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BGX13S22GA-V31R
BLUETOOTH MODULE
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: SILICON LABS
- Product type: Bluetooth Modules & Adaptors
- SVHC: To Be Advised
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 5.29 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
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BGX13S Blue Gecko Xpress Bluetooth [®]<br>SiP Module Data Sheet<br>The BGX13S Blue Gecko Xpress Bluetooth [®] SiP Module family of serial replacement<br>modules eliminate Bluetooth firmware development complexity with a serial interface that KEY FEATURES<br>can operate as a raw data stream or control the device through a command API. The<br>BGX13S can facilitate a device-to-device cable replacement link or communicate with • Bluetooth 5 low energy compliant<br>mobile devices through the Xpress Bluetooth mobile library. The device integrates a • Serial interface with hardware flow control<br>Bluetooth 5 compliant stack to future-proof applications as Bluetooth 5 adoption increa- • GPIO control through command API<br>ses. • Integrated antenna<br>The device is targeted for applications where ultra-small size, reliable high performance • TX power up to 8 dBm<br>•<br>RF, low-power consumption, and fast time-to-market are key requirements. At 6.5 × 6.5 Encrypted bonding and connectivity<br>× 1.4 mm the BGX13S module fits applications where size is a constraint. BGX13S also • Operates as central or peripheral<br>integrates a high-performance, ultra-robust antenna, which requires minimal PCB, plas- • Onboard Bluetooth stack<br>tic, and metal clearance. The total PCB area required by BGX13S is only 51 mm [2] . The • Centralized OTA through mobile app<br>BGX13S has Bluetooth, CE, full FCC, Japan and South-Korea certifications.<br>library<br>BGX13S SIP modules can be used in a wide variety of applications:<br>• Health, sports and wellness devices<br>• Industrial, home and building automation<br>• Smart phone, tablet and PC accessories<br>Serial interface Bluetooth Radio<br>controller<br>Bluetooth 5 Radio<br>compliant transceiver<br>Command<br>stack<br>parser<br>Chip<br>Raw data Timers antenna<br>stream<br>buffers<br>OTA Matching<br>manager network<br>silabs.com | Building a more connected world. Rev. 1.1<br>Not Recommended for New Designs<br>control<br>RX/TX and flow<br>GPIO control<br>**----- End of picture text -----**<br>
BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Ordering Information
## **1. Ordering Information**
## **Table 1.1. Ordering Information**
|**Frequency Band**|||||
|---|---|---|---|---|
|**Ordering Code**<br>**Protocol Stack**<br>**@ Max TX Power**<br>**Antenna**<br>**GPIO**<br>**Packaging**<br>BGX13S22GA-V31R<br>Bluetooth Low<br>Energy<br>2.4 GHz @ 8 dBm<br>Built-in<br>8<br>Reel<br>BGX13S22GA-V31<br>Bluetooth Low<br>Energy<br>2.4 GHz @ 8 dBm<br>Built-in<br>8<br>Tray<br>Not Recommended for New Designs|||||
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## **Table of Contents**
|**1. Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2. Electrical Specifications .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**|**.**||**.**|**.**|**.**|**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 5**|
|2.1 Electrical Characteristics<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 5<br>2.1.1 Absolute Maximum Ratings .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 5<br>2.1.2 Operating Conditions<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 6<br>2.1.3 Power Consumption.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 7<br>2.1.4 2.4 GHz RF Transceiver Characteristics .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 8<br>2.1.5 Non-Volatile Configuration Storage.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.12<br>2.1.6 General-Purpose I/O (GPIO) .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.13<br>**3. Typical Connection Diagrams**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**. 15**<br>3.1 Typical BGX13S Connections .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.15<br>**4. Layout Guidelines**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**. 16**<br>4.1 Layout Guidelines .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.16<br>4.2 Effect of PCB Width<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.17<br>4.3 Effect of Plastic and Metal Materials .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.17<br>4.4 Effects of Human Body .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.18<br>4.5 2D Radiation Pattern Plots .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.18<br>**5. Pin Definitions .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**20**<br>5.1 BGX13S Device Pinout .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.20<br>**6. Functional Overview**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.23**<br>6.1 Introduction .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.23<br>6.2 Communication Use Cases.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.23<br>6.3 Embedded Interface .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.23<br>6.4 Command Mode and Streaming Mode .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.23<br>6.5 Command API .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.24<br>6.6 GPIO Control<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.24<br>6.7 Device Configuration .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.24<br>6.8 Security Features .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.24<br>6.9 OTA<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.24<br>6.10 Direct Test Mode Support .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.24<br>**7. Package Specifications**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.25**<br>7.1 BGX13S Package Dimensions<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.25<br>7.2 BGX13S Recommeded PCB Land Pattern<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.28<br>Not Recommended for New Designs|||||||||||||||||||
|7.3 BGX13S Package Marking .<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.|.||.|.|.|.<br>.|.<br>.|.|.|.|.|.|.|.31|
|**8. Tape and Reel Specifications**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|||**.**|**.**|**.**|**.**||**.**|**.**|**.**<br>**.**<br>**.**<br>**.**<br>**.**|||**.**|**.**|**.**|**.**|**.**|**. 32**|
|8.1 Tape and Reel Packaging .<br>.<br>.<br>.<br>.<br>.|.<br>.|.|.|.|.||.|.|.|.<br>.|.<br>.|.|.|.|.|.|.|.32|
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8.2 Reel and Tape Specifications . . . . . . . . . . . . . . . . . . . . . . . . .32 8.3 Orientation and Tape Feed . . . . . . . . . . . . . . . . . . . . . . . . . .34 8.4 Tape and Reel Box Dimensions . . . . . . . . . . . . . . . . . . . . . . . .34 8.5 Moisture Sensitivity Level . . . . . . . . . . . . . . . . . . . . . . . . . .34 **9. Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . 35** 9.1 Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . .35 **10. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36** 10.1 Qualified Antenna Types . . . . . . . . . . . . . . . . . . . . . . . . . .36 10.2 Bluetooth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 10.3 CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 10.4 FCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 10.5 ISED Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 10.6 Japan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 10.7 KC (South-Korea) . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 **11. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41**
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2. Electrical Specifications**
## **2.1 Electrical Characteristics**
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
- Typical values are based on TAMB = 25 °C and VBAT = 3.3 V, by production test and/or technology characterization.
|• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-<br>er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.<br>• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,<br>unless stated otherwise.<br>Refer to for more details about operational supply and temperature limits.<br>**2.1.1 Absolute Maximum Ratings**<br>Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of<br>the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure<br>to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-<br>bility data, see the Quality and Reliability Monitor Report athttp://www.silabs.com/support/quality/pages/default.aspx.<br>**Table 2.1. Absolute Maximum Ratings**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Storage temperature range<br>TSTG<br>-40<br>—<br>85<br>°C<br>Voltage on any supply pin<br>VDDMAX<br>-0.3<br>—<br>3.8<br>V<br>Voltage ramp rate on any<br>supply pin<br>VDDRAMPMAX<br>—<br>—<br>1<br>V / µs<br>DC voltage on any GPIO pin<br>VDIGPIN<br>-0.3<br>—<br>IOVDD+0.3<br>V<br>Maximum RF level at input<br>PRFMAX2G4<br>—<br>—<br>10<br>dBm<br>Total current into supply pins<br>IVDDMAX<br>Source<br>—<br>—<br>200<br>mA<br>Total current into VSS<br>ground lines<br>IVSSMAX<br>Sink<br>—<br>—<br>200<br>mA<br>Current per I/O pin<br>IIOMAX<br>Sink<br>—<br>—<br>50<br>mA<br>Source<br>—<br>—<br>50<br>mA<br>Current for all I/O pins<br>IIOALLMAX<br>Sink<br>—<br>—<br>200<br>mA<br>Source<br>—<br>—<br>200<br>mA<br>Junction temperature<br>TJ<br>-40<br>—<br>105<br>°C<br>Not Recommended for New Designs|
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2.1.2 Operating Conditions**
The following subsections define the operating conditions for the module.
