BMRB00060630100MA1
Power Inductor (SMD), 10 µH, 4 A, Shielded, 5.5 A, BMRx Series
- Manufacturer: PULSE ELECTRONICS
- Product type: SMD Power Inductors
- SVHC: No SVHC (04-Feb-2026)
- Inductance: 10µH
- Product Range: BMRx Series
- Product Width: 6.6mm
- Product Height: 3mm
- Product Length: 7.3mm
- DC Resistance Max: 0.068ohm
- RMS Current (Irms): 4A
- Power Inductor Case: 7.3mm x 6.6mm x 3mm
- Inductance Tolerance: ± 20%
- Inductor Construction: Shielded
- Inductor Case / Package: -
- Saturation Current (Isat): 5.5A
| Delivery and price | |
|---|---|
| Units per pack | 2000 |
| Price | 0.151 € |
| Current stock | 10+ |
| Lead time | 30 days |
## **Power Inductor** ## **BMRB Series** ## **Overview** BMRx series is designed for low profile type with low RDC and ultra large current. Its molded magnetic shielded type is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto the board. This series also provides customers with embossed carrier type packaging for automatic mounting machine. ## **Benefits** 1. High rated current 2. Ultra low buzz noise ## **Applications** 1. DC-DC converters 2. Switchs and servers 3. DC-DC converters, inverters, and battery management systems. 4. Base stations, 5G infrastructure 5. Consumer Electronics: Smartphones, laptops, tablets, wearable devices, and gaming consoles. ## **Product Information** |**Series**|**L (mm)**|**W(mm)**|**T (mm)**|**Inductance (**µ**H)**| |---|---|---|---|---| |BMRB|4.1|4.6|1.2|0.1 ~ 15| ||5.4|5.7|1.2|| ||5.2|5.4|1.2|| ||5.4|5.7|1.5|| ||5.4|5.7|1.8|| ||5.2|5.4|1.6|| ||6.6|7.3|1.2|| ||6.6|7.3|1.3|| ||6.6|7.3|1.6|| ||6.6|7.3|2.4|| ||6.6|7.3|3.0|| ||6.6|7.3|5.0|| ## **BMRB00060630 Series Specification** 1 **Scope** This specification applies to large current and low loss SMD power inductor. ~~:~~ 2 **Part numbering** **==> picture [391 x 353] intentionally omitted <==** **----- Start of picture text -----**<br> B MRB □□ □□□□□□ □□□ □ □□<br>_ Internal code<br>= Tolerance<br>Inductance<br>Dimension<br>Control code<br>Prouduct series<br>LLE= Grade<br>Temperature rating<br>Operating Temperature: -55°C to 125°C.<br>Storage Temperature: (on tape & reel): -20°C to +40°C; 75% RH max.<br>| XX Marking : 1R0<br>**----- End of picture text -----**<br> ## ~~,~~ 3 **Temperature rating** ## ~~:~~ 4 **Marking** ## ~~__|~~ 5 **Standard testing condition** ||Unless otherwise specified|Incase ofdoubt| |---|---|---| |Temperature|OrdinaryTemperature(15 to 35°C)|20 to 30°C| |Humidity|OrdinaryHumidity(25 to 85%RH)|50 to 80 %RH| **BMRB00060630 Series Specification** ~~ee~~ ~~__|~~ 6 **Configuration and dimensions** B F **Dimensions in mm Type 060630 A 6.6 ± 0.2** A D **B 6.95 ± 0.35 C 3.0 Max D 3.0 ± 0.3 F 1.6 ± 0.5** ~~P~~ o ~~t =~~ C c ~~i~~ L **Size Code Net weight(grms)ght(grms)ht(grms)(grms)rms))** J 7 ~~_~~ ## **Size Code Net weight(grms)ght(grms)ht(grms)(grms)rms)) 060630 0.72(typ.)** ~~a~~ ## 7 **Electrical characteristics** |**Part number**|**(uH)**<br>**Inductance**|**(±%)**<br>**Tolerance**|**Test Freq.**|**Typ.**<br>**Irms (A)**|**Isat (A)**<br>**Typ.**|**RDC (mΩ)**<br>**Max.(Typ.)