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Illustrative purposes only
BGM270SC22SNA4R
Bluetooth Module, Silicon Labs EFR32BG27, Bluetooth LE 6.0, -95.5 dBm, 1.8 to 3.8V, 2.402 to 2.48GHz
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: SILICON LABS
- Product type: Bluetooth Modules & Adaptors
- SVHC: No SVHC (25-Jun-2025)
- Interfaces: I2C, SPI, UART, USART
- Product Range: BGM270S Series
- Certifications: CE, FCC, ISED, KC, MIC, UKCA
- Bluetooth Class: -
- Bluetooth Version: Bluetooth LE 6.0
- Supply Voltage Range: 1.8V to 3.8V
- Receiver Sensitivity Rx: -95.9dBm
- Operating Temperature Range: -40 °C to 105 °C
| Delivery and price | |
|---|---|
| Units per pack | 2500 |
| Price | 3.11 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **BGM270S Wireless Gecko Module Data Sheet**
The BGM270S is a secure, high-performance wireless module optimized for the needs of battery and line-powered IoT devices operating in the 2.4 GHz band.
Based on the Series 2 EFR32BG27 SoC, it enables Bluetooth® Low Energy connectivity, delivering exceptional RF performance and energy efficiency.
The BGM270S is a complete System in Package solution offered with robust and fully upgradeable software stacks, global regulatory certifications, advanced development and debugging tools, and documentation that simplifies and minimizes the development cycle of your end-product, helping to accelerate its time-to-market.
The BGM270S is targeted for a broad range of applications, including:
- Bluetooth Mesh
- Portable Medical
- Home End Devices
## **KEY FEATURES**
- 32-bit ARM® Cortex®-M33 core with 76.8 MHz maximum operating frequency
- 768 kB of flash and 64 kB of RAM
- Energy-efficient radio core with low active and sleep currents
- Integrated PA with 6.5 dBm (2.4 GHz) TX power
- Secure Boot with Root of Trust and Secure Loader (RTSL)
- DC-DC supporting buck (1.8 to 3.8 V)
- 26 GPIO pins
- -40 to 105 °C
- 6.5 x 6.5 x 1.3 mm
- Fleet/Asset Monitoring
- Industrial Automation
- Access Control
- Sport, Fitness, and Wellness Devices
- Power Tools
**==> picture [540 x 173] intentionally omitted <==**
**----- Start of picture text -----**<br>
Core / Memory Crystal Clock Management Supply Energy Management Security Features<br>ARM CortexDSP extensions, FPU, [TM] M33 Flash Memory RAM Memory 38.4 MHz HF Crystal Oscillator RC OscillatorHF DC-DC LC DC-DC Buck Coulomb Counter Crypto Acceleration, Secure Boot RTSL available down to Energy Mode:<br>TrustZone 768 kB 64 kB Fast StartupRC Oscillator Precision LFRC Oscillator Decoupling RegulatorsVoltage ResetPower-On TRNG, PUF Key Secure Debug EM0<br>Debug InterfaceSWD, ETM, JTAG Controller8-Channel Linked DMA LF Crystal Oscillator Ultra LF RC Oscillator DetectorsBrown-Out DPA Countemeasures External Trace Tamper Detect Run<br>EM1<br>Sleep<br>32-bit bus32-bit bus<br>12-Channel Peripheral Reflex SystemPeripheral Reflex System EM2<br>Deep Sleep<br>Antenna Radio Serial Interfaces Timers and Triggers I/O Ports Analog I/F<br>2x USART 1x EUSART 2x 32-bit, 3-ch 3x 16-bit, 3-ch External ADC EM3Stop<br>M0+ Radio UART, SPI, I2S UART, SPI Timers Timers Interrupts 12-16 bit<br>Antenna or RF Pin Controller<br>Matching Integrated PAs0 and +6.8 dBmIntegrated PA 1x I2C 1x I2C 24-bit, 2-ch Low Energy Timer Counter / CaptureReal Time General Purpose I/OPin Reset ComparatorAnalog ShutoffEM4<br>PDM Watchdog Back-Up Real Temperature<br>2-ch, 16-bit Timer Time Counter Pin Wakeup Sensor<br>**----- End of picture text -----**<br>
**Copyright © 2025 by Silicon Laboratories**
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Rev. 1.0
BGM270S Wireless Gecko Module Data Sheet Feature List
## **1. Feature List**
Following are the highlighted features of BGM270S.
- **Low Power Wireless System-on-Chip**
- High Performance 32-bit 76.8 MHz ARM Cortex[®] -M33 with DSP instruction and floating-point unit for efficient signal processing
- 768 kB flash program memory
- 64 kB RAM data memory
- 2.4 GHz radio operation
- **Radio Performance**
- -106.5 dBm sensitivity @ 125 kbps GFSK
- -102.2 dBm sensitivity @ 500 kbps GFSK
- -98.8 dBm sensitivity @ 1 Mbit/s GFSK
- -95.9 dBm sensitivity @ 2 Mbit/s GFSK
- TX power up to 6.5 dBm
- **Low System Energy Consumption**
- 3.8 mA RX current (1 Mbps GFSK)
- 4.7 mA TX current @ 0 dBm output power
- 11.2 mA TX current @ 6.5 dBm output power
- 29 μA/MHz in Active Mode (EM0) at 76.8 MHz
- 2.2 μA EM2 DeepSleep current (RTCC running from LFXO, Full RAM retention)
- 0.22 μA EM4 current
- **Protocol Support**
- Bluetooth Low Energy (Bluetooth 6.0)
- **Security Features**
- Secure Boot with Root of Trust and Secure Loader (RTSL)
- Hardware Cryptographic Acceleration for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH
- DPA Countermeasures
- Key Management with PUF
- True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31
- ARM[®] TrustZone[®]
- Secure Debug with lock/unlock
- External Tamper Detect
- **Wide selection of MCU peripherals**
- Analog to Digital Converter (ADC)
- 12-bit @ 1 Msps
- 16-bit @ 76.9 ksps
- Analog Comparator (ACMP)
- Up to 26 General Purpose I/O pins with output state retention and asynchronous interrupts
- 8 Channel DMA Controller
- 12 Channel Peripheral Reflex System (PRS)
- 2 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels
- 3 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels
- 32-bit Real Time Counter
- 24-bit Low Energy Timer for waveform generation
- 1 × Watchdog Timer
- 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I[2] S)
- 1 × Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI)
- 2 × I[2] C interface with SMBus support
- Digital Microphone interface (PDM)
- Precision Low-Frequency RC Oscillator to replace 32 kHz sleep crystal
- Die temperature sensor with +/-1.5 °C accuracy after singlepoint calibration
- Coulomb counter integrated into DC-DC
## • **Wide Operating Range**
- 1.8 to 3.8 V power supply
- -40 to +105 °C
- **Packages**
- **LGA** 6.5 mm x 6.5 mm 48 Pins
- **Regulatory Certification**
- CE (EU)
- UKCA (UK)
- FCC (USA)
- ISED (Canada)
- MIC (Japan)
- KC (South Korea)
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Rev. 1.0 | 2
BGM270S Wireless Gecko Module Data Sheet Ordering Information
## **2. Ordering Information**
**Table 2.1. Ordering Information**
|**Ordering Code**|**Protocol Stack**|**Max**<br>**TX**<br>**Power**|**DC-DC**|**Flash**<br>**(kB)**|**RAM**<br>**(kB)**|**GPIO**|**Package**|**Temp**<br>**Range**|**Pack-**<br>**aging**|
|---|---|---|---|---|---|---|---|---|---|
|BGM270SC22SNA4|Bluetooth 6.0<br>• Direction Find-<br>ing (AoA Trans-<br>mitter)|6.5<br>dBm|Buck|768|64|26|SiP|-40 to<br>+105 °C|Cut<br>Tape|
|BGM270SC22SNA4R|Bluetooth 6.0<br>• Direction Find-<br>ing (AoA Trans-<br>mitter)|6.5<br>dBm|Buck|768|64|26|SiP|-40 to<br>+105 °C|Reel|
Bluetooth 6.0: As the Bluetooth standard evolves, Silicon Labs is regularly adding new features. For more information on supported Bluetooth capabilities, visit https://www.silabs.com/bluetooth-hardware.
Throughout this document, the module may be referred to by its product family/marketing name (i.e. BGM270S), by its model name (i.e. BGM270S22A), or by its full ordering code as seen in the table above.
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Rev. 1.0 | 3
## **Table of Contents**
|**1.**|**Feature List .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2.**|**Ordering Information**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 3**|
|**3.**|**System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 6**|
||3.1 Introduction .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 6|
||3.2 EFR32BG27 SoC .<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
||3.3 Antenna .<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
||3.4 Power Supply<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
|**4.**|**Electrical Characteristics .**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 8**|
||4.1 Absolute Maximum Ratings.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 8|
||4.2 General Operating Conditions|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 9|
||4.2.1 DC-DC Operating Limits|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.10|
||4.3 Thermal Characteristics .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.11|
||4.4 MCU Current Consumption with||3.0|V|Supply|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12|
||4.5 Radio Current Consumption with 3.0 V Supply|||||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.14|
||4.6 RF Transmitter General Characteristics for||||||the|2.4|GHz||Band||.|.|.|.|.|.|.|.|.|.|.|.|.|.15|
||4.7 RF Receiver General Characteristics for the 2.4 GHz|||||||||Band .|||.|.|.|.|.|.|.|.|.|.|.|.|.|.15|
||4.8 RF Receiver Characteristics for Bluetooth Low|||||||Energy in the 2.4||||||GHz Band 1 Mbps Data Rate||||||||||.|.|.16|
||4.9 RF Receiver Characteristics for Bluetooth Low|||||||Energy in the 2.4||||||GHz Band 2 Mbps Data Rate||||||||||.|.|.17|
||4.10 RF Receiver Characteristics|for Bluetooth|||||Low Energy||||in the 2.4 GHz Band 500|||||||||kbps Data Rate .||||||.18|
||4.11 RF Receiver Characteristics|for Bluetooth|||||Low Energy||||in the 2.4 GHz Band 125|||||||||kbps Data Rate .||||||.19|
||4.12 High-Frequency Crystal<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.20|
||4.13 Low Frequency Crystal Oscillator|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.20|
||4.14 Precision Low Frequency RC Oscillator|||||(LFRCO) .||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.21|
||4.15 GPIO Pins .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.22|
||4.16 Microcontroller Peripherals|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.23|
||4.17 Antenna Radiation Patterns|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24|
|**5.**|**Reference Diagrams.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**26**|
||5.1 Network Co-Processor (NCP)|Application with||||||UART||Host||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.26|
||5.2 SoC Application<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.27|
|**6.**|**Pin Definitions .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**<br>**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**28**|
||6.1 48-Pin SiP Module Device Pinout.|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.28|
||6.2 Alternate Function Table.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.30|
||6.3 Analog Peripheral Connectivity||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.31|
||6.4 Digital Peripheral Connectivity .||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.32|
|**7.**|**Design Guidelines**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 35**|
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Rev. 1.0 | 4
|7.1 Layout and Placement<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.35|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|7.2 Best Design Practices<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.38|
|7.3 Radio Performance vs. Carrier Board|||||Size||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.40|
|7.4 Proximity to Other Materials||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.40|
|7.5 Proximity to Human Body|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.40|
|7.6 Antenna Tuning and Validity of Modular Certifications .|||||||||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.41|
|**8. Package Specifications**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.42**|
|8.1 Package Dimensions .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.42|
|8.2 Recommended PCB Land|Pattern|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.44|
|8.3 Top Marking .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.45|
|**9. Soldering Recommendations**|||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 46**|
|**10. Tape and Reel**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.47**|
|**11. Certifications .**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**49**|
|11.1 Qualified Antennas .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.50|
|11.2 CE and UKCA - EU and UK||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.51|
|11.3 FCC - USA .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.51|
|11.4 ISED - Canada<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.54|
|11.5 MIC - Japan<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.56|
|11.6 KC - South Korea<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.57|
|11.7 RF Exposure and Proximity||to|Human Body|||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.58|
|11.8 Bluetooth Qualification .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.58|
|**12. Revision History.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**59**|
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Rev. 1.0 | 5
BGM270S Wireless Gecko Module Data Sheet System Overview
## **3. System Overview**
## **3.1 Introduction**
The BGM270S module is a highly-integrated, high-performance system in package with all the hardware components needed to enable 2.4 GHz wireless connectivity and support robust networking capabilities via multiple wireless protocols.
