BSC028N06NSATMA1
Power MOSFET, N Channel, 60 V, 100 A, 2800 µohm, TDSON, Surface Mount
- Manufacturer: INFINEON
- Product type: Single MOSFETs
- Transistor Polarity:N Channel; Continuous Drain Current Id:100A; Drain Source Voltage Vds:60V; On Resistance Rds(on):0.0025ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2.8V;
- MSL: MSL 1 - Unlimited
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 8Pins
- Channel Type: N Channel
- Product Range: -
- Qualification: -
- Power Dissipation: 83W
- Transistor Mounting: Surface Mount
- Rds(on) Test Voltage: 10V
- Transistor Case Style: TDSON
- Drain Source Voltage Vds: 60V
- Operating Temperature Max: 150°C
- Continuous Drain Current Id: 100A
- Drain Source On State Resistance: 2800µohm
- Gate Source Threshold Voltage Max: 2.8V
| Delivery and price | |
|---|---|
| Units per pack | 3000 |
| Price | 1.16 € |
| Current stock | 1000+ |
| Lead time | 30 days |
**BSC028N06NS**
## **MOSFET**
## **OptiMOS[TM]**
## **Features**
1)
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|**Parameter**|**Value**|**Unit**|
|---|---|---|
|_V_DS|60|V|
|_R_DS(on),max|2.8|mΩ|
|_I_D|132|A|
|_Q_oss|43|nC|
|_Q_G(0..10V)|37|nC|
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S 1S 2 T i l 8 D7 D<br>S 3 6 D<br>I K EDA<br>G 4 5 D<br>**----- End of picture text -----**<br>
|~~Type/OrderingCode|~~|**Package**<br>~~||__|~~|**Marking**<br>~~|__|~~Related|Related Links|
|---|---|---|---|
|BSC028N06NS<br>~~Type/OrderingCode |~~|PG-TDSON-8<br>~~|~~|028N06NS<br>|-<br>|
1) J-STD20 and JESD22
Final Data Sheet
1
**OptiMOS[TM] �Power-Transistor,�60�V BSC028N06NS**
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## **Table�of�Contents**
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Final Data Sheet
2
Rev.�2.5,��2020-09-21
**OptiMOS[TM] �Power-Transistor,�60�V BSC028N06NS**
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**1�����Maximum�ratings** at� _T_ A=25�°C,�unless�otherwise�specified
## **Table�2�����Maximum�ratings**
|**Table2Maximumratings**|||||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**||**Values**||**Unit**|**Note/TestCondition**|
|||**Min.**|**Typ.**|**Max.**|||
|Continuous drain current1)|_I_D|-<br>-<br>-|-<br>-<br>-|132<br>83<br>23|A|_V_GS=10V,_T_C=25°C<br>_V_GS=10V,_T_C=100°C<br>_V_GS=10V,_T_A=25°C,_R_thJA=50K/W2)|
|Pulsed drain current3)|_ID,pulse_|-|-|528|A|_T_C=25°C|
|Avalanche energy, single pulse4)|_E_AS|-|-|100|mJ|_I_D=50A,_R_GS=25Ω|
|Gate source voltage|_V_GS|-20|-|20|V|-|
|Power dissipation|_P_tot|-<br>-|-<br>-|83<br>2.5|W|_T_C=25°C<br>_T_A=25°C,_R_thJA=50K/W3)|
|Operating and storage temperature|_T_j,_T_stg|-55|-|150|°C|IEC climatic category;<br>DIN IEC 68-1: 55/150/56|
## **2�����Thermal�characteristics**
## **Table�3�����Thermal�characteristics**
|**Parameter**|**Symbol**||**Values**|**Values**|**Unit**|**Note/TestCondition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Thermal resistance, junction - case,<br>bottom|_R_thJC|-|0.9|1.5|K/W|-|
|Thermal resistance, junction - case,<br>top|_R_thJC|-|-|20|K/W|-|
|Device on PCB,<br>6 cm2cooling area2)|_R_thJA|-|-|50|K/W|-|
> 1) Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature at 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actual environmental conditions.
> 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.