**|**Marking**| |---|---|---|---|---|---|---|---| |BMRB00060630R10MA1|0.1|20|100kHz,0.5V|32.5|60|1.7(1.5)|R10| |BMRB00060630R15MA1|0.15|20|100kHz,0.5V|30|40|2.5(1.9)|R15| |BMRB00060630R22MA1|0.22|20|100kHz,0.5V|23|34|3(2.5)|R22| |BMRB00060630R33MA1|0.33|20|100kHz,0.5V|21|25|3.5(3)|R33| |BMRB00060630R36MA1|0.36|20|100kHz,0.5V|20|24|3.9(3.3)|R36| |BMRB00060630R47MA1|0.47|20|100kHz,0.5V|18|20|4.1(3.5)|R47| |BMRB00060630R56MA1|0.56|20|100kHz,0.5V|16.5|18|4.5(3.9)|R56| |BMRB00060630R68MA1|0.68|20|100kHz,0.5V|16|17|5.3(4.8)|R68| |BMRB00060630R82MA1|0.82|20|100kHz,0.5V|14|16|6(5.4)|R82| |BMRB000606301R0MA1|1|20|100kHz,0.5V|12|15|7.4(6.7)|1R0| |BMRB000606301R2MA1|1.2|20|100kHz,0.5V|10|14|10(7.8)|1R2| |BMRB000606301R5MA1|1.5|20|100kHz,0.5V|10|14|12.1(10.6)|1R5| |BMRB000606302R2MA1|2.2|20|100kHz,0.5V|8|10|15(13.5)|2R2| |BMRB000606303R3MA1|3.3|20|100kHz,0.5V|6.5|9.5|22(18)|3R3| |BMRB000606304R7MA1|4.7|20|100kHz,0.5V|5.5|6.5|33(28)|4R7| |BMRB000606305R6MA1|5.6|20|100kHz,0.5V|5.5|6|42(39)|5R6| |BMRB000606306R8MA1|6.8|20|100kHz,0.5V|4.5|6|50(43.9)|6R8| |BMRB000606308R2MA1|8.2|20|100kHz,0.5V|4.5|6|60(54)|8R2| |BMRB00060630100MA1|10|20|100kHz,0.5V|4|5.5|68(62)|100| ## **Note:** 1. Operating temperature range -55°C to 125°C. 2. Isat for Inductance drop 30% from its value without current. 3. Irms for a 40°C temperature rise from 25°C ambient. 4. The part temperature (ambient + temp rise) should not exceed 125°C under worst case operating conditions. Circuit design 125°C under worst case operating conditions. Component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 5. Absolute maximum voltage 30V DC. (Based on test method, it may not the sameunder different application, it is recommended to verify first.) ## **BMRB00060630 Series Specification** ~~Fe~~ 8 **BMRB00060630 Series 8.1 Construction** **==> picture [68 x 80] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>2 c<br>**----- End of picture text -----**<br> **==> picture [10 x 13] intentionally omitted <==** **----- Start of picture text -----**<br> 3<br>**----- End of picture text -----**<br> ## **8.2 Material List** |Item|Part|Description| |---|---|---| |1|Magnetic core|Magnetic metal powder| |2|Coil|Enameled copper wire| |3|Terminals|Copper based terminal| ## **BMRB00060630 Series Specification** ## 9 **Reliability test items** **1-1.Mechanical Performance** **==> picture [490 x 520] intentionally omitted <==** **----- Start of picture text -----**<br> ||||| |---|---|---|---| |No|Item|Specification|Test Method| |1-1-1|Vibration|Appearance: No damage|Test device shall be soldered on the substrate| |Inductance:within±10% of|Oscillation Frequency: 10 to 55 to 10Hz for 1min| |initial value|Amplitude: 1.5mm| |Time: 2hrs for each axis (X, Y & Z), total 6hrs| |1-1-2|Resistance to Soldering Heat|Appearance: No damage|Pre-heating: 150°C, 1min| |Solder Composition: Sn/Ag3.0/Cu0.5| |Solder Temperature: 260±5°C| |Immersion Time: 10±1sec| |1-1-3|Solder ability|The electrodes shall be at|Pre-heating: 150°C, 1min| |least 95% covered with new|Solder Composition: Sn/Ag3.0/Cu0.5| |solder coating|Solder Temperature: 245±5°C| |Immersion Time: 4±1sec| |1-1-4|Resistance to solvent|There must be no change in|Inductors must withstand 6 minutes of alcohol or water.| |appearance or obliteration of| |marking.