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BGX220S22HNA21R
BLUETOOTH MODULE
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: SILICON LABS
- Product type: Bluetooth Modules & Adaptors
- SVHC: To Be Advised
| Delivery and price | |
|---|---|
| Units per pack | 2500 |
| Price | 5.36 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**==> picture [577 x 653] intentionally omitted <==** **----- Start of picture text -----**<br> BGX220S Wireless Gecko Bluetooth<br>Xpress Module Data Sheet<br>The BGX220S is a wireless cable replacement module that elimi-<br>nates Bluetooth firmware development complexity with a serial in- KEY FEATURES<br>terface that can operate as a raw data stream or control the de- • Bluetooth 5.2 Technologies<br>vice through an abstracted command API. The BGX220S can fa- • Bluetooth Low Energy<br>cilitate a device-to-device cable replacement link or communicate • Built-in antenna<br>with mobile devices through the Xpress Bluetooth mobile library. • Up to 6 dBm TX power<br>The device integrates a Bluetooth 5.2 compliant stack to future- •• -98.6 dBm BLE RX sensitivity at 1 Mbps8 GPIO pins<br>proof applications as Bluetooth 5.2 adoption increases. • I2C master interface<br>BGX220S modules are a full solution that comes with fully-upgradeable, robust software • Input pin event monitoring and response<br>stacks, world-wide regulatory certifications, and support that will minimize and simplify • 6.0 mm x 6.0 mm<br>the engineering and development of your end-products helping to accelerate their time-<br>to-market.<br>The BGX220S is intended for a broad range of applications, including:<br>• Health, sports, and wellness devices<br>• Industrial, home, and building automation<br>• Smart phone, tablet, and PC accessories<br>Serial interface Bluetooth Radio<br>controller<br>Bluetooth 5 Radio<br>compliant transceiver<br>Command<br>stack<br>parser<br>Chip<br>Raw data Timers antenna<br>stream<br>buffers<br>OTA Matching<br>manager network<br>silabs.com | Building a more connected world. Rev. 1.0<br>Not Recommended for New Designs<br>control<br>RX/TX and flow<br>GPIO control<br>**----- End of picture text -----**<br> BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Ordering Information ## **1. Ordering Information** **Table 1.1. Ordering Information** |**TX Power**<br>**Flash**<br>**RAM**|| |---|---| |**Ordering Code**<br>**Protocol Stack**<br>**Rating**<br>**Antenna**<br>**RF Shield**<br>**(kB)**<br>**(kB)**<br>**GPIO**<br>**Temp Range**<br>BGX220S22HNA21<br>• Bluetooth 5.2<br>6 dBm<br>Built-in<br>Yes<br>512<br>32<br>8<br>-40 to 105 °C<br>**Note:**<br>1. End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with<br>the formal certification test reports.<br>2. Throughout this document, the device in the table above may be referred to by their product family name (e.g. BGX220S), by<br>model name (BGX220S22A), or by full ordering code.<br>Not Recommended for New Designs|| **silabs.com** | Building a more connected world. Rev. 1.0 | 2 ## **Table of Contents** |**Table of Contents**|||||| |---|---|---|---|---|---| |**1. Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**<br>**.**<br>**.**|**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**. 2**| |**2. System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**<br>**.**<br>**.**|**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**. 5**| |2.1 Block Diagram .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 5<br>2.2 EFR32BG22 SoC .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 6<br>2.3 Antenna .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 6<br>2.4 Power Supply<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 6<br>**3. Electrical Characteristics .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**. 7**<br>3.1 Absolute Maximum Ratings.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 7<br>3.2 General Operating Conditions .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 8<br>3.2.1 DC-DC Operating Limits<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 9<br>3.3 Power Consumption .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.10<br>3.4 RF Transmitter General Characteristics for the 2.4 GHz Band .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.11<br>3.5 RF Receiver General Characteristics for the 2.4 GHz Band .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.11<br>3.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate .<br>.<br>.12<br>3.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate .<br>.<br>.13<br>3.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate .<br>.14<br>3.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate .<br>.15<br>3.10 Non-Volatile Configuration Storage.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.16<br>3.11 High-Frequency Crystal<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.16<br>3.12 GPIO Pins .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.17<br>3.13 Typical Performance Curves .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.17<br>3.13.1 Antenna Typical Characteristics<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.18<br>**4. Reference Diagrams.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**19**<br>4.1 Typical Connections .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.19<br>**5. 44-Pin SiP Module Device Pinout .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**20**<br>**6. Functional overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**22**<br>6.1 Introduction .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.22<br>6.2 Communication Use Cases.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.22<br>6.3 Embedded Interface .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.22<br>6.4 Command Mode and Streaming Mode .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.22<br>6.5 Command API .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.23<br>6.6 GPIO Control<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.23<br>Not Recommended for New Designs|||||| |6.7 Device Configuration .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.<br>.|.<br>.<br>.|.<br>.<br>.<br>.<br>.<br>.|.|.23| |6.8 Security Features .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.<br>.|.<br>.<br>.|.<br>.<br>.<br>.<br>.<br>.|.|.23| |6.9 OTA<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.<br>.|.<br>.<br>.|.<br>.<br>.<br>.<br>.<br>.|.|.23| **silabs.com** | Building a more connected world. Rev. 1.0 | 3 **==> picture [577 x 646] intentionally omitted <==** **----- Start of picture text -----**<br> 6.10 Direct Test Mode Support . . . . . . . . . . . . . . . . . . . . . . . . . .23<br>7. Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24<br>7.1 Layout and Placement . . . . . . . . . . . . . . . . . . . . . . . . . . .24<br>7.2 Best Design Practices . . . . . . . . . . . . . . . . . . . . . . . . . . .27<br>7.3 Radio Performance vs. Carrier Board Size . . . . . . . . . . . . . . . . . . . .29<br>7.4 Proximity to Other Materials . . . . . . . . . . . . . . . . . . . . . . . . .29<br>7.5 Proximity to Human Body . . . . . . . . . . . . . . . . . . . . . . . . . .30<br>8. Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . .31<br>8.1 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . .31<br>8.2 Recommended PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . .33<br>8.3 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34<br>9. Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . 35<br>10. Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36<br>11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38<br>11.1 Certifications for Model BGM220S22A . . . . . . . . . . . . . . . . . . . . .38<br>12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br> **silabs.com** | Building a more connected world. Rev. 1.0 | 4 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet System Overview ## **2. System Overview** ## **2.1 Block Diagram** The BGX220S module combines an energy-friendly MCU with a highly integrated radio transceiver in a SiP module with a robust, integrated antenna. This section gives a short introduction to the features of the module. Note that features in the module are not directly configurable in this pre-programmed product, and are instead controlled through the abstracted command and variable set. The block diagram for the BGX220S module is shown in the figure below. The wireless module includes the EFR32BG22 wireless System on a Chip (SoC), required decoupling capacitors and inductors, 38.4 MHz crystal, RF matching circuit, and integrated antenna. 2400 – 2483.5 MHz External Antenna 2400 – 2483.5 MHz 1.8 - 3.8 V **VREGVDD** or **ANT_OUT Integral IOVDD Supply Decoupling Antenna ANT_IN and DC-DC Support VREG DECOUPLE** 0 Ohm **RF_2G4 RF Match Silicon Labs (up to 8)** ~~**G**~~ **PIO EFR32BG22 HF XTAL GND 38.4 MHz Figure 2.1. BGX220S Block Diagram** A simplified internal schematic for the BGX220S module is shown in Figure 2.2 BGX220S Module Schematic on page 5. EFR32BG22 VREGVDD VREGVDD Integral ANT_OUT 4.7µF AVDD Antenna ANT_IN IOVDD IOVDD Matching VREGSW RF2G4_IO RF_2G4 Network 2.2µH GPIOx GPIO(0-7) VREG DVDD RFVDD PAVDD HFXTAL_I 4.7µF 38.4 MHz DECOUPLE DECOUPLE HFXTAL_O 2.2µF **Figure 2.2. BGX220S Module Schematic silabs.com** | Building a more connected world. Rev. 1.0 | 5 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet System Overview ## **2.2 EFR32BG22 SoC** The EFR32BG22 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 512 kB of flash memory, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG22 Wireless Gecko Reference Manual and the EFR32BG22 Data Sheet for details. Note that the Flash and other features in this product are not directly accessible, and are instead accessed through the product's abstracted command and variable set. **==> picture [577 x 569] intentionally omitted <==** **----- Start of picture text -----**<br> 2.3 Antenna<br>BGX220S modules include an integral antenna on board with the characteristics detailed in the tables below.<br>Table 2.1. Antenna Efficiency and Peak Gain<br>Parameter With optimal layout Note<br>Efficiency -1 to -2 dB Antenna efficiency, gain and radiation pattern are highly depend-<br>ent on the application PCB layout and mechanical design. Refer<br>Peak gain 2.3 dBi to 7. Design Guidelines for recommendations to achieve optimal<br>antenna performance.<br>2.4 Power Supply<br>The BGX220S requires a single nominal supply level of 3.0 V to operate. All necessary decoupling and filtering components are inclu-<br>ded in the module.<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br> **silabs.com** | Building a more connected world. Rev. 1.0 | 6 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3. Electrical Characteristics** All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: - Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization. - Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna. |• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,<br>unless stated otherwise.<br>**3.1 Absolute Maximum Ratings**<br>Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of<br>the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure<br>to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-<br>bility data, see the Quality and Reliability Monitor Report athttp://www.silabs.com/support/quality/pages/default.aspx.<br>**Table 3.1. Absolute Maximum Ratings**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Storage temperature range<br>TSTG<br>-50<br>—<br>+150<br>°C<br>Voltage on any supply pin<br>VDDMAX<br>-0.3<br>—<br>3.8<br>V<br>Junction temperature<br>TJMAX<br>-N grade<br>—<br>—<br>+105<br>°C<br>Voltage ramp rate on any<br>supply pin<br>VDDRAMPMAX<br>—<br>—<br>1.0<br>V / µs<br>DC voltage on any GPIO pin<br>VDIGPIN<br>-0.3<br>—<br>VIOVDD+<br>0.3<br>V<br>Input RF level on RF pin<br>RF_2G4<br>PRFMAX2G4<br>—<br>—<br>+10<br>dBm<br>Absolute voltage on RF pin<br>RF_2G4<br>VMAX2G4<br>-0.3<br>—<br>VVREG+<br>0.3<br>V<br>Total current into VDD power<br>lines<br>IVDDMAX<br>Source<br>—<br>—<br>200<br>mA<br>Total current into VSS<br>ground lines<br>IVSSMAX<br>Sink<br>—<br>—<br>200<br>mA<br>Current per I/O pin<br>IIOMAX<br>Sink<br>—<br>—<br>50<br>mA<br>Source<br>—<br>—<br>50<br>mA<br>Current for all I/O pins<br>IIOALLMAX<br>Sink<br>—<br>—<br>200<br>mA<br>Source<br>—<br>—<br>200<br>mA<br>Not Recommended for New Designs|• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,<br>unless stated otherwise.<br>**3.1 Absolute Maximum Ratings**<br>Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of<br>the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure<br>to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-<br>bility data, see the Quality and Reliability Monitor Report athttp://www.silabs.com/support/quality/pages/default.aspx.<br>**Table 3.1. Absolute Maximum Ratings**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Storage temperature range<br>TSTG<br>-50<br>—<br>+150<br>°C<br>Voltage on any supply pin<br>VDDMAX<br>-0.3<br>—<br>3.8<br>V<br>Junction temperature<br>TJMAX<br>-N grade<br>—<br>—<br>+105<br>°C<br>Voltage ramp rate on any<br>supply pin<br>VDDRAMPMAX<br>—<br>—<br>1.0<br>V / µs<br>DC voltage on any GPIO pin<br>VDIGPIN<br>-0.3<br>—<br>VIOVDD+<br>0.3<br>V<br>Input RF level on RF pin<br>RF_2G4<br>PRFMAX2G4<br>—<br>—<br>+10<br>dBm<br>Absolute voltage on RF pin<br>RF_2G4<br>VMAX2G4<br>-0.3<br>—<br>VVREG+<br>0.3<br>V<br>Total current into VDD power<br>lines<br>IVDDMAX<br>Source<br>—<br>—<br>200<br>mA<br>Total current into VSS<br>ground lines<br>IVSSMAX<br>Sink<br>—<br>—<br>200<br>mA<br>Current per I/O pin<br>IIOMAX<br>Sink<br>—<br>—<br>50<br>mA<br>Source<br>—<br>—<br>50<br>mA<br>Current for all I/O pins<br>IIOALLMAX<br>Sink<br>—<br>—<br>200<br>mA<br>Source<br>—<br>—<br>200<br>mA<br>Not Recommended for New Designs| |---|---| |**silabs.com**| Building a more connected world.<br>Rev. 1.0 | 7|| BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.2 General Operating Conditions** This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum values of all other tables are specifed over this operating range, unless otherwise noted. **Table 3.2. General Operating Conditions** |**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Operating ambient tempera-<br>ture range<br>TA<br>-N temperature grade<br>-40<br>—<br>+105<br>°C<br>IOVDDx operating supply<br>voltage (All IOVDD pins)<br>VIOVDDx<br>1.71<br>3.0<br>3.8<br>V<br>VREGVDD operating supply<br>voltage<br>VVREGVDD<br>DCDC in regulation1<br>2.2<br>3.0<br>3.8<br>V<br>DCDC in bypass<br>1.8<br>3.0<br>3.8<br>V<br>**Note:**<br>1. The supported maximum VVREGVDDin regulation mode is a function of temperature and 10-year lifetime average load current.<br>See more details in3.2.1 DC-DC Operating Limits.<br>Not Recommended for New Designs|**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Operating ambient tempera-<br>ture range<br>TA<br>-N temperature grade<br>-40<br>—<br>+105<br>°C<br>IOVDDx operating supply<br>voltage (All IOVDD pins)<br>VIOVDDx<br>1.71<br>3.0<br>3.8<br>V<br>VREGVDD operating supply<br>voltage<br>VVREGVDD<br>DCDC in regulation1<br>2.2<br>3.0<br>3.8<br>V<br>DCDC in bypass<br>1.8<br>3.0<br>3.8<br>V<br>**Note:**<br>1. The supported maximum VVREGVDDin regulation mode is a function of temperature and 10-year lifetime average load current.<br>See more details in3.2.1 DC-DC Operating Limits.