Built around the EFR32BG27 Wireless SoC, the BGM270S includes a built-in antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, an LC tank for DC-DC conversion, a 38.4 MHz reference crystal, and an RF shield. Also, it supports the use of an external 32 kHz crystal as a low frequency reference signal via GPIO pins for use cases demanding maximum energy efficiency.
For designs where an external antenna solution may be beneficial, a configuration option with a 50 Ω-matched RF pin instead of the built-in antenna is available
**==> picture [468 x 227] intentionally omitted <==**
**----- Start of picture text -----**<br>
2402 – 2480 MHz 1.8 - 3.8 V<br>VREGVDD<br>ANT_OUT<br>2402 – 2480 MHz Integral IOVDD<br>Supply Decoupling<br>Antenna<br>External ANT_IN and DC-DC Support VDCDC<br>Antenna<br>DECOUPLE<br>or 1.5 nH<br>RF_2G4 RF Match<br>Silicon Labs (up to 26)<br>G PIO<br>EFR32BG27<br>RESET_N<br>HF XTAL<br>GND<br>38.4 MHz<br>**----- End of picture text -----**<br>
**Figure 3.1. BGM270S Block Diagram**
A simplified internal schematic for the BGM270S module is shown in the following figure.
EFR32BG27
**==> picture [396 x 199] intentionally omitted <==**
**----- Start of picture text -----**<br>
VREGVDD VREGVDD Integral ANT_OUT<br>4.7µF Antenna ANT_IN<br>AVDD<br>Matching<br>IOVDD IOVDD RF2G4_IO RF_2G4<br>Network<br>1.0µF<br>VDCDC VREGSW<br>PA0x PAx (0-8)<br>PB0x PBx (0-4)<br>2.2µH PC0x PCx (0-7)<br>PD0x PDx (0-3)<br>DVDD RESET_N RESET_N<br>RFVDD<br>0.1µF<br>PAVDD<br>HFXTAL_I<br>4.7µF<br>38.4 MHz<br>DECOUPLE DECOUPLE HFXTAL_O<br>2.2µF<br>**----- End of picture text -----**<br>
**Figure 3.2. BGM270S Module Schematic**
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BGM270S Wireless Gecko Module Data Sheet System Overview
## **3.2 EFR32BG27 SoC**
The EFR32BG27 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 768 kB of flash memory, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG27 Wireless Gecko Reference Manual and the EFR32BG27 Wireless Gecko SoC Family Data Sheet for details.
## **3.3 Antenna**
BGM270S support two antenna configurations: a built-in integral ground loop type antenna realized by a PCB trace design, or a 50 Ω- matched RF pin to support an external antenna. Typical performance characteristics for the built-in antenna are detailed in the table below. Refer to , 7.3 Radio Performance vs. Carrier Board Size and 11.1 Qualified Antennas for other relevant details.
**Table 3.1. BGM270S antenna specification**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Antenna Frequency<br>Range|FRANGE||2402|—|2480|MHz|
|Antenna Gain|GMAX|Maximum relative to isotropic|—|—|1.74|dBi|
|Antenna Efficiency|Efficiency||—|—|-1.79|dB|
|Reference impedance|Z||—|50|—||
|Dielectric Constant Host<br>Board|DICONST||—|4.3|—||
|VSWR|VSWR|Maximum|—|—|2:1|—|
Antenna efficiency, gain and radiation pattern are dependent on the application PCB layout and mechanical design. Antenna specification is based on the assumption that the host board design guidelines in 7. Design Guidelines are followed.
## **3.4 Power Supply**
The BGM270S typically requires a primary supply voltage of nominal 3.0 V to VREGVDD, and a IO supply voltage (IOVDD, typically using the primary supply) to operate.
All necessary decoupling, filtering and DC-DC related components are included in the module, and the supply is fully regulated internally.
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4. Electrical Characteristics**
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
- Typical values are based on TA = 25 °C and VREGVDD = IOVDD supply at 3.0 V, by production test and/or technology characterization.
- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.
- Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
## **4.1 Absolute Maximum Ratings**
Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at https://www.silabs.com/documents/public/corporate/quarterly-reliability-report.pdf.
**Table 4.1. Absolute Maximum Ratings**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Storage temperature range|TSTG||-40|—|+105|°C|
|Voltage on any supply pin|VDDMAX||-0.3|—|3.8|V|
|Junction temperature|TJMAX||—|—|+125|°C|
|Voltage ramp rate on any<br>supply pin|VDDRAMPMAX||—|—|1.0|V / µs|
|DC voltage on any GPIO pin|VDIGPIN||-0.3|—|VIOVDD+<br>0.3|V|
|Input RF level on RF pin<br>RF_2G4|PRFMAX2G4||—|—|+10|dBm|
|Absolute voltage on RF pin<br>RF_2G4|VMAX2G4||-0.3|—|VVREG+<br>0.3|V|
|Total current into VDD power<br>lines|IVDDMAX|Source|—|—|200|mA|
|Total current into VSS<br>ground lines|IVSSMAX|Sink|—|—|200|mA|
|Current per I/O pin|IIOMAX|Sink|—|—|50|mA|
|||Source|—|—|50|mA|
|Current for all I/O pins|IIOALLMAX|Sink|—|—|200|mA|
|||Source|—|—|200|mA|
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.2 General Operating Conditions**
This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum values of all other tables are specifed over this operating range, unless otherwise noted.
**Table 4.2. General Operating Conditions**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Operating ambient tempera-<br>ture range|TA|-N temperature grade|-40|—|+105|°C|
|IOVDDx operating supply<br>voltage (All IOVDD pins)|VIOVDDx||1.71|3.0|3.8|V|
|VREGVDD operating supply<br>voltage|VVREGVDD|DC-DC in regulation1|2.2|3.0|3.8|V|
|||DC-DC in bypass|1.8|3.0|3.8|V|
|HCLK and SYSCLK frequen-<br>cy|fHCLK|VSCALE2, MODE = WS1|—|—|80|MHz|
|||VSCALE2, MODE = WS0|—|—|40|MHz|
|||VSCALE1, MODE = WS0|—|—|40|MHz|
|PCLK frequency|fPCLK|VSCALE2|—|—|40|MHz|
|||VSCALE1|—|—|40|MHz|
|EM01 Group A clock fre-<br>quency|fEM01GRPACLK|VSCALE2|—|—|80|MHz|
|||VSCALE1|—|—|40|MHz|
|EM01 Group B clock fre-<br>quency|fEM01GRPBCLK|VSCALE2|—|—|80|MHz|
|||VSCALE1|—|—|40|MHz|
|Radio HCLK frequency|fRHCLK|VSCALE2 or VSCALE1|—|38.4|—|MHz|
|**Note:**<br>1. The supported maximum VVREGVDD in regulation mode is a function of temperature and 10-year lifetime average load current.<br>See more details in 4.2.1 DC-DC Operating Limits.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.2.1 DC-DC Operating Limits**
The maximum supported voltage on the VREGVDD supply pin is limited under certain conditions. Maximum input voltage is a function of temperature and the average load current over a 10-year lifetime. Figure 4.1 Lifetime average load current limit vs. Maximum input voltage on page 10 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the reliability and performance of the DC-DC converter.
The average load current for an application can typically be determined by examining the current profile during the time the device is powered. For example, an application that is continuously powered which spends 99 % of the time asleep consuming 2 µA and 1 % of the time active and consuming 10 mA has an average lifetime load current of about 102 µA.
**==> picture [225 x 167] intentionally omitted <==**
**----- Start of picture text -----**<br>
60 Tj ≤ 105 °C<br>5<br>3.3 3.8<br>Maximum VVREGVDD (V)<br> (mA)<br>LOAD<br>Average Lifetime I<br>**----- End of picture text -----**<br>
**Figure 4.1. Lifetime average load current limit vs. Maximum input voltage**
The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting. Figure 4.2 Transient maximum load current vs. Minimum input voltage on page 10 shows the max load current vs. input voltage for different DC-DC peak inductor current settings.
**==> picture [225 x 166] intentionally omitted <==**
**----- Start of picture text -----**<br>
60<br>36<br>IPEAK = 150 mA<br>5 IPEAK = 90 mA<br>1.8 2.2<br>Minimum VVREGVDD (V)<br> (mA)<br>LOAD<br>Maximum I<br>**----- End of picture text -----**<br>
**Figure 4.2. Transient maximum load current vs. Minimum input voltage**
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.3 Thermal Characteristics**
## **Table 4.3. Thermal Characteristics**
|**Package**|**Board**|**Parameter**|**Symbol**|**Test Condition**|**Value**|**Unit**|
|---|---|---|---|---|---|---|
|44 parame-<br>ter pads, 4<br>center<br>pads,SIP,<br>6.5 mm x<br>6.5 mm|JEDEC - Low<br>Thermal Cond.<br>(2s)1|Thermal Resistance, Junction<br>to Ambient|ΘJA|Still Air (JESDS1 -2A)|92.7|°C/W|
|||Thermal Resistance, Junction<br>to Top Center|ѰJT|Still Air (JESDS1 -2A)|0.6|°C/W|
|||Thermal Resistance, Junction<br>to Board|ѰJB|Still Air (JESDS1 -2A)|38.3|°C/W|
|44 parame-<br>ter pads, 4<br>center<br>pads,SIP,<br>6.5 mm x<br>6.5 mm|JEDEC - High<br>Thermal Cond.<br>(2s2p)2|Thermal Resistance, Junction<br>to Ambient|ΘJA|Still Air (JESD51-2A)|56.1|°C/W|
|||Thermal Resistance, Junction<br>to Top Center|ѰJT|Still Air (JESD51-2A)|0.06|°C/W|
|||Thermal Resistance, Junction<br>to Board|ѰJB|Still Air (JESD51-2A)|35.6|°C/W|
|||Thermal Resistance, Junction<br>to Board|ΘJB|Junction to Board (JESD51-8)|43.5|°C/W|
|44 parame-<br>ter pads, 4<br>center<br>pads,SIP,<br>6.5 mm x<br>6.5 mm|No Board|Thermal Resistance, Junction<br>on to Top Center of Case|ΘJC|Temperature controlled heat sink on<br>top of package, all other sides of<br>package insulated to prevent heat<br>flow, per JESD51-4|18.3|°C/W|
|**Note:**<br>1. Based on 2 layer PCB with dimension 3" x 4.5", PCB Thickness of 1.6 mm, per JED51-3.<br>2. Based on 4 layer PCB with dimension 3" x 4.5", PCB Thickness of 1.6 mm, per JED51-7. Substrate has 4 Land pads with thermal<br>Vias to top internal plane of PCB, per JESD51-5.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.4 MCU Current Consumption with 3.0 V Supply**
Unless otherwise indicated, typical conditions are: VREGVDD = IOVDD = 3.0 V, DC-DC in regulation. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C.