| |1-2.Environmental Performance| |No|Item|Specification|Test Method| |1-2-1|Temperature Shock|Appearance: No damage|10 cycles (Air to Air) 1 cycles shall consist of:| |Inductance:within±10% of|30 minutes exposure to -55°C| |initial value|30 minutes exposure to 125°C| |15 seconds maximum transition between temperatures| |1-2-2|Temperature Cycle|One cycle:| |Step|Temperature (°C)|Time (min)| |1|-55±3|30| |2|25±2|3| |3|125±3|30| |4|25±2|3| |Total: 100cycles| |Measured after exposure in the room condition for 24hrs| |1-2-3|Humidity Resistance|Temperature: 40±2°C| |Relative Humidity: 90 ~ 95%| |Time: 1000hrs| |Measured after exposure in the room condition for 24hrs| |1-2-4|Heat Life|Temperature: 85±3°C| |Relative Humidity: 20%| |Applied Current: Rated Current| |Time: 1000hrs| |Measured after exposure in the room condition for 24hrs| |1-2-5|Cold Resistance|Temperature: -55±3°C| |Relative Humidity: 0%| |Time: 1000hrs| |Measured after exposure in the room condition for 24hrs| **----- End of picture text -----**<br> ## **BMRB00060630 Series Specification** **==> picture [189 x 17] intentionally omitted <==** **----- Start of picture text -----**<br> __| 10 Recommended IR reflow profile<br>**----- End of picture text -----**<br> |oC||Ramp-up|Ramp-up|||Pre-heating|Pre-heating|Pre-heating|Pre-heating|||Reflo|Reflo||||Cooling||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |300||||||||||||Peak: 260|||||||| ||||||||||||||||||||| ||217°C||||||||||||||||||| ||150°C||||||||||||||||6°C/ sec|C/ sec|| ||||||||||||||||||||| |100|||||||||||||||||||| |°|||3°C/sec max||||||||||||||||| |0||50|100||||150||200|||250|||||300<br>350||sec| ||||||||Reflow||profile||||||||||| |Lead-Free(LF)|||||||||||||||||Refer to J-STD-020F|Refer to J-STD-020F|| |Item||Ramp-up||||Pre-heating|||Reflow||||||Peak Temp.||||Cooling| |Temp. scope||R.T. ~150|R.T. ~150°C||150°C~200°C||||217°C|||||||260±5°C||Peak Temp.<br>150°C|| |Time spec||-||||60~120 sec|||60~150 sec||||||20~40 sec||||-| Note: 1. IR reflow times: within 3 times. 2. Nitrogen adopted is recommended while in IR reflow. ## **BMRB00060630 Series Specification** **==> picture [341 x 541] intentionally omitted <==** **----- Start of picture text -----**<br> __| 11 Packaging<br>11.1 Packaging-cover tape<br>The force for tearing off cover tape is 10 to 130 grams.<br>165° to 180°<br>Top cover tape<br>NS \<br>\_<br>Base tape<br>11.2 Packaging quantity<br>Type pcs/reel<br>060630 1000<br>a<br>11.3 Reel dimensions<br>A C B<br>oy<br>D<br>Dimensions in mm<br>Type A B C D<br>060630 330 100 13 16<br>aS<br>**----- End of picture text -----**<br> ## **BMRB00060630 Series Specification** **==> picture [196 x 29] intentionally omitted <==** **----- Start of picture text -----**<br> __| 11 Packaging<br>11.4 Tape dimensions in mm<br>**----- End of picture text -----**<br> **==> picture [451 x 190] intentionally omitted <==** **----- Start of picture text -----**<br> P0 P2<br>D<br>E<br>W<br>B0<br>K0 P<br>ab =)<br>Pulling direction<br>A0<br>Type A0 B0 K0 D E W P P0 P2<br>060630 6.9 7.6 3.4 1.5 1.75 16 12 4 2<br>———<br>1R0<br>**----- End of picture text -----**<br> **==> picture [144 x 16] intentionally omitted <==** **----- Start of picture text -----**<br> __| 12 Recommended pattern<br>**----- End of picture text -----**<br> **==> picture [430 x 156] intentionally omitted <==** **----- Start of picture text -----**<br> C<br>Dimensions in mm<br>A Type A B C<br>060630 3.5 3.7 8.4<br>U l ><br>B<br>__| 13 Note<br>1. Please make sure that your product has been evaluated and confirmed against your specifications<br>when our product is mounted to your product.