## **2.1.2.1 General Operating Conditions**
|**Table 2.2. General Operating Conditions**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Operating ambient tempera-<br>ture range<br>TA<br>-40<br>25<br>85<br>°C<br>VBATT operating supply<br>voltage<br>VVBATT<br>2.4<br>3.3<br>3.8<br>V<br>VBATT current<br>IVBATT<br>—<br>—<br>200<br>mA<br>IOVDD operating supply volt-<br>age<br>VIOVDD<br>1.62<br>—<br>VVBATT<br>V<br>Not Recommended for New Designs|
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2.1.3 Power Consumption**
Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 °C.
**Table 2.3. Power Consumption**
|**Parameter**<br>**Symbol**<br>Active supply current, Un-<br>connected, Idle<br>IACTIVE_IDLE<br>Active supply current, Adver-<br>tising<br>IACTIVE_ADV<br>Active supply current, Con-<br>nected, 15 ms Interval<br>IACTIVE_CONN<br>Supply current in low power<br>mode<br>ILPM<br>Not Recomm|**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|
|---|---|---|---|---|---|---|---|
||Active supply current, Un-<br>connected, Idle<br>|IACTIVE_IDLE<br>|Baud rate ≤ 9600 bps<br>|—<br>|3<br>|—<br>|µA<br>n|
||||Baud rate > 9600 bps<br>|—<br>|3.25<br>|—<br>|mA<br>|
||Active supply current, Adver-<br>tising<br>|IACTIVE_ADV<br>|Interval = 546.25 ms, Baud rate ≤<br>9600 bps<br>|—<br>|90<br>|—<br>si|µA<br>|
||||Interval = 20 ms, Baud rate ≤<br>9600 bps<br>|—<br>|2<br>|—<br>e|mA<br>|
||||Interval = 546.25 ms, Baud rate ><br>9600 bps<br>|—<br>|3.3<br>|—<br>|mA<br>|
||||Interval = 20 ms, Baud rate ><br>9600 bps<br>|—<br>|4.7<br>w|—<br>|mA<br>|
||Active supply current, Con-<br>nected, 15 ms Interval<br>|IACTIVE_CONN<br>|Idle, Baud Rate ≤ 9600 bps<br>|—<br>|660<br>|—<br>|µA<br>|
||||TX/RX (acknowledged) at highest<br>throughput, Baud Rate ≤ 9600<br>bps<br>r|—<br>|3.5<br>|—<br>|mA<br>|
||||TX/RX (unacknowledged) at high-<br>est throughput, Baud Rate ≤ 9600<br>bps<br>fo|—<br>|4<br>|—<br>|mA<br>|
||||Idle, Baud Rate > 9600 bps<br>|—<br>|3.5<br>|—<br>|mA<br>|
||||TX/RX (acknowledged) at highest<br>throughput, Baud Rate > 9600<br>bps<br>de|—<br>|5.25<br>|—<br>|mA<br>|
||||TX/RX (unacknowledged) at high-<br>est throughput, Baud Rate > 9600<br>bps<br>en|—<br>|7<br>|—<br>|mA<br>|
||Supply current in low power<br>mode<br>|ILPM<br>om|Radio disabled<br>|—<br>|3<br>|—<br>|µA<br>|
||||Radio enabled, Advertising, Inter-<br>val = 546.25 ms<br>|—<br>|90<br>|—<br>|µA<br>|
||||Radio enabled, Advertising, Inter-<br>val = 20 ms<br>|—<br>|2<br>|—<br>|mA<br>|
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2.1.4 2.4 GHz RF Transceiver Characteristics**
## **2.1.4.1 RF Transmitter General Characteristics for 2.4 GHz Band**
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
|**Table 2.4. RF Transmitter General Characteristics for 2.4 GHz Band**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Maximum TX power1<br>POUTMAX<br>—<br>7.8<br>—<br>dBm<br>Minimum active TX Power<br>POUTMIN<br>CW<br>-30<br>—<br>dBm<br>Output power step size<br>POUTSTEP<br>-5 dBm< Output power < 0 dBm<br>—<br>1<br>—<br>dB<br>0 dBm < output power <<br>POUTMAX<br>—<br>0.5<br>—<br>dB<br>Output power variation vs<br>supply at POUTMAX<br>POUTVAR_V<br>2.4 V < VVBATT< 3.3 V<br>—<br>2.1<br>—<br>dB<br>Output power variation vs<br>temperature at POUTMAX<br>POUTVAR_T<br>From -40 to +85 °C<br>—<br>1.7<br>—<br>dB<br>Output power variation vs RF<br>frequency at POUTMAX<br>POUTVAR_F<br>Over RF tuning frequency range<br>—<br>0.3<br>—<br>dB<br>RF tuning frequency range<br>FRANGE<br>2400<br>—<br>2483.5<br>MHz<br>**Note:**<br>1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-<br>ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.<br>Not Recommended for New Designs|
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2.1.4.2 RF Receiver General Characteristics for 2.4 GHz Band**
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
**Table 2.5. RF Receiver General Characteristics for 2.4 GHz Band**
|**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>||
|---|---|---|---|---|---|---|---|
|RF tuning frequency range<br>|FRANGE<br>||2400<br>|—<br>|2483.5<br>|MHz<br>n||
|Receive mode maximum<br>spurious emission<br>|SPURRX<br>|30 MHz to 1 GHz<br>|—<br>|-57<br>|—<br>|dBm<br>||
|||1 GHz to 12 GHz<br>|—<br>|-47<br>|—<br>i|dBm<br>||
|Max spurious emissions dur-<br>ing active receive mode, per<br>FCC Part 15.109(a)<br>|SPURRX_FCC<br>|216 MHz to 960 MHz, Conducted<br>Measurement<br>|—<br>|-55.2<br>|—<br>es|dBm<br>||
|||Above 960 MHz, Conducted<br>Measurement<br>|—<br>|-47.2<br>|—<br>|dBm<br>||
|Level above which<br>RFSENSE will trigger1<br>|RFSENSETRIG<br>|CW at 2.45 GHz<br>|—<br>|-24<br>w|—<br>|dBm<br>||
|Level below which<br>RFSENSE will not trigger1<br>|RFSENSETHRES <br>|CW at 2.45 GHz<br>|—<br>e|-50<br>|—<br>|dBm<br>||
|**Note:**<br>1. RFSENSE performance is only valid from 0<br>||to 85 °C. RFSENSE should be disabled outside this temperature range.<br>or||||||
1. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2.1.4.3 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate**
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
**Table 2.6. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate**
||**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|
|---|---|---|---|---|---|---|---|
||Max usable receiver input<br>level, 0.1% BER<br>|SAT<br>|Signal is reference signal1. Packet<br>length is 20 bytes.<br>|—<br>|10<br>|—<br>|dBm<br>n|
||Sensitivity, 0.1% BER<br>|SENS<br>|Signal is reference signal1. Using<br>DC-DC converter.<br>|—<br>|-94.1<br>|—<br>si|dBm<br>|
||||With non-ideal signals as speci-<br>fied in RF-PHY.TS.4.2.2, section<br>4.6.1.<br>|—<br>|-93.8<br>|—<br>e|dBm<br>|
||Signal to co-channel interfer-<br>er, 0.1% BER<br>|C/ICC<br>|Desired signal 3 dB above refer-<br>ence sensitivity.<br>|—<br>|9.0<br>|—<br>|dB<br>|
||N+1 adjacent channel selec-<br>tivity, 0.1% BER, with allowa-<br>ble exceptions. Desired is<br>reference signal at -67 dBm<br>|C/I1+<br>|Interferer is reference signal at +1<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz<br>|—<br>Ne|-3.3<br>|—<br>|dB<br>|
||N-1 adjacent channel selec-<br>tivity, 0.1% BER, with allowa-<br>ble exceptions. Desired is<br>reference signal at -67 dBm<br>|C/I1-<br>|Interferer is reference signal at -1<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz<br>for|—<br>|-1.6<br>|—<br>|dB<br>|
||Alternate selectivity, 0.1%<br>BER, with allowable excep-<br>tions. Desired is reference<br>signal at -67 dBm<br>|C/I2<br>|Interferer is reference signal at ± 2<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz<br>ed|—<br>|-42.0<br>|—<br>|dB<br>|
||Alternate selectivity, 0.1%<br>BER, with allowable excep-<br>tions. Desired is reference<br>signal at -67 dBm<br>|C/I3<br>|Interferer is reference signal at ± 3<br>MHz offset. Desired frequency<br>2404 MHz ≤ Fc ≤ 2480 MHz<br>nd|—<br>|-46.4<br>|—<br>|dB<br>|
||Selectivity to image frequen-<br>cy, 0.1% BER. Desired is ref-<br>erence signal at -67 dBm<br>|C/IIM<br>m|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion<br>|—<br>|-42.0<br>|—<br>|dB<br>|
||Selectivity to image frequen-<br>cy ± 1 MHz, 0.1% BER. De-<br>sired is reference signal at<br>-67 dBm<br>|C/IIM+1<br>om|Interferer is reference signal at im-<br>age frequency ± 1 MHz with 1<br>MHz precision<br>|—<br>|-47.1<br>|—<br>|dB<br>|
||Intermodulation performance<br>e|IM<br>|Per Core_4.1, Vol 6, Part A, Sec-<br>tion 4.4 with n = 3<br>|—<br>|-18.4<br>|—<br>|dBm<br>|
||**Note:**<br>1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;<br>interferer data = PRBS15; frequency accuracy better than 1 ppm.<br>ot R|||||||
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2.1.4.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate**
Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.