**Table 4.4. MCU Current Consumption with 3.0 V Supply**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Current consumption in EM0<br>mode with all peripherals dis-<br>abled|IACTIVE|76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running while loop from flash,<br>VSCALE2|—|29|—|µA/MHz|
|||76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running CoreMark loop from flash,<br>VSCALE2|—|42|—|µA/MHz|
|||38.4 MHz crystal, CPU running<br>Prime from flash|—|30|—|µA/MHz|
|||38.4 MHz crystal, CPU running<br>while loop from flash|—|30|—|µA/MHz|
|||38.4 MHz crystal, CPU running<br>CoreMark loop from flash|—|43|—|µA/MHz|
|||38 MHz HFRCO, CPU running<br>while loop from flash|—|25|—|µA/MHz|
|||76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal, CPU<br>running Prime from flash,<br>VSCALE2|—|32|—|µA/MHz|
|Current consumption in EM1<br>mode with all peripherals dis-<br>abled|IEM1|76.8 MHz HFRCO w/ DPLL refer-<br>enced to 38.4 MHz crystal,<br>VSCALE2|—|19|—|µA/MHz|
|||38.4 MHz crystal|—|20|—|µA/MHz|
|||38 MHz HFRCO|—|16|—|µA/MHz|
|Current consumption in EM2<br>mode, VSCALE0|IEM2_VS|Full RAM retention and RTC run-<br>ning from LFXO|—|2.2|—|µA|
|||Full RAM retention and RTC run-<br>ning from LFRCO|—|2.2|—|µA|
|||24 kB RAM retention and RTC<br>running from LFXO|—|1.4|—|µA|
|||24 kB RAM retention and RTC<br>running from LFRCO in precision<br>mode|—|1.8|—|µA|
|||8 kB RAM retention and RTC run-<br>ning from LFXO|—|1.3|—|µA|
|||8 kB RAM retention and RTC run-<br>ning from LFRCO|—|1.3|—|µA|
|Current consumption in EM3<br>mode, VSCALE0|IEM3_VS|8 kB RAM retention and RTC run-<br>ning from ULFRCO|—|1.1|—|µA|
|Current consumption in EM4<br>mode|IEM4|No BURTC, no LF oscillator, DC-<br>DC bypassed|—|0.22|—|µA|
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Additional current in EM2 or<br>EM3 when any peripheral in<br>PD0B is enabled1|IPD0B_VS||—|1.2|—|µA|
|**Note:**<br>1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the<br>peripherals in each power domain.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.5 Radio Current Consumption with 3.0 V Supply**
RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VREGVDD = IOVDD = 3.0 V, DC-DC in regulation. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C.
**Table 4.5. Radio Current Consumption with 3.0 V Supply**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|System current consumption<br>in receive mode, active pack-<br>et reception|IRX_ACTIVE|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|4.0|—|mA|
|||125 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2, EM1|—|4.5|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|4.0|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2, EM1|—|4.5|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|3.8|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2, EM1|—|4.3|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|4.2|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2, EM1|—|4.7|—|mA|
|System current consumption<br>in receive mode, listening for<br>packet|IRX_LISTEN|125 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|4.0|—|mA|
|||125 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2, EM1|—|4.4|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|4.0|—|mA|
|||500 kbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2, EM1|—|4.5|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|3.8|—|mA|
|||1 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2, EM1|—|4.3|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE1, EM1P|—|4.3|—|mA|
|||2 Mbit/s, 2GFSK, f = 2.4 GHz,<br>VSCALE2, EM1|—|4.8|—|mA|
|System current consumption<br>in transmit mode|ITX|f = 2.4 GHz, CW, 0 dBm output<br>power|—|4.7|—|mA|
|||f = 2.4 GHz, CW, 6.5 dBm output<br>power|—|11.2|—|mA|
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.6 RF Transmitter General Characteristics for the 2.4 GHz Band**
Unless otherwise indicated, typical conditions are: VREGVDD = IOVDD = 3.0V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.6. RF Transmitter General Characteristics for the 2.4 GHz Band**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2402|—|2480|MHz|
|Maximum TX power|POUTMAX|6.5 dBm output power|—|6.5|—|dBm|
|||0 dBm output power|—|-1.5|—|dBm|
|Minimum active TX power|POUTMIN|6.5 dBm output power|—|-29.7|—|dBm|
|||0 dBm output power|—|-26.2|—|dBm|
|Output power variation vs<br>supply voltage variation, fre-<br>quency = 2450 MHz|POUTVAR_V|6.5 dBm output power with<br>VREGVDD swept from 1.8 to 3.0<br>V|—|0.01|—|dB|
|||0 dBm PA output power, with<br>VREGVDD swept from 1.8 to 3.0<br>V|—|0.01|—|dB|
|Output power variation vs<br>temperature, Frequency =<br>2450 MHz|POUTVAR_T|6.5 dBm output power, (-40 to<br>+105 °C)|—|1.1|—|dB|
|||0 dBm output power, (-40 to +105<br>°C)|—|1.1|—|dB|
|Output power variation vs RF<br>frequency|POUTVAR_F|6.5 dBm output power|—|0.1|—|dB|
|||0 dBm output power|—|0.5|—|dB|
## **4.7 RF Receiver General Characteristics for the 2.4 GHz Band**
Unless otherwise indicated, typical conditions are: VREGVDD = IOVDD = 3.0V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.7. RF Receiver General Characteristics for the 2.4 GHz Band**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2402|—|2480|MHz|
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate**
Unless otherwise indicated, typical conditions are: VREGVDD = IOVDD = 3.0V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.8. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-98.8|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-97.2|—|dBm|
|||With non-ideal signals3 1|—|-96.7|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|8.6|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-6.7|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-6.5|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-40.5|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-39.9|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-47.0|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-46.9|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-23.7|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-40.8|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-6.7|—|dB|
|Intermodulation performance|IM|n = 3 (see note7)|—|-19.0|—|dBm|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1.<br>4. Desired signal -67 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.<br>7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate**
Unless otherwise indicated, typical conditions are: VREGVDD = IOVDD = 3.0V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-95.9|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-94.3|—|dBm|
|||With non-ideal signals3 1|—|-94.0|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|8.7|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-6.5|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-6.9|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +4<br>MHz offset1 5 4 6|—|-41.4|—|dB|
|||Interferer is reference signal at -4<br>MHz offset1 5 4 6|—|-45.1|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +6<br>MHz offset1 5 4 6|—|-50.3|—|dB|
|||Interferer is reference signal at -6<br>MHz offset1 5 4 6|—|-51.6|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-23.1|—|dB|
|Selectivity to image frequen-<br>cy ± 2 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +2 MHz with 1<br>MHz precision1 6|—|-42.5|—|dB|
|||Interferer is reference signal at im-<br>age frequency -2 MHz with 1 MHz<br>precision1 6|—|-6.3|—|dB|
|Intermodulation performance|IM|n = 3 (see note7)|—|-18.4|—|dBm|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1.<br>4. Desired signal -67 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.<br>7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate**
Unless otherwise indicated, typical conditions are: VREGVDD = IOVDD = 3.0V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-102.2|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-101.0|—|dBm|
|||With non-ideal signals3 1|—|-99.9|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|2.7|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-7.8|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-7.8|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-45.9|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-50.2|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-46.5|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-55.1|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-48.2|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-48.5|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-46.6|—|dB|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1.<br>4. Desired signal -72 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.11 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate**
Unless otherwise indicated, typical conditions are: VREGVDD = IOVDD = 3.0V, DC-DC in regulation. RF center frequency 2.45 GHz. TA = 25 °C.
**Table 4.11. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Rx Max Strong Signal Input<br>Level for 0.1% BER|RXSAT|Signal is reference signal1|—|10|—|dBm|
|Sensitivity|SENS|Signal is reference signal, 37 byte<br>payload2|—|-106.5|—|dBm|
|||Signal is reference signal, 255<br>byte payload1|—|-106.1|—|dBm|
|||With non-ideal signals3 1|—|-105.7|—|dBm|
|Signal to co-channel interfer-<br>er|C/ICC|(see notes)1 4|—|1.0|—|dB|
|N ± 1 Adjacent channel se-<br>lectivity|C/I1|Interferer is reference signal at +1<br>MHz offset1 5 4 6|—|-13.3|—|dB|
|||Interferer is reference signal at -1<br>MHz offset1 5 4 6|—|-13.2|—|dB|
|N ± 2 Alternate channel se-<br>lectivity|C/I2|Interferer is reference signal at +2<br>MHz offset1 5 4 6|—|-51.8|—|dB|
|||Interferer is reference signal at -2<br>MHz offset1 5 4 6|—|-55.5|—|dB|
|N ± 3 Alternate channel se-<br>lectivity|C/I3|Interferer is reference signal at +3<br>MHz offset1 5 4 6|—|-50.3|—|dB|
|||Interferer is reference signal at -3<br>MHz offset1 5 4 6|—|-60.9|—|dB|
|Selectivity to image frequen-<br>cy|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion1 6|—|-51.4|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz|C/IIM_1|Interferer is reference signal at im-<br>age frequency +1 MHz with 1<br>MHz precision1 6|—|-52.3|—|dB|
|||Interferer is reference signal at im-<br>age frequency -1 MHz with 1 MHz<br>precision1 6|—|-52.1|—|dB|
|**Note:**<br>1. 0.017% Bit Error Rate.<br>2. 0.1% Bit Error Rate.<br>3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1.<br>4. Desired signal -79 dBm.<br>5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.<br>6. With allowed exceptions.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.12 High-Frequency Crystal**
**Table 4.12. High-Frequency Crystal**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal frequency|fHFXTAL||—|38.4|—|MHz|
|Initial calibrated accuracy|ACCHFXTAL||-10|—|10|ppm|
|Temperature drift|DRIFTHFXTAL|Across specified temperature<br>range|-20|—|20|ppm|
## **4.13 Low Frequency Crystal Oscillator**
**Table 4.13. Low Frequency Crystal Oscillator**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Crystal frequency|FLFXO||—|32.768|—|kHz|
|Supported crystal equivalent<br>series resistance (ESR)|ESRLFXO|GAIN = 0|—|—|80|kΩ|
|||GAIN = 1 to 3|—|—|100|kΩ|
|Supported range of crystal<br>load capacitance1|CL_LFXO|GAIN = 0|4|—|6|pF|
|||GAIN = 1|6|—|10|pF|
|||GAIN = 2 (see note2)|10|—|12.5|pF|
|||GAIN = 3 (see note2)|12.5|—|18|pF|
|Current consumption|ICL12p5|ESR = 70 kΩ, CL= 12.5 pF,<br>GAIN3= 2, AGC4= 1|—|254|—|nA|
|Startup time|TSTARTUP|ESR = 70 kΩ, CL= 7 pF, GAIN3=<br>1, AGC4= 1|—|43|—|ms|
|On-chip tuning cap step size|SSLFXO||—|0.26|—|pF|
|On-chip tuning capacitor val-<br>ue at minimum setting5|CLFXO_MIN|CAPTUNE = 0|—|4|—|pF|
|On-chip tuning capacitor val-<br>ue at maximum setting5|CLFXO_MAX|CAPTUNE = 0x4F|—|24.5|—|pF|
|**Note:**<br>1. Total load capacitance seen by the crystal.<br>2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.<br>3. In LFXO_CAL Register.<br>4. In LFXO_CFG Register.<br>5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two<br>caps will be seen in series by the crystal.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.14 Precision Low Frequency RC Oscillator (LFRCO)**
**Table 4.14. Precision Low Frequency RC Oscillator (LFRCO)**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Nominal oscillation frequen-<br>cy|FLFRCO||—|32.768|—|kHz|
|Frequency accuracy|FLFRCO_ACC|Normal mode|-3|—|3|%|
|||Precision mode1, across operat-<br>ing temperature range2|-500|—|500|ppm|
|Startup time|tSTARTUP|Normal mode|—|211|—|µs|
|||Precision mode1|—|11.7|—|ms|
|Current consumption|ILFRCO|Normal mode|—|183|—|nA|
|||Precision mode1, T = stable at 25<br>°C3|—|664|—|nA|
|**Note:**<br>1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.<br>2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.<br>3. Includes periodic re-calibration against HFXO crystal oscillator.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.15 GPIO Pins**
Unless otherwise indicated, typical conditions are: IOVDD = 3.0 V.