<br>**----- End of picture text -----**<br> 2. Don’t design/ mount any components in contact with this product. 3. The moisture sensitivity level (MSL) of products is classified as level 1. 4. Shelf life: 1 years from the date of shipment. ## **BMRB00060630 Series Specification** ## ~~__|~~ 14 Graph **==> picture [481 x 496] intentionally omitted <==** **----- Start of picture text -----**<br> BMRB00060630R10MA1 BMRB00060630R15MA1<br>0.15 100 0.20 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>0.12 80 0.16 80<br>= TA = TT<br>0.09 60 0.12 60<br>SEeRnnyG0nE SaenGEre<br>0.06 40 0.08 40<br>SESE8/A0nne a2<br>0.03 20 0.04 20<br>San? 4AR00RE CCC<br>0.00 CREE CC EEE 0 0.00 CCE Tr 0<br>0 5 10 15 20 25 30 35 40 45 50 55 60 0 5 10 15 20 25 30 35 40<br>DC Current(A) DC Current(A)<br>BMRB00060630R22MA1 BMRB00060630R33MA1<br>0.30 100 0.50 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>0.24 80 0.40 80<br>= A = Tee<br>0.18 60 0.30 60<br>=Seenr ane SEGmaGRRP<br>0.12 40 0.20 40<br>0.06 20 0.10 20<br>f s 7 40<br>0.00 Seer 0 0.00 PeCOER 0<br>0 5 10 15 20 25 30 35 40 45 0 3 6 9 12 15 18 21 24 27 30 33<br>TT er<br>DC Current(A) DC Current(A)<br>BMRB00060630R36MA1 BMRB00060630R47MA1<br>0.50 100 0.60 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>0.40 80 0.48 80<br>= Toe = Tae<br>0.30 60 0.36 60<br>sEEmURRGSN8 aoa" SS00008<br>0.20 40 0.24 40<br>PCA COTE<br>0.10 20 0.12 20<br>CO SERSEEPZaE<br>0.00 CCE 0 0.00 COCEEE 0<br>0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 2 4 6 8 10 12 14 16 18 20 22<br>TTT or<br>DC Current(A) DC Current(A)<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>**----- End of picture text -----**<br> ## **BMRB00060630 Series Specification** ## ~~__|~~ 14 Graph **==> picture [481 x 496] intentionally omitted <==** **----- Start of picture text -----**<br> BMRB00060630R56MA1 BMRB00060630R68MA1<br>0.70 100 1.0 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>0.56 80 0.8 80<br>= Oe = OTT,<br>0.42 60 0.6 60<br>PERRET Erte itty<br>0.28 40 0.4 40<br>(CCT re COC EES<br>0.14 20 0.2 20<br>SERREEDEaaE SEnnnee Ane<br>0.00 eT 0 0.0 PPT 0<br>0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 8 10 12 14 16 18 20<br>DC Current(A) DC Current(A)<br>BMRB00060630R82MA1 BMRB000606301R0MA1<br>1.20 100 1.5 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>0.96 = TTT 80 1.2 = TTT 80<br>0.72 60 0.9 60<br>H y — —<br>0.48 > Z 40 0.6 Wa 40<br>0.24 20 0.3 20<br>PEER = EEE ee<br>0.00 PET 0 0.0 PET 0<br>0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18<br>DC Current(A) DC Current(A)<br>BMRB000606301R2MA1 BMRB000606301R5MA1<br>1.5 100 2.0 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>1.2 80 1.6 80<br>= TTY =<br>0.9 60 1.2 60<br>A TER SHEET TA<br>0.6 Saar 40 0.8 PPP Pree 40<br>0.3 20 0.4 20<br>Pr er See Ane<br>0.0 0 0.0 0<br>0 nn? 2 4 6 8 anne 10 12 14 16 18 0 Peery 2 4 6 8 10 Tl 12 14 16<br>DC Current(A) DC Current(A)<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>**----- End of picture text -----**<br> ## **BMRB00060630 Series Specification** **==> picture [489 x 545] intentionally omitted <==** **----- Start of picture text -----**<br> __| 14 Graph<br>BMRB000606302R2MA1 BMRB000606303R3MA1<br>3.0 100 5.0 