**Table 2.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate**
||**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>|
|---|---|---|---|---|---|---|---|
||Max usable receiver input<br>level, 0.1% BER<br>|SAT<br>|Signal is reference signal1. Packet<br>length is 20 bytes.<br>|—<br>|10<br>|—<br>|dBm<br>n|
||Sensitivity, 0.1% BER<br>|SENS<br>|Signal is reference signal1. Using<br>DC-DC converter.<br>|—<br>|-90.2<br>|—<br>si|dBm<br>|
||||With non-ideal signals as speci-<br>fied in RF-PHY.TS.4.2.2, section<br>4.6.1.<br>|—<br>|-89.9<br>|—<br>e|dBm<br>|
||Signal to co-channel interfer-<br>er, 0.1% BER<br>|C/ICC<br>|Desired signal 3 dB above refer-<br>ence sensitivity.<br>|—<br>|8.6<br>|—<br>|dB<br>|
||N+1 adjacent channel selec-<br>tivity, 0.1% BER, with allowa-<br>ble exceptions. Desired is<br>reference signal at -67 dBm<br>|C/I1+<br>|Interferer is reference signal at +2<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz<br>|—<br>Ne|-7.6<br>|—<br>|dB<br>|
||N-1 adjacent channel selec-<br>tivity, 0.1% BER, with allowa-<br>ble exceptions. Desired is<br>reference signal at -67 dBm<br>|C/I1-<br>|Interferer is reference signal at -2<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz<br>for|—<br>|-11.4<br>|—<br>|dB<br>|
||Alternate selectivity, 0.1%<br>BER, with allowable excep-<br>tions. Desired is reference<br>signal at -67 dBm<br>|C/I2<br>|Interferer is reference signal at ± 4<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz<br>ed|—<br>|-40.3<br>|—<br>|dB<br>|
||Alternate selectivity, 0.1%<br>BER, with allowable excep-<br>tions. Desired is reference<br>signal at -67 dBm<br>|C/I3<br>|Interferer is reference signal at ± 6<br>MHz offset. Desired frequency<br>2404 MHz ≤ Fc ≤ 2480 MHz<br>nd|—<br>|-45.1<br>|—<br>|dB<br>|
||Selectivity to image frequen-<br>cy, 0.1% BER. Desired is ref-<br>erence signal at -67 dBm<br>|C/IIM<br>m|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion<br>|—<br>|-7.6<br>|—<br>|dB<br>|
||Selectivity to image frequen-<br>cy ± 2 MHz, 0.1% BER. De-<br>sired is reference signal at<br>-67 dBm<br>|C/IIM+1<br>om|Interferer is reference signal at im-<br>age frequency ± 2 MHz with 2<br>MHz precision<br>|—<br>|-40.30<br>|—<br>|dB<br>|
||Intermodulation performance<br>e|IM<br>|Per Core_4.1, Vol 6, Part A, Sec-<br>tion 4.4 with n = 3<br>|—<br>|-18.4<br>|—<br>|dBm<br>|
||**Note:**<br>1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9;<br>interferer data = PRBS15; frequency accuracy better than 1 ppm.<br>ot R|||||||
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2.1.5 Non-Volatile Configuration Storage**
**Table 2.8. Non-Volatile Configuration Storage**
|**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Update cycles before failure<br>UC<br>10000<br>—<br>—<br>cycles<br>Data retention<br>RET<br>10<br>—<br>—<br>years<br>Supply voltage during update VDD<br>2.4<br>—<br>3.6<br>V<br>Not Recommended for New Designs|
|---|
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
## **2.1.6 General-Purpose I/O (GPIO)**
**Table 2.9. General-Purpose I/O (GPIO)**
||**Parameter**<br>|**Symbol**<br>|**Test Condition**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>||
|---|---|---|---|---|---|---|---|---|
||Input low voltage1<br>|VIL<br>|GPIO pins<br>|—<br>|—<br>|IOVDD*0.3<br>|V<br>||
||Input high voltage1<br>|VIH<br>|GPIO pins<br>|IOVDD*0.7<br>|—<br>|—<br>|V<br>n||
||Output high voltage relative<br>to IOVDD<br>|VOH<br>|Sourcing 3 mA, IOVDD ≥ 3 V,<br>Drive Strength = Weak<br>|IOVDD*0.8<br>|—<br>|—<br>si|V<br>||
||||Sourcing 1.2 mA, IOVDD ≥ 1.62<br>V,<br>Drive Strength = Weak<br>|IOVDD*0.6<br>|—<br>D|—<br>e|V<br>||
||||Sourcing 20 mA, IOVDD ≥ 3 V,<br>Drive Strength = Strong<br>|IOVDD*0.8<br>|—<br>w|—<br>|V<br>||
||||Sourcing 8 mA, IOVDD ≥ 1.62 V,<br>Drive Strength = Strong<br>|IOVDD*0.6<br>N|—<br>|—<br>|V<br>||
||Output low voltage relative to<br>IOVDD<br>|VOL<br>|Sinking 3 mA, IOVDD ≥ 3 V,<br>Drive Strength = Weak<br>or|—<br>|—<br>|IOVDD*0.2<br>|V<br>||
||||Sinking 1.2 mA, IOVDD ≥ 1.62 V,<br>Drive Strength = Weak<br>d f|—<br>|—<br>|IOVDD*0.4<br>|V<br>||
||||Sinking 20 mA, IOVDD ≥ 3 V,<br>Drive Strength = Strong<br>de|—<br>|—<br>|IOVDD*0.2<br>|V<br>||
||||Sinking 8 mA, IOVDD ≥ 1.62 V,<br>Drive Strength = Strong<br>n|—<br>|—<br>|IOVDD*0.4<br>|V<br>||
||Input leakage current<br>|IIOLEAK<br>mm|All GPIO except LFXO pins, GPIO<br>≤ IOVDD<br>|—<br>|0.1<br>|30<br>|nA<br>||
||||LFXO Pins, GPIO ≤ IOVDD<br>|—<br>|0.1<br>|50<br>|nA<br>||
||I/O pin pull-up/pull-down re-<br>sistor2<br>|RPUD<br>o||30<br>|40<br>|65<br>|kΩ<br>||
||Pulse width of pulses re-<br>moved by the glitch suppres-<br>sion filter<br>ec|tIOGLITCH<br>||15<br>|25<br>|45<br>|ns<br>||
||Output fall time, From 70%<br>to 30% of VIO<br>ot R|tIOOF<br>|CL= 50 pF,<br>Drive Strength = Strong<br>|—<br>|1.8<br>|—<br>|ns<br>||
||||CL= 50 pF,<br>Drive Strength = Weak<br>|—<br>|4.5<br>|—<br>|ns<br>||
||Output rise time, From 30%<br>to 70% of VIO<br>|tIOOR<br>|CL= 50 pF,<br>Drive Strength = Strong<br>|—<br>|2.2<br>|—<br>|ns<br>||
||||CL= 50 pF,<br>Drive Strength = Weak|—|7.4|—|ns||
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications
**Parameter Symbol Test Condition**
**Min**
**Typ**
**Max Unit**
## **Note:**
1. GPIO input threshold are proportional to the IOVDD supply, except for RESETn which is proportional to VBATT. 2. GPIO pull-ups are referenced to the IOVDD supply, except for RESETn, which connects to VBATT.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Typical Connection Diagrams
## **3. Typical Connection Diagrams**
## **3.1 Typical BGX13S Connections**
Typical connections for the BGX13S module are shown in Figure 3.1 Typical Connections for BGX13S on page 15. This diagram shows connections for:
- Power supplies