**Table 4.15. GPIO Pins**
|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Leakage current|ILEAK_IO|MODEx = DISABLED, IOVDD =<br>3.0 V|—|2.5|—|nA|
|Input low voltage1|VIL|Any GPIO pin|—|—|0.3 *<br>IOVDD|V|
|||RESETn|—|—|0.3 * DVDD|V|
|Input high voltage1|VIH|Any GPIO pin|0.7 *<br>IOVDD|—|—|V|
|||RESETn|0.7 * DVDD|—|—|V|
|Hysteresis of input voltage|VHYS|Any GPIO pin|0.05 *<br>IOVDD|—|—|V|
|||RESETn|0.05 *<br>DVDD|—|—|V|
|Output high voltage|VOH|Sourcing 20 mA, IOVDD = 3.0 V|0.8 *<br>IOVDD|—|—|V|
|||Sourcing 8 mA, IOVDD = 1.71 V|0.6 *<br>IOVDD|—|—|V|
|Output low voltage|VOL|Sinking 20 mA, IOVDD = 3.0 V|—|—|0.2 *<br>IOVDD|V|
|||Sinking 8 mA, IOVDD = 1.71 V|—|—|0.4 *<br>IOVDD|V|
|GPIO rise time|TGPIO_RISE|IOVDD = 3.0 V, Cload= 50 pF,<br>SLEWRATE = 4, 10% to 90%|—|8.4|—|ns|
|GPIO fall time|TGPIO_FALL|IOVDD = 3.0 V, Cload= 50 pF,<br>SLEWRATE = 4, 90% to 10%|—|7.1|—|ns|
|Pull up/down resistance2|RPULL|Any GPIO pin. Pull-up to IOVDD:<br>MODEn = DISABLE DOUT = 1.<br>Pull-down to VSS: MODEn =<br>WIREDORPULLDOWN DOUT =<br>0.|35|44|55|kΩ|
|||RESETn pin. Pull-up to DVDD|34|44|60|kΩ|
|Maximum filtered glitch width|TGF|MODE = INPUT, DOUT = 1|—|27|—|ns|
|**Note:**<br>1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD.<br>2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD.|||||||
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.16 Microcontroller Peripherals**
The MCU peripherals set available in BGM270S modules includes:
- Analog to Digital Converter: 12-bit at 1 Msps, 16-bit at 76.9 ksps (IADC)
- 16-bit and 32-bit Timers/Counters (TIMER)
- 24-bit Low Energy Timer for Waveform Generation (LETIMER)
- 32-bit Counter for Real Time Clock with Capture (RTCC)
- Pulse Density Modulation interface for Digital Microphone (PDM)
- 12 Channel Peripheral Reflex System (PRS)
- Analog Comparator (ACMP)
- Up to 26 GPIO pins
- 8 Channel Linked Direct Memory Access Controller (LDMA)
- Watchdog Timer (WDOG)
- Precision Low-Frequency RC Oscillator to replace 32 kHz sleep crystal (LFRCO)
- Die Temperature Sensor with +/-1.5[o] C accuracy after single-point calibration
- USART (UART/SPI/SmartCards/IrDA/I[2] S)
- EUSART (UART/SPI)
- I[2] C peripheral interfaces
- Coulomb counter integrated into DC-DC
For details on their electrical performance, consult the relevant portions of Section 4 in the SoC data sheet.
To learn which GPIO ports provide access to every peripheral, consult Analog Peripheral Connectivity and Digital Peripheral Connectivity.
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
## **4.17 Antenna Radiation Patterns**
Typical BGM270S radiation patterns for the on-board chip antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna.
**Figure 4.3. BGM270S Typical 2D Antenna Radiation Patterns on 55 mm x 30 mm board - Phi 0[o] Gain (dBi)**
**Figure 4.4. BGM270S Typical 2D Antenna Radiation Patterns on 55 mm x 30 mm board - Phi 90[o] Gain (dBi)**
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BGM270S Wireless Gecko Module Data Sheet Electrical Characteristics
**Figure 4.5. BGM270S Typical 2D Antenna Radiation Patterns on 55 mm x 30 mm board - Theta 90[o] Gain (dBi)**
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BGM270S Wireless Gecko Module Data Sheet Reference Diagrams
## **5. Reference Diagrams**
## **5.1 Network Co-Processor (NCP) Application with UART Host**
The BGM270S can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, refer to _AN958: Debugging and Programming Interfaces for Custom Designs_ .
**==> picture [319 x 309] intentionally omitted <==**
**----- Start of picture text -----**<br>
Antenna Loop<br>44 43 42 41 40 39 38 37 36 35 34<br>VDD<br>1 ANT_OUT GND 33<br>2 NC BGM270S IOVDD 32<br>3 31<br>NC PD00<br>1.5 nH 4 GND GND 30 32.768 kHz<br>5 ANT_IN 45 46 PD01 29 (Optional)<br>RF_2G4 PD02<br>6 28<br>GND PD03<br>7 47 48 27<br>PB05 VREGVDD<br>8 GND GND 26<br>PB04 GND<br>9 25<br>PB03 DECOUPLE<br>10 24<br>PB02 VDCDC<br>11 23<br>PB01 GND<br>12 13 14 15 16 17 18 19 20 21 22<br>RESET<br>PTI_SYNC (PC05) PTI_DATA (PC04)<br>NC GND RESET_N PC07 PC06 PC05 PC04 PC03 PC02 PC01 PC00<br>PB00 PA00 PA01 PA02 PA03 PA04 GND PA05 PA06 PA08 PA07<br>VCOM_CTS (PA00) DBG_TDO_SWCLK (PA01) DBG_TDO_SWDIO (PA02) DBG_TDO_SWO (PA03) VCOM_TX (PA05) VCOM_RX (PA06) VCOM_RTS (PA07)<br>**----- End of picture text -----**<br>
**==> picture [340 x 90] intentionally omitted <==**
**----- Start of picture text -----**<br>
MINI SIMPLICITY<br>VDD CONNECTOR VDD HOST CPU<br>1<br>VDD 2<br>1 VDD GND 2 RX 0R VCOM_TX (PA05)<br>3<br>RESET 3 RESET VCOM_RX 4 0R VCOM_RX (PA06) TX 4 0R VCOM_RX (PA06)<br>VCOM_TX (PA05) 0R 5 VCOM_TX SWO 6 DBG_TDO_SWO (PA03) RTS 5 VCOM_CTS (PA00)<br>DBG_TDO_SWDIO (PA02) 7 SWDIO SWCLK 8 DBG_TDO_SWCLK (PA01) CTS 6 VCOM_RTS (PA07)<br>9 10 7 RESET RESET<br>PTI_SYNC (PC05) PTI_SYNC PTI_DATA PTI_DATA (PC04) GND<br>**----- End of picture text -----**<br>
**Figure 5.1. UART NCP Configuration**
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BGM270S Wireless Gecko Module Data Sheet Reference Diagrams
## **5.2 SoC Application**
The BGM270S can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, refer to _AN958: Debugging and Programming Interfaces for Custom Designs_ .
**==> picture [329 x 456] intentionally omitted <==**
**----- Start of picture text -----**<br>
Antenna Loop<br>44 43 42 41 40 39 38 37 36 35 34<br>VDD<br>1 33<br>ANT_OUT GND<br>2 NC BGM270S IOVDD 32<br>3 31<br>NC PD00<br>1.5 nH 4 GND GND 30 32.768 kHz<br>5 ANT_IN 45 46 PD01 29 (Optional)<br>RF_2G4 PD02<br>6 28<br>GND PD03<br>7 47 48 27<br>PB05 VREGVDD<br>8 GND GND 26<br>PB04 GND<br>9 25<br>PB03 DECOUPLE<br>10 24<br>PB02 VDCDC<br>11 23<br>PB01 GND<br>12 13 14 15 16 17 18 19 20 21 22<br>MINI SIMPLICITY<br>VDD CONNECTOR<br>1 2<br>VDD GND<br>3 4<br>RESET RESET VCOM_RX 0R VCOM_RX (PA06)<br>5 6<br>VCOM_TX (PA05) 0R VCOM_TX SWO DBG_TDO_SWO (PA03)<br>7 8<br>DBG_TDO_SWDIO (PA02) SWDIO SWCLK DBG_TDO_SWCLK (PA01)<br>9 10<br>PTI_SYNC (PC05) PTI_SYNC PTI_DATA PTI_DATA (PC04)<br>RESET<br>PTI_SYNC (PC05) PTI_DATA (PC04)<br>NC GND RESET_N PC07 PC06 PC05 PC04 PC03 PC02 PC01 PC00<br>PB00 PA00 PA01 PA02 PA03 PA04 GND PA05 PA06 PA08 PA07<br>DBG_TDO_SWCLK (PA01) DBG_TDO_SWDIO (PA02) DBG_TDO_SWO (PA03) VCOM_TX (PA05) VCOM_RX (PA06)<br>**----- End of picture text -----**<br>
**Figure 5.2. Stand-Alone SoC Configuration**
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BGM270S Wireless Gecko Module Data Sheet Pin Definitions
## **6. Pin Definitions**
## **6.1 48-Pin SiP Module Device Pinout**
**==> picture [540 x 406] intentionally omitted <==**
## **Figure 6.1. 48-Pin SiP Module Device Pinout**
The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.2 Alternate Function Table, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity.