> 3) See Diagram 3 for more detailed information
> 4) See Diagram 13 for more detailed information
Final Data Sheet
3
Rev.�2.5,��2020-09-21
**OptiMOS[TM] �Power-Transistor,�60�V BSC028N06NS**
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## **3�����Electrical�characteristics**
at� _T_ j=25�°C,�unless�otherwise�specified
## **Table�4�����Static�characteristics**
|**Parameter**|**Symbol**||**Values**|**Values**|**Unit**|**Note/TestCondition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Drain-source breakdown voltage|_V_(BR)DSS|60|-|-|V|_V_GS=0V,_I_D=1mA|
|Gate threshold voltage|_V_GS(th)|2.1|2.8|3.3|V|_V_DS=_V_GS,_I_D=50µA|
|Zero gate voltage drain current|_I_DSS|-<br>-|0.5<br>10|1<br>100|µA|_V_DS=60V,_V_GS=0V,_T_j=25°C<br>_V_DS=60V,_V_GS=0V,_T_j=125°C|
|Gate-source leakage current|_I_GSS|-|10|100|nA|_V_GS=20V,_V_DS=0V|
|Drain-source on-state resistance|_R_DS(on)|-<br>-|2.5<br>3.4|2.8<br>4.2|mΩ|_V_GS=10V,_I_D=50A<br>_V_GS=6V,_I_D=12.5A|
|Gate resistance1)|_R_G|-|1.3|1.95|Ω|-|
|Transconductance|_g_fs|50|100|-|S||_V_DS|>2|_I_D|_R_DS(on)max,_I_D=50A|
|**Table5Dynamiccharacteristics**|||||||
|**Parameter**|**Symbol**||**Values**||**Unit**|**Note/TestCondition**|
|||**Min.**|**Typ.**|**Max.**|||
|Input capacitance1)|_C_iss|2025|2700|3375|pF|_V_GS=0V,_V_DS=30V,_f_=1MHz|
|Output capacitance1)|_C_oss|495|660|825|pF|_V_GS=0V,_V_DS=30V,_f_=1MHz|
|Reverse transfer capacitance1)|Crss|8.5|28|56|pF|_V_GS=0V,_V_DS=30V,_f_=1MHz|
|Turn-on delay time|_t_d(on)|-|11|22|ns|_V_DD=30V,_V_GS=10V,_I_D=50A,<br>_R_G,ext=3Ω|
|Rise time|_t_r|-|38|57|ns|_V_DD=30V,_V_GS=10V,_I_D=50A,<br>_R_G,ext=3Ω|
|Turn-off delay time|_t_d(off)|-|19|38|ns|_V_DD=30V,_V_GS=10V,_I_D=50A,<br>_R_G,ext=3Ω|
|Fall time|_t_f|-|8|16|ns|_V_DD=30V,_V_GS=10V,_I_D=50A,<br>_R_G,ext=3Ω|
|**Table6Gatechargecharacteristics2)**|||||||
|**Parameter**|**Symbol**||**Values**||**Unit**|**Note/TestCondition**|
|||**Min.**|**Typ.**|**Max.**|||
|Gate to source charge|_Q_gs|9|12|16.5|nC|_V_DD=30V,_I_D=50A,_V_GS=0to10V|
|Gate charge at threshold|_Q_g(th)|6|8|11|nC|_V_DD=30V,_I_D=50A,_V_GS=0to10V|
|Gate to drain charge|_Q_gd|5|7|10.3|nC|_V_DD=30V,_I_D=50A,_V_GS=0to10V|
|Switchingcharge|_Q_sw|8|12|17|nC|_V_DD=30V,_I_D=50A,_V_GS=0to10V|
|Gate charge total|_Q_g|31|37|49|nC|_V_DD=30V,_I_D=50A,_V_GS=0to10V|
|Gate plateau voltage|_V_plateau|4.0|4.6|5.2|V|_V_DD=30V,_I_D=50A,_V_GS=0to10V|
|Gate charge total, sync. FET|_Q_g(sync)|27|33|43|nC|_V_DS=0.1V,_V_GS=0to10V|
|Output charge|_Q_oss|32|43|54|nC|_V_DD=30V,_V_GS=0V|
> 1) Defined by design. Not subject to production test
> 2) See ″ Gate charge waveforms ″ for parameter definition. Defined by design, not subject to production test
Final Data Sheet
Rev.�2.5,��2020-09-21
4