**Note:** The 1V8 pin is the 1.8V output of the internal DC-DC converer. This pin should be left unconnected. Do not add external decoupling or power external circuits from this pin. • Antenna loop for internal antenna usage or external antenna connection - The RF and ANTENNA pins should be tied together for correct operation of the module. An optional 0R resistor can be added between RF and ANTENNA, making it possible to measure the signal between these pins. • Reset line **Note:** It is recommended to connect the RESETn line to an open-drain IO pin on the host CPU. RESETn includes an internal pull-up to the VBATT supply and input logic levels on RESETn are referenced to VBATT. In systems where IOVDD is not equal to VBATT, additional considerations may need to be taken. • UART connection to an embedded host • Optional 32.768 kHz crystal - Recommended crystal is KDS part number 1TJG125DP1A0012 or equivalent. Crystal used must have better than 100 ppm accuracy. **Note:** If external low-frequency crystal is unused, LFXTAL pins must be tied to ground - ground connections are detected by device and internal oscillator is used instead. • Optional BOOT pin connection - BOOT is an active-low digital input that will force the module into a DFU bootloader state after device reset. BOOT can be tied to IOVDD or left disconnected if it is unused. Battery / Supply Voltage Battery or Regulator (optional) Inductor or capacitor for antenna fine tuning RESETn GPIO ANTENNA Use 0R to connect the UART_TX RX Host CPU antenna to the RF output UART_RX TX RF UART_CTS RTS UART_RTS CTS GPIO0 BGX13S GPIO1 (optional) GPIO2 LFXTAL_P 32.768 kHz XTAL GPIO3 LFXTAL_N GPIO4 GPIO5 GPIO6 GPIO7 BOOT **Figure 3.1. Typical Connections for BGX13S silabs.com** | Building a more connected world. Rev. 1.1 | 15
BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Layout Guidelines
## **4. Layout Guidelines**
For optimal performance of the BGX13S, please follow the PCB layout guidelines and ground plane recommendations indicated in this section.
## **4.1 Layout Guidelines**
**==> picture [577 x 569] intentionally omitted <==**
**----- Start of picture text -----**<br>
This section contains generic PCB layout and design guidelines for the BGX13S module. For optimal performance:<br>• Place the module at the edge of the PCB, as shown in the figures in this chapter.<br>• Do not place any metal (traces, components, etc.) in the antenna clearance area.<br>• Connect all ground pads directly to a solid ground plane.<br>• Place the ground vias as close to the ground pads as possible.<br>Reserve placeholder forantenna<br>fine tuning capacitor/inductor<br>. . . . 5 P . .<br>Lo 0<br>BS Zz. Use GND [stitching] [vias]<br>. . a. of for5mm separated for overlappingby max<br>GND planes<br>=.<br>.Avoidfor usingthermalsthe GND pads<br>. . . . . .<br>Figure 4.1. BGX13S PCB Top Layer Design<br>The following rules are recommended for the PCB design:<br>• Trace to copper clearance 150um<br>• PTH drill size 300um<br>• PTH annular ring 150um<br>Important :<br>The antenna area must align with the pads precisely. Please refer to the recommended PCB land pattern for exact dimensions.<br>ee<br>..Do....‘<br>..<br>. .<br>ery .<br>. . Make GND clearance on<br>. inner and bottom layers<br>same size as on the top layer<br>. . . ° C) .<br>Figure 4.2. BGX13S PCB Middle and Bottom Layer Design<br>OR to connectRF output<br>Capcitor or inductor for to the antenna input<br>fine tuning the antenna<br>Figure 4.3. Practical Installation of BGX13S on Application PCB<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br>
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Layout Guidelines
Antenna loop missing Antenna loop short circuited Module not located to the edge of the PCB **Figure 4.4. Poor Layout Designs for the BGX13S** Layout checklist for BGX13S: 1. Antenna area is aligned relative to the module pads as shown in the recommended PCB land pattern. 2. Clearance area within the inner layers and bottom layer is covering the whole antenna area as shown in the layout guidelines. 3. The antenna loop is implemented on the top layer as shown in the layout guidelines. 4. All dimensions within the antenna area are precisely as shown in the recommended PCB land pattern. 5. The module is placed near the edge of the PCB with max 1mm indentation. 6. The module is not placed in the corner of the PCB. **4.2 Effect of PCB Width** The BGX13S module should be placed at the center of the PCB edge. The width of the board has an impact to the radiated efficiency and, more importantly, there should be enough ground plane on both sides of the module for optimal antenna performance. Figure 4.5 BGX13S PCB Top Layer Design on page 17 gives an indication of ground plane size vs. maximum achievable range. (Renge sism) 45 mm eee) (Range <400m) A furgeaies LT . ° ° ° ° ° ° corti ' . ° ° ° ° ° ° = Shite ee Hy =titememe ‘TEREEEEEEEEBC e TEEEEEEEEEEDC e e e Minimum size PCB design Optimal size PCB design **Figure 4.5. BGX13S PCB Top Layer Design** The impact of the board size to the radiated performance is a generic feature of all PCB and chip antennas and it is not a unique feature of the BGX13S. For the BGX13S the depth of the board is not important and does not impact the radiated performance. **4.3 Effect of Plastic and Metal Materials** The antenna on the BGX13S is insensitive to the effects of nearby plastic and other materials with low dielectric constant. No separation between the BGX13S and plastic or other materials is needed. The board thickness has an impact on the module and the additional inductor/capacitor will help to tune the antenna to any board thickness. In some cases, it may be necessary to fine tune the antenna to optimize for any specific application layout or mechanical design. A capacitor or an inductor in parallel with the antenna input can be used for optimizing the antenna for any PCB layouts. A capacitor moves the antenna frequency lower and an inductor moves the antenna frequency higher. Capacitor values between 0.1 pF-10 pF and inductor values 3.6 nH-10 nH can be used. The antenna is extremely robust against any objects in close proximity or in direct contact with the antenna and it is recommended not to adjust the dimensions of the antenna area unless it is clear that a metal object, such as a coin cell battery, within the antenna area is detuning the antenna.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Layout Guidelines
## **4.4 Effects of Human Body**
Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.