**Table 6.1. 48-Pin SiP Module Device Pinout**
|**Pin Name**|**Pin(s)**|**Description**||**Pin Name**|**Pin(s)**|**Description**|
|---|---|---|---|---|---|---|
|ANT_OUT|1|Integral Antenna Output||NC|2|Do Not Connect|
|NC|3|Do Not Connect||ANT_IN|4|Integral Antenna Input|
|RF_2G4|5|2.4 GHz RF Input/Output||GND|6|Ground|
|GND|7|Ground||PB04|8|GPIO|
|PB03|9|GPIO||PB02|10|GPIO|
|PB01|11|GPIO||PB00|12|GPIO|
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BGM270S Wireless Gecko Module Data Sheet Pin Definitions
|**Pin Name**|**Pin(s)**|**Description**||**Pin Name**|**Pin(s)**|**Description**|
|---|---|---|---|---|---|---|
|PA00|13|GPIO||PA01|14|GPIO|
|PA02|15|GPIO||PA03|16|GPIO|
|PA04|17|GPIO||GND|18|Ground|
|PA05|19|GPIO||PA06|20|GPIO|
|PA08|21|GPIO||PA07|22|GPIO|
|GND|23|Ground||VDCDC|24|Test pin (internal pin usage)|
|DECOUPLE|25|Decouple output for on-chip voltage<br>regulator. This pin is internally decou-<br>pled, and should be left disconnected.||GND|26|Ground|
|VREGVDD|27|Module input power supply||PD03|28|GPIO|
|PD02|29|GPIO||PD01|30|GPIO|
|PD00|31|GPIO||IOVDD|32|I/O power supply|
|GND|33|Ground||PC00|34|GPIO|
|PC01|35|GPIO||PC02|36|GPIO|
|PC03|37|GPIO||PC04|38|GPIO|
|PC05|39|GPIO||PC06|40|GPIO|
|PC07|41|GPIO||RESETn|42|Reset Pin. The RESETn pin is internally<br>pulled up to VDCDC (DVDD).|
|GND|43|Ground||NC|44|Do Not Connect|
|GND|45|Ground||GND|46|Ground|
|GND|47|Ground||GND|48|Ground|
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BGM270S Wireless Gecko Module Data Sheet Pin Definitions
## **6.2 Alternate Function Table**
Some GPIOs support alternate functions like debugging, wake-up from EM4, external low frequency crystal access, etc. The following table shows both which module pins have alternate capabilities and the functions they support. Refer to the SoCs reference manual for more details.
**Table 6.2. GPIO Alternate Function Table**
|**GPIO**|**Alternate Functions**|
|---|---|
|PA00|IADC0.VREFP|
|PA01|GPIO.SWCLK|
|PA02|GPIO.SWDIO|
|PA03|GPIO.SWV|
||GPIO.TDO|
||GPIO.TRACEDATA0|
|PA04|GPIO.TDI|
||GPIO.TRACECLK|
|PA05|GPIO.TRACEDATA1|
||GPIO.EM4WU0|
|PA06|GPIO.TRACEDATA2|
|PA07|GPIO.TRACEDATA3|
|PB01|ETAMPDET.ETAMPIN0|
||GPIO.EM4WU3|
|PB03|GPIO.EM4WU4|
|PC00|ETAMPDET.ETAMPIN1|
||GPIO.EM4WU6|
||GPIO.THMSW_EN|
||GPIO.THMSW_HALFSWITCH|
|PC01|ETAMPDET.ETAMPOUT0|
||GPIO.EFP_TX_SDA|
|PC02|ETAMPDET.ETAMPOUT1|
||GPIO.EFP_TX_SCL|
|PC05|GPIO.EFP_INT|
||GPIO.EM4WU7|
|PC07|GPIO.EM4WU8|
|PD00|LFXO.LFXTAL_O|
|PD01|LFXO.LFXTAL_I|
||LFXO.LF_EXTCLK|
|PD02|GPIO.EM4WU9|
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BGM270S Wireless Gecko Module Data Sheet Pin Definitions
## **6.3 Analog Peripheral Connectivity**
Many analog resources are routable and can be connected to numerous GPIO's. The following table indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the device Reference Manual for more details on the ABUS and analog peripherals.
**Table 6.3. ABUS Routing Table**
|**Peripheral**|**Signal**|**PA**|**PA**|**PB**|**PB**|**PC**|**PC**|**PD**|**PD**|
|---|---|---|---|---|---|---|---|---|---|
|||**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|**EVEN**|**ODD**|
|ACMP0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
|IADC0|ANA_NEG|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
||ANA_POS|Yes|Yes|Yes|Yes|Yes|Yes|Yes|Yes|
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BGM270S Wireless Gecko Module Data Sheet Pin Definitions
## **6.4 Digital Peripheral Connectivity**
Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port.
**Table 6.4. DBUS Routing Table**
|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|CMU.CLKIN0|||Available|Available|
|CMU.CLKOUT0|||Available|Available|
|CMU.CLKOUT1|||Available|Available|
|CMU.CLKOUT2|Available|Available|||
|EUART0.CTS|Available|Available|Available|Available|
|EUART0.RTS|Available|Available|Available|Available|
|EUART0.RX|Available|Available|Available|Available|
|EUART0.TX|Available|Available|Available|Available|
|FRC.DCLK|||Available|Available|
|FRC.DFRAME|||Available|Available|
|FRC.DOUT|||Available|Available|
|I2C0.SCL|Available|Available|Available|Available|
|I2C0.SDA|Available|Available|Available|Available|
|I2C1.SCL|||Available|Available|
|I2C1.SDA|||Available|Available|
|LETIMER0.OUT0|Available|Available|||
|LETIMER0.OUT1|Available|Available|||
|MODEM.ANT0|Available|Available|Available|Available|
|MODEM.ANT1|Available|Available|Available|Available|
|MODEM.ANT_ROLL_OVER|||Available|Available|
|MODEM.ANT_RR0|||Available|Available|
|MODEM.ANT_RR1|||Available|Available|
|MODEM.ANT_RR2|||Available|Available|
|MODEM.ANT_RR3|||Available|Available|
|MODEM.ANT_RR4|||Available|Available|
|MODEM.ANT_RR5|||Available|Available|
|MODEM.ANT_SW_EN|||Available|Available|
|MODEM.ANT_SW_US|||Available|Available|
|MODEM.ANT_TRIG|||Available|Available|
|MODEM.ANT_TRIG_STOP|||Available|Available|
|MODEM.DCLK|Available|Available|||
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BGM270S Wireless Gecko Module Data Sheet Pin Definitions
|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|MODEM.DIN|Available|Available|||
|MODEM.DOUT|Available|Available|||
|PDM.CLK|Available|Available|Available|Available|
|PDM.DAT0|Available|Available|Available|Available|
|PDM.DAT1|Available|Available|Available|Available|
|PRS.ASYNCH0|Available|Available|||
|PRS.ASYNCH1|Available|Available|||
|PRS.ASYNCH10|||Available|Available|
|PRS.ASYNCH11|||Available|Available|
|PRS.ASYNCH2|Available|Available|||
|PRS.ASYNCH3|Available|Available|||
|PRS.ASYNCH4|Available|Available|||
|PRS.ASYNCH5|Available|Available|||
|PRS.ASYNCH6|||Available|Available|
|PRS.ASYNCH7|||Available|Available|
|PRS.ASYNCH8|||Available|Available|
|PRS.ASYNCH9|||Available|Available|
|PRS.SYNCH0|Available|Available|Available|Available|
|PRS.SYNCH1|Available|Available|Available|Available|
|PRS.SYNCH2|Available|Available|Available|Available|
|PRS.SYNCH3|Available|Available|Available|Available|
|TIMER0.CC0|Available|Available|Available|Available|
|TIMER0.CC1|Available|Available|Available|Available|
|TIMER0.CC2|Available|Available|Available|Available|
|TIMER0.CDTI0|Available|Available|Available|Available|
|TIMER0.CDTI1|Available|Available|Available|Available|
|TIMER0.CDTI2|Available|Available|Available|Available|
|TIMER1.CC0|Available|Available|Available|Available|
|TIMER1.CC1|Available|Available|Available|Available|
|TIMER1.CC2|Available|Available|Available|Available|
|TIMER1.CDTI0|Available|Available|Available|Available|
|TIMER1.CDTI1|Available|Available|Available|Available|
|TIMER1.CDTI2|Available|Available|Available|Available|
|TIMER2.CC0|Available|Available|||
|TIMER2.CC1|Available|Available|||
|TIMER2.CC2|Available|Available|||
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BGM270S Wireless Gecko Module Data Sheet Pin Definitions
|**Peripheral.Resource**|**PORT**|**PORT**|**PORT**|**PORT**|
|---|---|---|---|---|
||**PA**|**PB**|**PC**|**PD**|
|TIMER2.CDTI0|Available|Available|||
|TIMER2.CDTI1|Available|Available|||
|TIMER2.CDTI2|Available|Available|||
|TIMER3.CC0|||Available|Available|
|TIMER3.CC1|||Available|Available|
|TIMER3.CC2|||Available|Available|
|TIMER3.CDTI0|||Available|Available|
|TIMER3.CDTI1|||Available|Available|
|TIMER3.CDTI2|||Available|Available|
|TIMER4.CC0|Available|Available|||
|TIMER4.CC1|Available|Available|||
|TIMER4.CC2|Available|Available|||
|TIMER4.CDTI0|Available|Available|||
|TIMER4.CDTI1|Available|Available|||
|TIMER4.CDTI2|Available|Available|||
|USART0.CLK|Available|Available|Available|Available|
|USART0.CS|Available|Available|Available|Available|
|USART0.CTS|Available|Available|Available|Available|
|USART0.RTS|Available|Available|Available|Available|
|USART0.RX|Available|Available|Available|Available|
|USART0.TX|Available|Available|Available|Available|
|USART1.CLK|Available|Available|||
|USART1.CS|Available|Available|||
|USART1.CTS|Available|Available|||
|USART1.RTS|Available|Available|||
|USART1.RX|Available|Available|||
|USART1.TX|Available|Available|||
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BGM270S Wireless Gecko Module Data Sheet Design Guidelines
## **7. Design Guidelines**
## **7.1 Layout and Placement**
For optimal performance of the BGM270S the following guidelines are recommended:
- Place the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as illustrated in Figure 7.1 Recommended Layout for BGM270S (Integral Antenna) on page 35.
- Copy the exact design from Figure 7.2 TOP Layer Antenna Layout With Coordinates on page 36 with the values for coordinates A to M given in Table 7.1 Antenna Polygon Coordinates, Referenced to Center of BGM270S on page 36.
- Make a cutout in all lower layers aligned with the right edge and the bottom edge of the integral loop antenna as indicated by the red box in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 37.
- Connect all ground pads directly to a solid ground plane in the top layer.
- Connect RF_2G4 to ANT_IN through a 1.5 nH inductor for obtaining the expected internal antenna performance.
- 1.5 nH inductor is not to be used in the case of external antenna configurations and when taking conducted measurement.
- Place ground vias as close to the ground pads of the BGM270S as possible.
- Place ground vias along the antenna loop right and bottom side.
- Place ground vias along the edges of the application board.