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>2.4 80 4.0 80<br>= Ty =<br>1.8 60 3.0 60<br>n s SHuSeRnnnyé<br>1.2 40 2.0 40<br>HCP Per COOPER<br>0.6 20 1.0 20<br>CCC ET<br>0.0 0 0.0 CCEEERET CECE 0<br>0 2 4 6 8 10 12 14 0 1 2 3 4 5 6 7 8 9 10 11 12<br>DEEP [Toe] SEREEED> ARE<br>DC Current(A) DC Current(A)<br>BMRB000606304R7MA1 BMRB000606305R6MA1<br>6.0 100 7.0 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>4.8 80 5.6 80<br>= _ Foe = Conor<br>3.6 60 4.2 60<br>2.4 40 2.8 40<br>P L Sanna<br>1.2 20 1.4 20<br>SEnRmOG<br>0.0 0 0.0 0<br>0 1 2 3 4 5 6 7 8 9 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5<br>CREEP Eo2 STHCOLCERrRET<br>DC Current(A) DC Current(A)<br>BMRB000606306R8MA1 BMRB000606308R2MA1<br>10.0 100 10.0 100<br>Inductance(μH) Inductance(μH)<br>Temp Rise (°C) Temp Rise (°C)<br>8.0 80 8.0 80<br>= e =<br>6.0 60 6.0 60<br>e e ACTER<br>4.0 40 4.0 40<br>aera an<br>2.0 20 2.0 20<br>oaaerane ee<br>0.0 CORT 0 0.0 CEE 0<br>0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7<br>DC Current(A) DC Current(A)<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>) ℃ ) ℃<br>Inductance(μH) Temp Rise( Inductance(μH) Temp Rise(<br>**----- End of picture text -----**<br> ## **BMRB00060630 Series Specification** ## ~~__|~~ 14 Graph **==> picture [216 x 130] intentionally omitted <==** **----- Start of picture text -----**<br> BMRB00060630100MA1<br>15 100<br>Inductance(μH)<br>Temp Rise (°C)<br>12 = Oo 80<br>9 60<br>S a<br>6 40<br>CEPT Err<br>3 20<br>SOO<br>0 COCEP TE 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0<br>DC Current(A)<br>) ℃<br>Inductance(μH) Temp Rise(<br>**----- End of picture text -----**<br>
Updated at June 10, 2026
Pulse Electronics, a YAGEO company, is a global leader in the design and manufacturing of passive electronic components. With a legacy of innovation dating back to 1956, the company provides essential technology for the communications, computing, industrial, transportation, and IoT sectors. Pulse is recognized worldwide for delivering high-performance solutions that power advanced applications, ranging from 5G networks and electric vehicles to data centers and smart grids. The company's extensive product portfolio is heavily anchored in power and networking magnetics. This includes a comprehensive range of power inductors engineered for exceptional efficiency and reliability in demanding environments. To address complex electromagnetic compatibility challenges, Pulse also manufactures highly effective EMC and RFI suppression solutions, such as common mode chokes and filters, alongside specialized toroidal and RF inductors designed to ensure clean power delivery and optimal signal integrity. Beyond traditional magnetics, Pulse excels in the development of advanced wireless and power conversion components. Their connectivity solutions feature a wide array of high-performance RF antennas and single-band chip antennas tailored for modern connected devices. Furthermore, to support sophisticated power architectures, Pulse provides a broad spectrum of transformers—encompassing PCB-mounted designs, current sensing transformers, and precise pulse transformers—equipping engineers with robust, industry-proven components for power isolation and measurement.
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