**OptiMOS[TM] �Power-Transistor,�60�V BSC028N06NS**
**==> picture [120 x 53] intentionally omitted <==**
## **Table�7�����Reverse�diode**
|**Table7Reversediode**|||||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**||**Values**||**Unit**|**Note/TestCondition**|
|||**Min.**|**Typ.**|**Max.**|||
|Diode continuous forward current|_I_S|-|-|100|A|_T_C=25°C|
|Diode pulse current|_I_S,pulse|-|-|528|A|_T_C=25°C|
|Diode forward voltage|_V_SD|-|0.9|1.2|V|_V_GS=0V,_I_F=50A,_T_j=25°C|
|Reverse recoverytime1)|_t_rr|14|35|56|ns|_V_R=30V,_I_F=50A,d_i_F/d_t_=100A/µs|
|Reverse recoverycharge1)|_Q_rr|14|29|58|nC|_V_R=30V,_I_F=50A,d_i_F/d_t_=100A/µs|
1) Defined by design. Not subject to production test Final Data Sheet
Rev.�2.5,��2020-09-21
5
**OptiMOS[TM] BSC028N06NS**
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10 [3] 10 [1]<br>EHH SES 1 µs S AFR<br>10 [2] FHS S 10 µs EEE ER<br>SSO EES Ht Oo Co oo<br>RRR RST TM UII | UTIney<br>10 [0]<br>a 0 =. Senn — 0.5 oe<br>100 µs<br>0.2<br>10 [1] 1 ms<br>EE EEE EG 10 ms AoIE=ESNG EGE 0.1 iit WA<br>DC<br>10 [-1]<br>0.05<br>10 [0] 0.02<br>[NEE va /<br>0.01<br>SSS Sr ee eee rat case (| 0 | |<br>single pulse<br>10 [-2]<br>SLATE lel Zeige — LIME LIME ELUM LT<br>10 [-1]<br>SSS<br>| [tty tT ETa Ty TTTee | CO<br>Nh TTI ATI UTA LETTE EEE<br>10 [-2] 10 [-3]<br>10 [-1] 10 [0] 10 [1] 10 [2] 10 [-6] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1]<br>V DS [V] t p [s]<br>I D=f( V DS yi_=25°C;_=0; T C D parameter: t p Z thJC=f( t p D = t p/ T<br>I D thJC<br>Z<br>**----- End of picture text -----**<br>
Final Data Sheet
6
**OptiMOS[TM] BSC028N06NS**
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**----- Start of picture text -----**<br>
400 8<br>10 V<br>360 |FFF|| 7 -7AL 7 V | | a 5 V 5.5 V 6 V<br>7<br>a r_ Pe<br>320 es ee) ey2 Lr | | [Ft | Tq, tT | [| fg tT | [ JT 7<br>6<br>280<br>pe ft 6 V 5 ae<br>240 es a) AAee<br>< 200 ee ay ae —ee| 4 rota| [| Vi [fT [| | fF [ JT | [ Jf fT<br>Af E i<br>— | A ee ae ae =<br>7 V<br>160<br>nsseeae—— 5.5 V ee 3 SCEeeeee<br>120 TTL SER 10 V<br>2<br>80 5 V<br>40 fnrao || 1 PeSEEEEEEEEEEEEEE<br>Zee ee eee ee<br>0 P| | {| | | | | | 0 a<br>0.0 0.5 1.0 1.5 2.0 0 50 100 150 200 250 300 350 400<br>V DS [V] I D [A]<br>I D=f( V DS T j V GS R DS(on)=f( I D T j V GS<br>400 a ee ee | 160 ee ee ee ee<br>360<br>i a<br>320 eeee ee ee ee >} — a<br>120<br>280<br>a a<br>240<br>ee eee e e eee o_o<br>Se ese | ee<br>200 80<br>160 a Sf<br>Sn nn SL<br>120<br>ee ee ee $+} —<br>40<br>/<br>8040 ee ee<br>SE 150 °C n/a 25 °C A ee<br>0 U rT Z/frod 0 | ee ee ee<br>0 2 4 6 8 0 20 40 60 80 100<br>V GS I D<br>[Vv] [A]<br>I D=f( V GS V DS|>2| I D| R DS(on)max T j g fs=f( I D T j<br>] Ω<br>I D<br>DS(on)<br>R<br>I D fs g<br>**----- End of picture text -----**<br>
Final Data Sheet
7