<br>Not Recommended for New Designs| |---|---| |**silabs.com**| Building a more connected world.<br>Rev. 1.0 | 8|| BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.2.1 DC-DC Operating Limits** The maximum supported voltage on the VDD supply pin is limited under certain conditions. Maximum input voltage is a function of temperature and the average load current over a 10-year lifetime. Figure 3.1 Lifetime average load current limit vs. Maximum input voltage on page 9 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the reliability and performance of the DC-DC converter. The average load current for an application can typically be determined by examining the current profile during the time the device is powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of the time active and consuming 10 mA has an average lifetime load current of about 102 µA. 60 Tj ≤ 105 °C 5 3.3 3.8 Maximum VVREGVDD (V) **Figure 3.1. Lifetime average load current limit vs. Maximum input voltage** The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting. Figure 3.2 Transient maximum load current vs. Minimum input voltage on page 9 shows the max load current vs. input voltage for different DC-DC peak inductor current settings. 60 36 IPEAK = 150 mA 5 IPEAK = 90 mA 1.8 2.2 Minimum VVREGVDD (V) **Figure 3.2. Transient maximum load current vs. Minimum input voltage** **silabs.com** | Building a more connected world. Rev. 1.0 | 9 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.3 Power Consumption** **Table 3.3. Power Consumption** |**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|| |---|---|---|---|---|---|---|---| |Active supply current, Un-<br>connected, Idle<br>|IACTIVE_IDLE<br>|Baud rate ≤ 9600 bps<br>|—<br>|2.0<br>|—<br>|µA<br>|| |||Baud rate > 9600 bps<br>|—<br>|1.0<br>|—<br>|mA<br>n|| |Active supply current, Adver-<br>tising<br>|IACTIVE_ADV<br>|Interval = 546.25 ms, Baud rate ≤<br>9600 bps<br>|—<br>|30<br>|—<br>i|µA<br>|| |||Interval = 20 ms, Baud rate ≤<br>9600 bps<br>|—<br>|0.67<br>|—<br>es|mA<br>|| |||Interval = 546.25 ms, Baud rate ><br>9600 bps<br>|—<br>|1.0<br>|—<br>|mA<br>|| |||Interval = 20 ms, Baud rate ><br>9600 bps<br>|—<br>|1.6<br>w||mA<br>|| |Active supply current, Con-<br>nected, 15 ms Interval<br>|IACTIVE_CONN<br>|Idle, Baud Rate ≤ 9600 bps<br>|—<br>|325<br>|—<br>|µA<br>|| |||TX/RX (acknowledged) at highest<br>throughput, Baud Rate ≤ 9600<br>bps<br>|—<br>N|TX: 4.7<br>RX: 3.8<br>|—<br>|mA<br>|| |||Idle, Baud Rate > 9600 bps<br>|—<br>|3.6<br>|—<br>|mA<br>|| |||TX/RX (acknowledged) at highest<br>throughput, Baud Rate > 9600<br>bps<br>d f|—<br>|TX: 3.8<br>RX: 3.7<br>|—<br>|mA<br>|| |Supply current in low power<br>mode<br>|ILPM<br>|Radio disabled<br>|—<br>|2.25<br>|—<br>|µA<br>|| |||Radio enabled, Advertising, Inter-<br>val = 546.25 ms<br>d|—<br>|26<br>|—<br>|µA<br>|| |||Radio enabled, Advertising, Inter-<br>val = 20 ms<br>n|—<br>|0.65<br>|—<br>|mA<br>|| |**Note:**<br>1. All current consumption figures were measured using Bluetooth Xpress firmware version 1.3.2.<br>m|||||||| **silabs.com** | Building a more connected world. Rev. 1.0 | 10 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.4 RF Transmitter General Characteristics for the 2.4 GHz Band** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 3.4. RF Transmitter General Characteristics for the 2.4 GHz Band** |**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>| |---|---|---|---|---|---|---| |RF tuning frequency range<br>|FRANGE<br>||2400<br>|—<br>|2483.5<br>|MHz<br>| |Maximum TX power1<br>|POUTMAX<br>|6 dBm output power<br>|—<br>|6.0<br>|—<br>|dBm<br>n| |||0 dBm output power<br>|—<br>|-0.5<br>|—<br>i|dBm<br>| |Minimum active TX Power<br>|POUTMIN<br>||—<br>|-27<br>|—<br>s|dBm<br>| |Output power variation vs<br>VREGVDD supply voltage<br>variation, frequency = 2450<br>MHz<br>|POUTVAR_V<br>|6 dBm output power with<br>VREGVDD voltage swept from<br>1.8 V to 3.0 V<br>|—<br>|0.04<br>D|—<br>e|dB<br>| |||0 dBm output power, with<br>VREGVDD voltage swept from<br>1.8 to 3.0 V<br>|—<br>|0.04<br>w|—<br>|dB<br>| |Output power variation vs<br>temperature, Frequency =<br>2450 MHz<br>|POUTVAR_T<br>|6 dBm output power, (-40 to +105<br>°C)<br>|—<br>e|0.2<br>|—<br>|dB<br>| |||0 dBm output power, (-40 to +105<br>°C)<br>|—<br>|1.3<br>|—<br>|dB<br>| |Output power variation vs RF<br>frequency<br>|POUTVAR_F<br>|6 dBm output power<br>|—<br>|0.09<br>|—<br>|dB<br>| |||0 dBm output power<br>f|—<br>|0.15<br>|—<br>|dB<br>| |**Note:**<br>1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-<br>ered in this data sheet can be found in the Max TX Power column of the Ordering Information Table.<br>ded||||||| **==> picture [261 x 306] intentionally omitted <==** **----- Start of picture text -----**<br> Note:<br>3.5 RF Receiver General Characteristics for the 2.4 GHz Band<br>Unless otherwise indicated, typical conditions are: TAA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.<br>Parameter Symbol<br>RF tuning frequency range FRANGE<br>**----- End of picture text -----**<br> ## **3.5 RF Receiver General Characteristics for the 2.4 GHz Band** Unless otherwise indicated, typical conditions are: TAA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. ## **Table 3.5. RF Receiver General Characteristics for the 2.4 GHz Band** |**Table 3.5. RF Receiver General Characteristics for the 2.4 GHz Band**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>RF tuning frequency range<br>FRANGE<br>2400<br>—<br>2483.5<br>MHz<br>om| |---| || **silabs.com** | Building a more connected world. Rev. 1.0 | 11 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 3.6. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate** ||**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|| |---|---|---|---|---|---|---|---|---| ||Max usable receiver input<br>level<br>|SAT<br>|Signal is reference signal1<br>|—<br>|10<br>|—<br>|dBm<br>n|| ||Sensitivity<br>|SENS<br>|Signal is reference signal, 37 byte<br>payload2<br>|—<br>|-98.6<br>|—<br>i|dBm<br>|| ||||Signal is reference signal, 255<br>byte payload1<br>|—<br>|-97.2<br>|—<br>es|dBm<br>|| ||||With non-ideal signals3 1<br>|—<br>|-96.6<br>|—<br>|dBm<br>|| ||Signal to co-channel interfer-<br>er<br>|C/ICC<br>|(see notes)1 4<br>|—<br>|8.7<br>|—<br>|dB<br>|| ||N ± 1 Adjacent channel se-<br>lectivity<br>|C/I1<br>|Interferer is reference signal at +1<br>MHz offset1 5 4 6<br>|—<br>e|-6.6<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -1<br>MHz offset1 5 4 6<br>|—<br>N|-6.5<br>|—<br>|dB<br>|| ||N ± 2 Alternate channel se-<br>lectivity<br>|C/I2<br>|Interferer is reference signal at +2<br>MHz offset1 5 4 6<br>or|—<br>|-40.9<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -2<br>MHz offset1 5 4 6<br>f|—<br>|-39.9<br>|—<br>|dB<br>|| ||N ± 3 Alternate channel se-<br>lectivity<br>|C/I3<br>|Interferer is reference signal at +3<br>MHz offset1 5 4 6<br>ed|—<br>|-45.9<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -3<br>MHz offset1 5 4 6<br>nd|—<br>|-46.2<br>|—<br>|dB<br>|| ||Selectivity to image frequen-<br>cy<br>|C/IIM<br>|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6<br>e|—<br>|-23.5<br>|—<br>|dB<br>|| ||Selectivity to image frequen-<br>cy ± 1 MHz<br>c|C/IIM_1<br>om|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6<br>|—<br>|-40.9<br>|—<br>|dB<br>|| ||||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6<br>|—<br>|-6.6<br>|—<br>|dB<br>|| ||Intermodulation performance<br>e|IM<br>|n = 3 (see note7)<br>|—<br>|-17.1<br>|—<br>|dBm<br>|| ||**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -67 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.<br>7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4<br>Not R|||||||| **silabs.com** | Building a more connected world. Rev. 1.0 | 12 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 3.