## **4.5 2D Radiation Pattern Plots**
x —— 2480 00MH2} = 180deg **Figure 4.6. Typical 2D Radiation Pattern – Front View** Zz Legend 180deg **Figure 4.7. Typical 2D Radiation Pattern – Side View**
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet
Layout Guidelines
180deg **Figure 4.8. Typical 2D Radiation Pattern – Top View**
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Pin Definitions
## **5. Pin Definitions**
## **5.1 BGX13S Device Pinout**
**Figure 5.1. BGX13S Device Pinout** The following table provides package pin connections and general descriptions of pin functionality.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Pin Definitions
## **Table 5.1. BGX13S Device Pinout**
||**Pin Name**|**Pin(s)**|**Description**|
|---|---|---|---|
||VSS<br>|1<br>4<br>5<br>20<br>31<br>45<br>46<br>48<br>49<br>50<br>51<br>|Ground<br>esigns|
||RF<br>|3<br>|50 Ohm I/O for external antenna connection.<br>|
||GPIO0<br>|10<br>|Pin with input/output functionality configured by the command API.<br>|
||GPIO1<br>|11<br>|Pin with input/output functionality configured by the command API.<br>|
||GPIO2<br>|12<br>|Pin with input/output functionality configured by the command API.<br>|
||GPIO3<br>|17<br>|Pin with input/output functionality configured by the command API.<br>|
||GPIO4<br>|18<br>|Pin with input/output functionality configured by the command API.<br>|
||GPIO5<br>|26<br>|Pin with input/output functionality configured by the command API.<br>r|
||GPIO6<br>|27<br>|Pin with input/output functionality configured by the command API.<br>f|
||UART_TX<br>|13<br>|Digital output<br>|
||UART_RX<br>|14<br>|Digital input<br>|
||UART_CTS<br>|15<br>|Digital input<br>|
||UART_RTS<br>|16<br>|Digital output<br>|
||GPI07<br>|28<br>|Pin with input/output functionality configured by the command API.<br>|
||VBATT<br>|22<br>|Battery supply voltage input to the internal DC-DC and analog supply.<br>|
||IOVDD<br>|24<br>|Digital IO power supply.<br>|
||LFXTAL_P<br>|19<br>|Low frequency external oscillator output pin.<br>|
||LFXTAL_N<br>|21<br>|Low frequency external oscillator input pin.<br>|
||RESETn<br>c|44<br>|Reset input, active low. To apply an external reset source to this pin, it is required<br>to only drive this pin low during reset, and let the internal pull-up ensure that reset<br>is released.<br>|
||ANTENNA<br>|2<br>|50 Ohm input, pin for internal 2.4 GHz antenna<br>|
||1V8<br>t R|23<br>|1.8V output of the internal DC-DC converer. Do not add external decoupling or<br>power external circuits from this pin.<br>|
||BOOT<br>o|33<br>|Active-low digital input to force module entrance into DFU bootloader state upon<br>device reset. See command API documentation for functional details.<br>|
||ANT_GND<br>|47<br>|Antenna ground.<br>|
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Pin Definitions
|**Pin Name**|**Pin(s)**|**Description**||
|---|---|---|---|
||6|||
||7|||
||8|||
||9|||
||25|||
|N/C<br>29<br>30<br>32<br>34<br>35<br>36<br>37<br>38<br>39<br>40<br>41<br>42<br>43<br>No Connect.<br>**Note:**Pins labeled N/C (No Connect) and any unused GPIO pins should be left disconnected. UART flow control pins may also be left<br>disconnected when feature is unused.<br>Not Recommended for New Designs||||
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Functional Overview
## **6. Functional Overview**
## **6.1 Introduction**
The BGX13S creates a Bluetooth 5 compliant Bluetooth Low Energy cable replacement interface, facilitating a Bluetooth Low Energy link to a second embedded device or a mobile device. An embedded MCU controls the device and communicates across the Bluetooth Low Energy link through a serial interface and control signals. Parameters stored in non-volatile memory and configurable through the serial interface adjust performance characteristics of the device. Silicon Labs offers iOS and Android mobile libraries for Blue Gecko Xpress devices to speed mobile development and simplify communication with the device. This library also controls OTA management, facilitating secure and reliable updates to the device’s embedded stack. This functional overview does not cover each command supported by the command API. The complete command API specification is available at https://docs.silabs.com/bgx/latest/ **6.2 Communication Use Cases** The BGX13S family facilitates two types of Bluetooth Low Energy communication links: • BGX-to-mobile • BGX-to-BGX In the BGX-to-mobile communication use case, the BGX13S operates as a peripheral that is discoverable and connectable when configured to that state through either the command API or the pin states driven by the embedded MCU. Using the Xpress mobile library, mobile applications can scan for BGX13S devices, connect, and communicate with the device in both streaming and remote command modes, where the mobile app can execute command API functions remotely. In the BGX-to-BGX communication use case, one BGX13S must be configured as the central device and one or more other BGX devices should be configured as a peripheral. Devices can be configured at runtime through the command API, or those settings can be saved to non-volatile memory so that each device wakes from power-on or low power states as either a peripheral or central. For more information on advertising and connection options, please see the command API documentation. **6.3 Embedded Interface** The BGX13S family uses an 8-N-1 USART interface for data and flow control signaling. The interface is used both for a raw data streaming interface and a command interface, depending on additional hardware pin configuration. UART_TX and UART_RX are defined with flow directions relative to the BGX. Bytes sent from the embedded host to the BGX use the UART_RX pin. Bytes sent from the BGX to the embedded host appear on the UART_TX pin. UART_CTS is a digital input that controls the state of the UART_RTS digital output on the other end of the wireless link. Assertion of a CTS/RTS pair signals that the embedded MCU driving its respective UART_CTS is available to receive bytes. The baud rate of the BGX13S is a configurable parameter. For information on the process by which a baud rate change gets processed and executed by the device, please see the command API documentation. State control signals and visual indicators described below can be assigned to any of the GPIO pins through the command API. These settings can be stored in non-volatile memory and take effect during the next power cycle. For information on configuration of standard GPIO and available special function I/O available on the device, please see the command API documentation. **6.4 Command Mode and Streaming Mode** The BGX13S is designed to wake and offer optimized serial interface with hardware flow control. Hardware flow control signaling is disabled by default. When operating in a peripheral role and when flow control signals are monitored, the device may never need to leave streaming mode during operation. However, when use cases require more advanced runtime configuration, the device can switch to command interface through pin or escape sequence. Commands defined here can control scanning, advertising, connection state, and GPIO settings. The command interface is also used to configure and store customizable parameters. Streaming mode can be switched to command mode through an escape sequence of characters if the sequence has been previously saved in the device's configuration. A command can be issued in command mode to switch to streaming mode. Stream mode and command mode entrance can be controlled through a device port pin state, if a pin has been previously defined for that purpose.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Functional Overview
## **6.5 Command API**
Each command begins with a command name followed by arguments, and the syntax of each command is defined in the command API documentation.