- Do not place plastic or any other dielectric material in contact with the antenna.
- A minimum clearance of 0.5 mm is advised.
- Solder mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region.
- Proper module placement and electrical connection should be ensured by measuring radiated output power from antenna.
- Impedance of the antenna can be verified by measuring S11 at ANT_IN pin that is corresponding antenna specification.
- With an external antenna, use a 50Ω trace to connect RF signal to the antenna, as it is illustrated in Figure 7.4 Recommended Layout for BGM270S (External Antenna) on page 37.
**==> picture [474 x 270] intentionally omitted <==**
**Figure 7.1. Recommended Layout for BGM270S (Integral Antenna)**
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BGM270S Wireless Gecko Module Data Sheet Design Guidelines
**Figure 7.2. TOP Layer Antenna Layout With Coordinates**
**Table 7.1. Antenna Polygon Coordinates, Referenced to Center of BGM270S**
|**Point**|**Coordinate**|
|---|---|
|A|(2.35, 3.15)|
|B|(2.65, 3.15)|
|C|(2.65, 4.20)|
|D|(2.35, 5.00)|
|E|(6.65, 5.00)|
|F|(6.65, 4.20)|
|G|(6.65, -0.30)|
|H|(5.52,-0.30)|
|I|(3.02, 2.20)|
|J|(2.76, 2.20)|
|K|(2.21, 1.68)|
|L|(0.15, 1.68)|
|M|(0.15, 5.00)|
Tolerance for the coordinates is +/- 0.05 mm.
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BGM270S Wireless Gecko Module Data Sheet Design Guidelines
**==> picture [482 x 271] intentionally omitted <==**
**Figure 7.3. Antenna Clearance in Inner and Bottom Layers**
**==> picture [482 x 271] intentionally omitted <==**
**Figure 7.4. Recommended Layout for BGM270S (External Antenna)**
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BGM270S Wireless Gecko Module Data Sheet Design Guidelines
## **7.2 Best Design Practices**
The design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommended:
- Place the BGM270S and antenna close to the center of the longest edge of the application board.
- Do not place any circuitry between the board edge and the antenna.
- Make sure to tie all GND planes in the application board together with as many vias as can be fitted.
- Generally ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 37.
- Open-ended stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of spurious emissions.
- The width of the GND plane to the sides of the BGM270S will impact the efficiency of the on-board integral loop antenna.
- To achieve optimal performance, a GND plane width of 55 mm is recommended as seen on Figure 7.5 Illustration of Recommended Board Width on page 38.
- See for reference.
- Figure 7.6 Non-Recommended Layout Examples on page 39 illustrates layout scenarios that will lead to severely degraded RF performance for the application board.
**==> picture [50 x 13] intentionally omitted <==**
**----- Start of picture text -----**<br>
55 mm<br>**----- End of picture text -----**<br>
**Figure 7.5. Illustration of Recommended Board Width**
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BGM270S Wireless Gecko Module Data Sheet Design Guidelines
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**Figure 7.6. Non-Recommended Layout Examples**
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BGM270S Wireless Gecko Module Data Sheet Design Guidelines
## **7.3 Radio Performance vs. Carrier Board Size**
For many applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. A carrier board width of 55 mm is recommended for the BGM270S. However, the ideal width is not always possible in the end-application, and another form factor might be required. In this case, the antenna performance of the integral antenna will possibly become compromised, but it may still be sufficiently good for providing the required link quality and range of the end-application. As can be seen in Figure 7.7 Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM270S on page 40, the best performance is achieved for a carrier board size of 55 mm x 30 mm, with relatively constant performance for larger boards and rapidly declining performance for smaller boards. Notice that carrier PCB thickness and relative permittivity might also have an impact on the antenna impedance and/or resonance frequency.
**==> picture [546 x 308] intentionally omitted <==**
**----- Start of picture text -----**<br>
xGM270S Antenna Efficiency vs. Carrier Board size<br>0<br>100 80 60 55 40 30<br>-1<br>-2<br>-3<br>-4<br>-5<br>-6<br>-7<br>Carrier Board Width [mm]<br>Efficiency [dB]<br>**----- End of picture text -----**<br>
**Figure 7.7. Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM270S**
## **7.4 Proximity to Other Materials**
Placing plastic and/or any other dielectric material directly in contact with (or in very close proximity to) the antenna is likely to cause RF performance degradation. A clearance of minimum 0.5 mm is recommended to avoid excessive detuning of the antenna. Solder mask, conformal coating, and/or other thin dielectric layers are acceptable directly on top of the antenna region, however these might also negatively impact antenna efficiency and reduce range. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes.
## **7.5 Proximity to Human Body**
Placing the module in contact with, or very close to the human body will negatively impact antenna efficiency and reduce range. Furthermore, additional certification work may be required if the module is integrated into a wearable device: refer to 11.7 RF Exposure and Proximity to Human Body.
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BGM270S Wireless Gecko Module Data Sheet Design Guidelines
## **7.6 Antenna Tuning and Validity of Modular Certifications**
A modular certification is valid if all the design guidelines from the manufacturer with regards to carrier Printed Circuit Board (PCB) size, thickness, relative permittivity, module placement, and antenna loop dimensions are followed. In particular, the modular certification is still valid if no antenna tuning is applied to compensate for the reduced performance in terms of range, which may result from suboptimal carrier PCB size, thickness, relative permittivity, module placement, and/or proximity to other materials such as assembly housing.
Conversely, any antenna tuning or change of the antenna loop dimensions might invalidate a modular certification, unless it is done to compensate for the degradation caused by a PCB deviating from the manufacturer’s best-case reference in size, thickness, relative permittivity, and/or module placement, or to compensate for the degradation caused by the proximity of assembly housing.
Class 1 Permissive Change (C1PC) is considered if the host PCB modifications do not increase emissions. Class 2 Permissive Change (C2PC) is considered if the modifications degrade the emissions, but remain below regulatory limits. In any case, the required spotchecking by the end-product manufacturer becomes even more relevant here to identify the path forward.
Whether antenna tuning is applied or not, it is strongly recommended that spot-checking is performed in any case with the end-product having the transmitter(s) operating, so to confirm that the host product meets all regulatory requirements under any circumstance.
The emission levels established in the module certification are limits for the end device too, and determine whether or not a _Permissive Change_ should be considered. Since this is evaluated on a case-by-case basis, customers must consult with the company providing certification services for their product to identify the best approach. Additional information on module certification and _Permissive Changes_ is provided in AN1048: Regulatory RF Module Certifications.
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BGM270S Wireless Gecko Module Data Sheet Package Specifications
## **8. Package Specifications**
## **8.1 Package Dimensions**
The package dimensions are shown in Figure 8.1 Package Dimensions - Full on page 42 and Figure 8.2 Package Dimensions - Detail on page 42.
**Figure 8.1. Package Dimensions - Full**
**Figure 8.2. Package Dimensions - Detail**
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BGM270S Wireless Gecko Module Data Sheet Package Specifications
## **Table 8.1. Package Dimensions**
|**Dimension**|**MIN**|**NOM**|**MAX**|
|---|---|---|---|
|A|1.200|1.300|1.400|
|A1|0.260|0.300|0.340|
|A2|0.950|1.000|1.050|
|b|0.200|0.250|0.300|
|D|6.000 BSC|||
|D1|5.000 BSC|||
|e|0.500 BSC|||
|E|6.500 BSC|||
|E1|5.000 BSC|||
|L|0.300|0.350|0.400|
|L1|0.125|0.175|0.225|
|L2|0.575|0.625|0.675|
|L3|0.450|0.500|0.550|
|eD1|0.450 BSC|||
|eD2|0.900 BSC|||
|eE1|0.450 BSC|||
|eE2|0.900 BSC|||
|aaa|0.100|||
|bbb|0.100|||
|ccc|0.100|||
|ddd|0.100|||
|eee|0.100|||
|**Note:**<br>1. The dimensions in parenthesis are reference.<br>2. All dimensions in millimeters (mm).<br>3. Unless otherwise specified, tolerances are:<br>a. Decimal: X.X = +/- 0.1<br>X.XX = +/- 0.05<br>X.XXX = +/- 0.03<br>b. Angular: +/- 0.1 (In Deg)<br>4. Hatching lines means package shielding area.||||
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BGM270S Wireless Gecko Module Data Sheet Package Specifications
## **8.2 Recommended PCB Land Pattern**
The recommended PCB Land Pattern is shown in Figure 8.3 Module Land Pattern on page 44
**Figure 8.3. Module Land Pattern**
**Table 8.2. PCB Land Pattern Dimensions**
|**Dimension**|**Typ (mm)**|
|---|---|
|D1|5.00|
|D2|2.90|
|E1|5.00|
|E2|2.90|
|eD1|0.45|
|eD2|0.90|
|b|0.25|
|e|0.50|
|L|0.35|
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BGM270S Wireless Gecko Module Data Sheet Package Specifications
|**Dimension**||**Typ (mm)**|
|---|---|---|
|L1||0.50|
|**Note: General**|||
|1. All feature sizes shown are at<br>Maximum Material Condition(MMC) and a||card fabrication tolerance of 0.05mmis assumed.|
|2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.|||
## **Note: General**
## **Stencil Design**
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.100 mm (4 mils).
3. The stencil aperture to land pad size recommendation is 80% paste coverage.
_**Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling.**_
## **8.3 Top Marking**
**Figure 8.4. BGM270S Top Marking**
**Table 8.3. Top Marking Definition**
|**OPN**|**Line 1 Marking**|**Line 2 Marking**|**Line 3 Marking**|
|---|---|---|---|
|BGM270SC22SNA4|BGM270S22A|SC22SNA4|See note below|
|**Note:**YY = Year. WW = Work Week, TTTTTTT = Trace Code||||
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BGM270S Wireless Gecko Module Data Sheet Soldering Recommendations
## **9. Soldering Recommendations**
It is recommended that final PCB assembly of the BGM270S follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements.
## **CLASS 1 General Electronic Products**
Includes products suitable for applications where the major requirement is function of the completed assembly.
## **CLASS 2 Dedicated Service Electronic Products**
Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures.
## **CLASS 3 High Performance/Harsh Environment Electronic Products**
Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems.
**Note:** General SMT application notes are provided in the AN1223 document.
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BGM270S Wireless Gecko Module Data Sheet Tape and Reel
## **10. Tape and Reel**
BGM270S modules are delivered to the customer in tray (490 pcs / tray) or reel (2500 pcs / reel) packaging with the dimensions below. All dimensions are given in mm unless otherwise indicated.
**Figure 10.1. Carrier Tape Dimensions**
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BGM270S Wireless Gecko Module Data Sheet Tape and Reel
**Figure 10.2. Reel Dimensions**
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BGM270S Wireless Gecko Module Data Sheet Certifications
## **11. Certifications**
This section details the certification status of the BGM270S modules with regards to regional regulatory radio type approvals. Where applicable, the status with the qualifications against the specifications of the supported global industrial wireless standards is also provided.
The address of the legal manufacturer (technology owner) and certifications applicant/holder is:
SILICON LABS / SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland
The BGM270S modules have brand name of "SILICON LABS". For certifications and qualifications purposes, the modules are referred to by their formal Model Name of "BGM270S22A".