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate** ||**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|| |---|---|---|---|---|---|---|---|---| ||Max usable receiver input<br>level<br>|SAT<br>|Signal is reference signal1<br>|—<br>|10<br>|—<br>|dBm<br>n|| ||Sensitivity<br>|SENS<br>|Signal is reference signal, 37 byte<br>payload2<br>|—<br>|-95.9<br>|—<br>i|dBm<br>|| ||||Signal is reference signal, 255<br>byte payload1<br>|—<br>|-94.3<br>|—<br>es|dBm<br>|| ||||With non-ideal signals3 1<br>|—<br>|-94.0<br>|—<br>|dBm<br>|| ||Signal to co-channel interfer-<br>er<br>|C/ICC<br>|(see notes)1 4<br>|—<br>|8.8<br>|—<br>|dB<br>|| ||N ± 1 Adjacent channel se-<br>lectivity<br>|C/I1<br>|Interferer is reference signal at +2<br>MHz offset1 5 4 6<br>|—<br>e|-9.2<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -2<br>MHz offset1 5 4 6<br>|—<br>N|-6.6<br>|—<br>|dB<br>|| ||N ± 2 Alternate channel se-<br>lectivity<br>|C/I2<br>|Interferer is reference signal at +4<br>MHz offset1 5 4 6<br>or|—<br>|-43.3<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -4<br>MHz offset1 5 4 6<br>f|—<br>|-44.0<br>|—<br>|dB<br>|| ||N ± 3 Alternate channel se-<br>lectivity<br>|C/I3<br>|Interferer is reference signal at +6<br>MHz offset1 5 4 6<br>ed|—<br>|-48.6<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -6<br>MHz offset1 5 4 6<br>nd|—<br>|-50.7<br>|—<br>|dB<br>|| ||Selectivity to image frequen-<br>cy<br>|C/IIM<br>|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6<br>e|—<br>|-23.8<br>|—<br>|dB<br>|| ||Selectivity to image frequen-<br>cy ± 2 MHz<br>c|C/IIM_1<br>om|Interferer is reference signal at im-<br>age frequency +2 MHz with 1<br>MHz precision1 6<br>|—<br>|-43.3<br>|—<br>|dB<br>|| ||||Interferer is reference signal at im-<br>age frequency -2 MHz with 1 MHz<br>precision1 6<br>|—<br>|-9.2<br>|—<br>|dB<br>|| ||Intermodulation performance<br>e|IM<br>|n = 3 (see note7)<br>|—<br>|-18.8<br>|—<br>|dBm<br>|| ||**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -64 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.<br>7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4<br>Not R|||||||| **silabs.com** | Building a more connected world. Rev. 1.0 | 13 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 3.8. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate** ||**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|| |---|---|---|---|---|---|---|---|---| ||Max usable receiver input<br>level<br>|SAT<br>|Signal is reference signal1<br>|—<br>|10<br>|—<br>|dBm<br>n|| ||Sensitivity<br>|SENS<br>|Signal is reference signal, 37 byte<br>payload2<br>|—<br>|-102.3<br>|—<br>i|dBm<br>|| ||||Signal is reference signal, 255<br>byte payload1<br>|—<br>|-100.9<br>|—<br>es|dBm<br>|| ||||With non-ideal signals3 1<br>|—<br>|-99.8<br>|—<br>|dBm<br>|| ||Signal to co-channel interfer-<br>er<br>|C/ICC<br>|(see notes)1 4<br>|—<br>|2.7<br>|—<br>|dB<br>|| ||N ± 1 Adjacent channel se-<br>lectivity<br>|C/I1<br>|Interferer is reference signal at +1<br>MHz offset1 5 4 6<br>|—<br>e|-8.0<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -1<br>MHz offset1 5 4 6<br>|—<br>N|-7.9<br>|—<br>|dB<br>|| ||N ± 2 Alternate channel se-<br>lectivity<br>|C/I2<br>|Interferer is reference signal at +2<br>MHz offset1 5 4 6<br>or|—<br>|-46.5<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -2<br>MHz offset1 5 4 6<br>f|—<br>|-49.9<br>|—<br>|dB<br>|| ||N ± 3 Alternate channel se-<br>lectivity<br>|C/I3<br>|Interferer is reference signal at +3<br>MHz offset1 5 4 6<br>ed|—<br>|-48.9<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -3<br>MHz offset1 5 4 6<br>nd|—<br>|-53.8<br>|—<br>|dB<br>|| ||Selectivity to image frequen-<br>cy<br>|C/IIM<br>|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6<br>e|—<br>|-48.3<br>|—<br>|dB<br>|| ||Selectivity to image frequen-<br>cy ± 1 MHz<br>c|C/IIM_1<br>om|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6<br>|—<br>|-49.9<br>|—<br>|dB<br>|| ||||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6<br>|—<br>|-46.5<br>|—<br>|dB<br>|| ||**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -72 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.<br>Not Re|||||||| **silabs.com** | Building a more connected world. Rev. 1.0 | 14 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz. **Table 3.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate** ||**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|| |---|---|---|---|---|---|---|---|---| ||Max usable receiver input<br>level<br>|SAT<br>|Signal is reference signal1<br>|—<br>|10<br>|—<br>|dBm<br>n|| ||Sensitivity<br>|SENS<br>|Signal is reference signal, 37 byte<br>payload2<br>|—<br>|-106.4<br>|—<br>i|dBm<br>|| ||||Signal is reference signal, 255<br>byte payload1<br>|—<br>|-106.0<br>|—<br>es|dBm<br>|| ||||With non-ideal signals3 1<br>|—<br>|-105.6<br>|—<br>|dBm<br>|| ||Signal to co-channel interfer-<br>er<br>|C/ICC<br>|(see notes)1 4<br>|—<br>|0.9<br>|—<br>|dB<br>|| ||N ± 1 Adjacent channel se-<br>lectivity<br>|C/I1<br>|Interferer is reference signal at +1<br>MHz offset1 5 4 6<br>|—<br>e|-13.6<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -1<br>MHz offset1 5 4 6<br>|—<br>N|-13.4<br>|—<br>|dB<br>|| ||N ± 2 Alternate channel se-<br>lectivity<br>|C/I2<br>|Interferer is reference signal at +2<br>MHz offset1 5 4 6<br>or|—<br>|-52.6<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -2<br>MHz offset1 5 4 6<br>f|—<br>|-55.8<br>|—<br>|dB<br>|| ||N ± 3 Alternate channel se-<br>lectivity<br>|C/I3<br>|Interferer is reference signal at +3<br>MHz offset1 5 4 6<br>ed|—<br>|-53.7<br>|—<br>|dB<br>|| ||||Interferer is reference signal at -3<br>MHz offset1 5 4 6<br>nd|—<br>|-59.0<br>|—<br>|dB<br>|| ||Selectivity to image frequen-<br>cy<br>|C/IIM<br>|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6<br>e|—<br>|-52.7<br>|—<br>|dB<br>|| ||Selectivity to image frequen-<br>cy ± 1 MHz<br>c|C/IIM_1<br>om|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6<br>|—<br>|-53.7<br>|—<br>|dB<br>|| ||||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6<br>|—<br>|-52.6<br>|—<br>|dB<br>|| ||**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1<br>4. Desired signal -79 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.<br>Not Re|||||||| **silabs.com** | Building a more connected world. Rev. 1.0 | 15 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.10 Non-Volatile Configuration Storage** **Table 3.10. Non-volatile Configuration Storage** |**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Supply voltage during update VFLASH<br>1.71<br>—<br>3.8<br>V<br>**3.11 High-Frequency Crystal**<br>**Table 3.11. High-Frequency Crystal**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Crystal frequency<br>fHFXTAL<br>—<br>38.4<br>—<br>MHz<br>Initial calibrated accuracy<br>ACCHFXTAL<br>-10<br>+/-5<br>10<br>ppm<br>Temperature drift<br>DRIFTHFXTAL<br>Across specified temperature<br>range<br>-20<br>—<br>20<br>ppm<br>Not Recommended for New Designs|**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Supply voltage during update VFLASH<br>1.71<br>—<br>3.8<br>V<br>**3.11 High-Frequency Crystal**<br>**Table 3.11. High-Frequency Crystal**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Crystal frequency<br>fHFXTAL<br>—<br>38.4<br>—<br>MHz<br>Initial calibrated accuracy<br>ACCHFXTAL<br>-10<br>+/-5<br>10<br>ppm<br>Temperature drift<br>DRIFTHFXTAL<br>Across specified temperature<br>range<br>-20<br>—<br>20<br>ppm<br>Not Recommended for New Designs|**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Supply voltage during update VFLASH<br>1.71<br>—<br>3.8<br>V<br>**3.11 High-Frequency Crystal**<br>**Table 3.11. High-Frequency Crystal**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Crystal frequency<br>fHFXTAL<br>—<br>38.4<br>—<br>MHz<br>Initial calibrated accuracy<br>ACCHFXTAL<br>-10<br>+/-5<br>10<br>ppm<br>Temperature drift<br>DRIFTHFXTAL<br>Across specified temperature<br>range<br>-20<br>—<br>20<br>ppm<br>Not Recommended for New Designs|**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Supply voltage during update VFLASH<br>1.71<br>—<br>3.8<br>V<br>**3.11 High-Frequency Crystal**<br>**Table 3.11. High-Frequency Crystal**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Crystal frequency<br>fHFXTAL<br>—<br>38.4<br>—<br>MHz<br>Initial calibrated accuracy<br>ACCHFXTAL<br>-10<br>+/-5<br>10<br>ppm<br>Temperature drift<br>DRIFTHFXTAL<br>Across specified temperature<br>range<br>-20<br>—<br>20<br>ppm<br>Not Recommended for New Designs| |---|---|---|---| |**silabs.com**| Building a more connected world.