The command interface saves settings as key-value pairs. These values can be used at runtime to modify the operational state, and they can also be stored in non-volatile memory. Values stored in non-volatile memory function to configure the device's startup/default state. **6.6 GPIO Control** The BGX13S offers 8 GPIO pins. These pins can be configured as state control pins or visual indicator pins. Alternatively, they can be used as general purpose I/O pins. Digital output settings can be set and digital input state can be read through the command interface locally or remotely through the remote command execution using the mobile libraries. **6.7 Device Configuration** Device configuration is handled through the command API, where commands are executed when the serial interface is set to operate in command mode. These commands can also be executed remotely through the mobile library unless prohibited through previous configuration. Additionally, a device configuration can be generated and saved using Simplicity Studio's Xpress Configurator tool. A generated configuration can be submitted to Silicon Labs through the process defined in that application. Silicon Labs will then validate the configuration request, generate a custom orderable part number, and deliver first article samples for testing. Developers should contact sales representatives for more information about this process. Once first article samples have been validated by the customer, this custom orderable part number can be ordered directly from Silicon Labs. **6.8 Security Features** BGX13S devices communicate with LE secure connections, establishing encrypted communication upon connection. Device OTA requires an encrypted image signed by Silicon Laboratories. Only firmware developed, signed, and encrypted by Silicon Labs can be bootloaded successfully on the device. **6.9 OTA** The BGX13S supports secure OTA of the embedded stack and the command interface. Images are encrypted and signed by Silicon Laboratories. OTA can be performed through the mobile library APIs. Specific device firmware versions can be selected and programmed through these APIs. See command API documentation for more information. For information on new functionality including firmware updates to BGX13S, please see docs.silabs.com. BGX13S module OPN firmware will not be updated to include newly released features available through OTA and DFU updates provided by Silicon Labs. Module OPN firmware will only be updated at manufacturing time to provide security-related enhancements. Contact Silicon Labs technical support for information on customer factory programming options for custom OPN ordering with a specified device firmware version and for customer factory programming options. **6.10 Direct Test Mode Support** The BGX13S's command API offers a command set that configures the device to support the Direct Test Mode (DTM) protocol as defined in the Bluetooth Core Specification Version 4.2, Volume 6, part F. See the command API for information about commands to support specific DTM test procedures.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications
## **7. Package Specifications**
## **7.1 BGX13S Package Dimensions**
|**Figure 7.1. BGX13S Package Dimensions**<br>**Dimension**<br>**MIN**<br>**NOM**<br>**MAX**<br>A<br>1.20<br>1.30<br>1.40<br>Not Recommended for New Designs<br>1/1<br>1:<br>7)<br>TOPVIEW<br>[B |<br>SIDEVIEW<br>TH sosodbaeerSt<br>ale<br>23}<br>ze<br>jae shei<br>=SPP<br>RB<br>ebay|**Figure 7.1. BGX13S Package Dimensions**<br>**Dimension**<br>**MIN**<br>**NOM**<br>**MAX**<br>A<br>1.20<br>1.30<br>1.40<br>Not Recommended for New Designs<br>1/1<br>1:<br>7)<br>TOPVIEW<br>[B |<br>SIDEVIEW<br>TH sosodbaeerSt<br>ale<br>23}<br>ze<br>jae shei<br>=SPP<br>RB<br>ebay|**Figure 7.1. BGX13S Package Dimensions**<br>**Dimension**<br>**MIN**<br>**NOM**<br>**MAX**<br>A<br>1.20<br>1.30<br>1.40<br>Not Recommended for New Designs<br>1/1<br>1:<br>7)<br>TOPVIEW<br>[B |<br>SIDEVIEW<br>TH sosodbaeerSt<br>ale<br>23}<br>ze<br>jae shei<br>=SPP<br>RB<br>ebay|**Figure 7.1. BGX13S Package Dimensions**<br>**Dimension**<br>**MIN**<br>**NOM**<br>**MAX**<br>A<br>1.20<br>1.30<br>1.40<br>Not Recommended for New Designs<br>1/1<br>1:<br>7)<br>TOPVIEW<br>[B |<br>SIDEVIEW<br>TH sosodbaeerSt<br>ale<br>23}<br>ze<br>jae shei<br>=SPP<br>RB<br>ebay|**Figure 7.1. BGX13S Package Dimensions**<br>**Dimension**<br>**MIN**<br>**NOM**<br>**MAX**<br>A<br>1.20<br>1.30<br>1.40<br>Not Recommended for New Designs<br>1/1<br>1:<br>7)<br>TOPVIEW<br>[B |<br>SIDEVIEW<br>TH sosodbaeerSt<br>ale<br>23}<br>ze<br>jae shei<br>=SPP<br>RB<br>ebay|
|---|---|---|---|---|
||A1<br>0.26<br>0.30||0.34||
||A2<br>0.95<br>1.00||1.05||
||b<br>0.27<br>0.32||0.37||
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications
||||BGX13S Blue Gecko Xpre|ss_Bluetooth_ ®SiP Module Data Sheet<br>Package Specifications|
|---|---|---|---|---|
||**Dimension**|**MIN**|**NOM**|**MAX**|
||D|6.50 BSC|||
||D2|2.92 BSC|||
||D3|4.50 BSC|||
||D4<br>|0.68 BSC<br>|||
||D5<br>|0.60 BSC<br>|||
||e<br>|0.50 BSC<br>n|||
||E<br>|6.50 BSC<br>i|||
||E2<br>|1.00 BSC<br>s|||
||E3<br>|5.50 BSC<br>|||
||E4<br>|4.00 BSC<br>|||
||E5<br>|0.60 BSC<br>|||
||L<br>|0.43<br>|0.48<br>|0.53<br>|
||L1<br>|0.11<br>|0.16<br>|0.21<br>|
||L2<br>|0.34<br>|0.39<br>|0.44<br>|
||L3<br>|0.24<br>|0.29<br>|0.34<br>|
||L4<br>|0.14<br>|0.19<br>r|0.24<br>|
||L5<br>|0.62<br>|0.67<br>f|0.72<br>|
||eD1<br>|1.20 BSC<br>|||
||eD2<br>|2.40 BSC<br>|||
||eD3<br>|0.07 BSC<br>|||
||eD4<br>|1.50 BSC<br>|||
||eE1<br>|0.30 BSC<br>n|||
||eE2<br>|0.20 BSC<br>|||
||eE3<br>|1.60 BSC<br>|||
||eE4<br>|1.65 BSC<br>|||
||eE5<br>|0.80 BSC<br>|||
||aaa<br>|0.10<br>|||
||bbb<br>c|0.10<br>|||
||ccc<br>|0.10<br>|||
||ddd<br>|0.10<br>|||
||eee<br>t|0.10<br>|||
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications
**Dimension**
**MIN**
**NOM**
**MAX**
## **Note:**
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Tolerances are:
- a. Decimal:
- X.X = ±0.1 X.XX = ±0.05 X.XXX = ±0.03
- b. Angular: ±0.1 Degrees
- 3. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 4. This drawing conforms to the JEDEC Solid State Outline MO-220. 5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 6. Hatching lines means package shielding area. 7. Solid pattern (3.1x3.1mm) shows non-shielding area including its side walls. For side wall, borderline between shielding area and not-shielding area could not be defined clearly like top side.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications
## **7.2 BGX13S Recommeded PCB Land Pattern**
This section describes the recommended PCB land pattern for the BGX13S. The antenna copper clearance area is shown in Figure 7.2 BGX13S Recommended Antenna Clearance on page 28, while the X-Y cordinates of pads relative to the origin are shown in Table 7.1 BGX13S Pad Coordinates and Sizing on page 29. The origin is the center point of pin number 47. It is very important to align the antenna area relative to the module pads precisely.
—-| 1.00 2.63oo 3.83 o oa O° 0.84 — | |_| Cl]? “OQUUOUOUUUUUS* 2[ ]* + 2 + = @ 8 @ 5» @ [| |” 2 — ] []* *— ] Cl]? >‘a[ WU []g:7 7] Cc]2 = — ] fj “OOQOOO000000" **Figure 7.2. BGX13S Recommended Antenna Clearance**
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications
## **Table 7.1. BGX13S Pad Coordinates and Sizing**
|||**Pad No.**|**Pad coordinates (X,Y)**|**Pad size (mm)**||
|---|---|---|---|---|---|
|||47|Pad Center, Origin (0,0)|0.32 x 0.48||
|1<br>(0,-1.60)<br>2<br>(0,-2.10)<br>9<br>(0,-5.60)<br>10<br>(0.60,-5.75)<br>19<br>(5.10,-5.75)<br>20<br>(5.70,-5.60)<br>31<br>(5.70,-0.10)<br>32<br>(5.10,-0.05)<br>36<br>(5.10,-1.65)<br>45<br>(0.60,-1.65)<br>49<br>(0,-1.00)<br>46<br>(2.92,0)<br>50<br>(1.65,-3.70)<br>0.67 x 0.67<br>51<br>(4.05,-3.70)<br>Not Recommended for New Designs||||||
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications
|**Figure 7.3. BGX13S Recommended PCB Land Pattern**<br>**Table 7.2. BGX13S Recommended PCB Land Pattern**<br>**Symbol**<br>**NOM (mm)**<br>b<br>0.32 BSC<br>D1<br>5.50 BSC<br>D2<br>3.70 BSC<br>D3<br>4.00 BSC<br>D4<br>0.05 BSC<br>D5<br>1.65 BSC<br>eD1<br>1.00 BSC<br>eD2<br>0.60 BSC<br>eD3<br>0.15 BSC<br>e<br>0.50 BSC<br>E1<br>5.70 BSC<br>E2<br>5.10 BSC<br>E3<br>3.60 BSC<br>E4<br>2.92 BSC<br>E5<br>1.65 BSC<br>Not Recommended for New Designs<br>Peer |chs<br>ee stooge |<br>St,<br>S|<br>wsTkOUUpet|**Figure 7.3. BGX13S Recommended PCB Land Pattern**<br>**Table 7.2. BGX13S Recommended PCB Land Pattern**<br>**Symbol**<br>**NOM (mm)**<br>b<br>0.32 BSC<br>D1<br>5.50 BSC<br>D2<br>3.70 BSC<br>D3<br>4.00 BSC<br>D4<br>0.05 BSC<br>D5<br>1.65 BSC<br>eD1<br>1.00 BSC<br>eD2<br>0.60 BSC<br>eD3<br>0.15 BSC<br>e<br>0.50 BSC<br>E1<br>5.70 BSC<br>E2<br>5.10 BSC<br>E3<br>3.60 BSC<br>E4<br>2.92 BSC<br>E5<br>1.65 BSC<br>Not Recommended for New Designs<br>Peer |chs<br>ee stooge |<br>St,<br>S|<br>wsTkOUUpet|**Figure 7.3. BGX13S Recommended PCB Land Pattern**<br>**Table 7.2. BGX13S Recommended PCB Land Pattern**<br>**Symbol**<br>**NOM (mm)**<br>b<br>0.32 BSC<br>D1<br>5.50 BSC<br>D2<br>3.70 BSC<br>D3<br>4.00 BSC<br>D4<br>0.05 BSC<br>D5<br>1.65 BSC<br>eD1<br>1.00 BSC<br>eD2<br>0.60 BSC<br>eD3<br>0.15 BSC<br>e<br>0.50 BSC<br>E1<br>5.70 BSC<br>E2<br>5.10 BSC<br>E3<br>3.60 BSC<br>E4<br>2.92 BSC<br>E5<br>1.65 BSC<br>Not Recommended for New Designs<br>Peer |chs<br>ee stooge |<br>St,<br>S|<br>wsTkOUUpet|**Figure 7.3. BGX13S Recommended PCB Land Pattern**<br>**Table 7.2. BGX13S Recommended PCB Land Pattern**<br>**Symbol**<br>**NOM (mm)**<br>b<br>0.32 BSC<br>D1<br>5.50 BSC<br>D2<br>3.70 BSC<br>D3<br>4.00 BSC<br>D4<br>0.05 BSC<br>D5<br>1.65 BSC<br>eD1<br>1.00 BSC<br>eD2<br>0.60 BSC<br>eD3<br>0.15 BSC<br>e<br>0.50 BSC<br>E1<br>5.70 BSC<br>E2<br>5.10 BSC<br>E3<br>3.60 BSC<br>E4<br>2.92 BSC<br>E5<br>1.65 BSC<br>Not Recommended for New Designs<br>Peer |chs<br>ee stooge |<br>St,<br>S|<br>wsTkOUUpet|
