GS=0 to 4.5 V<br>~~|~~<br>~~Pt |~~<br>~~|~~<br>~~Pt |~~<br>~~|~~<br>~~Pt |~~<br>~~|~~<br>~~Pt |~~<br>~~|~~<br>~~|~~<br>~~|~~<br>~~**P**t |~~<br>~~|~~<br>~~|~~|||nC<br>V<br>nC<br>~~|~~| |Gate plateau voltage<br>Output charge|_V_plateau<br>Q1 _Q_oss<br>Q2<br>~~+~~<br>~~oe~~|_V_DD=12 V,_V_GS=0 V|-<br>2.3<br>-<br>-<br>8<br>-<br>-<br>27<br>-<br>~~=~~|V<br>nC| - 3) 8 Layers copper 70μm thickness. PCB in still air - 4) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain connection. PCB is vertical in still air. Rev.2.1 page 3 2016-03-08 **BSG0813NDI Parameter Symbol Conditions Values Unit min. typ. max. Reverse Diode** Diode continuous forward current Q1 _I_ S - - 29 A Q2 - - 50 _T_ C=25 °C Diode pulse current Q1 _I_ S,pulse - - 160 Q2 - - 160 Diode forward voltage Q1 _V_ SD _V_ GS=0 V, _I_ F=20 A, - 0.82 1 V _T_ =25 °C j Q2 _V_ GS=0 V, _I_ F=11 A, - 0.52 0.7 _T_ =25 °C j Reverse recovery charge Q1 _Q_ rr _V_ R=12 V, _I_ F= _I_ S, - 10 - nC d _i_ F/d _t_ =100 A/µs Q2 ~~SHE~~ 5) For more information see application note n° TBD 6) The device can withstand a pulse of not more than 30 V for a duration of up to 2 ns at a frequency of 600 kHz with maximum buck converter input voltage VIN=16 V Rev.2.1 page 4 2016-03-08 ## **1 Power dissipation (Q1)** _P_ tot=f( _T_ A)[4)] ## **2 Power dissipation (Q2)** _P_ tot=f( _T_ A)[4)] **==> picture [466 x 610] intentionally omitted <==** **----- Start of picture text -----**<br> 3 3<br>2.5 2.5<br>2 2<br>1.5 1.5<br>1 1<br>0.5 0.5<br>0 0 ne<br>0 40 80 120 160 0 40 80 120 160<br>T A [°C] T A [°C]<br>3 Drain current (Q1) 4 Drain current (Q2)<br>=f( T C)) I D=f( T C)<br>parameter: V GS≥10 V≥10 V parameter: V GS≥10 V<br>60 60<br>50 50<br>40 40<br>30 30<br>20 20<br>10 10<br>0 0<br>0 40 80 120 160 0 40 80 120 160<br>T C [°C] T C [°C]<br> [W] [W]<br>tot tot<br>P P<br> [A] [A]<br>I D I D<br>**----- End of picture text -----**<br> ## **3 Drain current (Q1)** _I_ D=f( _T_ C)) parameter: _V_ GS≥10 V≥10 V Rev.2.1 page 5 2016-03-08 ## **5 Safe operating area (Q1)** _I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 parameter: _t_ p ## **6 Safe operating area (Q2)** _I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 parameter: _t_ p **==> picture [220 x 263] intentionally omitted <==** **----- Start of picture text -----**<br> 10 [3 ]<br>1 µs<br>10 [2 ] 10 µs<br>100 µs<br>1 ms<br>10 [1 ]<br>10 ms<br>DC<br>10 [0 ]<br>10 [-1 ]<br>10 [-1 ] 10 [0 ] 10 [1 ] 10<br>V DS [V]<br>[A]<br>I D<br>**----- End of picture text -----**<br> **==> picture [220 x 263] intentionally omitted <==** **----- Start of picture text -----**<br> 10 [3 ]<br>1 µs<br>10 [2 ] 10 µs<br>100 µs<br>1 ms<br>10 [1 ] 10 ms<br>DC<br>10 [0 ]<br>10 [-1 ]<br>10 [-1 ] 10 [0 ] 10 [1 ] 10<br>V DS [V]<br> [A]<br>I D<br>**----- End of picture text -----**<br> **7 Max. transient thermal impedance (Q1)** _Z_ thJC=f( _t_ p) parameter: _D_ = _t_ p/ _T_ **8 Max. transient thermal impedance (Q2)** _Z_ thJC=f( _t_ p) parameter: _D_ = _t_ p/ _T_ **==> picture [459 x 264] intentionally omitted <==** **----- Start of picture text -----**<br> 10 [1 ] 10 [1 ]<br>0.5 10 [0 ] 0.5<br>0.2<br>0.2<br>10 [0 ] 0.1<br>0.1 0.05<br>0.02<br>0.05<br>0.01<br>10 [-1 ]<br>0.02 single pulse<br>0.01<br>single pulse<br>10 [-1 ] 10 [-2 ]<br>10 [-5 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10 [0 ] 10 [-5 ] 10 [-4 ] 10 [-3 ] 10 [-2 ] 10 [-1 ] 10<br>t p [s] t p [s]<br> [K/W] [K/W]<br>thJC thJC<br>Z Z<br>**----- End of picture text -----**<br> Rev.2.1 page 6 2016-03-08 ## **9 Typ. output characteristics (Q1)** _I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS ## **10 Typ. output characteristics (Q2)** _I_ D=f( _V_ DS); _T_ j=25 °C parameter: _V_ GS **==> picture [463 x 610] intentionally omitted <==** **----- Start of picture text -----**<br> 160 4 V 400<br>10 V<br>10 V 3.5 V<br>4.5 V 3.3 V 4 V 3.5 V<br>4.5 V<br>120 300 3.3 V<br>3 V<br>80 200<br>3 V<br>2.8 V<br>2.8 V<br>40 100<br>0 0<br>0 1 2 3 0 1 2 3<br>V DS [V] V DS [V]<br>11 Typ. drain-source on resistance (Q1) 12 Typ. drain-source on resistance (Q2)<br> DS(on)=f(=f( I D); ); T j=25 °C=25 °C R DS(on)=f( I D); T j=25 °C<br>parameter: V GS parameter: V GS<br>10 3<br>2.5<br>8 3 V<br>2<br>6 3 V 3.3 V<br>3.5 V<br>1.5<br>3.3 V<br>4 V<br>3.5 V<br>4 4.5 V<br>4 V<br>5 V<br>4.5 V 1<br>5 V<br>10 V<br>10 V<br>2<br>0.5<br>0 0<br>0 20 40 60 80 0 20 40 60 80<br>I D [A] I D [A]<br> [A] [A]<br>I D I D<br>] ]<br>W W<br> [m [m<br>DS(on) DS(on)<br>R R<br>**----- End of picture text -----**<br> ## **11 Typ. drain-source on resistance (Q1)** _R_ DS(on)=f(=f( _I_ D); ); _T_ j=25 °C=25 °C parameter: _V_ GS Rev.2.1 page 7 2016-03-08 ## **13 Typ. transfer characteristics (Q1)** _I_ D=f( _V_ GS); | _V_ DS |>2 | _I_ D| _R_ DS(on)max parameter: _T_ j ## **14 Typ. transfer characteristics (Q2)** _I_ D=f( _V_ GS); _|V_ DS |>2 | _I_ D _| R_ parameter: _T_ j DS(on)max **==> picture [461 x 267] intentionally omitted <==** **----- Start of picture text -----**<br> 160 400<br>120 300<br>80 200 |<br>40 | 100 |<br>150 °C<br>25 °C<br>150 °C<br>25 °C<br>0 | 0 Ve<br>0 1 2 3 4 0 1 2 3 4<br>V GS [V] V GS [V]<br> [A] [A]<br>I D I D<br>**----- End of picture text -----**<br> ## **15 Drain-source on-state resistance (Q1)** _R_ DS(on)=f( _T_ j); _I_ D=20 A; _V_ GS=10 V ## **16 Drain-source on-state resistance (Q2)** _R_ DS(on)=f( _T_ j); _I_ D=20 A; _V_ GS=10 V **==> picture [466 x 268] intentionally omitted <==** **----- Start of picture text -----**<br> 7 2<br>6<br>1.5<br>5<br>4<br>1<br>typ<br>3<br>typ<br>2<br>0.5<br>1<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C] T j [°C]<br>] ]<br>W W<br>[m [m<br>DS(on) DS(on)<br>R R<br>**----- End of picture text -----**<br> Rev.2.1 page 8 2016-03-08 ## **17 Typ. gate threshold voltage (Q1)** _V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=250 µA ## **18 Typ. gate threshold voltage (Q2)** _V_ GS(th)=f( _T_ j); _V_ GS= _V_ DS; _I_ D=10 mA **==> picture [466 x 268] intentionally omitted <==** **----- Start of picture text -----**<br> 2.8 2.8<br>2.4 2.4<br>2 2<br>1.6 1.6<br>1.2 1.2<br>0.8 0.8<br>0.4 0.4<br>0 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C] T j [°C]<br> [V] [V]<br>GS(th) GS(th)<br>V V<br>**----- End of picture text -----**<br> ## **19 Typ. capacitances (Q1)** _C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz ## **20 Typ. capacitances (Q2)** _C_ =f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz **==> picture [460 x 266] intentionally omitted <==** **----- Start of picture text -----**<br> 10 [4] 10 [4 ]<br>Ciss<br>Ciss<br>10 [3 ]<br>ee e) e ee<br>10 [3 ] Coss<br>Coss<br>10 [2 ]<br>a Crss<br>10 [2 ]<br>Crss<br>10 [1 ]<br>10 [0 ] 10 [1 ]<br>0 5 10 15 20 25 0 5 10 15 20 25<br>V DS [V] V DS [V]<br> [pF] [pF]<br>C C<br>**----- End of picture text -----**<br> Rev.2.1 page 9 2016-03-08 **BSG0813NDI** **21 Forward characteristics of reverse diode (Q1)** _I_ F=f( _V_ SD) ## **22 Forward characteristics of reverse diode (Q2)** _I_ F=f( _V_ SD) **==> picture [483 x 668] intentionally omitted <==** **----- Start of picture text -----**<br> parameter: T j parameter: T j<br>10 [3 ] 10 [3 ]<br>10 [2 ] 10 [2 ]<br>150 °C 25 °C<br>10 [1 ] 10 [1 ]<br>10 [0 ] 10 [0 ]<br>-55 °C<br>25 °C<br>150 °C<br>10 [-1 ] 10 [-1 ]<br>100 °C<br>10 [-2 ] 10 [-2 ]<br>0 0.4 0.8 1.2 0 0.4 0.8 1.2<br>V SD [V] V SD [V]<br>23 Avalanche characteristics (Q1) 24 Avalanche characteristics (Q2)<br>I AS=f( t AV); R GS=25 W I AS=f( t AV); R GS=25 W<br>parameter: T j(start) parameter: T j(start)<br>10 [2 ] 10 [2 ]<br>25 °C<br>125 °C 100 °C<br>10 [1 ] 25 °C 10 [1 ]<br>100 °C<br>125 °C<br>10 [0 ] 10 [0 ]<br>10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ] 10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ]<br>t AV [µs] t AV [µs]<br>Rev.2.1 [_] page 10 2016-03-08<br> [A] [A]<br>I F I F<br> [A] [A]<br>I AV I AV<br>**----- End of picture text -----**<br> Rev.2.1 ## **25 Typ. gate charge (Q1)** _V_ GS=f( _Q_ gate); _I_ D=20 A pulsed parameter: _V_ DD ## **26 Typ. gate charge (Q2)** _V_ GS=f( _Q_ gate); _I_ D=20 A pulsed parameter: _V_ DD **==> picture [463 x 610] intentionally omitted <==** **----- Start of picture text -----**<br> 10 10<br>8 8<br>12 V<br>12 V<br>5 V<br>20 V<br>6 20 V 6 5 V<br>4 4 V<br>Y<br>2 2<br>0 0<br>0 2 4 6 8 10 12 14 0 10 20 30<br>Q gate [nC] Q gate [nC]<br>27 Drain-source breakdown voltage (Q1) 28 Typ. drain-source leakage current (Q2)<br> BR(DSS)=f(=f( T j); ); I D=1 mA=1 mA I DSS=f( V DS ); V GS=0 V<br>parameter: T j<br>28 10 [-2 ]<br>27<br>26 10 [-3 ]<br>125 °C<br>25<br>100 °C<br>24 10 [-4 ]<br>75 °C<br>23<br>22 10 [-5 ]<br>21<br>25 °C<br>20 10 [-6 ]<br>-60 -20 20 60 100 140 180 0 5 10 15 20<br>T [°C] °C] C] V DS [V]<br> [V] [V]<br>GS GS<br>V V<br> [V]<br> [A]<br>BR(DSS) I DSS<br>V<br>**----- End of picture text -----**<br> ## **27 Drain-source breakdown voltage (Q1)** _V_ BR(DSS)=f(=f( _T_ j); ); _I_ D=1 mA=1 mA **==> picture [227 x 268] intentionally omitted <==** **----- Start of picture text -----**<br> 28<br>27<br>26<br>25<br>24<br>23<br>22<br>21<br>20<br>-60 -20 20 60 100 140 180<br>T j [°C] °C] C]<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br> Rev.2.1 page 11 2016-03-08 **BSG0813NDI** ## **Package Outline PG-TISON8-4** Rev.2.1 page 12 2016-03-08 ## **Boardpads & Apertures** ## **PG-TISON8-4** **All the dimensions in mm** Rev.2.1 page 13 2016-03-08 **BSG0813NDI** ## BSG0813NDI |Previous Revision|Previous Revision|| |---|---|---| |Revision|Date|Subjects (major changes since last revision)| |2.0|2015-03-17|Release of final version| |2.1|2016-03-24|Update package drawing| ## **erratum@infineon.com** ## **Information** **www.infineon.com** ). ## **Warnings** 15
Updated at June 9, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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