||Rev. 1.0 | 16|| BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.12 GPIO Pins** Unless otherwise indicated, typical conditions are: IOVDD = 3.0 V. **Table 3.12. GPIO Pins** ||**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|| |---|---|---|---|---|---|---|---|---| ||Leakage current<br>|ILEAK_IO<br>|MODEx = DISABLED, IOVDD =<br>1.71 V<br>|—<br>|1.9<br>|—<br>|nA<br>n|| ||||MODEx = DISABLED, IOVDD =<br>3.0 V<br>|—<br>|2.5<br>|—<br>i|nA<br>|| ||Input low voltage1<br>|VIL<br>|Any GPIO pin<br>|—<br>|—<br>|0.3*IOVDD<br>s|V<br>|| ||||RESETn<br>|—<br>|—<br>|0.3*DVDD<br>|V<br>|| ||Input high voltage1<br>|VIH<br>|Any GPIO pin<br>|0.7*IOVDD<br>|—<br>|—<br>|V<br>|| ||||RESETn<br>|0.7*DVDD<br>|—<br>|—<br>|V<br>|| ||Hysteresis of input voltage<br>|VHYS<br>|Any GPIO pin<br>|0.05*IOVD<br>D<br>|—<br>w|—<br>|V<br>|| ||||RESETn<br>|0.05*DVDD<br>|—<br>|—<br>|V<br>|| ||Output high voltage<br>|VOH<br>|Sourcing 20mA, IOVDD = 3.0 V<br>|0.8 *<br>IOVDD<br>|—<br>|—<br>|V<br>|| ||||Sourcing 8mA, IOVDD = 1.71 V<br>o|0.6 *<br>IOVDD<br>|—<br>|—<br>|V<br>|| ||Output low voltage<br>|VOL<br>|Sinking 20mA, IOVDD = 3.0 V<br>d f|—<br>|—<br>|0.2 *<br>IOVDD<br>|V<br>|| ||||Sinking 8mA, IOVDD = 1.71 V<br>e|—<br>|—<br>|0.4 *<br>IOVDD<br>|V<br>|| ||GPIO rise time<br>|TGPIO_RISE<br>|IOVDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%<br>nd|—<br>|8.4<br>|—<br>|ns<br>|| ||||IOVDD = 1.71 V, Cload= 50pF,<br>SLEWRATE = 4, 10% to 90%<br>e|—<br>|13<br>|—<br>|ns<br>|| ||GPIO fall time<br>|TGPIO_FALL<br>mm|IOVDD = 3.0 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%<br>|—<br>|7.1<br>|—<br>|ns<br>|| ||||IOVDD = 1.71 V, Cload= 50pF,<br>SLEWRATE = 4, 90% to 10%<br>|—<br>|11.9<br>|—<br>|ns<br>|| ||Pull up/down resistance2<br>t Rec|RPULL<br>|Any GPIO pin. Pull-up to IOVDD:<br>MODEn = DISABLE DOUT=1.<br>Pull-down to VSS: MODEn =<br>WIREDORPULLDOWN DOUT =<br>0.<br>|35<br>|44<br>|55<br>|kΩ<br>|| ||||RESETn pin. Pull-up to DVDD<br>|35<br>|44<br>|55<br>|kΩ<br>|| ||Maximum filtered glitch width<br>o|TGF<br>|MODE = INPUT, DOUT = 1<br>|—<br>|27<br>|—<br>|ns<br>|| ||**Note:**<br>1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD.<br>2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD.<br>N|||||||| ## **3.13 Typical Performance Curves** Typical performance curves indicate typical characterized performance under the stated conditions. **silabs.com** | Building a more connected world. Rev. 1.0 | 17 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Electrical Characteristics ## **3.13.1 Antenna Typical Characteristics** Typical BGX220S radiation patterns for the on-board chip antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. **==> picture [577 x 653] intentionally omitted <==** **----- Start of picture text -----**<br> Zz Zz<br>I / / ; tA .fie | \ \\ \ i i f ay, \ :<br>x<br>Top Left: Phi 0 [o] , Top Right: Phi 90 [o] , Bottom Left: Theta 90 [o]<br>Figure 3.3. BGX220S Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board<br>silabs.com | Building a more connected world. Rev. 1.0 | 18<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br> BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Reference Diagrams ## **4. Reference Diagrams** ## **4.1 Typical Connections** **==> picture [577 x 681] intentionally omitted <==** **----- Start of picture text -----**<br> The BGX220S can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply and host<br>interface connections are shown in the figure below.<br>Note that an external pull-up should not be placed on the reset pin.<br>Antenna Loop<br>RESETn<br>0.1 µF<br>(optional)<br>0 Ohm NC NC<br>ANT_IN NC<br>RF_2G4 BGX220S NC<br>GND NC<br>GND NC<br>GPIO0 BOOT<br>VDD<br>GPIO1 NC<br>GPIO2 IOVDD<br>GPIO3 VREGVDD<br>GPIO4 VREG<br>GPIO RESETn<br>RTS<br>CTS Host CPU<br>TX<br>RX<br>Figure 4.1. Typical Connection Diagram<br>silabs.com | Building a more connected world. Rev. 1.0 | 19<br>r New Designs<br>o<br>Not Recommended f<br>ANT_OUT NC NC NC GND RESETn NC NC NC NC<br>UART_TX NC NC DECOUPLE UART_RX UART_RTS UART_CTS GPIO5 GPIO6 GPIO7<br>VDD<br>GND<br>**----- End of picture text -----**<br> BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet 44-Pin SiP Module Device Pinout ## **5. 44-Pin SiP Module Device Pinout** **==> picture [577 x 658] intentionally omitted <==** **----- Start of picture text -----**<br> NC NC<br>ANT_IN NC<br>RF_2G4 NC<br>GND NC<br>GND GND<br>GND NC<br>GPIO0 BOOT<br>GND GND<br>GPIO1 NC<br>GPIO2 IOVDD<br>GPIO3 VREGVDD<br>GPIO4 VREG<br>Figure 5.1. 44-Pin SiP Module Device Pinout<br>Table 5.1. 44-Pin SiP Module Device Pinout<br>Pin Name Pin(s) Description Pin Name Pin(s) Description<br>NC 1 No connect ANT_IN 2 Antenna In<br>RF_2G4 3 2.4 GHz RF input/output GND 4 Ground<br>Pin with input/output functionality con-<br>GND 5 Ground GPIO0 6<br>figured through the command API.<br>Pin with input/output functionality con- Pin with input/output functionality con-<br>GPIO1 7 GPIO2 8<br>figured through the command API. figured through the command API.<br>Pin with input/output functionality con- Pin with input/output functionality con-<br>GPIO3 9 GPIO4 10<br>figured through the command API. figured through the command API.<br>UART_TX 11 Digital output NC 12 No connect<br>Not Recommended for New Designs<br>ANT_OUT NC NC NC GND RESETn NC NC NC NC<br>UART_TX NC NC DECOUPLE UART_RX UART_RTS UART_CTS GPIO5 GPIO6 GPIO7<br>**----- End of picture text -----**<br> **silabs.com** | Building a more connected world. Rev. 1.0 | 20 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet 44-Pin SiP Module Device Pinout |**Pin Name**|**Pin(s)**|**Description**||**Pin Name**|**Pin(s)**|**Description**| |---|---|---|---|---|---|---| |NC|13|No connect||DECOUPLE|14|Decouple output for on-chip voltage<br>regulator. This pin is internally decou-<br>pled, and should be left disconnected.| |UART_RX|15|Digital input||UART_RTS|16|Digital output| |UART_CTS<br>|17<br>|Digital input<br>||GPIO5<br>|18<br>|Pin with input/output functionality con-<br>figured through the command API.<br>| |GPIO6<br>|19<br>|Pin with input/output functionality con-<br>figured through the command API.<br>||GPIO7<br>|20<br>|Pin with input/output functionality con-<br>figured through the command API.<br>n| |VREG<br>|21<br>|Regulated supply voltage. This pin is in-<br>ternally connected to the SoC DVDD,<br>RFVDD, and PAVDD supply lines. It is<br>not intended to power external circuitry.<br>||VREGVDD<br>|22<br>|Module input power supply. This pin is<br>internally connected to the SoC AVDD<br>and VREGVDD supply lines.<br>esig| |IOVDD<br>|23<br>|I/O power supply<br>||NC<br>|24<br>|No connect<br>| |BOOT<br>|25<br>|Active-low digital input to force module<br>entrance into DFU bootloader state<br>upon device reset. See command API<br>documentation for functional details.