|---|---|---|---|
|||E6<br>4.50 BSC||
|||E7<br>4.50 BSC||
|||L<br>0.48 BSC||
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications
|**Symbol**|**NOM (mm)**|
|---|---|
|L1|0.67 BSC|
|eE1|0.60 BSC|
|eE2|0.60 BSC|
|eE3<br>Not Recommended for New Designs|2.40 BSC<br>Not Recommended for New Designs|
|eE3<br>2.40 BSC<br>**Notes**:<br>1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.<br>2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.<br>3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.<br>4. The stencil thickness should be 0.100mm (4 mils).<br>5. The stencil aperture to land pad size recommendation is 70% paste coverage.<br>6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different<br>parameters and fine tune their SMT process as required for their application and tooling.<br>**7.3 BGX13S Package Marking**<br>The figure below shows the package markings printed on the module.<br>**Figure 7.4. BGX13S Package Marking**<br>**Explanations**:<br>**Marking**<br>**Explanation**<br>BGX13Sxxx<br>Model Number<br>Certification Marks<br>Certification marks will be printed in this area according to regula-<br>tory body requirements.<br>YWWTTTT<br>1. Y = Manufacturing Year<br>2. WW = Manufacturing Work Week<br>3. TTTT = Trace Code<br>Not Recommended for New Designs<br>BGX13SecA<br>|<br>Certification<br>|<br>Marks<br>e<br>YWWITTT|eE3<br>2.40 BSC<br>**Notes**:<br>1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.<br>2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.<br>3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.<br>4. The stencil thickness should be 0.100mm (4 mils).<br>5. The stencil aperture to land pad size recommendation is 70% paste coverage.<br>6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different<br>parameters and fine tune their SMT process as required for their application and tooling.<br>**7.3 BGX13S Package Marking**<br>The figure below shows the package markings printed on the module.<br>**Figure 7.4. BGX13S Package Marking**<br>**Explanations**:<br>**Marking**<br>**Explanation**<br>BGX13Sxxx<br>Model Number<br>Certification Marks<br>Certification marks will be printed in this area according to regula-<br>tory body requirements.<br>YWWTTTT<br>1. Y = Manufacturing Year<br>2. WW = Manufacturing Work Week<br>3. TTTT = Trace Code<br>Not Recommended for New Designs<br>BGX13SecA<br>|<br>Certification<br>|<br>Marks<br>e<br>YWWITTT|
|---|---|
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Tape and Reel Specifications
## **8. Tape and Reel Specifications**
## **8.1 Tape and Reel Packaging**
This section contains information regarding the tape and reel packaging for the BGX13S Blue Gecko Module.
**8.2 Reel and Tape Specifications** • Reel material: Polystyrene (PS) • Reel diameter: 13 inches (330 mm) • Number of modules per reel: 1000 pcs • Disk deformation, folding whitening and mold imperfections: Not allowed • Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm) • Antistatic treatment: Required • Surface resistivity: 10[4] - 10[9] Ω/sq. 20.4+2.0 rs Ne (\ : C % aan 16.541.0 | GOO fi RS) EE y 1.5 min. **Figure 8.1. Reel Dimensions - Side View silabs.com** | Building a more connected world. Rev. 1.1 | 32
BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Tape and Reel Specifications SS( OX W V **Figure 8.2. Cover tape information Symbol Dimensions [mm]** Thickness (T) 0.05 ± 0.005 Width (W) 13.3 ± 0.1 0..500.05 Xa, 2.00+0.10 4.00:#0.10 & | Roe $G$ H / os 6 o— ° (FJ (~~ } re) — 3 rt i _L| _ | a | C) a ____| aN 8 é nn © | 6 1 I I | / : 1.6040.10 (__| J {— 1_-_) 61.50 (__|Min __) = 6.8020.10 1. 10 sprocket hole pitch cumulative tolerance +0.2 2. Camber not to exceed 1mm in 250mm 3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. **Figure 8.3. Tape information silabs.com** | Building a more connected world. Rev. 1.1 | 33
BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Tape and Reel Specifications
## **8.3 Orientation and Tape Feed**
The user direction of feed, start and end of tape on reel and orientation of the modules on the tape are shown in the figure below.
|**Figure 8.4. Module Orientation and Feed Direction**<br>**8.4 Tape and Reel Box Dimensions**<br>**Figure 8.5. Tape and Reel Box Dimensions**<br>**Symbol**<br>**Dimensions [mm]**<br>W2<br>349<br>W3<br>337<br>W4<br>60<br>**8.5 Moisture Sensitivity Level**<br>Reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements.<br>Not Recommended for New Designs<br>for: a2}<br>| ar: aa] |<br>><br>\<br>Q3 Q4<br>| 03|04<br>UserDirection ofFeed<br>|<br>|<br>|_\<br>Pin 1Quadrant:Q1<br>Kt<br>+<br>YK|
|---|
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Soldering Recommendations
## **9. Soldering Recommendations**
## **9.1 Soldering Recommendations**
The BGX13S is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
• Refer to technical documentations of particular solder paste for profile configurations. • Avoid using more than two reflow cycles. • A no-clean, type-3 solder paste is recommended. • A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. • Recommended stencil thickness is 0.100mm (4 mils). • Refer to the recommended PCB land pattern for an example stencil aperture size. • For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines. • Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Certifications
## **10. Certifications**
## **10.1 Qualified Antenna Types**
The BGX13S has been designed to operate with a standard 2.14 dBi dipole antenna. Any antenna of a different type or with a gain higher than 2.14 dBi is strictly prohibited for use with this device. Using an antenna of a different type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. The required antenna impedance is 50 Ω. **Table 10.1. Qualified Antennas for BGX13S Antenna Type Maximum Gain** Dipole 2.14 dBi **10.2 Bluetooth** The BGX13S is pre-qualified as a Low Energy RF-PHY tested component, having Declaration ID of D039577 and QDID of 119769. For the qualification of an end product embedding the BGX13S, the above should be combined with the most up to date Wireless Gecko Link Layer and Host components. **10.3 CE** The BGX13S22 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU). Please note that every application using the BGX13S22 will need to perform the radio EMC tests on the end product, according to EN 301 489-17. Separate RF testing is not required provided that the customer follows the module manufacturer's recommendations and instructions and does not make modifications (e.g. to the provided antenna solutions or requirements). A formal DoC is available via www.silabs.com **silabs.com** | Building a more connected world. Rev. 1.1 | 36
BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Certifications
## **10.4 FCC**
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
**FCC RF Radiation Exposure Statement:** This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. **OEM Responsibilities to comply with FCC Regulations:** OEM integrator is responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). • With BGX13S22 the antenna(s) must be installed such that a minimum separation distance of 0 mm is maintained between the radiator (antenna) and all persons at all times. • The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. **Important Note:** In the event that the above conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. **End Product Labeling** The variants of BGX13S Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: **"Contains Transmitter Module FCC ID: QOQ13"** Or **"Contains FCC ID: QOQ13"** The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.