**OptiMOS[TM] BSC028N06NS**
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**----- Start of picture text -----**<br>
6.0 5<br>OO<br>OO<br>5.5 es<br>5.0<br>a 4<br>BEREEEEEEEEH | COCCEeeererere<br>4.5 es<br>A<br>A<br>4.0<br>TTT =a<br>3.5 ee max KT 3 —~ 500 µA<br>SE ae Ss<br>3.0 i ts | | | SEK<br>a ——~J~_<br>50 µA<br>ee See<br>2.5 typ<br>2<br>I NON,<br>la al<br>2.0<br>a<br>eer eEEEEEER | COTTE<br>SSS 55525252<br>1.5<br>1<br>1.0 es = 0 eee<br>a<br>0.5 es<br>0.0 es 0<br>-60 EERREEEEEEES -20 20 60 100 140 180 | -60 POPPE -20 20 60 ere 100 140 180<br>T j [°C] T j [°C]<br>R DS(on)=f( T j I D V GS V GS(th)=f( T j V GS= V DS<br>] Ω<br> [m<br>GS(th)<br>DS(on) V<br>R<br>**----- End of picture text -----**<br>
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10 [4] 10 [3]<br>25 °C<br>a a | L]L 25 °C, max PiERRTTEERETT tT tT yt tt tt tt<br>a i 150 °C EEREREE<br>a i 150 °C, max POCA eer<br>Ciss<br>mT AHGAATAAANAUTONADE@S@RIRLUIDE<br>10 [3] aae 10 [2]<br>FERRE ESSEREEEE<br>————annCe, a TTTeeeeTENDee AecAONNee<br>ac XK | Coss ee| —— _ LTT TTT TTT TTT ttttT ttt ett eet it TATvt TTTtT ytveTTTT TTTT<br>FNS SSFt<br>~-KEE<br>10 [2] PIA ]} 10 [1] Ul<br>esa pttttEEEREEEREEERA titiA i AtiieEERE EHtit tttHFtpEEE]<br>aa eeDe | SeeSER eeeeesee eee<br>a COCO<br>ee ee PET<br>Crss<br>| |Ef) ET<br>10 [1] 10 [0]<br>0 20 40 60 0.00 0.25 0.50 0.75 1.00 1.25 1.50<br>V DS V SD<br>[Vv] [Vv]<br>C =f( V DS V GS f I F=f( V SD T j<br>C I F<br>**----- End of picture text -----**<br>
Final Data Sheet
8
**OptiMOS[TM] BSC028N06NS**
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**----- Start of picture text -----**<br>
10 [2] 12<br>a A 0ee<br>Ee Pf | | | ft J fl<br>a eeee<br>30 V<br>ENT N DN S 10 | | tf | ft | | |<br>{TI | ><br>NE 125 °C NSENT 100 °C 25 °C | ITI 12 V<br>48 V<br>A Noi | pM] e/a<br>10 [1] 8<br>aSe eeee ee ff<br>— aSSa SeSe ee ee, Aejf<br>6<br><x Pot LTTE fT TTT NENT a p<br>|<br>a A<br>10 [0] a a at 4 af/f e<br>eeA ee0 eeA A eeeA a a Vij e<br>aa a ee ee ee ee ee 2 | IF}vy, Jf | fot ft<br>CoCo cos | fo<br>10 [-1] 0<br>10 [0] 10 [1] 10 [2] 10 [3] 0 10 20 30 40<br>t AV [us] Q gate [nc]<br>I AS=f( t AV R GS Ω T j(start) V GS=f( Q gate I D V DD<br>| Diagram Gate charge waveforms<br>70 TT | [TT tT tT tT tT tT yt ey<br>Pot | ft yp ye<br>Pt | ft yt yp tt Ves<br>66 Pt | tf tt te O<br>Pt | tT tt tT tT et 9<br>Pt | [| | tT tT tT et ee<br>Pt | ft ft ty tt tT tee<br>62 ee ee eeeee<br>S pf f | | |e<br>A cel<br>Pt pT tT ET<br>58 pmmT | TT TTtT tT tTtT tTtT retetht ee<br>Pot | ft yp ye<br>Pt | ft yt yp tt<br>54 PtPt || tftT tttt tetT tT et<br>Pt | [| | tT tT tT et ee Rom | | Qey Q gate<br>Pt | [| | tT tT tT et ee<br>50 Pt | tf ft tT tT et ee Qos Qos<br>-60 -20 20 60 100 140 180<br>T j [°C]<br>V BR(DSS)=f( T j I D<br>I AV V GS<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>