<br>||NC<br>|26<br>|No connect<br>w| |NC<br>|27<br>|No connect<br>||NC<br>|28<br>|No connect<br>| |NC<br>|29<br>|No connect<br>||NC<br>|30<br>|No connect<br>| |NC<br>|31<br>|No connect<br>||NC<br>|32<br>|No connect<br>| |NC<br>|33<br>|No connect<br>||NC<br>f|34<br>|No connect<br>| |RESETn<br>|35<br>|Reset Pin. The RESETn pin is internally<br>pulled up to VREG (DVDD).<br>||GND<br>|36<br>|Ground<br>| |NC<br>|37<br>|No connect<br>||NC<br>|38<br>|No connect<br>| |NC<br>|39<br>|No connect<br>||ANT_OUT<br>|40<br>|Antenna Out<br>| |GND<br>|41<br>|Ground<br>n||GND<br>|42<br>|Ground<br>| |GND<br>|43<br>|Ground<br>||GND<br>|44<br>|Ground<br>| **silabs.com** | Building a more connected world. Rev. 1.0 | 21 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Functional overview ## **6. Functional overview** ## **6.1 Introduction** The BGX220S creates a Bluetooth 5.2 compliant Bluetooth Low Energy cable replacement interface, facilitating a Bluetooth Low Energy link to a second embedded device or a mobile device. An embedded MCU controls the device and communicates across the Bluetooth Low Energy link through a serial interface and control signals. Parameters stored in non-volatile memory and configurable through the serial interface adjust performance characteristics of the device. Silicon Labs offers iOS and Android mobile libraries for Bluetooth Xpress devices to speed mobile development and simplify communication with the device. This library also controls OTA management, facilitating secure and reliable updates to the device’s embedded stack. This functional overview does not cover each command supported by the command API. The complete command API specification is available at docs.silabs.com. **6.2 Communication Use Cases** The BGX220S family facilitates two types of Bluetooth Low Energy communication links: • BGX-to-mobile • BGX-to-BGX In the BGX-to-mobile communication use case, the BGX220S operates as a peripheral that is discoverable and connectable when configured to that state through either the command API or the pin states driven by the embedded MCU. Using the Xpress mobile library, mobile applications can scan for BGX220S devices, connect, and communicate with the device in both streaming and remote command modes, where the mobile app can execute command API functions remotely. In the BGX-to-BGX communication use case, one BGX220S must be configured as the central device and one or more other BGX devices should be configured as a peripheral. Devices can be configured at runtime through the command API, or those settings can be saved to non-volatile memory so that each device wakes from power-on or low power states as either a peripheral or central. For more information on advertising and connection options, please see the command API documentation. **6.3 Embedded Interface** The BGX220S family uses an 8-N-1 USART interface for data and flow control signaling. The interface is used both for a raw data streaming interface and a command interface, depending on additional hardware pin configuration. UART_TX and UART_RX are defined with flow directions relative to the BGX. Bytes sent from the embedded host to the BGX use the UART_RX pin. Bytes sent from the BGX to the embedded host appear on the UART_TX pin. UART_CTS is a digital input that controls the state of the UART_RTS digital output on the other end of the wireless link. Assertion of a CTS/RTS pair signals that the embedded MCU driving its respective UART_CTS is available to receive bytes. The baud rate of the BGX220S is a configurable parameter. For information on the process by which a baud rate change gets processed and executed by the device, please see the command API documentation. State control signals and visual indicators described below can be assigned to any of the GPIO pins through the command API. These settings can be stored in non-volatile memory and take effect during the next power cycle. For information on configuration of standard GPIO and available special function I/O available on the device, please see the command API documentation. **6.4 Command Mode and Streaming Mode** The BGX220S is designed to wake and offer optimized serial interface with hardware flow control. Hardware flow control signaling is disabled by default. When operating in a peripheral role and when flow control signals are monitored, the device may never need to leave streaming mode during operation. However, when use cases require more advanced runtime configuration, the device can switch to command interface through pin or escape sequence. Commands defined here can control scanning, advertising, connection state, and GPIO settings. The command interface is also used to configure and store customizable parameters. Streaming mode can be switched to command mode through an escape sequence of characters if the sequence has been previously saved in the device's configuration. A command can be issued in command mode to switch to streaming mode. Stream mode and command mode entrance can be controlled through a device port pin state, if a pin has been previously defined for that purpose. **silabs.com** | Building a more connected world. Rev. 1.0 | 22 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Functional overview ## **6.5 Command API** Each command begins with a command name followed by arguments, and the syntax of each command is defined in the command API documentation. The command interface saves settings as key-value pairs. These values can be used at runtime to modify the operational state, and they can also be stored in non-volatile memory. Values stored in non-volatile memory function to configure the device's startup/default state. **6.6 GPIO Control** The BGX220S offers 8 GPIO pins. These pins can be configured as state control pins or visual indicator pins. Alternatively, they can be used as general purpose I/O pins. Digital output settings can be set and digital input state can be read through the command interface locally or remotely through the remote command execution using the mobile libraries. **6.7 Device Configuration** Device configuration is handled through the command API, where commands are executed when the serial interface is set to operate in command mode. These commands can also be executed remotely through the mobile library unless prohibited through previous configuration. Additionally, a device configuration can be generated and saved using Simplicity Studio's Xpress Configurator tool. A generated configuration can be submitted to Silicon Labs through the process defined in that application. Silicon Labs will then validate the configuration request, generate a custom orderable part number, and deliver first article samples for testing. Developers should contact sales representatives for more information about this process. Once first article samples have been validated by the customer, this custom orderable part number can be ordered directly from Silicon Labs. **6.8 Security Features** BGX220S devices communicate with LE secure connections, establishing encrypted communication upon connection. Device OTA requires an encrypted image signed by Silicon Laboratories. Only firmware developed, signed, and encrypted by Silicon Labs can be bootloaded successfully on the device. **6.9 OTA** The BGX220S supports secure OTA of the embedded stack and the command interface. Images are encrypted and signed by Silicon Laboratories. OTA can be performed through the mobile library APIs. Specific device firmware versions can be selected and programmed through these APIs. See command API documentation for more information. For information on new functionality including firmware updates to BGX220S, please see docs.silabs.com. BGX220S module OPN firmware will not be updated to include newly released features available through OTA and DFU updates