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## **10.5 ISED Canada**
## **ISEDC**
This radio transmitter (IC: 5123A-13) has been approved by Industry Canada to operate with the antenna types listed above, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device **RF Exposure Statement** Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. The models BGX13S22GA meet the given requirements when the minimum separation distance to human body is 15 mm. RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation distance is less than stated above the OEM integrator is responsible for evaluating the SAR. **OEM Responsibilities to comply with IC Regulations** The BGX13S modules have been certified for integration into products only by OEM integrators under the following conditions: • The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times. • The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). **IMPORTANT NOTE** In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the ISEDC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate ISEDC authorization. **End Product Labeling** The BGX13S module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “ **Contains Transmitter Module IC: 5123A-13** ” or “ **Contains IC: 5123A-13”** The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Certifications
## **ISEDC (Français)**
Industrie Canada a approuvé l’utilisation de cet émetteur radio (IC: 5123A-13) en conjonction avec des antennes de type dipolaire à 2.14dBi ou des antennes embarquées, intégrée au produit. L’utilisation de tout autre type d’antenne avec ce composant est proscrite.
Ce composant est conforme aux normes RSS, exonérées de licence d'Industrie Canada. Son mode de fonctionnement est soumis aux deux conditions suivantes:
1. Ce composant ne doit pas générer d’interférences.
2. Ce composant doit pouvoir est soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement. **Déclaration d'exposition RF** L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. Les modules BGX13S22GA répondent aux exigences requises lorsque la distance minimale de séparation avec le corps humain est de 15 mm. La déclaration d’exposition RF ou l'évaluation SAR n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de procédé à une évaluation SAR. **Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré** Le module BGX13S a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions suivantes: • L'antenne (s) doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur (antenne) et toutes les personnes avoisinante, ce à tout moment. • Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée plus haut. Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Cependant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pourrait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de périphériques PC, etc.). **REMARQUE IMPORTANTE** ans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'autorisation ISEDC n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'obtention d'une autorisation ISEDC distincte. **Étiquetage des produits finis** Les modules BGX13S sont étiquetés avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module intégré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes: “ **Contient le module transmetteur: 5123A-13** ” or “ **Contient le circuit: 5123A-13”** L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio.
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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Certifications
## **10.6 Japan**
The BGX13S22GA are certified in Japan with certification number 209-J00306.
Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan.
**==> picture [577 x 653] intentionally omitted <==**
**----- Start of picture text -----**<br>
of host and radio module to verify if they are actually using a radio device which is approved for use in Japan.<br>Certification Text to be Placed on the Outside Surface of the Host Equipment:<br>SaasC(t Su AICHE fee em SOAS & RT CAE RA ae & ee LT LS,<br>Translation of the text:<br>“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under<br>the Radio Law.”<br>The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment. Note<br>that additional information may be required if the device is also subject to a telecom approval.<br>[R] 209-J00306<br>=.<br>Figure 10.1. GITEKI Mark and ID<br>TTT TTT,<br>A h bo “haa<br>a) 66 2aNe<br>ada <4 a ee O54<br>|| | rr ada<br>Bae oer aes<br>SR, re<br>PL [LTE] LE<br>oda Oba oda<br>Figure 10.2. GITEKI Mark<br>10.7 KC (South-Korea)<br>The BGX13S22GA have certification in South-Korea.<br>Certification number: MSIP-CRM-BGT-13<br>silabs.com | Building a more connected world. Rev. 1.1 | 40<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br>
BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Revision History
## **11. Revision History**
## **Revision 1.1**
## November 2019
- Updated OPNs in 1. Ordering Information.
- Updated 3.1 Typical BGX13S Connections with new layout guidelines.3.1 Typical BGX13S Connections with new layout guidelines. with new layout guidelines.
**==> picture [577 x 569] intentionally omitted <==**
**----- Start of picture text -----**<br>
Updated 3.1 Typical BGX13S Connections with new layout guidelines.3.1 Typical BGX13S Connections with new layout guidelines. with new layout guidelines.<br>• Updated 4.3 Effect of Plastic and Metal Materials with the new layout guidelines.<br>• Removed the Antenna Tuning image from 4.3 Effect of Plastic and Metal Materials.<br>• Added note in 5.1 BGX13S Device Pinout to leave unused and no-connect pins disconnected.<br>• Added 8. Tape and Reel Specifications.<br>• Updated Figure 7.2 BGX13S Recommended Antenna Clearance on page 28 in 7.2 BGX13S Recommeded PCB Land Pattern.<br>• Updated Figure 4.1 BGX13S PCB Top Layer Design on page 16 and Figure 4.2 BGX13S PCB Middle and Bottom Layer Design on<br>page 16.<br>• Added Figure 4.3 Practical Installation of BGX13S on Application PCB on page 16.<br>• Added certification chapter 10. Certifications.<br>• Added default hardware flow control settings to 6.4 Command Mode and Streaming Mode description.<br>• Changed "BLE" to "Bluetooth Low Energy" throughout.<br>• Minor typographical corrections, including capitalization, mis-spellings and punctuation marks, throughout document.<br>Revision 1.0<br>December 2018<br>• 6.9 OTA: Updated firmware update policy.<br>• 2.1.1 Absolute Maximum Ratings: Corrected storage temperature.<br>• Table 2.2 General Operating Conditions on page 6: Added VIOVDD specification line.<br>• Table 2.8 Non-Volatile Configuration Storage on page 12: Corrected minimum supply voltage during update.<br>• Table 2.9 General-Purpose I/O (GPIO) on page 13: Added details about RESETn supply reference.<br>• 2.1.4.1 RF Transmitter General Characteristics for 2.4 GHz Band: Removed references to internal supply connections.<br>• 3.1 Typical BGX13S Connections: Updated recommended connection details for RESETn, BOOT, and 1V8.<br>• 7.3 BGX13S Package Marking: Replaced detailed certification marks and text description with Certification Mark area.<br>Revision 0.5<br>August 2018<br>• Public Release<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br>
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Simplicity Studio’4 a EA a er =i. | y = **Simplicity Studio** One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! **IoT Portfolio SW/HW Quality Support and Community** _www.silabs.com/IoT www.silabs.com/simplicity www.silabs.com/quality community.silabs.com_ **Disclaimer** Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. **Trademark Information** Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, ClockBuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, Gecko OS, Gecko OS Studio, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® , Zentri, the Zentri logo and Zentri DMS, Z-Wave®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.
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Silicon Labs is a recognized industry leader in secure, intelligent wireless technology and precision timing solutions. Renowned for driving innovation in the Internet of Things (IoT) and industrial automation, the company develops electronic components that deliver the performance, energy savings, and design simplicity required to build a seamlessly connected world. Our extensive portfolio of Silicon Labs components prominently features their robust wireless connectivity and timing products. This includes a comprehensive selection of Bluetooth modules and adaptors engineered for reliable, low-power communication in smart devices. Complementing these wireless offerings is a broad array of precision timing devices, particularly standard and advanced MEMS oscillators, which are critical for ensuring exact synchronization and stable frequency control in demanding circuit designs. To support a wider spectrum of networking and communication requirements, the lineup also encompasses versatile WLAN modules and USB adaptors. Additionally, engineers will find highly integrated sub-2.4GHz ISM band RF transceivers, available as both standalone integrated circuits and complete RF modules, providing exceptional range and signal resilience for complex wireless deployments.
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