~~|~~ **Diagram Gate charge waveforms**
Final Data Sheet
9
**OptiMOS[TM] �Power-Transistor,�60�V BSC028N06NS**
**==> picture [120 x 53] intentionally omitted <==**
## **5�����Package�Outlines**
**==> picture [123 x 43] intentionally omitted <==**
|1.27<br>**MILLIMETERS**<br>0.90<br>1.20<br>0.34<br>0.54<br>0.03<br>0.23<br>3.88<br>4.31<br>0.45<br>0.71<br>**MIN.**<br>**MAX.**<br>0.45<br>0.69<br>0.15<br>0.35<br>3.90<br>4.40<br>4.80<br>5.35<br>5.70<br>6.10<br>5.90<br>6.42||Z8B00003332<br>|**.**|
|---|---|---|---|
|||**REVISION**<br>07||
||0|1<br>**10:1**<br>**SCALE**<br>2|3mm|
|||||
||**EU**|**ROPEAN PROJE**|**CTION**|
|||**ISSUE DATE**<br>06.06.2019||
## **Figure�1�����Outline�PG-TDSON-8,�dimensions�in�mm**
Final Data Sheet
10
Rev.�2.5,��2020-09-21
**OptiMOS[TM] �Power-Transistor,�60�V BSC028N06NS**
**==> picture [120 x 53] intentionally omitted <==**
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**----- Start of picture text -----**<br>
PG-TDSON-8: Recommended Boardpads & Apertures<br>1.905 1.905<br>1.27 0.6 1.27 0.5<br>3x 3x<br>1.6<br>0.2 1.5<br>1.27 0.5 1.27 0.4<br>3x 3x<br>1.905 1.905<br>copper solder mask stencil apertures all dimensions in mm<br>0.8<br>0.2 0.75<br>3.325 2.9<br>4.455<br>1.5<br>5<br>7<br>2.863 2.863 80. 0.825<br>0.925<br>**----- End of picture text -----**<br>
## Figure 2 Outline Boardpads (TDSON-8), dimensions in mm
Final Data Sheet
11
Rev.�2.5,��2020-09-21
OptiMOS[TM] Power-Transistor , 60 V BSC028N06NS
**==> picture [69 x 7] intentionally omitted <==**
**----- Start of picture text -----**<br>
Dimension in mm<br>**----- End of picture text -----**<br>
Figure 3 Outline Tape (TDSON-8)
Rev. 2.5, 2020-09-21
Final Data Sheet
12
OptiMOS[TM] Power-Transistor , 60 V BSC028N06NS
**==> picture [120 x 53] intentionally omitted <==**
## Revision History
## BSC028N06NS
## Revision: 2020-09-21, Rev. 2.5
## Previous Revision
|Revision|Date|Subjects (major changes since last revision)|
|---|---|---|
|2.3|2014-11-10|Added RthJC_typ, updated outline and footprint drawings, insert footnote "Defined by<br>design...."|
|2.4|2020-02-04|Update package drawings|
|2.5|2020-09-21|Update current rating|
## Trademarks
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## Published by
Infineon Technologies AG 81726 München, Germany © 2020 Infineon Technologies AG All Rights Reserved.
## Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) .
With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application.
## Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com).
## Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Rev. 2.5, 2020-09-21
Final Data Sheet
13
Updated at April 29, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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