provided by Silicon Labs. Module OPN firmware will only be updated at manufacturing time to provide security-related enhancements. Contact Silicon Labs technical support for information on customer factory programming options for custom OPN ordering with a specified device firmware version and for customer factory programming options. **6.10 Direct Test Mode Support** The BGX220S's command API offers a command set that configures the device to support the Direct Test Mode (DTM) protocol as defined in the Bluetooth Core Specification Version 4.2, Volume 6, part F. See the command API for information about commands to support specific DTM test procedures. **silabs.com** | Building a more connected world. Rev. 1.0 | 23 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Design Guidelines ## **7. Design Guidelines** ## **7.1 Layout and Placement** For optimal performance of the BGX220S the following guidelines are recommended: - Place the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as illustrated in Figure 7.1 Recommended Layout for BGX220S on page 24. - • Copy the exact antenna design from Figure 7.2 Antenna Layout With Coordinates on page 25 with the values for coordinates A to L given in Table 7.1 Antenna Polygon Coordinates, Referenced to Center of BGX220S on page 25. - • Make a cutout in all lower layers aligned with the right edge and the bottom edge of the antenna as indicated by the yellow box in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 26. - • Connect all ground pads directly to a solid ground plane in the top layer. • Connect RF_2G4 to ANT_IN through a 0-ohm resistor. • The 0-ohm gives the ability to test conducted and to evaluate the antenna impedance in the design. - • Place ground vias as close to the ground pads of the BGX220S as possible. • Place ground vias along the antenna loop right and bottom side. • Place ground vias along the edges of the application board. • Do not place plastic or any other dielectric material in contact with the antenna. • A minimum clearance of 0.5 mm is advised. • Solder mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region. **Figure 7.1. Recommended Layout for BGX220S** **silabs.com** | Building a more connected world. Rev. 1.0 | 24 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Design Guidelines |**Figure 7.2. Antenna Layout With Coordinates**<br>**Table 7.1. Antenna Polygon Coordinates, Referenced to Center of BGX220S**<br>**Point**<br>**BGX220S22HNA21**<br>A<br>(2.87, 2.13)<br>B<br>(2.54, 2.13)<br>C<br>(2.54, 3.69)<br>D<br>(3.36, 4.51)<br>E<br>(7.75, 4.51)<br>F<br>(7.75, 4.15)<br>G<br>(6.84, 4.15)<br>H<br>(6.21, 3.52)<br>I<br>(4.26, 3.52)<br>J<br>(3.97, 3.81)<br>K<br>(3.10, 3.81)<br>L<br>(2.87, 3.58)<br>Wloop<br>4.88<br>Hloop<br>4.15<br>Not Recommended for New Designs<br>a<br>Wioop<br>Bx *lA<br>8<br>L<br>(0 , 0)| |---| ## **Note:** 1. All coordinates and dimensions listed in mm. **silabs.com** | Building a more connected world. Rev. 1.0 | 25 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Design Guidelines 5.95 mm BGX220S22A **Figure 7.3. Antenna Clearance in Inner and Bottom Layers** **silabs.com** | Building a more connected world. Rev. 1.0 | 26 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Design Guidelines ## **7.2 Best Design Practices** The design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommended: - Place the BGX220S and antenna close to the center of the longest edge of the application board. - Do not place any circuitry between the board edge and the antenna. - Make sure to tie all GND planes in the application board together with as many vias as can be fitted. Make sure to tie all GND planes in the application board together with as many vias as can be fitted. • Generally ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 26. • Open-ended stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of spurious emissions. • The width of the GND plane to the sides of the BGX220S will impact the efficiency of the on-board chip antenna. • To achieve optimal performance, a GND plane width of 55 mm for BGX220S is recommended as seen on Figure 7.4 Illustration of Recommended Board Width on page 27. • See 3.13.1 Antenna Typical Characteristics for reference. Figure 7.5 Non-Optimal Layout Examples on page 28 illustrates layout scenarios that will lead to severely degraded RF performance for the application board. 55 mm (BGX220S22A) **Figure 7.4. Illustration of Recommended Board Width silabs.com** | Building a more connected world. Rev. 1.0 | 27 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Design Guidelines aN **Figure 7.5. Non-Optimal Layout Examples** _[tS] **silabs.com** | Building a more connected world. Rev. 1.0 | 28 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Design Guidelines ## **7.3 Radio Performance vs. Carrier Board Size** For many applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. The recommended carrier board width of 55 mm for BGX220S22A is thus not always possible in the end-application. If another form factor is required, the antenna performance of the integrated antenna will be compromised but it may still be sufficiently good for providing the required link quality and range of the end-application. Figure 7.6 Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGX220S22A on page 29, which is also representative of antenna efficiency of the BGX220S, show the total efficiency of the integrated antenna for different carrier board sizes. As can be seen the best performance is achieved for the carrier board size of 55 mm x 25 mm for the BGX220S22A, with relatively constant performance for larger boards and rapidly declining performance for smaller boards. The performance of all the sizes tested will be adequate for more than 15 m line-of-sight range and all of the sizes are thus usable. mm for the BGX220S22A, with relatively constant performance for larger boards and rapidly declining performance for smaller boards. The performance of all the sizes tested will be adequate for more than 15 m line-of-sight range and all of the sizes are thus usable. **WARNING: Any antenna tuning or change of the loop dimensions will void the modular certification of modules with modular certification. In that case, a Permissions Change to the modular approval is required.** BGX220S822A Antenna Efficiency @ 2440 MHz vs. Carrier Board Dimensions 0.00 -1.00 __ -2.00 faa) ©, > ©[-3.00] a YL 5 -4.00 -5.00 -6.00 100x60 60x60 60x30 55x30 55x25 55x20 50x20 40x20 30x20 20x20 Carrier Board Dimensions [mm] **Figure 7.6. Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGX220S22A 7.4 Proximity to Other Materials** Placing plastic or any other dielectric material directly in contact with the antenna may cause performance degradation. A clearance of minimum 0.5 mm is recommended to avoid excessive detuning of the antenna. Solder mask, conformal coating, and other thin dielectric layers are acceptable directly on top of the antenna region. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. **silabs.com** | Building a more connected world. Rev. 1.0 | 29 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Design Guidelines ## **7.5 Proximity to Human Body** Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. Furthermore, additional certification may be required if the module is used in a wearable device. **silabs.com** | Building a more connected world. Rev. 1.0 | 30 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Package Specifications ## **8. Package Specifications** ## **8.1 Package Dimensions** The package dimensions are shown in Figure 8.1 Package Dimensions - Full on page 31 and Figure 8.2 Package Dimensions - Detail on page 31. [Jaaa[C[B] (2x) [77 ]ece |] ony CORNER nama “Th. E/2 4 V) 1s d3 ] TOP VIEW a SIDE VIEW (1.225) 03) pay | , PIN 11D - . “sesadasanty aes cae J = =a) [ES] 4X SMT PAD (DETAIL G) "| GHG G|J@e eB » 7 os " Sox RE PAD ORTANLD) BOTTOM VIEW **Figure 8.1. Package Dimensions - Full** SRO EDGE a ~~ L i — Ll 0.08 x 45°, CHAMFER b fae —Ne DETAIL F (SCALE: N/A) L2 \ @ L * §X Rotated 90° CCWSRO EDGE Ll a S (0.255) mia | L3 L - (SCALE:DE1X **T** hisAIL rotation N/A) H **Figure 8.2. Package Dimensions - Detail** **silabs.com** | Building a more connected world. Rev. 1.0 | 31 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Package Specifications **Table 8.1. Package Dimensions** ||**Dimension**|**MIN**|**NOM**|**MAX**| |---|---|---|---|---| ||A|1.080|1.180|1.280| ||A1<br>|0.140<br>|0.180<br>|0.220<br>| ||A2<br>|0.950<br>|1.000<br>|1.050<br>| ||b<br>|0.200<br>|0.250<br>|0.300<br>n| ||D<br>|6.000 BSC<br>i||| ||D1<br>|4.500 BSC<br>s||| ||e<br>|0.500 BSC<br>||| ||E<br>|6.000 BSC<br>||| ||E1<br>|4.500 BSC<br>||| ||L<br>|0.300<br>|0.350<br>|0.400<br>| ||L1<br>|0.125<br>|0.175<br>|0.225<br>| ||L2<br>|0.575<br>|0.625<br>|0.675<br>| ||L3<br>|0.450<br>|0.500<br>|0.550<br>| ||eD1<br>|0.450 BSC<br>r||| ||eD2<br>|0.900 BSC<br>f||| ||eE1<br>|0.450 BSC<br>||| ||eE2<br>|0.900 BSC<br>||| ||aaa<br>|0.100<br>||| ||bbb<br>|0.100<br>||| ||ccc<br>|0.100<br>n||| ||ddd<br>|0.100<br>||| ||eee<br>|0.100<br>||| ||**Note:**<br>1. The dimensions in parenthesis are reference.<br>2. All dimensions in millimeters (mm).<br>3. Unless otherwise specified, tolerances are:<br>a. Decimal: X.X = +/- 0.1<br>X.XX = +/- 0.05<br>X.XXX = +/- 0.03<br>b. Angular: +/- 0.1 (In Deg)<br>4. Hatching lines means package shielding area.<br>ot Recom|||| **silabs.com** | Building a more connected world. Rev. 1.0 | 32 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Package Specifications ## **8.2 Recommended PCB Land Pattern** The recommended PCB Land Pattern is shown in Figure 8.3 Module Land Pattern on page 33 |**Figure 8.3. Module Land Pattern**<br>**Table 8.2. PCB Land Pattern Dimensions**<br>**Dimension**<br>**Typ (mm)**<br>D1<br>4.50<br>D2<br>2.65<br>E1<br>4.50<br>E2<br>2.25<br>eD1<br>0.45<br>eD2<br>0.90<br>b<br>0.25<br>e<br>0.50<br>L<br>0.35<br>L1<br>0.50<br>**Note:**<br>1. All feature sizes shown are at<br>Maximum Material Condition(MMC) and a<br>card fabrication tolerance of 0.05mmis assumed.<br>2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.<br>3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.<br>4. The stencil thickness should be 0.100 mm (4 mils).<br>5. The stencil aperture to land pad size recommendation is 80% paste coverage.<br>Not Recommended for New Designs<br>HHAHHH<br>=<br>3<br>EE]<br>[E2]<br>ma<br>Ee<br>4 41<br>44<br>Ea<br>=<br>GG<br>oo<br>|<br>i<br>|*<br>fe<br>|<br>=<br>10 EE]<br>E<br>A<br>denen eee<br>11<br>f<br>20<br>[e011]|**Figure 8.3. Module Land Pattern**<br>**Table 8.2. PCB Land Pattern Dimensions**<br>**Dimension**<br>**Typ (mm)**<br>D1<br>4.50<br>D2<br>2.65<br>E1<br>4.50<br>E2<br>2.25<br>eD1<br>0.45<br>eD2<br>0.90<br>b<br>0.25<br>e<br>0.50<br>L<br>0.35<br>L1<br>0.50<br>**Note:**<br>1. All feature sizes shown are at<br>Maximum Material Condition(MMC) and a<br>card fabrication tolerance of 0.05mmis assumed.<br>2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.<br>3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.<br>4. The stencil thickness should be 0.100 mm (4 mils).<br>5. The stencil aperture to land pad size recommendation is 80% paste coverage.<br>Not Recommended for New Designs<br>HHAHHH<br>=<br>3<br>EE]<br>[E2]<br>ma<br>Ee<br>4 41<br>44<br>Ea<br>=<br>GG<br>oo<br>|<br>i<br>|*<br>fe<br>|<br>=<br>10 EE]<br>E<br>A<br>denen eee<br>11<br>f<br>20<br>[e011]| |---|---| |6.**_Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use_**|| |**_different parameters and fine tune their SMT process as required for their application and tooling._**|| **silabs.com** | Building a more connected world. Rev. 1.0 | 33 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Package Specifications ## **8.3 Top Marking** PPPPPPPPPP PPPPPPPPPP YYWWEET ETT + **Figure 8.4. BGX220S Top Marking Table 8.3. Top Marking Definition OPN Line 1 Marking Line 2 Marking Line 3 Marking** BGX220S22HNA21 BGX220S22A SC22HNA2 See note below **Note:** YY = Year. WW = Work Week, TTTTTTT = Trace Code **silabs.com** | Building a more connected world. Rev. 1.0 | 34 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Soldering Recommendations ## **9. Soldering Recommendations** It is recommended that final PCB assembly of the BGX220S follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. ## **CLASS 1 General Electronic Products** Includes products suitable for applications where the major requirement is function of the completed assembly. **CLASS 2 Dedicated Service Electronic Products** Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. **CLASS 3 High Performance/Harsh Environment Electronic Products** Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. **Note:** General SMT application notes are provided in the AN1223 document. **silabs.com** | Building a more connected world. Rev. 1.0 | 35 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Tape and Reel ## **10. Tape and Reel** BGX220S modules are delivered to the customer in tray (490 pcs / tray) or reel (2500 pcs / reel) packaging with the dimensions below. All dimensions are given in mm unless otherwise indicated. 4.00.1 17920.) 2.0£0.1 01.5+0.1 A —0.0 —0.3040.05 TH+[COG] GSO OO GOOGO SF 4 01.5MIN. . fy $5 BO 16.0+0.3. tor |)EF__| Ey__+_)_|| _(| +]a\_(| AAO 12.0 _ +£0.10 DETAIL A” + ref. 0.20 SECTION “A—A [80[6.30mm-+£0.1] 6.30mm+0.1 foi/ 4 ‘ 1.60mm+0.1 \ / ref.0.20 ‘s. see ref. RO.36 DETAIL "A” SCALE : 4/1 **Figure 10.1. Carrier Tape Dimensions** **silabs.com** | Building a more connected world. Rev. 1.0 | 36 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Tape and Reel ee ww fe fiswn fo [z02un Fw fico38 w ffFAY NX [; i “Ne \ hi ===5, AG) + \(oS[| i a | i j ro Tl \ / | G a ) = L | | TL, WIDTH MARKING : 16 7 **Figure 10.2. Reel Dimensions** **silabs.com** | Building a more connected world. Rev. 1.0 | 37 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Certifications ## **11. Certifications** Please refer to the corresponding chapter 11 of the BGM220S modules for all information regarding regulatory radio approvals and Bluetooth qualification information. The BGX220S22A is derived from the BGM220S22A and shares the same test reports and certifications. ## **11.1 Certifications for Model BGM220S22A** Certification is not yet completed for the BGM220SC22WGA2 and BGM220SC22HNA2. **silabs.com** | Building a more connected world. Rev. 1.0 | 38 BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet Revision History ## **12. Revision History** ## **Revision 1.0** Initial release. **silabs.com** | Building a more connected world. Rev. 1.0 | 39 One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! **IoT Portfolio SW/HW Quality Support & Community** www.silabs.com/IoT www.silabs.com/simplicity www.silabs.com/quality www.silabs.com/community **Disclaimer** Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required, or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. **Trademark Information** Silicon Laboratories Inc.®, Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, ClockBuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, Gecko OS, Gecko OS Studio, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri, the Zentri logo and Zentri DMS, Z-Wave®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders. Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA **http://www.silabs.com**
Updated at April 28, 2026
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