"SILICON LABS" (and "Silicon Labs") is a trademark globally owned by the Silicon Laboratories Inc. corporation, and all branches and subsidiaries, including the above applicant, holds the right to use it.
For any clarification on regulatory certifications, or if you need to discuss topics such as Permissive Changes or Change in ID requests, please contact your Sales Representative or our Technical Support. You can get started by visiting Contact Us.
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BGM270S Wireless Gecko Module Data Sheet Certifications
## **11.1 Qualified Antennas**
The BGM270S22A module have been tested and certified for the use with either the built-in integral antenna or a reference external antenna attached to the module's RF pin denoted as RF_2G4. The intended antenna impedance is 50 Ω.
Performance characteristics for the built-in antenna are presented in 3.3 Antenna, 7.3 Radio Performance vs. Carrier Board Size and . The details of the qualified external antenna(s) are summarized in the table below. The qualified external antenna(s) is(are) meant to be directly connected to the module's RF pin, with no active/non-linear component(s) along the RF path in between.
**Table 11.1. Qualified External Antennas for BGM270S22A Modules**
|**Brand and Model**|**Antenna Type**|**Maximum Gain**|**Impedance**|
|---|---|---|---|
|Linx Technologies Inc.,<br>ANT-2.4-CW-CT-RPS|Connectorized Coaxial Dipole|+2.8 dBi|50 Ω|
Any external antenna of the same general type and of equal or less peak directional gain compared to the one(s) listed in the above table, and having similar in-band and out-of-band characteristics, can be used in the regulatory areas that have modular radio approvals, such as USA and Canada, as long as spot-check testing of the host is performed to verify that no performance changes compromising compliance have been introduced. In the particular FCC case, to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203, the module integrator must additionally consider the use of an external antenna having a unique connector or being non-detachable.
When using instead an external antenna of a different type (such as a chip antenna, a host PCB trace antenna, or a patch) and/or having non-similar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, in principle it can be added to the existing modular grant/certificate by means of a Permissive Change, for example with FCC and ISED. Typically, some radiated emission testing is demanded, but no modular or end-product re-certification is required. Please consult your certification house and/or a certification body and/or the module manufacturer for a confirmation on the correct procedures and for any authorization to perform a FCC's _Change in ID_ and/or a ISED's _Multiple Listing_ , to be followed by the intended Permissive Changes.
On the other hand, products designed to be used with an external antenna having higher peak gain than the maximum gain listed in the table above are very likely to require full new end-product's radio type approvals, with certification IDs under the host manufacturer's ownership. Since the exact Permissive Change or registration or re-certification procedure is chosen on a case-by-case basis, consult your certification house and/or a certification body for understanding the correct approach based on your unique design.
In countries applying the ETSI standards, where manufacturers issue a self-Declaration of Conformity before placing their products in the market (like in the EU countries, as well as in the UK or AU and NZ), the radiated emissions are always evaluated with the endproduct and the external antenna type is not critical, but antennas with higher gain may violate some of the EIRP regulatory limits.
For Japan, where compliance testing is done conductively, a list of allowed external antennas is found in the certificate(s) and/or test report(s). These qualified external antennas are meant to be directly connected to the module's RF pin, with no active/non-linear component along the RF path in between. For the use of any other external antenna, it will have to be formally added to the list of approved antennas by the certificate holder: in this case, please reach out to the module manufacturer to discuss such addition, or consider certifying the end-product itself as an alternative.
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BGM270S Wireless Gecko Module Data Sheet Certifications
## **11.2 CE and UKCA - EU and UK**
The BGM270S22A modules have been tested against the relevant applicable harmonized/designated standards (in relation to RF, EMC, Safety) and are in conformity with the essential requirements and other relevant requirements of the EU's Radio Equipment Directive (RED) (2014/53/EU) and of the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206).
The modules are thus entitled to carry the CE and UKCA compliance marks in their labels and/or accompanying documentation, while the related manufacturer's formal Declarations of Conformity (DoC) are available at the product web page, which is reachable starting from silabs.com.
Note that every final product integrating the BGM270S22A module will need to go through full Safety and EMC assessments, for example in accordance with the ETSI 301 489-x applicable standards. In fact, Safety and EMC tests performed on a bare radio module are generally not supposed to provide confidence of Safety and EMC compliance of the final radio-equipped product as a whole assembly.
Furthermore, it is ultimately the responsibility of the manufacturers to ensure the compliance of their complete final products also with respect to the RF performance. The specific product assembly is likely to have an impact on RF radiated characteristics, when compared to the bare module. Hence, manufacturers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI EN 300 328 standard.
OEMs must also consider the importance of applying the compliance mark(s) to a visible location on their final products, on top of the need to writing down and signing the legal manufacturer's Declaration of Conformity for the final product itself. More in general, module customers assume full responsibility with regards to learning the guidelines and meeting the requirements for the compliance in each region where their end-products are marketed.
## **11.3 FCC - USA**
This device complies with FCC's e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI C63.10 standard) when operating with the built-in integral antenna or with an external antenna type as discussed in chapter 11.1.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
## **FCC RF Radiation Exposure Statement**
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying the RF exposure compliance.
In particular, this transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance with the evaluation exposed in the RF Exposure test report(s). This transmitter also meets the Portable requirements at distances equal or above those being reported in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 58.
This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures.
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BGM270S Wireless Gecko Module Data Sheet Certifications
## **OEM Responsibilities to Comply with FCC Regulations**
This module has been tested for compliance to FCC Part 15.
OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.)
Additionally, investigative measurements and spot-check testing, covering at least max power and spurious emission and band-edge (with all transmitters active, if other co-located radios than the module itself exist on the host), are strongly recommended in order to verify that the full system's compliance is maintained when the module is integrated and active, even with the module having a full modular approval, in accordance with the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide.
## • **General Considerations**
This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement, which is typically applicable to the final host. The final host will still need to be assessed for compliance to this portion of the rule requirements, if applicable.
- **Manual Information to the End User**
The OEM integrator must not provide information to the end users regarding how to install or remove this RF module, or how to change RF related parameters, in the user’s manual of the final product which integrates this module.
The end user's manual shall include all required regulatory information/warnings as shown in this manual.
## • **Host Manufacturer Responsibilities**
Each host manufacturer is ultimately responsible for the full compliance of their host system as a whole. The final product is supposed to be assessed against all the essential requirements of the FCC rules, such as FCC Part 15 Subpart B, before it can be placed on the US market. This includes re-assuring the compliance of the radio transmitter with the RF and EMF essential requirements of the FCC rules.
The modular radio transmitter must not be incorporated into any other radio-equipped device or system without retesting for compliance as multi-radio and combined equipment.
For more details about integrating the Single Modular Transmitter, refer to the following FCC document:
- KDB 996369 D04 Module Integration Guide
For a better understanding of the process leading to obtaining a Full Modular Approval, see the following documents instead:
- KDB 996369 D01 Transmitter Module Equipment Authorization Guide
- KDB 996369 D02 Frequently Asked Questions and Answers about Modules
The two documents above provide insight into the FCC requirements from the module manufacturer's perspective, and emphasize why integrators must follow the integration instructions and design guidance, including accounting for the RF Exposure limitations, if any. Should a deviation occur, integrators might need to work with the module manufacturer in order to proceed with a Permissive Change (following a _Change in ID_ ), in accordance with the FCC guidelines described in the following documents:
- KDB 178919 D01 Permissive Change Policy
- KDB 178919 D02 Permissive Change Frequently-Asked Questions
## **Separation**
- To meet the SAR exemption for portable conditions, the minimum separation distances indicated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 58 must be maintained between the human body and the radiator (antenna) at all times.
- This transmitter module is tested in a standalone RF Exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation, or a reduction in the max output power or in the duty-cycle, might be required for the host, ultimately leading to a Class II Permissive Change, or more rarely to a new grant.
- **Important Note:** In the event that the conditions for the exemption cannot be met, the final product will likely have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle, for the FCC authorization to remain valid, and a Permissive Change will have to be applied. The SAR evaluation (and/or reconfiguration) is in the responsibility of the end-product’s manufacturer, as well as the Permissive Change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a _Change in ID_ authorization by the module's original grant holder.
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## **End Product Labeling**
The BGM270S22A modules are not labeled with their own FCC ID due to their very small size. Instead, the anti-static bags containing the reels or trays come with a special label displaying the FCC ID. Consequently, the outside of the device into which the module is installed must have a label with a reference to the embedded module. In particular, the final product must be labeled in a visible area with the following:
## **"Contains Transmitter Module FCC ID: QOQ-GM270S"**
or
## **"Contains FCC ID: QOQ-GM270S"**
## **Final note:**
As long as all the conditions in this and all the above chapters are met, further RF testing of the transmitter will not be strictly required. However, still consider the good practice and the FCC strong recommendation to ensure the compliance of the host by spot-checking. Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements which might be mandatory with this module installed.
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## **11.4 ISED - Canada**
This radio transmitter (with IC: 5123A-GM270S) has been approved by _Innovation, Science and Economic Development Canada_ ( _ISED Canada_ , formerly _Industry Canada_ ) to operate with the built-in integral antenna or with one of the external antenna type(s) listed in 11.1 Qualified Antennas, having the maximum permissible gain as indicated in the table. External antennas of other types not found in this list, or having a peak gain greater than the maximum gain listed, are strictly prohibited for use with this device.
- This radio-equipped device complies with ISED's license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference.
2. This device must accept any interference, including interference that may cause undesired operation of the device.
## **RF Exposure Statement**
Exception from routine SAR evaluation limits are given in RSS-102 Issue 6.
The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance to the limit(s) exposed in the RF Exposure Analysis.
For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above those reported in Table 11.2.
If the separation distance from the human body is less than the values stated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 58, then the OEM integrator is responsible for evaluating the SAR with the end-product, or for the reconfiguration of the radio module in the host in terms of lowering the max RF TX power and/or the duty-cycle. A Permissive Change would be required too, under the responsibility of the host manufacturer, following a _Multiple Listing_ authorization by the module's original certificate holder.
## **OEM Responsibilities to Comply with IC Regulations**
The BGM270S22A modules have been certified for integration into products only by OEM integrators, under the following conditions:
- The module must be installed in such a way that the intended minimum separation distances are maintained between the radiator (antenna) and all persons at all times. Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 58 indicates the distances in accordance to the use cases.
- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
**Important Note:** In the event that the above two conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the ISED authorization to remain valid; a Permissive Change will have to be applied too. The RF Exposure evaluation (SAR, or possibly a re-configuration) is in the responsibility of the end-product's manufacturer, as well as the Permissive Change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a _Multiple Listing_ authorization by the module's original certificate holder.
## **End Product Labeling**
The BGM270S22A modules are not labeled with their own IC ID due to their very small size. Instead, the anti-static bags containing the reels or trays come with a special label displaying the IC ID. Consequently, the outside of the device into which the module is installed must have a label with a reference to the embedded module. In particular, the final product must be labeled in a visible area with the following:
## “ **Contains Transmitter Module IC: 5123A-GM270S** ”
or
## “ **Contains IC: 5123A-GM270S** "
## **Final notes:**
The OEM integrator must not provide information to end users regarding how to install or remove this RF module, or how to change RF related parameters, in the user's manual of the final product which integrates the module.
As long as all the conditions in this and all the above sections are met, further transmitter testing will not be required. However, the OEM integrators are still responsible for testing their end-products for the fulfillment of any additional compliance requirements, such as digital device emissions, PC peripheral requirements, etc.
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## **ISED (Français)**
Le présent émetteur radio (IC: 5123A-GM270S) a été approuvé par _Innovation, Sciences et Développement Économique Canada_ ( _ISED Canada_ , anciennement _Industrie Canada_ ) pour fonctionner avec l'antenne intégrée ou avec l'un des antennes externes énumérés à la section 11.1 Qualified Antennas, ayant le gain maximum permis comme indiqué dans le tableau. Les types d'antenne non inclus dans cette liste, ou ayant un gain de crête supérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:
1. L’appareil ne doit pas produire de brouillage;
2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
## **Déclaration d'exposition RF**
Les exceptions aux limites de l'évaluation SAR sont données dans le numéro 6 de la publication RSS-102.
Le module répond aux exigences pour les cas d'utilisation Mobile lorsque la distance minimale de séparation du corps humain est de 20 cm ou plus, conformément à la (aux) limite(s) exposée(s) dans l'analyse de l'exposition RF.
Pour les cas d'utilisation Portables, l'évaluation de l'exposition RF ou l'évaluation SAR n'est pas requise lorsque les distances de séparation du corps humain sont égales ou supérieures à celles indiquées dans Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 58.
Si la distance de séparation du corps humain est inférieure aux valeurs indiquées dans Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 58, l'intégrateur OEM est responsable de l'évaluation du SAR avec le produit final, ou de la reconfiguration du module radio dans l'hôte en termes de réduction de la puissance RF TX maximale et/ou du rapport cyclique. Une modification permise au matériel serait également nécessaire, sous la responsabilité du fabricant de l'hôte, suite à une autorisation de inscription multiple par le titulaire du certificat du module d'origine.
## **Responsabilités du fabricant de se conformer à la réglementation IC**
Le module a été certifié pour l'intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes:
- Le module doit être installée de manière à maintenir une distance de séparation minimale entre le radiateur (antenne) et toutes les personnes à tout moment. Le tableau 11.2 indique les distances en fonction des cas d'utilisation.
- Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur.
**Remarque Importante:** au cas où ces deux conditions ci-dessus ne pourraient pas être remplies, le produit final devra être soumis à des tests supplémentaires pour évaluer l'exposition RF, ou passer par une reconfiguration de la puissance de sortie maximale et/ou du rapport cyclique, afin que l'autorisation ISED reste valable; une modification permis au matériel devra également être appliqué. L'évaluation de l'exposition aux radiofréquences (SAR, ou éventuellement une reconfiguration) est sous la responsabilité du fabricant du produit final, ainsi que le modification permis qui peut être effectué avec l'aide de l'organisme de certification des télécommunications du client, après autorisation de inscription multiple par le titulaire de la certification du module.
## **Étiquetage des produits finis**
Les modules BGM270S22A ne sont pas étiquetés avec leur propre IC ID en raison de leur taille. Au lieu de cela, l'étiquette d'emballage contient l'ID IC. Par conséquent, l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant référence au module inclus. Dans ce cas, le produit final doit être étiqueté dans une zone visible avec les éléments suivants:
## “ **Contient le module transmetteur IC: 5123A-GM270S** ”
ou
## “ **Contient IC: 5123A-GM270S** "
## **Remarques finales:**
L’intégrateur OEM ne doit pas fournir aux utilisateurs finaux d’informations sur la procédure d’installation ou de retrait de ce module RF, ni sur la modification des paramètres liés à la RF dans le manuel d’utilisation du produit final intégrant le module.
Tant que toutes les conditions de cette section et de toutes les sections précédentes sont remplies, aucun test RF supplémentaire de l'émetteur ne sera nécessaire. Toutefois, les intégrateurs OEM restent responsables de tester leurs produits finaux afin de garantir leur conformité à toute exigence de conformité supplémentaire, telle que les émissions des appareils numériques, les exigences relatives aux périphériques PC, etc.
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BGM270S Wireless Gecko Module Data Sheet Certifications
## **11.5 MIC - Japan**
The BGM270S22A module are certified in Japan with following certification number:
• 203-JN1426
While the module manufacturer takes all reasonable steps to prevent non-compliant operation, it is still the end-product manufacturer's responsibility to ensure that a module is configured to meet the compliance requirements, for example in relation to the maximum allowed RF TX power. When applicable, refer to the SDK documentation and/or API reference manuals and/or integration and certification guides, to learn how to configure (limit) the maximum RF TX power for ensuring the compliance of the end-product during regular operation, if need be. Refer as well to the power setting table(s) and measurements in the test report(s) in order to realize the maximum output power levels allowed for the regulatory compliance in Japan.
Manufacturers integrating a certified radio module into their host equipment are supposed to make the Technical Conformity Mark and the certification number visible on the outside of their radio-equipped device, typically in the device's own label. This combination of mark and number, and their relative placement, is depicted in the Figure 11.1 Example of "Giteki" Mark with Placeholder for Actual Certification Number on page 56 below, and depending on the overall size it might also appear among the markings of the radio module (not the case with the BGM270S modules, due to the small size). The Technical Conformity Mark and the certification number must be placed close to the text in the Japanese language which is provided below. This requirement in the Radio Law enables users of the combination of host and radio module to verify if they are actually using a radio-equipped device which is approved for use in Japan.
Certification-related text to be placed on the outside surface of the host equipment: YF ESE - SESE ICAES <. HUPRES EERIE A SEA TREL TLS,
Translation of the text:
“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.”
The "Giteki" Technical Conformity Mark, together with the actual module's certification number, as shown in the following example figures, must be affixed to an easily noticeable section of the specified radio-enabled host equipment. Notice that such section may be required to contain additional information if the end-device embedding the module is also subject to a Telecom approval.
The manufacturer of the final product is also responsible to provide a Japanese language version of the User Manual and/or Installation Instructions as a companion document coming with the final product when placed on the market in Japan. Such a document will have to mention the integrated radio component and the related certification information.
**Figure 11.1. Example of "Giteki" Mark with Placeholder for Actual Certification Number**
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BGM270S Wireless Gecko Module Data Sheet Certifications
**Figure 11.2. Detail of "Giteki" Technical Conformity Mark**
## **11.6 KC - South Korea**
The BGM270S22A module have a RF registration for import and use in South Korea.
Registration number is KC ID: R-R-BGT-GM270S
These modules are meant to be integrated into end-products, which then become exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and as long as, where applicable, the approved external antennas are used and any additional transmit power backoff is implemented in accordance to the measurements and configurations seen in the formal test report(s).
EMC testing and any other relevant test applicable to the end-product as a whole, plus appropriate labeling of the end-product, might still be required for the full regulatory compliance in the country.
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BGM270S Wireless Gecko Module Data Sheet Certifications
## **11.7 RF Exposure and Proximity to Human Body**
When using the BGM270S22A modules in an application where the radio-equipped end-product is located close to the human body, the human RF Exposure must be taken into account. FCC, ISED, and CE/UKCA all have different standards and rules for evaluating the RF Exposure. In particular, each regulator has different requirements when it comes to the exemption from having to perform RF Exposure evaluation and/or SAR (Specific Absorption Rate) measurements, and the minimum separation distances between the module's antenna and the human body varies accordingly. The properties of the BGM270S22A modules allow the minimum separation distances detailed in the table below for the SAR measurement exemption in the Portable use cases (less than 20 cm from the human body). These modules are approved for the Mobile use case (more than 20 cm) without any need for RF Exposure evaluation.
**Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption**
|**Certification**|**BGM270S22A**|
|---|---|
|FCC|Integral Antenna: 7 mm<br>External Reference Dipole Antenna: 7 mm|
|ISED|Integral Antenna: 15 mm<br>External Reference Dipole Antenna: 15 mm|
|CE / UKCA|The RF exposure should always be evaluated with the end-product when transmitting<br>with power levels higher than 20 mW (13 dBm) while operating at distances closer than<br>20 cm from the human body. Not to be evaluated with this module, since it is inherently<br>compliant due to the max RF TX output power level being below the exclusion limit at all<br>times.|
The exemption minimum distances above, calculated for reference in the full output power use-case, are based on the rules in force at the time of originally writing this data sheet. Even though changes happen rarely, always ensure to apply the rules in force at the time of placing the end-product into the market.
FCC and ISED rules allow use of a module at its max RF TX power in an end-product where the typical separation distance from the human body is smaller than mentioned above, but it requires evaluating the RF Exposure in the final assembly and applying for a _Class 2 Permissive Change_ to the FCC and ISED approvals of the module. To proceed with the Permissive Changes, first the module manufacturer should be asked for an authorization to do an FCC's _Change in ID_ and an ISED's _Multiple Listing_ ; then, the new Portable condition will be added to the new parallel grants owned by the end-product manufacturer, for extending the approvals to their unique host under their unique configuration and mode of use.
For those end-products where the embedded module is configured to implement only a single wireless protocol which would allow for the exemption at a shorter distance than the overall minimum distance, there would be no need the evaluate the RF Exposure at such a shorter distance and above. However, a Permissive Change would still be needed as a mean to notify the FCC / ISED of the reason why in the field the module is allowed to operate at a shorter distance than the overall minimum distance seen in the table above.
An example of another use case where the module could operate at a shorter distance than indicated in the table above, without having to do the RF Exposure evaluation / SAR measurement, is when the power or the duty-cycle is reduced during normal operation. However, the new minimum distance for the exemption should be re-calculated, and still a permissive change would be needed to notify the regulators of the new conditions.
For the CE/UKCA compliance, RF Exposure must be considered and evaluated by the OEM in all cases (if any) when the end-product is transmitting at higher power level than mentioned in the table above.
**Note:** Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected.
## **11.8 Bluetooth Qualification**
The BGM270S22A modules are qualified as a Core-Controller Configuration design based on the Bluetooth Low Energy Core Specification 6.0, with Design Number (DN) Q375771. To qualify a product that embeds the BGM270S22A as a Core-Complete Configuration Design for Bluetooth Low Energy Core Specification 6.0, the Core-Controller Configuration design (DN Q375771) should be combined with the Core-Host Configuration design (DN Q333162), which combines the BGM270S22A modules with Silicon Labs' Wireless Simplicity Link Layer and Host based on BLE SDK versions 9.0.0 and above, using the Bluetooth SIG’s Qualification Workspace tool.
For more information on Bluetooth Qualification, visit docs.silabs.com.
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BGM270S Wireless Gecko Module Data Sheet Revision History
## **12. Revision History**
## **Revision 1.0**
## November, 2025
- Updated 4. Electrical Characteristics.
## **Revision 0.5**
August, 2025
The following sections and sub-sections were updated:
- Updated FrontPage.
- Updated 1. Feature List.
- Updated 2. Ordering Information.
- Updated 3. System Overview.
- Updated 4. Electrical Characteristics.
- Updated 5. Reference Diagrams.
- Updated 7. Design Guidelines.
- Updated 8. Package Specifications.
- Updated 9. Soldering Recommendations.
- Updated 10. Tape and Reel.
- Updated 11. Certifications.
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## **Disclaimer**
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.
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